James Swonger’s Post

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Owner / President / Chief Everything Officer at UltraSemi LLC

US Domestic IC Assembly - Enhanced Plastic - Old School? Working on a driver IC for space applications at high pin-pin voltage, I find no onshore options besides QFNs with too-fine lead pitch for the voltage. Given low market volumes a custom package development is not a great plan. I'm liking the older quad J-lead / gullwing for their compliant leads (board flex @ shock/vibe or launch, etc.). Only find these at overseas OSAT houses in my searching thus far. Do you like, or fear, hard body non-leaded packages in your application, qualification and launch environment? Could use some insights from the likely users of such a part or those who've gone down this road. Call it 250V pin-pin. Can I count on a general practice of conformal coating which would (in theory) raise the pin-pin potential (volts/distance) suitably (and are the basic PCB creepage specs, all there is to it?) or is New Space so much about cost, that this treatment might be skipped? Based on what you know about board construction, what't your "happy place" for max volts per mm or mil, continuous (VIN) and pulsed (SW)? I'm thinking a 50-mil pitch leaded package (can't see any QFNs at that pitch) might be the answer but would really like to stay onshore. And the whole bit about leaded vs unleaded, I've got mostly old ideas based on hermetic package back-end and strategic systems thermal & mechanical. Anybody know of any legit, space grade, onshore, old school leadframes, good MSL mold compound service providers? I know it's not asking much.

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