EMI-EMC - SHORT Q and A
EMI-EMC - SHORT Q and A
EMI-EMC - SHORT Q and A
1. Define EMI/EMC
EMI: Electromagnetic interference is the degradation in the performance of a device or
equipment or a system caused by an electromagnetic disturbance.
EMC: Electromagnetic compatibility is making system /equipment/circuit compatible
and immune to sustain the electromagnetic interference and to avoid the degradation in
the performance of a device or equipment or a system caused by an electromagnetic
disturbance.
2. Give some examples of EMI
1. What is grounding?
Grounding is a technique that provides a low resistance path between electrical or
electronic equipment and the earth or common reference low impedance plane to
bypass fault current or EMI signal.
2. What are the precautions used in earthing for EMC?
i. Moisturization ii. Chemical salting iii.
Cathode protection iv. Material, size, coatings
and method of bonding.
3. What is single point grounding? In this each subsystem is grounded to separate
planes (structural grounds, signal grounds shield grounds, AC primary and secondary
power grounds
4. What is multi point grounding?
In this scheme, every equipment is heavily bonded to a solid ground conducting
plane which is then earthed for safety purpose.
5. What is hybrid grounding?
In this scheme, the ground appears as a single point ground at low frequencies
and a multi point ground at high frequencies.
In this shielding, where there are n-number os shields of impedances z1, z2,..
zm including both metals and air gaps. The total reflection loss can be expressed as the
sum of the reflection losses at earth interface.
10. What is isolated double shield?
In a big shielding enclosure, a very high shielding is normally provided with
double isolated conducting metal sheets separated by an inner core made up of dry
plywood.
11. What is shielding?
17. What are the factors that influence the EMI performance of bonding?
i. Generation of intermediation products because of nonlinear effects at
contacts between similar and dissimilar metals. ii. Development of
potential differences caused by DC and AC resistances and inductance
of a given length of the bond strap.
iii. Adverse impedance response because of resonance of inductance and the
residual capacitance of the bond strap.
18. Write in brief how opto-isolator is used to control EMI.