Thanks to everyone who visited the Amkor Technology, Inc. booth at ICCAD 2024 in Shanghai. We also appreciate those who attended Oliver Gu's presentation on Semiconductor Packaging Technologies in the #AI Era. Oliver's presentation illuminated the critical role of data centers in driving AI applications, which demand high memory bandwidth (#HBM) and processing power. #HeterogeneousIntegration and chiplet technologies have emerged as essential solutions to meet these evolving technological needs. High-end system-on-chip (#SoC) packaging and high-capacity #Memory integration are crucial for AI edge devices. Advanced design systems with robust simulation capabilities are vital for reducing development cycle times and improving electrical performance, while cutting-edge #Technology toolboxes ensure stable yield and #Manufacturing quality. To learn more about Amkor's IC packaging solutions, please visit https://lnkd.in/gw8Ejkh #Amkor #AdvancedPackaging #ICCAD #ICCAD2024 #SemiconductorIndustry #Semiconductors #Semiconductor
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