Vinayak Agrawal’s Post

View profile for Vinayak Agrawal, graphic

Founder, Chiplets, SoC, Mixed signal Senior Member IEEE

Perhaps I didn't focus on it, but I hadn't seen any major news about US CHIPS Act money being spent on package, assembly and testing https://lnkd.in/gPZESgk5 TSMC and Amkor Technology, Inc. sign a deal to build advanced packing near TSMC's new fab in US, in Arizona If US wants complete Semiconductors manufacturing chain in the country, US will need facilities making the lowly QFN packages (even SOTs probably) - all these high-end chips are useless without the low end power and communication chips, and those need low end processing. It will be much harder to move that supply chain though, that supply chain is still quite a bit labour intensive.

TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer

TSMC, Amkor sign MOU for advanced packaging at US facility, Apple to be first customer

digitimes.com

To view or add a comment, sign in

Explore topics