SY8201

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Application Notes: AN_SY8208A


High Efficiency Fast Response
8A Continuous, 16A Peak, 28V Input
Synchronous Step Down Regulator

General Description Features


The SY8208A develops a high efficiency synchronous • Low RDS(ON) for internal switches (top/bottom):
step-down DC-DC regulator capable of delivering 8A 20/10 mΩ
continuous, 16A peak current. The SY8208A operates • Wide input voltage range: 4-28V
over a wide input voltage range from 4V to 28V and • Instant PWM architecture to achieve fast transient
integrates main switch and synchronous switch with responses
very low RDS(ON) to minimize the conduction loss. • Internal 400uS softstart limits the inrush current
• Pseudo-constant frequency: 800kHz.
The SY8208A adopts the instant PWM architecture to • 8A continuous/16A peak output current capability
achieve fast transient responses for high step down
• ±1.5% 0.6V reference
applications and high efficiency at light loads. In
• Programmable peak current limit
addition, it operates at pseudo-constant frequency of
800kHz under continuous conduction mode to • Power good indicator
minimize the size of inductor and capacitor. • Output discharge function
• Short circuit latch off protection
• Over voltage latch off protection
Ordering Information • Input UVLO
SY8208 □(□□)□ • Over temperature protection
Temperature Code • RoHS Compliant and Halogen Free
Package Code • Compact package: QFN3x3-10
Optional Spec Code
Temperature Range: -40°C to 85°C
Ordering Number Package type Note
Applications
SY8208AQNC QFN3x3-10 -- • LCD-TV/Net-TV/3DTV
• Set Top Box
• Notebook
• High Power AP

Typical Applications

VIN
IN
CIN
10uF
GND
PG PG (Open Drain Output)

BS CBS
High/Floating/Low ILMT 100nF
VOUT=3.3V
ON/OFF EN LX
L 1.5uH R1 COUT
C1
100k 22uF×3
220pF
CVCC VCC FB
2.2uF R2
22.1k

Figure 1 Schematic Figure 2. Efficiency

AN_SY8208A 1
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AN_SY8208A
Pinout (top view)

(QFN3x3-10)
Top Mark: MRxyz, (Device code: MR, x=year code, y=week code, z= lot number code)
Pin Name Pin Number Pin Description
EN 1 Enable control. Pull this pin high to turn on the IC. Do not leave this pin floating.
Power good Indicator. Open drain output when the output voltage is within 90% to
PG 2
120% of regulation point.
Current limit setting pin. The current limit is set to 8A, 12A or 16A when this pin
ILMT 3
is pull low, floating or pull high respectively.
Output Feedback Pin. Connect this pin to the center point of the output resistor
FB 4 divider (as shown in Figure 1) to program the output voltage:
Vout=0.6*(1+R1/R2)
5 Internal 3.3V LDO output. Power supply for internal analog circuits and driving
VCC
circuit. Bypass a capacitor to GND.
Boot-Strap Pin. Supply high side gate driver. Decouple this pin to LX pin with
BS 6
0.1uF ceramic cap.
IN 7,8 Input pin. Decouple this pin to GND pin with at least 10uF ceramic cap
GND 9 Ground pin
LX 10 Inductor pin. Connect this pin to the switching node of inductor

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AN_SY8208A
Absolute Maximum Ratings (Note 1)
IN, LX, PG, EN ------------------------------------------------------------------------------------------------------------------ 30V
BS-LX, FB, ILMT, VCC -------------------------------------------------------------------------------------------------------- 4V
Power Dissipation, PD @ TA = 25°C QFN3x3-10 -----------------------------------------------------------------------3.3W
Package Thermal Resistance (Note 2)
θ JA -----------------------------------------------------------------------------------------------------------------30°C/W
θ JC ---------------------------------------------------------------------------------------------------------------- 4°C/W
Junction Temperature Range ------------------------------------------------------------------------------------------------ 125°C
Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------------------------ 260°C
Storage Temperature Range -------------------------------------------------------------------------------------- -65°C to 150°C
Dynamic LX voltage in 50ns duration --------------------------------------------------------------------- IN+3V to GND-4V

Recommended Operating Conditions (Note 3)


Supply Input Voltage ---------------------------------------------------------------------------------------------------- 4V to 28V
Junction Temperature Range ------------------------------------------------------------------------------------- -40°C to 125°C
Ambient Temperature Range -------------------------------------------------------------------------------------- -40°C to 85°C

Block Diagram

AN_SY8208A 3
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AN_SY8208A
Electrical Characteristics
(VIN = 12V, VOUT =5V, COUT = 100uF, TA = 25°C, IOUT = 2A unless otherwise specified)

Parameter Symbol Test Conditions Min Typ Max Unit


Input Voltage Range VIN 4.0 28 V
Quiescent Current IQ IOUT=0, 100 µA
VFB=VREF*105%
Shutdown Current ISHDN EN=0 3 10 µA
Feedback Reference VREF 0.591 0.6 0.609 V
Voltage
FB Input Current IFB VFB=4V -50 50 nA
Top FET RON Rds(on)1 20 mΩ
Bottom FET RON Rds(on)2 10 mΩ
Discharge FET RON Rdis 50 Ω
Bottom FET Current ILIM ILMT=’0’ 8
Limit ILMT=Floating 12 A
ILMT=’1’ 16
ILMT Rising Threshold VILMTH Vcc-0.8 VCC V
ILMT Falling Threshold VILMTL 0.8 V
Soft Start Time TSS 400 µS
EN Rising Threshold VENH 0.8 V
EN Falling Threshold VENL 0.4 V
Input UVLO Threshold VUVLO 3.9 V
UVLO hysteresis VHYS 0.3 V
Oscillator Frequency FOSC Vo=5V 0.68 0.8 0.92 MHz
Min ON Time TON,MIN VIN=VINMAX 50 ns
Min OFF Time TOFF,MIN 80 ns
VCC Output VCC VIN=4V 3.2 3.3 3.4 V
Output Over Voltage VFB Rising 115 120 125 %VREF
Threshold
Output Over Voltage 2 %VREF
Hysteresis
Output Over Voltage 20 us
Delay Time
Power Good Threshold VFB Rising (Good) 88 90 92 %VREF
Power Good Hysteresis 2 %VREF
Power Good Delay Time 10 us
Thermal Shutdown TSD 150 °C
Temperature
Thermal Shutdown THYS 15 °C
hysteresis
Note 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability

Note 2: θ JA is measured in the natural convection at TA = 25°C on a four-layer Silergy Evaluation Board..
Note 3: The device is not guaranteed to function outside its operating conditions.

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AN_SY8208A
Typical Performance Characteristics
Efficiency vs. Load Current Efficiency vs. Load Current
100 100

90 90

80 80

70 70

60 60

50 50
VIN=5.0V,VOUT=3.3V
VIN=7.4V,VOUT=5.0V
40 40 VIN=12V,VOUT=3.3V
VIN=12V,VOUT=5.0V
VIN=19V,VOUT=3.3V
VIN=19V,VOUT=5.0V
30 30 VIN=28V,VOUT=3.3V
VIN=28V,VOUT=5.0V

20 20
0.001 0.01 0.10 1.00 10.00 0.001 0.01 0.10 1.00 10.00

Load Current (A) Load Current (A)

Efficiency vs. Load Current Efficiency vs. Load Current


95 95

85 85

75 75

65 65

55 55

45 45
VIN=5.0V,VOUT=1.8V VIN=5.0V,VOUT=1.2V
35 VIN=12V,VOUT=1.8V 35 VIN=12V,VOUT=1.2V
VIN=19V,VOUT=1.8V VIN=19V,VOUT=1.2V
25 VIN=28V,VOUT=1.8V 25 VIN=28V,VOUT=1.2V

15 15
0.001 0.01 0.10 1.00 10.00 0.001 0.01 0.10 1.00 10.00

Load Current (A) Load Current (A)

Load Transient Load Transient


(VIN=12V, VOUT=5V, ILOAD=0.8-8A) (VIN=12V, VOUT=5V, ILOAD=2-6A)

∆VOUT 100mV/div ∆VOUT 100mV/div

IL 2A/div

IL 5A/div

Time (200µs/div) Time (200µs/div)

AN_SY8208A 5
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AN_SY8208A
Startup from Enable Shutdown from Enable
(VIN=12V, VOUT=5V, ILOAD=8A) (VIN=12V, VOUT=5V, ILOAD=8A)

EN 5V/div EN 5V/div

VLX 10V/div

VLX 10V/div

VOUT 5V/div

VOUT 5V/div

IL 5A/div IL 5A/div

Time (400µs/div) Time (400µs/div)

Startup from VIN Shutdown from VIN


(VIN=12V, VOUT=5V, ILOAD=8A) (VIN=12V, VOUT=5V, ILOAD=8A)

VIN 10V/div VIN 10V/div

VLX 10V/div VLX 10V/div

VOUT 5V/div VOUT 5V/div

IL 5A/div IL 5A/div

Time (4ms/div) Time (2ms/div)

Short Circuit Protection


(VIN=12V, VOUT=5V, ILMT floating, Null Load to Short)

VOUT 2V/div

IL 5A/div

Time (100µs/div)

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AN_SY8208A
Output Ripple
Output Voltage VS Frequency(Io=4A)
(VIN=12V, VOUT=5V, ILOAD=8A)
850

∆Vout(AC) 20mV/div 800

750

VLX 5V/div 700

650

600

550
IL 5A/div
500

450

400
0 1 2 3 4 5 6
Time (2µs/div)
Output Voltage(V)

AN_SY8208A 7
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AN_SY8208A
Operation Output capacitor COUT:
The output capacitor is selected to handle the output
The SY8208A develops a high efficiency synchronous
ripple noise requirements. Both steady state ripple and
step-down DC-DC regulator capable of delivering 8A
transient requirements must be taken into consideration
continuous, 16A peak current. The SY8208A operates
when selecting this capacitor. For most applications,
over a wide input voltage range from 4V to 28V and
an X5R or better grade ceramic capacitor greater than
integrates main switch and synchronous switch with
66uF capacitance can work well. The capacitance
very low RDS(ON) to minimize the conduction loss.
derating with DC voltage must be considered.
The SY8208A adopts the instant PWM architecture to
Output inductor L:
achieve fast transient responses for high step down
There are several considerations in choosing this
applications and high efficiency at light loads. In
inductor.
addition, it operates at pseudo-constant frequency of
1) Choose the inductance to provide the desired
800kHz under continuous conduction mode to
ripple current. It is suggested to choose the ripple
minimize the size of inductor and capacitor.
current to be about 40% of the maximum output
current. The inductance is calculated as:
Applications Information
VOUT (1 − VOUT /VIN, MAX )
Because of the high integration in the SY8208A IC, the L=
FSW × I OUT, MAX × 40%
application circuit based on this regulator IC is rather
simple. Only input capacitor CIN, output capacitor COUT,
where Fsw is the switching frequency and IOUT,MAX is
output inductor L and feedback resistors (R1 and R2)
the maximum load current.
need to be selected for the targeted applications
The SY8208A regulator IC is quite tolerant of different
specifications.
ripple current amplitude. Consequently, the final choice
of inductance can be slightly off the calculation value
Feedback resistor dividers R1 and R2:
without significantly impacting the performance.
Choose R1 and R2 to program the proper output voltage.
2) The saturation current rating of the inductor must
To minimize the power consumption under light loads,
be selected to be greater than the peak inductor
it is desirable to choose large resistance values for both
current under full load conditions.
R1 and R2. A value of between 10kΩ and 1MΩ is
highly recommended for both resistors. If Vout is 3.3V,
VOUT(1-VOUT/VIN,MAX)
R1=100k is chosen, then using following equation, R2 ISAT, MIN > IOUT, MAX +
can be calculated to be 22.1k: 2 ⋅ FSW ⋅ L
VOUT
3) The DCR of the inductor and the core loss at the
0.6V R1
R2 = R1 . 0.6VFB
switching frequency must be low enough to
VOUT − 0.6V achieve the desired efficiency requirement. It is
R2
desirable to choose an inductor with DCR<10mΩ
GND
to achieve a good overall efficiency.

Input capacitor CIN: Current limit setting


The ripple current through input capacitor is calculated The current limit is set to 8A, 12A or 16A when ILMT
pin is pull low, floating or pull high respectively.
as:
I = I ⋅ D(1 − D) .
CIN _ RMS OUT Soft-start
The SY8208A has a built-in soft-start to control the
To minimize the potential noise problem, place a rise rate of the output voltage and limit the input
typical X5R or better grade ceramic capacitor really current surge during IC start-up. The typical soft-start
close to the IN and GND pins. Care should be taken to time is 400us.
minimize the loop area formed by CIN, and IN/GND
pins. In this case, a 10uF low ESR ceramic capacitor is Enable Operation
recommended.

AN_SY8208A 8
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AN_SY8208A
Pulling the EN pin low (<0.4V) will shut down the may further speed up the load transient responses.
device. During shutdown mode, the SY8208A
shutdown current drops to lower than 10uA, Driving
the EN pin high (>0.8V) will turn on the IC again.

External Boostrap Cap


This capacitor provides the gate driver voltage for
internal high side MOSEFET. A 100nF low ESR
ceramic capacitor connected between BS pin and LX
pin is recommended.
Layout Design:
BS
The layout design of SY8208A regulator is relatively
CBS simple. For the best efficiency and minimum noise
100nF
problem, we should place the following components
LX close to the IC: CIN, CVCC L, R1 and R2.
1) It is desirable to maximize the PCB copper area
connecting to GND pin to achieve the best thermal and
VCC LDO noise performance. If the board space allowed, a
The 3.3V VCC LDO provides the power supply for ground plane is highly desirable.
internal control circuit. Bypass this pin to ground with
a 2.2uf ceramic capacitor. 2) CIN must be close to Pins IN and GND. The loop
area formed by CIN and GND must be minimized.
VCC

2.2uF 3) The PCB copper area associated with LX pin must


be minimized to avoid the potential noise problem.
.
4) The components R1 and R2, and the trace connecting
Power Good Indication to the FB pin must NOT be adjacent to the LX net on
PG is an open drain output. This pin is externally the PCB layout to avoid the noise problem.
pulled high when the FB voltage is within 90% to
120% of the internal reference voltage. Otherwise is 5) If the system chip interfacing with the EN pin has a
pulled low. high impedance state at shutdown mode and the IN pin
is connected directly to a power source such as a Li-Ion
Load Transient Considerations: battery, it is desirable to add a pull down 1Mohm
The SY8208A regulator IC adopts the instant PWM resistor between the EN and GND pins to prevent the
architecture to achieve good stability and fast transient noise from falsely turning on the regulator at shutdown
responses. In applications with high step load current, mode.
adding an RC network RFF and CFF parallel with R1

AN_SY8208A 9
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AN_SY8208A
QFN3x3-10 FC Package Outline Drawing

Top View Bottom View

Side View Recommended PCB Layout


(Reference only)
Notes: All dimension in MM and exclude mold flash & metal burr

AN_SY8208A 10

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