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RF PCB Design Guidelines You Must Know

Introduction

Designing printed circuit boards for radio frequency (RF) applications

requires special considerations to ensure proper performance. At

microwave and mmWave frequencies, the properties and layout of PCB

materials have a major impact on parameters like loss, impedance control,

and signal integrity.

This guide covers key RF PCB design guidelines and best practices.

Following these will help RF boards achieve target behavior in terms of

losses, spurious signals, power transfer, and other critical high

frequency characteristics. We’ll examine stackup arrangements, layout

techniques, grounded coplanars, material selection, simulations, and

more.

Properly incorporating sound RF design principles results in PCBs

delivering reliable, repeatable performance across fabrication variations

and a wide array of operating conditions. Avoid surprises late in the

development cycle by understanding these essential RF design guidelines

up front.

Stackup Arrangement

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A properly planned layer stackup forms the foundation of any high

performance RF PCB layout:

Use Thin Dielectrics

At higher frequencies, a thinner dielectric allows tighter impedance

control and reduced loss per inch. Typical RF dielectrics are 2 to 4 mils

thick.

Orient Core Grain Direction

Alternate the dielectric grain direction in subsequent cores to equalize

dimensional stability. This prevents skewing during lamination.

Include Ground Planes

Ground planes provide an ideal continuous RF return path and shielding.

Place them strategically to isolate different signals.

Embed Controlled Impedances

Sandwich controlled impedance traces between ground planes to

enhance tuning and shielding.

Model Before Finalizing

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Model the stackup in your RF simulation tool and optimize before

committing to a configuration. Tweak dielectrics, copper weights, and

arrangements as needed to refined the design.

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Transmission Lines

PCB Transmission Lines

Transmission lines like microstrips and striplines carry high frequency

signals across a PCB:

Matched Impedance

Use controlled impedance lines matched to system impedance (typically

50 ohms) to minimize losses.

Short Stub Lines

Keep stubs short to avoid unwanted capacitive coupling. Use vertical

transitions where changes are unavoidable.

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Smooth Wave Impedance

Taper impedance gradually over longer lengths for impedance matching

and reduced reflections.

Terminate Lines

Properly terminate lines in their system impedance at the load end to

prevent reflections from discontinuities.

Reflection-Free Bends

Avoid 90 degree bends. Use arc or mitered 45 degree bevels to reduce

discontinuities in the wave impedance.

Coupled Lengths

When coupling lines, tightly control the gap and length ratio to achieve

target coupling factors.

Careful application of transmission line theory is critical to RF PCB

performance.

Grounded Coplanar Waveguides

Grounded coplanar waveguides involve placing signal traces between

ground planes on the same layer. Benefits include:

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 Excellent shielding and isolation

 Permits closer packing density

 Reduces radiation losses

 Allows easy shielding vias to ground

 Supports high frequency millimeter-wave signals

Use coplanar techniques where stripline or microstrip won’t suffice for

shielding or density needs.

Passive Components

RF passives require special attention during layout:

Place Near ICs

Keep passives physically close to their driving IC pins to avoid long stub

traces.

Orient Perpendicular

Wherever possible, orient inductors and capacitors perpendicular to their

attached traces. This avoids parasitics.

Flood Ground Around

Provide a flood ground fill around all passive components. This shields

noise coupling and maintains low inductance.

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Watch Spacing

mind spacing around passives to avoid coupling between components.

Model Libraries

Use vendor 3D models or EM-based parasitic models for passives for

optimal simulation accuracy.

Careful passive layout minimizes parasitic effects that impair frequency

response.

Material Selection

Choosing suitable PCB materials is crucial for achieving target RF

performance. Key considerations include:

Dielectric Constant

Select a dielectric constant to ensure proper impedance. Variability risks

impedance mismatches.

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Loss Tangent

Lower loss materials like PTFE reduce insertion losses for greater range

and efficiency.

Moisture Absorption

Lower absorption coefficients minimize performance degradation in

humid conditions.

Thermal Properties

Manage lamination stresses and match expansion coefficients to avoid

electrical issues from physical warping.

Lead-Free Assembly

Use high Tg materials compatible with lead-free assembly processes

necessary for commercial products.

Availability

Choose readily available materials with multiple qualified laminators to

control supply chain risks.

There are always tradeoffs to weigh when selecting RF laminates.

Copper and Finishes

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Like dielectrics, carefully selecting conductor materials enhances RF

response:

Copper Weights

Heavier copper above 2 oz enables better power handling and low loss

performance.

Rolled or Electrodeposited

Electrodeposited copper foils tend to provide smoother surface finishes.

Surface Roughness

Smooth copper foil reduces conductor losses at high frequencies due to

skin effects.

Final Finish

Immersion silver or gold provide excellent surface conductivity while

slowing tarnishing.

Plating Buildup

For heavy power traces, electroplated copper increases conductor

thickness over foil alone.

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Thermal Management

PCB thermal resistance

Poor thermal performance impacts RF PCBs through:

 Electrical parameter variations with temperature

 Mechanical warping inducing stress

 Accelerated aging and material breakdown

Use Thermal Vias

Place thermal vias under hot components allowing heat conduction to

inner and bottom layers.

Flood Planes

Use thick copper plane layers as heat spreaders where possible.

Heatsinks

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Add localized heatsinks under high power devices if needed.

Air Flow

Permit sufficient air flow for convection cooling during enclosure design.

Thermal Modeling

Model thermal performance early to identify hotspots and refine layouts.

Proper thermal design prevents fluctuations and damage over the

operating life.

Simulations

Accurately simulating RF boards requires using the appropriate tools:

EM Simulators

Full wave 3D EM simulation captures complex energy interactions

between components.

Parasitic Extractors

Model detailed parasitic characteristics caused by pads, vias, traces, and

ground planes.

Material Models

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Leverage available laminate material models from manufacturers

capturing frequency dependent performance.

PCB PDN Analysis

Analyze common and differential path impedances to predict noise

coupling on board.

S-Parameters

Use s-parameters for components to capture frequency-based

input/output behavior.

TDR Modeling

Time domain TDR simulation validates impedance control and dispersion.

Matching simulations to real measured results builds confidence in the

PCB layout.

Conclusion

Following sound RF design principles enables PCBs operating reliably at

microwave and mmWave frequencies. Paying attention to stackup

arrangements, layout techniques, material selections, simulations, and

other best practices prevents nasty surprises late in the development

cycle. While RF design requires meticulous care, the methodical

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application of these guidelines results in high performance boards

meeting their operating goals across all conditions.

Frequently Asked Questions

Q: At what frequency do RF design considerations for PCBs start to

become necessary?

A: Most experts recommend treating any design over 1 GHz as an RF

layout. However, techniques help even at a few hundreds MHz.

Q: What are some key software tools used for RF PCB design and

simulation?

A: Popular options include Cadence Allegro, Mentor Xpedition, Keysight

ADS, Ansys HFSS, and Altium.

Q: What are typical stackup layer counts for RF PCB designs?

A: High frequency boards trend towards 4-16 layers. This enables

embedding controlled impedances between ground planes while avoiding

overly thick dielectrics.

Q: How are impedance matched interconnects created on PCBs?

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A: Carefully engineering the trace geometry and dimensions along with

dielectric height relative to ground maintains target impedance like 50

ohms across a route.

Q: What are some common RF PCB laminate materials?

A: Popular options

include Rogers RO4000, Taconic RF-35, Isola IS680, Arlon CLTE, and PTFE

composites. These provide tightly controlled dielectric constants.

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1. All You Should Know about HDI PCB Design Guidelines

2. PCB Design Guidelines For EMI EMC

3. 2oz Copper PCB Thickness and its Design Guidelines

4. GPS PCB Design Guidelines and its Importance in Todays Age

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