Silergy Corp SY8213FCC - C178246
Silergy Corp SY8213FCC - C178246
Silergy Corp SY8213FCC - C178246
Typical Applications
AN_SY8213 Rev. 0.9 Silergy Corp. Confidential- Prepared for Customer Use Only 1
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Pinout (top view)
Top Mark: AJYxyz (device code: AJY, x=year code, y=week code, z= lot number code)
Note 1: Stresses beyond the “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Note 2: θ JA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity
test board of JEDEC 51-3 thermal measurement standard. Paddle of SO8E packages is the case position for θ JC
measurement.
Note 3: The device is not guaranteed to function outside its operating conditions.
Efficiency (%)
Efficiency (%)
IL 2A/div
IL 2A/div
2 FSW L
To minimize the potential noise problem, place a
typical X5R or better grade ceramic capacitor really 3) The DCR of the inductor and the core loss at the
close to the PVIN and GND pins. Care should be taken switching frequency must be low enough to
to minimize the loop area formed by CIN, and achieve the desired efficiency requirement. It is
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desirable to choose an inductor with DCR<10mΩ responses. In applications with high step load current,
to achieve a good overall efficiency. adding an RC network RFF and CFF parallel with R1
may further speed up the load transient responses.
Soft-start
Connect a capacitor from softstart programming pin to
ground to program the softstart time.
Tss(ms)=Css(nF)*0.6(V)/10(uA)
Enable Operation
Pulling the EN pin low (<1.2V) will shut down the
device. During shutdown mode, the SY8213 Layout Design:
shutdown current drops to lower than 5uA, Driving the The layout design of SY8213 regulator is relatively
EN pin high (>1.3V) will turn on the IC again. simple. For the best efficiency and minimum noise
problem, we should place the following components
External Boostrap Cap close to the IC: CIN, CVCC L, R1 and R2.
This capacitor provides the gate driver voltage for 1) It is desirable to maximize the PCB copper area
internal high side MOSEFET. A 100nF low ESR connecting to GND pin to achieve the best thermal and
ceramic capacitor connected between BS pin and LX noise performance. If the board space allowed, a
pin is recommended. BS ground plane is highly desirable.
CBS
100nF 2) CIN must be close to IN and GND Pins. The loop
area formed by CIN and GND must be minimized.
LX
COUT CIN
R3
L BS PVIN
CBS
LX SVIN CSVIN
GND
EN VCC CVC
C
SS FB
Css R2 R1
C1
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1.55
1.27 TYP
5.80 - 6.120
2.55
5.40
0.25 - 0.50
4.80 - 5.00
0.00 - 0.25
0.25 base
1.30 - 1.60
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