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    Thermal Management Considerations For PCBS: Measurement Techniques and Heat Conduction

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    Kishore Bhat
    The document discusses thermal management considerations for PCBs including measurement techniques, thermal resistance calculations, and factors that affect heat transfer. It also describes Apple apps for thermal engineers and thermal analysis software.

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    Thermal Management Considerations For PCBS: Measurement Techniques and Heat Conduction

    Uploaded by

    Kishore Bhat
    115 views37 pages
    The document discusses thermal management considerations for PCBs including measurement techniques, thermal resistance calculations, and factors that affect heat transfer. It also describes Apple apps for thermal engineers and thermal analysis software.

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    PCB Thermal Considerations-1

    Original Title

    PCB Thermal Considerations-1

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    The document discusses thermal management considerations for PCBs including measurement techniques, thermal resistance calculations, and factors that affect heat transfer. It also describes Apple apps for thermal engineers and thermal analysis software.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    115 views37 pages

    Thermal Management Considerations For PCBS: Measurement Techniques and Heat Conduction

    Uploaded by

    Kishore Bhat
    The document discusses thermal management considerations for PCBs including measurement techniques, thermal resistance calculations, and factors that affect heat transfer. It also describes Apple apps for thermal engineers and thermal analysis software.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPT, PDF, TXT or read online from Scribd
    Download as ppt, pdf, or txt
    of 37

    Thermal Management Considerations for PCBs

    Measurement techniques and heat conduction


    Dr Graham Berry

    Apple Apps for Thermal Engineers

    Gear1-Convection is comprised of three natural convection and three forced convection calculators. It is a visual application designed for touch-based interaction. This provides an instant sensitivity analysis to determine which parameters are the most important.

    Gear2-Materials is an encyclopedia in your pocket for ThermoPhysical properties of over 1,300 materials. These properties include: Density, Specific Heat, and Thermal Conductivity.

    Gear3-Finishes is an encyclopedia in your pocket for Thermo-Physical surface properties of hundreds of materials. If you need properties for Asphalt Shingles, Second Surface Silvered Teflon. or even a Deciduous Forest, you can find it here!

    Thermal Resistance

    TSP Method (temperature sensitive parameter) Meets military specifications Use forward voltage drop of calibrated diode to measure change in Tj due to known power dissipation

    Thermal resistance calculation

    Recall formula for junction temperature: TJ = (PD x qJA) + TA

    Rearranging equation, thermal resistance calculated by:


    qJA=DTJ/PD=TJ-TA/PD

    where TJ is junction temp, TA is ambient temp and PD is power dissipation

    TSP Calibration

    TSP diode calibrated in constant temperature oil bath, measured to 0.1C Calibration current low to minimise selfheating Normally performed at 25C and 75C

    Temperature coefficient

    Temperature coefficient known as K-factor Calculated using K=T2-T1/VF2-VF1 at constant IF where:


    K=Temperature coefficient (C/mV) T1,2 = lower and higher test temperatures (C) VF1,F2=Forward voltage at IF and T1,2 IF=Constant forward voltage measurement current

    Calibration graph

    K-factor measured from inverse of slope

    Thermal resistance measurement

    Constant voltage and constant current pulses applied to test device Constant current pulse is same value as used to calibrate TSP diode This is used to measure forward voltage Constant voltage pulse used to heat test device

    Thermal resistance measurements

    Constant voltage (heating) pulse much longer than constant current (measurement) pulse to minimise cooling during measurement Typically >99:1ratio

    Thermal resistance measurements

    Measurement cycle starts at ambient temperature Continues until steady state reached, i.e. thermal equilibrium

    Thermal resistance measurements

    Thermal resistance calculated by: qJA=DTJ/PD=K(VFA-VFS)/VH IH where:


    VFA=forward voltage of TSP at ambient temp (mV) VFS=Forward voltage of TSP at equilibrium (mV) VH=Heating voltage (V) IH=Heating current (A)

    Test ambient

    Measurement of qJA Devices soldered to special thermal resistance test boards 8-9 mil (200-225m) standoff from board Placed in box of known volume (1cu ft if youre American!) Temperature rise measured

    Air flow tests


    Ambient test can also use moving air Air flow passed over device at known constant rate Required for calculations involving active cooling (Lecture 2) Similar setup to static ambient test

    Test setups
    Test device on board

    Air flow test setups

    qJC Tests

    Test device held against an infinite heatsink This comprises a massive, water-cooled copper block, kept at 20C In this way, qCA (case-ambient) is very close to zero, so any measurement is purely qJC (junction-case)

    qJC Tests

    SO devices mounted with bottom of package against heatsink, using thermal grease for good conductivity PLCC devices mounted upside down, with top of package against heatsink Spacer used on bottom side to prevent heat loss from here

    PLCC qJC test setup

    qJC data

    Power dissipation has an effect on thermal resistance Must be considered when calculating cooling requirements

    Other factors affecting qJC


    Recall from Lecture 1: Leadframe design, pad size Larger pads reduce thermal resistance for given die size Leadframe material - Alloy 42 or copper

    qJA data

    Air flow also affects qJA Important consideration for forced-air cooling

    Heatsinks

    Purpose of a heatsink is to conduct heat away from a device Made of high thermal conductivity material (usually Al, Cu) Increased surface area (fins etc) helps to remove heat to ambient Interface between heatsink and device important for good thermal transfer

    Interface roughness

    Surface roughness at interface between two materials makes a huge difference to thermal conductivity Various different contact configurations on microscopic scale

    Surface roughness

    Surface roughness

    Air gaps act as effective insulators Need some interstitial filler Many types available, including greases, elastomers, adhesive tapes Seen by consumers e.g. in PC processor heatsink/fan kits

    Interstitial filler materials

    Solid interfaces

    Conforming rough surfaces can have high conductivity:

    Effect of contact pressure

    Heat Conduction in a PCB

    PCB is layered composite of copper foil and glass-reinforced polymer (FR4)

    Heat conduction in PCB

    Can treat this layered structure as homogeneous material with two different thermal conductivities Heat flow within plane is kIn-plane Heat flow through thickness of plane is kThrough

    Conductivity Equations
    k t
    i 1 N N

    k In plane

    i i

    t
    k Through
    i 1 N i i 1

    t
    i 1

    t /k

    where t is thickness of given layer and k is thermal conductivity of that layer

    Sample results

    Total PCB thickness is 1.59mm PCB comprises only copper and FR4 layers kof copper is 390 W/mK kof FR4 is 0.25 W/mK

    Sample results

    Conclusions from results

    Even for thin copper layers, kIn-plane is much greater than kThrough As FR4 has very low thermal conductivity, a continuous copper layer will dominate heat flow Because of this, thermal conduction is not efficient where no continuous copper path exists

    Refining calculations

    Trace (signal-carrying) copper layers have much less effect on heat transfer than planes Trace layers can normally be excluded from calculations If required, conductivity of trace layer can be calculated from k i f ikCu where fi is fractional copper coverage

    Summary

    TSP Method for measuring junction temperatures Thermal resistance test methods - junction-air and junction-case Effects of power dissipation and airflow on thermal resistance Interface resistance Use of interstitial materials to decrease this

    Summary

    Heat conduction in copper-clad PCB dominated by in-plane transfer Trace layers have only a small contribution to total conduction FR4 is a good insulator!

    Thermal Analysis Software

    PCAnalyze is an engineering application used to mathematically model and predict the thermal behavior of printed circuit assembly (PCA) designs. Component placement, cooling strategies, or "worst case" conditions can be quickly evaluated using this software. PCAnalyze will calculate the temperature of the board and its individual components, using its integrated steady state and transient solver. This is the same solver used in the TAK2000 Pro thermal analyzer. PCAnalyze is a stand-alone application with its own built-in solver. No third-party compiler, linker, or graphics package is required.

    http://www.pcanalyze.com/product.htm

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