Ken Kuang

I agree with this article. Silicon-Graphite anodes in EV cells is key to making better EV batteries for next generation of Affordable EVs, PROVIDED that costs and risks are reduced and scalability to EV quantities is supported by industrial partners. https://lnkd.in/gwN2syHf OneD Battery Sciences spent 15 years perfecting, patenting, and scaling-up the SINANODE processing. What is unique about it? (1) It is the lowest cost silicon technology, because it add silicon inside the pores of graphite anode materials already produced at large scale and low cost by qualified suppliers. The silicon is added using a fast and inexpensive patented catalytic process, reducing waste and time. By comparison, proprietary hard carbon substrates infused with silicon are at least 4 or 5 times more expensive and not yet scaled up to EV quantities. (2) Performance data in EV cell prototypes have proven that higher cell energy density can be achieved with less silicon because the SINANODE processing does not add the unnecessary inactive materials and excess voids found in other technologies. Instead, the anodes can be calendared to EV densities with very low wt. % of inactive materials. We provide EV cell prototypes to customers and partners so that they can verify our data. We do not expect anyone to trust marketing claims. (3) The SINANODE IP portfolio is unrivaled in providing customers and partners the IP Freedom to operate, and supporting the large-scale production by licensing established industrial partners in the EV supply chains. You can download the IP portfolio from the website at www.onedsinanode.com. The earliest priority dates of the patents are before that of our competitors and there are over 200 patents granted in the USA, Europe, Korea, Japan and China, with broad granted claims on materials, processes and equipment. Learn more at www.onedsinanode.com or feel free to ask questions in the comments. GM Ventures is an investor in OneD Battery Sciences. Other customers and partners to be announced soon. Our R&D team is in Palo Alto, California and our Pilot Production team is in Moses Lake, Washington. Terrific people doing great work in a very focused manner. #evbatteries #silicon #sinanode

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Thermoelectric thermal stabilizer for circulating fluid RRC-600-TE-LL liquid-to-liquid family. Laser technologies of microelectronics using the example of processing the most important electronics material, which remains silicon.  The advantages of laser technology become clear when new varieties are used, which involve fairly narrow “process windows” using complex nonlinear effects: the use of multiphoton absorption, filament, thermal spalling or “hidden” internal separation. These new technologies make it possible to dramatically reduce the size of defective zones, increase the quality of processing, while simultaneously reducing the width of the cut between chips (from 50–100 to 10–20 microns), which makes it possible to move to new architecture options or increase the density of chips on the wafer. Another option for laser technology is through drilling holes in a silicon wafer (Silicon Through Via), as well as precision laser milling and the formation of complex structures. These capabilities are significant for modern 3D assembly and micromechanical device (MEMS) designs. Laser technology makes it possible to achieve high quality holes, as well as a high ratio of hole diameter to depth, has no analogues from mechanical operations and in many cases is an interesting alternative to plasma-chemical etching. The high stability of the laser beam directly depends on the precise thermal stabilization of the light source. A new thermoelectric thermal stabilizer for circulating fluid RRC-600-TE-LL is developed and manufactured by Crystal Ltd. company for the fast-growing market of micro processing equipment, in particular for tasks in the micro- and electronics industry. The advanced solutions implemented in this device allow: - cool the circulating liquid, maximum cooling capacity 600W, - heat the circulating liquid, maximum cooling capacity 1000W, - stabilize the temperature of the circulating fluid with an accuracy of +/-0.02⁰С in the range from  +5⁰С to +60⁰С,  - noise level 42 dB  - control and monitor from a PC via the RS-485 interface or USB port using the Modbus-RTU protocol,  - carry out adjustment using a built-in temperature sensor or a sensor located directly at the cooled unit,  - automatically calculate setpoint offsets based on the temperature difference measured by the internal sensor and the external sensor,  - place the chiller in a 19” rack in laboratories and clean rooms,  - emergency stop in the following cases: the coolant temperature goes out of the specified range, the temperature sensor breaks, the coolant level in the tank drops below the minimum permissible, or there is no flow.  https://lnkd.in/eusrhQrt

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https://lnkd.in/gDPafu9p Applied Materials and Lam Research are instructing their supply chain to not source from Chinese sub-suppliers and to not accept any Chinese investment. In the meantime, around 40% of the total sales for AMAT & LAM comes from selling to Chinese customers. I understand the large dependency on the Chinese market, but to me this is a double standard, placing the burden on many, (smaller) suppliers. Does it feel like a double standard for you that it is OK for large semiconductor machinery builders to do business with China, but not for their suppliers ? #china #semi

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US Domestic IC Assembly - Enhanced Plastic - Old School? Working on a driver IC for space applications at high pin-pin voltage, I find no onshore options besides QFNs with too-fine lead pitch for the voltage. Given low market volumes a custom package development is not a great plan. I'm liking the older quad J-lead / gullwing for their compliant leads (board flex @ shock/vibe or launch, etc.). Only find these at overseas OSAT houses in my searching thus far. Do you like, or fear, hard body non-leaded packages in your application, qualification and launch environment? Could use some insights from the likely users of such a part or those who've gone down this road. Call it 250V pin-pin. Can I count on a general practice of conformal coating which would (in theory) raise the pin-pin potential (volts/distance) suitably (and are the basic PCB creepage specs, all there is to it?) or is New Space so much about cost, that this treatment might be skipped? Based on what you know about board construction, what't your "happy place" for max volts per mm or mil, continuous (VIN) and pulsed (SW)? I'm thinking a 50-mil pitch leaded package (can't see any QFNs at that pitch) might be the answer but would really like to stay onshore. And the whole bit about leaded vs unleaded, I've got mostly old ideas based on hermetic package back-end and strategic systems thermal & mechanical. Anybody know of any legit, space grade, onshore, old school leadframes, good MSL mold compound service providers? I know it's not asking much.

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Great insights on the #AI Infrastructure investments that aren’t always in the headlines. Click on the link, below to read the full report from IPC. In the report, “Several areas are identified that are critical and require significant government attention and #investment to enable a stronger, more resilient domestic supply chain for next-generation AI server data centers from design to manufacture,” added Devan Iyer. AI Infrastructure Partners #advancedpackaging #datacenter #supplychain #technology #infrastructure #semiconductor Intel Foundry

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An interesting article from the perspective of small fabs and assembly houses, detailing how these entities carve out a valuable niche in an industry dominated by large, high-volume manufacturers. https://lnkd.in/gW8GzSJX Importance of Small Fabs in the Semiconductor Ecosystem: Small fabs are not just surviving but thriving by focusing on areas where large manufacturers either cannot or do not want to compete. This includes low-volume, high-margin products that require specialized technology or custom processing. The emphasis on the role of small fabs in sectors like military, aerospace, and medical devices highlights their indispensable role in the broader semiconductor ecosystem. Flexibility and Innovation: Unlike megafabs, which are optimized for efficiency and scale, small fabs can adapt quickly to the unique needs of their customers. This flexibility is crucial for industries that demand customized solutions, such as MEMS, photonics, or advanced packaging with heterogeneous integration. It suggests that small fabs are not just filling a gap left by bigger players but are also driving innovation in ways that large foundries might not be able to. Challenges and Limitations: Despite their strengths, small fabs do face significant challenges, particularly when it comes to accessing the most advanced silicon nodes. The article correctly points out that the cost of cutting-edge equipment like EUV lithography is prohibitively expensive, limiting small fabs to older, less advanced technologies. However, the discussion on wafer coring as a workaround for this limitation is a fascinating insight into the innovative solutions small fabs employ to remain competitive. Strategic Positioning: From a strategic standpoint, the article makes a strong case for the continued relevance and success of small fabs. They are positioned as essential players in the semiconductor supply chain, especially as devices become more customized and as geopolitical factors drive demand for local, trusted suppliers. This positioning suggests that small fabs are not just temporary beneficiaries of market conditions but are likely to remain critical to the industry for the foreseeable future.

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Why yes, we also dramatically improve the performance of optical sensors and have the only high-index, solvent-free formulations on the market capable of delivering RI’s of 1.8+, >95%T, near zero haze, and film thicknesses from 30um to 50um! Check out the blog link below to learn more. #sensors #xr #extendedreality #displays #nanocomposites #nanomaterials #highindex

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Perhaps I didn't focus on it, but I hadn't seen any major news about US CHIPS Act money being spent on package, assembly and testing https://lnkd.in/gPZESgk5 TSMC and Amkor Technology, Inc. sign a deal to build advanced packing near TSMC's new fab in US, in Arizona If US wants complete Semiconductors manufacturing chain in the country, US will need facilities making the lowly QFN packages (even SOTs probably) - all these high-end chips are useless without the low end power and communication chips, and those need low end processing. It will be much harder to move that supply chain though, that supply chain is still quite a bit labour intensive.

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T-ray enabled isosurface imaging is a great tool for visualization and metrology.

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Stitching vias, also known as via stitching, are a crucial design practice for PCBs. By placing a series of vias around the perimeter of a ground plane or signal trace, a continuous conductive path is created, connecting the top and bottom layers of the board. #PCBdesign #viastitching

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NEED PRECISION OPTICAL METROLOGY? AOM IN TUCSON, AZ, HAS ANSWERS. I’ve just been talking to Tyler Steele, part of the dedicated team working with AOM - Arizona Optical Metrology LLC. Established in 2009, they are well-known globally as a leading computer-generated hologram (CGH) supplier for the world’s most challenging optical engineering projects. Often, metrology is the limiting factor in fabricating complex optical surfaces, as methods for qualification and feedback are not precise, flexible, or capable enough. A CGH overcomes many of these surface testing challenges to make optical surface qualification feasible for most complex surfaces while maintaining precision, resolution, and speed. EXPANDING HORIZONS Now, AOM are reaching out to bring CGH technology to a broader set of optics and photonics applications. Complex optics are being used more widely than ever–and at precision and production volumes that seemed impossible just a few years ago. The challenges these applications face are on par with the biggest space telescope projects of the past, but with a fraction of the budget and extremely tight timelines to complete. Think of the volume market for AR glasses. AOM - Arizona Optical Metrology LLC is delivering new and novel solutions to optics projects and programs to address this new world of optics production. They enable a new level of precision and ease of use for complex optics metrology from surface figure error of aspheres, freeforms, and off-axis sections to optical system alignment. A CGH converts an interferometer regular wavefront (collimated or spherical) into a custom-designed wavefront that matches the unique shape of the surface to be tested. The result is an interferometric null test when the test optic is well aligned to the CGH. In my conversation below, Tyler answers the Optica question: What can you do for other Optica corporate members, and what can they do for you? Quite a lot, it seems. Together, the future of optics is very bright indeed! Contact them directly or drop me a line for an introduction.

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In an unexpected twist, measures by the U.S. to limit semiconductor exports could be turning counterproductive. A recent report by SCMP highlighted a dramatic 40% increase in China's production of conventional semiconductor chips during the initial quarter of 2024. This spike in production could position China as a predominant figure in the manufacture of these older technology chips. #seniconductor #technology #china #chip https://lnkd.in/dhT4EFHx

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Interesting video about the pros and cons of two different gage study methods.

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Large and established cathode suppliers to the EV battery supply chain have traditionally been Japanese, Korean and European companies. More recently, Chinese cathode suppliers have been gaining market share, expanding production capacity and sales outside of China, and competing with incumbents in many markets globally. Predictably, the companies with the strongest IP portfolio are fighting back, using the IP generated over more than a decade of R&D and secured with granted patent claims in key markets. Here is one recent example: LG Chem suing Ningbo Ronbay New Energy Technology Co., Ltd. for cathode patent infringement. IP Freedom to Operate is essential and strategic when adopting new materials in the EV batteries, because of the large CAPEX investments and the potential exposure of OEM customers using the batteries.

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🔬 Why is higher detector sensitivity beneficial to #EBSD Analysis? High-sensitivity detectors will enable: ✅ Higher speed analyses using the same beam current, providing the required data quality in a shorter time ✅ The use of lower beam currents for all types of analysis, ensuring no loss in SEM resolution or depth of field ✅ The use of very low electron doses to prevent damage to the beam ✅The use of lower accelerating voltages, providing higher spatial resolution with minimal loss of speed (e.g. for fine-grained or highly deformed materials) This image is an EBSD orientation map from a metal halide perovskite solar cell. It has been collected using the highly sensitive Symmetry EBSD detector. Learn more about high sensitivity detectors 👉 https://okt.to/nXYtgw #ElectronBackscatterDiffraction #DataAnalysis #SEM #ScanningElectornMicroscope

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Spin coating is a well-known and widely used technique in semiconductor manufacturing, especially when it comes to applying photosensitive polymers like photoresist to semiconductor wafers. This method is integral to many steps in producing semiconductors. However, another less common but equally important method involves coating glass-like films known as Spin-On Glass (SOG). Though less practiced, SOG has significant applications, including doping the substrate, planarizing films, and serving as an interlayer dielectric. At our company, we’ve studied and addressed the challenges of SOG through specialized tools designed to resolve these potential yield-busting issues, providing solutions to wafer fabrication teams who rely on SOG in their processes. Learn more about how we do this in my latest article. #innovation #spinonglass #semiconductorindustry #semiconductormanufacturing

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So, you think slapping together a fibrous scaffold that "mimics native tissue structure" will magically achieve optimal cell function? In reality, designing effective electrospun tissue engineering scaffolds requires far more than just spinning it; you actually need to engineer the microstructure and even tailor it specifically for the cell type by studying cell-material interactions under different microstructure characteristics. So, don't wing it!

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Enhancing Biomanufacturing Efficiency: A Model-Based Plug-and-Play Hybrid Fed-Batch Process Using ATF Perfusion for High-Yield Drug Substance Production This study proposes a new single-step concentrated fed-batch process leveraging Alternating Tangential Flow (ATF) perfusion of the inoculum integrated to the production bioreactor to achieve high initial cell densities. A model-based approach was adopted to rationally optimize the process parameters. By integrating high seeding densities and optimized process strategies, this approach enhanced bioreactor efficiency and product yield by 4 to 6-fold (conventional 1.9 g/L to 10 - 12 g/L in intensified process), without compromising protein quality. The intensified process was further validated using different territory CHO cell lines and was found to yield similar results. An analysis of conventional fed-batch process to the new plug-and-play hybrid process suggested a 60 % reduction in costs, improvement in production efficiency, and consistent product quality, including post-translational modifications and glycosylation profiles. https://lnkd.in/g8RV2KQa #aspenalert #biotech #bioprocess

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