Prasad Dhond

After a 20-month hiatus, Kioxia has resumed full manufacturing operations, signaling a positive shift in market conditions. According to Nikkei, this move by the fourth-largest producer of 3D NAND in the world could lead to enhanced competition and potentially impact flash memory pricing. The corporation has secured ¥210 billion ($1.332 billion) in fresh credit and ¥540 billion ($3.424 billion) in refinancing from its lenders to support its operations. The study reveals that Kioxia ramped up production at its NAND flash memory plants in Yokkaichi and Kitakami to full capacity in June. Initially facing lower demand for its 3D NAND memory used in smartphones, Kioxia began reducing output in October 2022, surpassing 30% cutbacks at one point. For more details on Kioxia's strategic manufacturing decisions and their potential implications on the market, check out the full article: [Link to the article] #Kioxia #Manufacturing #MarketConditions #FlashMemory #NAND #TechIndustry

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Daily News ①HBM demand surge leads to an 8% DRAM price hike amid supply shortage. Industry heavily investing in High Bandwidth Memory (HBM) DRAM, while commodity DRAM is expected to face supply shortages. Reports indicate Samsung and SK Hynix are operating their commodity DRAM chip production at 80% to 90% capacity, contrasting sharply with NAND flash's full-speed production. Since early 2024, commodity DRAM capacity has only increased by approximately 10%.  ②Malaysia is emerging as a semiconductor hub in Southeast Asia. Supply chain diversification is crucial for semiconductor firms. Malaysia saw substantial investments from China, the US, the Netherlands, Singapore, and Japan. Taiwanese companies invested $129 million in 2022, making Taiwan Malaysia's 12th largest investor, with $112 million in the electronics and electrical sectors—Malaysia's proximity to Taiwan benefits semiconductor supply chains. ③AMD plans to construct a supercomputer with 1.2 million GPUs, potentially costing hundreds of billions. AMD's plan to build a cluster of 1.2 million GPUs for a supercomputer could greatly boost technological innovation and capacity expansion in the semiconductor industry. This initiative may manufacturers to ramp up production, expand facilities, streamline supply chains, and increase R&D investments to meet the high demand for computing power. End-users might also increase procurement of high-performance GPUs for their robust AI training capabilities. ④TSMC plans to build its third 2-nanometer chip manufacturing plant in Kaohsiung City. TSMC is constructing its first 2-nanometer fab in Kaohsiung, and the second fab is also underway. The planned third fab, Kaohsiung P3, covers 17.22 hectares and was reclassified by the Kaohsiung Urban Planning Commission as a Type A industrial zone on the 24th. After environmental impact assessments and soil pollution remediation, TSMC can apply for construction permits to start building the third 2-nanometer fab.  #randa #semiconductors #electroniccomponents #ic #cpu #mcu #gpu #supplychains #materials #EV #servers #AI #HBM #DRAM #NAND #AMD #solutions #procurementstrategies #trends #chips #MOSFET

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Source: #TrendForce NAND Flash memory confirms a 28.1% ($14.71 billion) growth in Q1 2024 with growth expected to continue into the Q2. Big changes in market rankings as #Micron overtook #WesternDigital for 4th place. 1) #SamsungElectronics maintains its market lead of 36.7% improving 28.6% QoQ.  2) #SKhynix is 2nd at 22.2% market share (and a 31.9% QoQ growth).  - Growth was driven by #smartphone and #server orders. 3) #KIOXIA Group grew 26.3% QoQ, with a 12.4% market share. - production cuts from the previous quarter were offset by rising Flash prices. 4) #MicronTechnology grew a strong 51.2% QoQ, with an 11.7% market share.. - #Micron benefited from slightly lower prices than its competitors. 5) #WesternDigital growth of 2.4% with a decline in the retail market (starting in February) being overcome by increased contract prices, resulting in 11.6% market share.

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Tessolve, a leading semiconductor engineering solutions provider, has announced a definitive agreement to acquire German chip design firm Dream Chip Technologies in a deal valued up to ₹400 crore. This acquisition strengthens Tessolve’s global footprint and enhances its capabilities in delivering end-to-end, turnkey design solutions for advanced chips, particularly in System on Chip (SoC) applications across the AI, automotive, data center, and industrial sectors. As part of this acquisition, Tessolve will add four new delivery centers in Germany and the Netherlands, including a specialized Advanced Driver Assistance Systems (ADAS) and imaging center of excellence. Srini Chinamilli, Tessolve’s CEO, highlighted that this deal positions Tessolve among the few global design firms with comprehensive capabilities to tackle complex ASIC design projects. Jens Benndorf, CEO of Dream Chip, noted that the combined strengths of Dream Chip’s design IP and Tessolve’s established services will enable fully integrated solutions, from chip architecture to post-silicon testing and supply chain management. This collaboration aims to drive innovation, especially in camera-based and AI-driven ASIC applications. In parallel, reports indicate that Hero Electronix, a key stakeholder in Tessolve, may sell a 25-30% stake in the company, though Hero remains committed as a long-term majority shareholder. Thanks again to The Economic Times for the full article with more background and insights click the source link in the comments below 💡 🙏👇 #Semiconductors #ChipDesign #Acquisition #TechInnovation #AI #ADAS #AutomotiveTech #SoC #ASIC #DataCenter #SemiconductorIndustry #Tessolve #DreamChip

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Renesas Electronics Falls Most in 15 Years on Sluggish #Industrial Demand - The #Toyota supplier reported disappointing quarterly profit - #Renesas has been chasing deals, seeking to expand beyond #cars Renesas Electronics Corp.’s stock fell the most in more than 15 years, hit by a broader #tech selloff and investor disappointment over the #Japanese #chipmaker's profit miss. Renesas’ stock fell about 14% on Thursday. The company, which supplies Toyota Motor Corporation and American Honda Motor Company, Inc., reported underwhelming operating profit in its mainstay industrial segment, which includes factory, #InternetofThings and #infrastructure related chips. “We were too optimistic in our outlook in the first quarter,” Renesas Chief Executive Officer Hidetoshi Shibata told reporters on Thursday. The company expects sales of its industrial-use #chips to fall in the current quarter, as it adjusts inventories, but revenue will recover in the following quarter, Shibata said. Thanks again to Yuki Furukawa , Mayumi Negishi and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/dqSBWqJx #semiconductorindustry #semiconductors #semiconductor #technology #chip #ic #ai #aiot #iot #geopolitics #automotiveindustry #computing #it

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Murata is committed to data science in various fields, as well as putting them into practical use.   This page introduces the initiatives of the data & analytics department and the people and organizations involved.🌟   🔗Read more: https://lnkd.in/gwaypjvM   #murata

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9 factors that impact #RFPCB designs and tips to resolve them 1. #Substrates with Dk>4 increase propagation delay 2. Impedance mismatch leads to inefficient signal transmission 3. Asymetrical RF stack-up leads to board warping 4. Narrow RF traces increase heat generation 5. Inadequate RF ground planes increase interference 6. Vias induce parasitic capacitance in RF boards 7. Inefficient power supply decoupling increases noise 8. Poor shielding increases RF interference 9. Inefficient thermal management alters the dielectric properties of RF PCBs -- Read the blog to learn the best practices to design an RF board. -- Share this post with #RFengineers. #pcblayout #pcbdesign #electricalengineering

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TMC170D is typically cascaded with TMC685D or TMC173D to increase the system gain.

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Michael Kelly, VP of Chiplets/FCBGA Integration at Amkor Technology, Inc. participated in the Semiconductor Engineering article "What Works Best For Chiplets" by Anne Meixner. Read the article here https://lnkd.in/e6twMDMU The article delves into the #semiconductor industry's efforts to create an open #chiplet ecosystem that integrates #chiplets from different manufacturers into a single package. It highlights the need to solve complex technical challenges around co-optimization of design and assembly processes, as well as the critical importance of fostering collaboration across the entire #supplychain ecosystem to enable designable chiplet-based products. #semiconductormanufacturing #semiconductorindustry

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OEMs are increasingly ditching off-the-shelf chips for custom-designed semiconductors. This shift is driven by the desire to gain complete control over product performance, accelerate innovation, and address supply chain vulnerabilities—especially following the global chip shortage that cost the automotive industry an estimated $210 billion in 2021. The automotive industry, for instance, has seen a significant rise in Autonomous Driving (AD) systems, requiring chips that can process massive amounts of sensor data in real-time. Tesla’s Full Self-Driving (FSD) chips, which perform a staggering 36 trillion operations per second, exemplify the need for custom silicon to power AI-driven tasks like object detection, decision-making algorithms, and edge computing. These capabilities would be impossible to achieve with generic chips designed for broader applications. Moreover, custom-designed chips enable OEMs to innovate faster and more efficiently. Apple’s M1 and M2 chips are game-changers in mobile computing, offering 3.5x faster CPU performance and up to 5x faster GPU speeds compared to Intel-based Macs, while maintaining up to 40% lower power consumption. This blend of performance and energy efficiency is key in a world where power-to-performance ratios are critical, particularly for battery-operated devices like EVs, smartphones, and IoT sensors. OEMs are also addressing supply chain bottlenecks by moving to in-house chip design. The global semiconductor market is set to hit $1 trillion by 2030, but recent disruptions—like the $210 billion hit to the automotive industry in 2021 due to chip shortages—have pushed companies to reduce dependency on third-party suppliers. By controlling their own silicon, OEMs can optimize wafer yields, accelerate product cycles, and mitigate risks associated with relying on foundries like TSMC or GlobalFoundries. This strategic shift isn’t just about staying ahead—it’s about building the next wave of technology. As EV adoption surges, with 60% of global car sales projected to be electric by 2035, and AI continues to drive industries forward, custom silicon is fast becoming a critical competitive advantage. From machine learning accelerators to neuromorphic processing units, OEMs are now the architects of the future, designing chips that are smarter, faster, and more energy-efficient than ever before. #ChipDesign #OEMInnovation #SemiconductorRevolution #TechLeadership #AutomotiveTech #AI #EdgeComputing #EVs #CustomSilicon #SupplyChain #FutureOfTech

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Great CNBC interview from our CEO, Vince Roche, discussing our earnings today! I'm very proud of #teamADI for managing this cycle so well while preparing for a brisk future. ADI holds such a privileged position at the physical/molecular edge, architecting the intelligent edge together with our customers. Our earnings this morning (https://ow.ly/2ENv50RQPA6) provide some highlights of our journey in shaping the future together: - Improving Healthcare: We are gaining momentum in the fast-growing surgical robotics market, where our precise signal processing and connectivity products make a big difference for people around the world. - Advancing Industrial: We’re working with our customers to build the Digital Factory of the future, moving to higher bandwidth industrial Ethernet that can connect up to 10 times more devices on the factory floor. - Using AI: We’re adding AI to our technology to meet customer needs faster. For example, we’re using AI in our power management platform to adjust power trees for changing consumption patterns in data centers. Our solutions make it easier and quicker for power engineers, saving money and time. There were many more examples, such as optical connectivity infrastructure for AI, neural networks for audio, GMSL for ADAS, BMS in Europe.... too many to count! To my team: you know who you are and should enjoy this proud moment! A heartfelt thank you to our brilliant customers. Through our impactful partnerships – with trust, ambition, and courage - we are able to stay ahead of what’s possible and unlock breakthroughs that positively impact people and the planet! Chris W. Shalini Palmer Jerry Fan Katsu Nakamura Jim Mollica Jodi Dahlgard Elise Heffelfinger https://lnkd.in/e7Sf3Nrx

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#INVITING EVERYONE TO Semicon India! Save the dates September 11-13 at Greater NOIDA. Join us at #Hall 3, #booth O31-37 for engaging discussions with our #team, #experts, #OEMs, and #overseas #partners. Explore the latest #tools, #processes, and #applications in #Wafer #fabrication, #Assembly, #FailureAnalysis, #Inspection, #Metrology and #Skill #Development. See you there! 🌟🔬🛠️ #semiconindia, #semi, #SemiconductorIndustry #Networking #Innovation #TechnicalInsights 🚀

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Don’t miss the Chiplets: Building the Future of SoCs virtual event on July 24 & 25! We’ll explore technical trends, market demand, and new application areas around chiplets concepts, challenges, technologies, and more with @EE Times and @Embedded.com. Hear from Cadence experts on the role of EDA companies in the chiplet transformation and how you can get a jumpstart in designing your own chiplets. https://ow.ly/tPUE50SBWkM

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HBM3e 12-Hi Faces Yield Challenges Amidst #Oversupply Concerns 🤔 As we look ahead to 2025, the market is increasingly wary of a potential oversupply of High Bandwidth Memory (#HBM), particularly #HBM3e 12-Hi. #TrendForce reports that while major manufacturers like #Samsung, #SKhynix, and #Micron have submitted initial #HBM3e 12-Hi samples, uncertainties remain regarding their ability to ramp up production and achieve #stable #yields amidst a steep learning curve. 📉 With Samsung planning a 40% increase in #TSV #production by the end of 2025, and #SKhynix targeting a 25% boost, the aggressive capacity #expansions by #DRAM #suppliers raise the specter of #oversupply and declining prices if validation milestones are not met. Historically, achieving stable yields for HBM products has required extensive learning time, making the outlook for HBM3e 12-Hi production particularly uncertain. 🧠 The implications of a potential #HBM #bubble could be significant for #memory #suppliers. If the market #oversaturates, older-generation products like #HBM2e may face steep price declines, impacting suppliers who have a heavier reliance on these products. Additionally, suppliers focused on high-margin products may find their revenue streams threatened as competitive pressures intensify. Given that over 80% of HBM demand in 2025 is expected to come from HBM3e, the successful validation and production ramp-up will be critical for suppliers to maintain profitability. If the learning curve proves too steep or validation fails, the ramifications could ripple through the entire DRAM market, leading to a reassessment of capacity expansions and #strategic #investments. 📊 Ultimately, the trajectory of the HBM market hinges on the ability of key players to navigate these challenges, and the potential oversupply scenario could reshape strategies for memory suppliers in the evolving semiconductor landscape. #HBM #Semiconductors #DRAM #MarketTrends #MemorySuppliers #Technology #CapacityExpansion #AI #Innovation #TrendForce https://lnkd.in/duhsAaK3

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Daily News ①The popularity of pressure sensors, terminal connectors, automotive connectors, DDR memory, and RF ICs has increased. In the category popularity rankings, the popularity of Memory ICs, Power ICs, Logic ICs, SMD transistors, and multilayer inductors has declined by 5.2%, 4.81%, 3.63%, 3.25%, and 4.36% respectively compared to the previous period. However, in the surge rankings, the popularity of pressure sensors, terminal connectors, automotive connectors, DDR memory, and RF ICs increased by 40.55%, 6.19%, 8.95%, 59.2%, and 5.39%, respectively. These figures reflect the shifting popularity trends across different categories within the semiconductor industry.  ②Q3 Global Smartphone Market Rebounds with 4% Year-on-Year Growth.  In Q3 2024, global smartphone shipments grew 3.8% year-on-year, reaching 307.7 million units, marking four consecutive quarters of recovery. However, the growth rate slowed to low single digits compared to previous quarters. Global wholesale smartphone revenue increased by 3.5% year-on-year, totaling $98.2 billion. In contrast, smartphones' wholesale average selling price (ASP) continued its downward trend for the fourth consecutive quarter, down 0.3% year-on-year. ③AI Spending in the Asia-Pacific to Reach $45 Billion in2024, Growing to $110 Billion by 2028.  AI adoption trends vary across countries in the Asia-Pacific region, with distinct application patterns in each market. China leads in AI investment, with a significant increase in AI projects expected within the next 12 months (59%), followed by India and Japan (at 51% and 46%, respectively). China and South Korea are advancing more quickly in AI adoption and integration than other countries, influenced by factors such as investment levels, regulatory frameworks, and AI talent  and infrastructure availability. In Japan, Australia, South Korea, and many areas in Southeast Asia, the shortage of skilled technical personnel remains a common concern for national and industry stakeholders. ④PC DIMM Market Dynamics and Future Outlook.  The PC DIMM (Dual Inline Memory Module) market remains weak, with minimal demand for AI-related products. As a result, OEMs are concerned about carrying high inventory costs before the market recovers. Despite weak overall demand, prices in the PC DIMM market are expected to rise by 8-10%, potentially indicating supply constraints or necessary cost adjustments. Looking ahead, with strong ongoing demand for DDR4, buyers may need to prepare for potential cost and supply fluctuations in the coming months due to persistent price increases.  #Randa #ElectronicComponents #Semiconductors #IC #Chips #MCU #CPU #GPU #Solutions #Materials #SupplyChains #DDR #Memory #HBM #RF #Smartphone #AI #Servers #Trends #Autoparts #ProcurementStrategies

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Good opportunity

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Great article with insights by Bernard Murphy at SemiWiki.com, "Arteris Frames Network-On-Chip Topologies in the Car." "... while there is plenty of complexity in evolving car architectures and the consequent impact on subsystem chip/chiplet designs, connected on-chip through both coherent and non-coherent networks, the intent behind these systems is quite clear. We just need to start thinking about total car system architecture rather than individual chip functions." #Arteris #NetworkOnChip #Automotive https://bit.ly/3UiKqls

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Reflecting on my interview with Andy Jacob on DotCom Magazine's Entrepreneur Spotlight series, I want to highlight a few things I said about leadership. I manage a team of 1500 engineers, designers, marketers, and more at the moment, and here are three core principles I've instilled as part of our culture: 1. Customer satisfaction - We want to ensure that our customers know they are being supported and cared for, and we will do all that is needed. 2. Roadmap growth - We want to ensure quality while simultaneously pushing the boundaries of innovation. 3. Alignment and accountability - Developing a culture where my teams are aligned and get the support they need, all while keeping one another (myself included) accountable to hit our objectives. Watch my video interview and comment below on anything that resonates or stands out with you. #Leadership #Business #LeadershipDevelopment https://lnkd.in/gx5Env-b

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