APX9131A

Hall Effect Micro Switch IC

Features General Description

• Micro Power Operation for Battery Applications The APX9131A, integrated circuit, is an ultra-sensitive,
• Chopper Stabilized Amplifier pole independent Hall-effect switch with a latched digital
• Independent of North or South Pole Magnet, output. A 2.5 volt to 3.5 volt operation and an unique clock-
ing scheme reduce the average operating power
Easy for Manufacture
requirements, either a north or south pole of sufficient
• Small Size Package
flux will turn the output on; in the absence of a magnetic
• Lead Free and Green Devices Available
field, the output is off. The polarity independence and
(RoHS Compliant) minimal power requirement allow this device to be easily
replaced reed switch for superior for signal conditioning.
Advanced CMOS processing is used to take advantage of
Applications low-voltage and low-power requirements, SOT-23 pack-
age provided a optimized package for most applications.
• Micro Switch

• Handheld Wireless Application Wake Up Switch

Pin Configuration
• Clamp Shell Type Application Switch GND

• Magnet Switch in Low Duty Cycle Applications

APX9131A

VDD VOUT

SOT-23

Ordering and Marking Information

APX9131A Package Code

A : SOT-23
Assembly Material Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code Handling Code
Temperature Range TR : Tape & Reel
Assembly Material
Package Code G : Halogen and Lead Free Device

APX9131A A: X31X X - Date Code

Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.

Copyright  ANPEC Electronics Corp. 1 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Absolute Maximum Ratings (TA = 25°C unless otherwise noted)

Symbol Parameter Rating Unit

VDD Supply Voltage 5 V

VOUT Output Voltage 5 V

TJ Junction Temperature Range 150

°C
TSTG Storage Temperature Range -65 to +150

Electrical Characteristics (TA = 25°C, VDD=3V unless otherwise noted)

APX9131A
Symbol Characteristic Test Conditions Unit
Min. Typ. Max.

VDD Supply Voltage Range Operating 2.5 - 3.5 V

Average - 5 10 µA

IDD Supply Current Awake - 1.2 2 mA

Sleep - 2 8 µA

IOFF Output Leakage Current VOUT = 3.5V, BRPN<B<BRPS - - 1.0 µA

VOL Output Low Voltage ISINK = 1mA - 20 40 mV

tawake Wake Up Time - 180 - µs

tperiod Period - 60 - mS

d.c. Duty Cycle - 0.3 - %

fc Chopping Frequency - 11 - kHz

Magnetic Characteristics (TA = 25°C, VDD=3V unless otherwise noted)

APX9131A
Symbol Characteristic Test Conditions Unit
Min. Typ. Max.

BOPS 20 40 60 G
Operate Points
BOPN -60 -40 -20 G

BRPS 10 25 50 G
Release Points
BRPN -50 -25 -10 G

Bhys Hysteresis - 15 - G

Copyright  ANPEC Electronics Corp. 2 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Typical Operating Characteristics

Switching Points vs. Ambient Temperature Switching Points vs. Supply Voltage
80 60
BOPS
60
BOPS 40
40

Switching Points(G)
Switching Points(G)

20 BRPS
20
BRPS
0 0
BRPN BRPN
-20
-20
-40
BOPN -40
-60 BOPN

-80 -60
-40 -20 0 20 40 60 80 100 2.5 3 3.5 4 4.5 5

Ambient Temperature( C)o Supply Voltage(V)

Average Supply Current vs. Ambient Average Supply Current vs. Supply
Temperature Voltage
10 20
18
Average Supply Current (µA)

Average Supply Current (µA)

8 16
14
6 12
10
4 8
6
2 4
2
0 0
-40 -20 0 20 40 60 80 100 2.5 3 3.5 4 4.5 5
Ambient Temperature (oC) Supply Voltage(V)

Output Sink Current vs. Output Low Voltage

20
18 VDD=5V
16
Output Sink Current(mA)

VDD=4V
14
12
VDD=3V
10
8
6
4
2
0
0 0.2 0.4 0.6 0.8 1
Output Low Voltage(V)

Copyright  ANPEC Electronics Corp. 3 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Operating Waveforms

Output Switch Waveform Output Switch Waveform

VDD=3V
Output Sink Voltage (0.5V/div)

Output Sink Voltage (0.5V/div)

VDD=3V
RL=5.1kΩ
RL=5.1kΩ
CL=12pF
CL=12pF

VOUT=0.5V/div

VOUT=0.5V/div
0

Time (50µs/div) Time (2µs/div)

Pin Description
PIN
FUNCTION
NO. NAME
1 VDD Power Input
When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than
BOPN), the output turns on (output is low). When the magnetic field is below the release point BRPS
2 VOUT
(or above BRPN), the output turns off (output is high). It is designed with open drain configuration
and connecting a pull up resistor from VOUT to VDD is necessary. It cannot be floating.
3 GND Ground Connection.

Copyright  ANPEC Electronics Corp. 4 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Block Diagram

VDD

Awake & Sleep

Timing Logic

VOUT

Hall Plane
Dynamic Offset
Cancellation

Latch
Circuit

Chopper Hysteresis GND

Amplifier Control

Typical Application Circuit

50kΩ

VOUT VDD
+
APX9131A 2.5V-3.5V
0.1µF -
GND

SOT-23 (Top View)

Copyright  ANPEC Electronics Corp. 5 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Function Description

Operation Chopper Stabilized Technique

The output of APX9131A switches low (turns on) when in The chopper stabilized technique cancels the mismatch-
presence of strong flux density facing the marked side of ing of the hall element, the amplifier offset voltage and
package exceeds the operate point BOPS (or is less than temperature sensitive drift by the dynamic offset cancel-
BOPN). After turn-on, the output is capable of sinking up to lation and switched capacitor technique. This technique
1mA and the output voltage is low (turns on). In absence produces devices have an extremely stable Hall output
of flux density below the release point BRPS (or increased voltage, therefore, the magnetic switch points are stable.
above BRPN), the APX9131A output switches high (turns
off). The difference in the magnetic operated and released
point is the hysteresis (Bhys) of the device. This built-in
hysteresis allows clean switching of the output even in the
presence of external mechanical bouncing vibration and
electrical noise.

OUTPUT OFF
5V
MAX BOPN BOPS
OUTPUT VOLTAGE

BRPN BRPS OUTPUT ON

0
-B 0 +B
MAGNETIC FLUX

Pole-Independent

The pole-independent sensing technique allows for op-

eration with either a north or south pole magnet
orientation, enhancing the manufacturability of the device.
The state-of-the-art technology provides the same output
polarity for either pole in presence.

Awake & Sleep

Internal awake & sleep timing block circuit activates the
sensor for 180µs and deactivates it for the remainder of the
period (60ms). A short “awake” time allows for stabiliza-
tion prior to the sensor sampling and data latching on the
falling edge of the timing pulse. While in sleep cycle, the
output is latched in its previous state.

Copyright  ANPEC Electronics Corp. 6 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Application Information

It is strongly recommended that an external bypass ca-

pacitor be connected (in close to the Hall sensor) be-
tween the supply and the ground of the device to reduce
both external noise and noise generated by the chop-
per-stabilization technique. This is especially true due
to the relatively high impedance of battery supplies.The
output is an open drain output, it must be connected a pull-
up resistor to a supply voltage which is lower than 5V,
connect a 50kΩ resistor to VDD in common use.

Copyright  ANPEC Electronics Corp. 7 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Package Information
SOT-23

D
e

SEE
E1 VIEW A

b c

e1

0.25
A2

GAUGE PLANE
A1

SEATING PLANE
L
0

VIEW A

S SOT-23
Y
M MILLIMETERS INCHES
B
O
L MIN. MAX. MIN. MAX.
A 1.45 0.057
A1 0.00 0.15 0.000 0.006
A2 0.90 1.30 0.035 0.051
b 0.30 0.50 0.012 0.020
c 0.08 0.22 0.003 0.009
D 2.70 3.10 0.106 0.122
E 2.60 3.00 0.102 0.118
E1 1.40 1.80 0.055 0.071
e 0.95 BSC 0.037 BSC
e1 1.90 BSC 0.075 BSC
L 0.30 0.60 0.012 0.024
0 0° 8° 0° 8°
Note : Dimension D and E1 do not include mold flash, protrusions or gate
burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil
per side.

Copyright  ANPEC Electronics Corp. 8 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Carrier Tape & Reel Dimensions

OD0 P0 P2 P1 A

E1
F

W
B0

K0 A0 OD1 B A
B

SECTION A-A

T
SECTION B-B

d
H
A

T1

Application A H T1 C d D W E1 F
8.4+2.00 13.0+0.50
178.0±2.00 50 MIN. 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05
-0.00 -0.20
SOT-23 P0 P1 P2 D0 D1 T A0 B0 K0
1.5+0.10 0.6+0.00
4.0±0.10 4.0±0.10 2.0±0.05 1.0 MIN. 3.20±0.20 3.10±0.20 1.50±0.20
-0.00 -0.40

(mm)

Devices Per Unit

Package Type Unit Quantity
SOT-23 Tape & Reel 3000

Copyright  ANPEC Electronics Corp. 9 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Taping Direction Information

SOT-23

USER DIRECTION OF FEED

Classification Profile

Copyright  ANPEC Electronics Corp. 10 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Classification Reflow Profiles

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Preheat & Soak
100 °C 150 °C
Temperature min (Tsmin)
150 °C 200 °C
Temperature max (Tsmax)
60-120 seconds 60-120 seconds
Time (Tsmin to Tsmax) (ts)

Average ramp-up rate

3 °C/second max. 3°C/second max.
(Tsmax to TP)
Liquidous temperature (TL) 183 °C 217 °C
Time at liquidous (tL) 60-150 seconds 60-150 seconds
Peak package body Temperature
See Classification Temp in table 1 See Classification Temp in table 2
(Tp)*
Time (tP)** within 5°C of the specified
20** seconds 30** seconds
classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)

3 3
Package Volume mm Volume mm
Thickness <350 ≥350
<2.5 mm 235 °C 220 °C
≥2.5 mm 220 °C 220 °C

Table 2. Pb-free Process – Classification Temperatures (Tc)

3 3 3
Package Volume mm Volume mm Volume mm
Thickness <350 350-2000 >2000
<1.6 mm 260 °C 260 °C 260 °C
1.6 mm – 2.5 mm 260 °C 250 °C 245 °C
≥2.5 mm 250 °C 245 °C 245 °C

Reliability Test Program

Test item Method Description
SOLDERABILITY JESD-22, B102 5 Sec, 245°C
HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C
PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C
TCT JESD-22, A104 500 Cycles, -65°C~150°C
ESD MIL-STD-883-3015.7 VHBM≧2KV, VMM≧200V
Latch-Up JESD 78 10ms, 1tr≧100mA

Copyright  ANPEC Electronics Corp. 11 www.anpec.com.tw

Rev. A.2 - Apr., 2009
APX9131A

Customer Service

Anpec Electronics Corp.

Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050

Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838

Copyright  ANPEC Electronics Corp. 12 www.anpec.com.tw

Rev. A.2 - Apr., 2009