Gene Weiner

📈⚡𝐄𝐥𝐞𝐯𝐚𝐭𝐢𝐧𝐠 𝐏𝐞𝐫𝐟𝐨𝐫𝐦𝐚𝐧𝐜𝐞 𝐰𝐢𝐭𝐡 𝐂𝐞𝐫𝐚𝐋𝐢𝐧𝐤 𝐛𝐲 𝐓𝐃𝐊 𝐄𝐥𝐞𝐜𝐭𝐫𝐨𝐧𝐢𝐜𝐬 In his most recent feature in Designing Electronics North America our very own Matt Reynolds delves into the powerful capabilities of PLZT (lead lanthanum zirconium titanate) capacitors, showcasing our cutting-edge CeraLink series. His article offers an insightful exploration of their role in high-performance applications and why these components are game changers for industries seeking the highest power efficiency and durability levels. 🚘 🔋 We've engineered our CeraLink capacitors to excel under the toughest conditions, ensuring high efficiency and reliability where it matters most. As Matt highlighted, these capacitors’ exceptional handling of high voltage and temperature makes them a game-changer in electronics design especially in the field of hybrid and #electricvehicles (xEVs). 👉 More information on CeraLink: https://lnkd.in/dKySWsss What opportunities do you see for enhancing your projects with the advanced capabilities of CeraLink capacitors? #TDK #CeraLink #Innovation #HighPerformance #EngineeringExcellence #FutureofMobility #emobility #xEV #EV

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Are you looking to boost your semiconductor wafer manufacturing yield? Don’t miss this insightful webinar led by industry experts Brian Rudary and Doug Nordstrom! In this session, you’ll learn how to: ·        Optimize your thermal loop system ·        Select the right components ·        Ensure proper installation ·        Conduct performance testing Unlock the secrets to enhancing your manufacturing process and achieving higher yields. Webinar link: https://lnkd.in/gqQaKBte ----- If you have any questions about our products and services, please contact our hotline at 0936420804 or email us at [email protected]. #Semiconductor #Manufacturing #Webinar #ThermalManagement #IndustryExperts #Swagelokvietnam #IncreaseYield

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Spin coating is a well-known and widely used technique in semiconductor manufacturing, especially when it comes to applying photosensitive polymers like photoresist to semiconductor wafers. This method is integral to many steps in producing semiconductors. However, another less common but equally important method involves coating glass-like films known as Spin-On Glass (SOG). Though less practiced, SOG has significant applications, including doping the substrate, planarizing films, and serving as an interlayer dielectric. At our company, we’ve studied and addressed the challenges of SOG through specialized tools designed to resolve these potential yield-busting issues, providing solutions to wafer fabrication teams who rely on SOG in their processes. Learn more about how we do this in my latest article. #innovation #spinonglass #semiconductorindustry #semiconductormanufacturing

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MCC (Micro Commercial Components) introduced new high-performance 40V N-channel #MOSFETs. These components leverage split-gate trench (SGT) technology and full AEC-Q101 qualification in compact packages. These versatile MOSFETs in high-demand DPAK and D2PAK packages ensure a seamless upgrade path with minimal changes for integration within existing designs. Adding to their unquestionable performance in harsh conditions, these components have a high operating junction temperature of up to 175°C. 

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Strong #Memory Demand, Increased Shipments to #China Limit Revenue Decline of Top 5 #Wafer Fab Equipment Makers in Q1 2024 💡 The world’s top-five wafer fab equipment (WFE) manufacturers’ revenue decreased 9% YoY in Q1 2024 due to delayed customer investments in leading-edge #semiconductors, which were offset to some extent by strong #DRAM demand. Among these top five, ASML and TOKYO ELECTRON LIMITED revenues declined 21% YoY and 14% YoY respectively. Applied Materials, Lam Research and KLA’s revenues declined in low single digits when compared to 2023. However, when compared to the previous quarter, ASML’s revenue declined 26% while KLA’s revenue declined 5% on account of customer capacity adjustment in the advanced node. Applied Materials and Lam Research’s revenues were flat QoQ while Tokyo Electron delivered a revenue increase of 18% due to strong demand from both #DRAM and #NAND. The top five WFE manufacturers’ revenue from China grew 116% YoY in Q1 2024, primarily due to increased DRAM shipments to the country. Strong demand from mid-critical and mature nodes across applications including #IoT, #automotive and #5G will likely continue for the rest of the year. Thanks again to Counterpoint Technology Market Research for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eeyghjdw #semiconductorindustry #semiconductormanufacturing #technology #it #chip #chips #geopolitics #foundry #innovation #tech #usa #china #ai #aiot #japan #ev #taiwan #southkorea #europe #smartphones #ic

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Check out my new blog on using our #radhard #MCU to reconfigure #Space deployed #FPGA. Please reach out if you have interest and we can provide specific details on how to deploy

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South Korean police arrested the CEO of China semiconductor maker Chengdu Gaozhen (CHJS) as well its head of process design, as the CEO allegedly stole key 20nm process technology from Samsung Electronics. Both men are former Samsung executives. Police value the theft at ₩4.3 trillion won (US$3.3 billion). #samsungelectronics #technology #innovation #business hashtag #Semiconductorindustry #electronics #semiconductor #supplychain #computerchips #semiconductors #chips #chipmaker #foundry #engineering #manufacturing Source: #businesskorea

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#HBM3e Production Surge Expected to Make Up 35% of Advanced Process #Wafer Input by End of 2024, Says TrendForce Corporation 🤯💡 TrendForce 集邦科技 reports that the three largest #DRAM suppliers are increasing wafer input for advanced processes. Following a rise in #memory contract prices, companies have boosted their capital investments, with capacity expansion focusing on the second half of this year. It is expected that wafer input for 1alpha nm and above processes will account for approximately 40% of total DRAM wafer input by the end of the year. #HBM production will be prioritized due to its profitability and increasing demand. However, limited yields of around 50–60% and a wafer area 60% larger than DRAM products mean a higher proportion of wafer input is required. Based on the TSV capacity of each company, HBM is expected to account for 35% of advanced process wafer input by the end of this year, with the remaining wafer capacity used for #LPDDR5(X) & #DDR5 products. Regarding the latest developments in HBM, TrendForce indicates that HBM3e will become the market mainstream this year, with shipments concentrated in the second half of the year. Currently, SK hynix remains the primary supplier, along with Micron Technology, both utilizing 1beta nm processes and already shipping to NVIDIA. Samsung Electronics, using a 1alpha nm process, is expected to complete qualification in the second quarter and begin deliveries mid-year. Thanks again to Ellie Wang and TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/egZzu8eY #semiconductorindustry #semiconductors #chips #icdesign #ic #ai #aiot #it #computing #computer #semiconductormanufacturing #hpc #micron #samsung #skhynix #usa #taiwan #southkorea #japan #chipsact

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Daily News ①Weekly Market Summary: Diverging Demand Trends Across the Electronic Components Industry. This week's analysis of the electronic components market reveals divergent demand trends across sectors, with different industries driving the rise and fall of various categories.TI continues to lead the market, demonstrating its leadership in the semiconductor industry and product reliability, especially in power management and analog chips. ST and ONSEMI follow closely, benefiting from growth in automotive electronics, industrial control, and green energy applications, which are driving these brands' popularity. Demand for traditional categories like memory ICs, power ICs, and logic lCs has decreased, indicating stable market supply and ample inventory, possibly influenced by weak consumer electronics demand. Meanwhile, there has been a significant increase in demand for pressure sensors, terminals and connectors, and SMD crystal oscillators. Notably, pressure sensor demand surged by 223.52%, driven by improvements in automotive safety, increased industrial automation needs, and technological upgrades in smart home applications.  ②Wide Price Gap Between DDR4 and DDR5 Affects Server Market Transition. By the end of September, the price difference between DDR5 64GB and DDR4 64GB was nearly 70%. Despite higher costs for DDR5 due to factors like die size and power management chips, the large gap is prompting some enterprise customers to opt for the more cost-effective DDR4 for less demanding applications. As DDR5 supply improves, recent price increases have slowed, but the significant gap and high investment costs still influence the pace of DDR5 adoption. ③Automotive Chip Market Shows Weak Recovery in H2 2024. In the first half of the year, global automotive growth slowed, particularly in electric vehicle sales in Europe and the U.S., impacting the revenues and profits of major automotive-grade chip manufacturers like Infineon and NXP. The full-year revenue and expectations face pressure, with Infineon predicting a 3% growth in automotive-related revenues despite weak end-user demand for vehicles throughout the year. NXP expects a rebound in H2 2024 but anticipates chip shipments to be below market demand, while STMicroelectronics projects slower growth than expected in the automotive sector. However, electric vehicle products are performing well. Texas Instruments foresees a continued decline in the global automotive market in H2 2024. ④Moderate Recovery in China's Smartphone Market, Q3 Grows 4% Year-Over-Year.  In Q3, manufacturers focused on the mid-range segment and affordable 5G products, releasing new models and promotional campaigns to stimulate replacement demand. With an emphasis on catering to various consumer segments, more upgrade options have been provided in the mid-range and budget-friendly 5G categories. Canalys expects a moderate recovery in the Chinese smartphone market, which will likely continue next year.

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Optimize your semiconductor manufacturing process with Kensington Lab's Wafer Handling End Effector. Designed for high precision, it guarantees safe and accurate wafer transfers, enhancing both productivity and operational reliability. 👉 Request a Quote - http://bit.ly/3RJc3TO #Semiconductor #Automation #WaferHandling #EngineeringInnovation #Productivity

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#AI Deployment and #SupplyChain Recovery from High Inventory Levels to Drive a 20% Annual Growth in #Wafer Foundry Market Value by 2025, Says TrendForce Corporation TrendForce posits that the wafer #foundry market is expected to see a recovery in 2025, with an estimated annual growth of 20%—up from 16% in 2024. This positive outlook comes despite the weak end-market demand for #consumer products, which has led component #manufacturers to adopt a conservative stocking strategy and made the average capacity utilization rate of wafer foundries fall below 80% in 2024. Only advanced processes, such as 5/4/3nm nodes used for #HPC products and flagship #smartphones, have managed to maintain full capacity, and this situation is expected to persist into 2025. However, the visibility in the consumer end market remains low for 2025. In contrast, the #automotive and #industrial control #supplychains are beginning to recover from inventory corrections starting in the second half of 2024, with gradual restocking expected to resume in 2025. Coupled with the increase in wafer consumption per unit driven by #edge AI and the continued expansion of cloud AI infrastructure, these factors are projected to drive a 20% annual growth in the wafer foundry market value in 2025. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eXWFzE82 #semiconductormanufacturing #semiconductorindustry #technology #tech #it #ai #chip #chips #ic #icdesign #geopolitics #semiconductor

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 U.S. semiconductor manufacturing capacity is predicted to skyrocket by 203%! See below more info: The Semiconductor Industry Association (SIA) and the Boston Consulting Group (BCG) have released a report predicting a 203% growth in U.S. domestic semiconductor manufacturing capacity from 2022 to 2032, following the enactment of the CHIPS and Science Act. This is the largest projected increase globally. The U.S. is also expected to grow its share of advanced logic manufacturing to 28% of global capacity by 2032, up from 0% in 2022. The report suggests that the CHIPS incentives are set to revitalize U.S. semiconductor manufacturing and strengthen U.S. chip supply chains. It also highlights the need for policy actions to further strengthen supply chains, support R&D and chip design, grow the semiconductor workforce, and ensure maximum benefits from the CHIPS Act. The U.S. is projected to capture over one-quarter (28%) of total global capital expenditures from 2024-2032, ranking second only to Taiwan. Without the CHIPS Act, the U.S. would have captured only 9% of global capex by 2032. The report also emphasizes the importance of ensuring chip companies have open access to global customers and suppliers. It warns of potential supply chain risks due to non-market-based investments resulting from incentive programs and large-scale industrial policies. The report also notes the concerted efforts by governments and companies worldwide to increase resilience in the semiconductor industry. The U.S. CHIPS Act committed $39 billion in incentives for semiconductor manufacturing, and companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states, totaling nearly $450 billion in private investments. These projects are expected to create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs. Despite these advancements, the report calls for additional government policy actions to address lingering supply chain vulnerabilities and to ensure America’s continued growth in the semiconductor industry. #interesting #technology #innovation #semiconductor ASML SK hynix Samsung Electronics Micron Technology SMIC Intel Corporation Lam Research TSMC

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One of the most exciting developments in semiconductor technology is TSMC's CoWoS (Chip-on-Wafer-on-Substrate) advanced packaging solution. CoWoS integrates chips such as GPUs and HBM modules on a silicon interposer, which is then mounted on a substrate. This sophisticated 2.5D and 3D packaging technology allows for higher I/O density and better electrical performance, significantly reducing signal delay and increasing bandwidth. It represents a significant shift from traditional process node scaling to innovative packaging techniques, addressing the need for higher performance in applications like AI. Despite the rapid advancements, the substrate remains a critical challenge, particularly for AI server with higher thermal design power. What is CoWoS: CoWoS Advanced Packaging: CoWoS (Chip-on-Wafer-on-Substrate) is an advanced semiconductor packaging technology developed by TSMC. It involves two stages: Chip-on-Wafer (CoW) and Wafer-on-Substrate (WoS), enabling 2.5D or 3D chip integration for enhanced performance. Structure and Process: CoWoS integrates chips like GPU and HBM modules on a silicon interposer, which is then mounted on a substrate. This process involves creating fine copper-filled vias in the interposer to connect upper and lower chip layers, improving signal transmission efficiency. Performance Enhancement: The technology addresses the limitations of traditional scaling by enabling higher I/O density and better electrical performance, crucial for advanced applications such as AI. It reduces signal delay and increases bandwidth by minimizing the distance between chips. Industry Impact: CoWoS is part of the semiconductor industry's shift from merely shrinking process nodes (e.g., 7nm, 5nm) to innovating packaging techniques, driven by the slowing pace of process node advancements and increasing demand for higher chip performance. Challenges and Development: Despite its advantages, CoWoS faces challenges in terms of technical maturity, stability of chip stacking, and heat dissipation. These challenges impact production yield and capacity, but ongoing advancements are expected to address these issues over time. #Semiconductor #Technology #Innovation #AI #CoWoS #TSMC #Nittobo #GlassFiber #AdvancedPackaging #Tglass #NEglass #NE #NER

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Global total #semiconductor equipment sales forecast to reach record $109 Billion in 2024, SEMI reports 💡🤩 Global sales of total #semiconductormanufacturing equipment by original equipment manufacturers are forecast to set a new industry record, reaching $109 billion in 2024, growing 3.4% year-on-year, #SEMI announced in its Mid-Year Total #Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2024. Semiconductor manufacturing equipment growth is expected to continue in 2025, with sales forecast to set a new high of $128 billion in 2025, driven by both the front-end and back-end segments. “The growth in total semiconductor manufacturing equipment sales already underway this year is forecast to be followed by a robust expansion of roughly 17% in 2025,” said Ajit Manocha, SEMI president and CEO. “The global #semiconductorindustry is demonstrating its strong fundamentals and growth potential supporting the diverse range of disruptive applications emerging from the #ArtificialIntelligence wave.” Thanks again to SEMI for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e-qw7rTR #semiconductors #chip #chips #manufacturing #geopolitics #it #mobile #ai #smartphone #computer #ai #aiot #foundry #usa #europe #taiwan #japan #china #computing #datacenter #technology #innovation #ic

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HBM3e 12-Hi Faces Yield Challenges Amidst #Oversupply Concerns 🤔 As we look ahead to 2025, the market is increasingly wary of a potential oversupply of High Bandwidth Memory (#HBM), particularly #HBM3e 12-Hi. #TrendForce reports that while major manufacturers like #Samsung, #SKhynix, and #Micron have submitted initial #HBM3e 12-Hi samples, uncertainties remain regarding their ability to ramp up production and achieve #stable #yields amidst a steep learning curve. 📉 With Samsung planning a 40% increase in #TSV #production by the end of 2025, and #SKhynix targeting a 25% boost, the aggressive capacity #expansions by #DRAM #suppliers raise the specter of #oversupply and declining prices if validation milestones are not met. Historically, achieving stable yields for HBM products has required extensive learning time, making the outlook for HBM3e 12-Hi production particularly uncertain. 🧠 The implications of a potential #HBM #bubble could be significant for #memory #suppliers. If the market #oversaturates, older-generation products like #HBM2e may face steep price declines, impacting suppliers who have a heavier reliance on these products. Additionally, suppliers focused on high-margin products may find their revenue streams threatened as competitive pressures intensify. Given that over 80% of HBM demand in 2025 is expected to come from HBM3e, the successful validation and production ramp-up will be critical for suppliers to maintain profitability. If the learning curve proves too steep or validation fails, the ramifications could ripple through the entire DRAM market, leading to a reassessment of capacity expansions and #strategic #investments. 📊 Ultimately, the trajectory of the HBM market hinges on the ability of key players to navigate these challenges, and the potential oversupply scenario could reshape strategies for memory suppliers in the evolving semiconductor landscape. #HBM #Semiconductors #DRAM #MarketTrends #MemorySuppliers #Technology #CapacityExpansion #AI #Innovation #TrendForce https://lnkd.in/duhsAaK3

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Check out this technical article on the difference between CMOS Switches and Solid-State Relays Learn more: https://ow.ly/eIoA50U54T4 #cmos #switch #relays #semiconductor #switching #mosfet #battery #thyristor #powerelectronics #powermanagement

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In the current rapidly evolving electronics industry, there is an increasing demand for high-performance #MOSFETs. With its superior specifications and robust design, the new Maspower Semiconductor MS2N350HGC0 #MOSFET stands out as an innovative solution for a wide range of high-voltage applications. With a maximum drain-source voltage of 3500V and a continuous drain current of 2A, it is capable of withstanding the high voltage applications on the market.

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