Maurice Moroney

A very interesting blog by Giuseppe Piccolboni of Weebit Nano Ltd about the use of our #ReRAM for #neuromorphic applications

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Great article with insights by Bernard Murphy at SemiWiki.com, "Arteris Frames Network-On-Chip Topologies in the Car." "... while there is plenty of complexity in evolving car architectures and the consequent impact on subsystem chip/chiplet designs, connected on-chip through both coherent and non-coherent networks, the intent behind these systems is quite clear. We just need to start thinking about total car system architecture rather than individual chip functions." #Arteris #NetworkOnChip #Automotive https://bit.ly/3UiKqls

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A reflection on 20 Years in IoT Twenty years ago today, on 13th September 2004 I made the bold move to leave the relative safety of my middle-management job in a small software company in Dublin (Soft-ex, a WidePoint Company), to become an FAE for a startup wireless semiconductor company in Cambridge, UK (Ember). It was a strange move as I knew nothing about semiconductors and nothing about wireless mesh networking, apart from that one networking module I did with Michael Scott in DCU years previously. The entirety of my 15-year career up to then was spent either writing or managing relatively boring telephone call accounting software that ran on PCs, and eventually, in what we would now call “The Cloud”. This was a whole new ball game. But the instigator of my move into the Internet of Things (IoT), my friend Adrian Tuck, who I had worked with at Soft-ex, assured me I would fit right in. My first day was spent flying to Heathrow, then on to Boston with my manager, Mohamed Awad (pictured with me in a restaurant at the top of Mont Blanc) who upgraded us with his airmiles to business class so that he could give me a 6-hour training session on wireless mesh networking and EmberNet. Thankfully, we did not touch on semiconductors much in that session or my mind would have been completely blown. Day 2 was spent on a booth at the Embedded Systems Conference in Boston, and the next 2 days were spent assisting with customer training. So, baptism by fire would be an apt description of my first week. What has followed has been a 20-year adventure. It is very exciting just to be associated with some of the brightest hardware and software engineers around, working on amazing wireless technologies. By 2008 I had decided that I could do better defining and delivering product roadmaps, so I convinced Robert LeFort at Ember that I could try Product Marketing. Since then I have launched exciting new products at Ember and Silicon Labs, and worked with amazing customer projects. Infineon Technologies has introduced me to new markets and industries, including automotive, where we have some very exciting projects going on and on the roadmap. Infineon has a broad portfolio of products, with great opportunities to combine wireless communications with sensors, motor control, capacitive sense, AI/ML and many other technologies. The IoT has grown for sure in the last 20 years, but it still has a long way to go. In the smart home, Matter promises to bring coherence and consistency to the market. Bluetooth is continuously changing and emerging, with new features. In automotive, the advance of electric vehicles and autonomous vehicles creates lots of opportunity for more computing and communications. The world is becoming more connected than ever before. After 20 years in the industry, at Infineon Technologies I feel that I am right where I need to be. I am excited and looking forward to what comes next, and grateful that I made that big scary move back in 2004.

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Applying Band aid where surgery is required. The mobile networks were optimized for "lower" latency traffic and never designed to carry large amounts of videos. Broadcast qualifies for special treatment right from the L1 and is a candidate for a "Broadcast slice"... Payload aware networks are the need of the hour. D2M is re-imagining the entire video distribution network from the production to the CDN into the device itself optimizing not just delivery and UX but also energy efficiency. Point to point CDN extremely energy inefficient...

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The future of infrastructure is bright. 5G is evolving and 6G is moving closer to reality, bringing ultra-fast speeds, low latency, and seamless connections between the digital and physical worlds. Arm’s partnering with Alphawave Semi to power this next generation of networks with advanced chiplet technology, enabling smarter, more efficient infrastructure

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HBM4 effectively doubles the bandwidth per stack to >1.6TB/s when compared to HBM3 by doubling the number of pins. The #Rambus controller is further capable of supporting up to 10Gb/s per pin which extends the bandwidth per stack to >2.5TB/s. This innovation goes a long way in making HBM4 the ideal choice for #AI/ML training, #HPC and advanced Data Center workloads. Raj Uppala Bunninder Falak Johnny (Hyun-Joong) Kim Phani Paladugu Neeraj Paliwal Brian Small Mark Wagner Nidish Kamath Tim Corcoran Sean Fan Susheel Tadikonda Trupti Kargaonkar Gowda Pardu Sampath K Banka John Simmons Romain Tourneau Romain Tourneau Andrew Lu

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Cadence introduces the Janus NoC for SoC designs.

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Uncover the power-efficient MPU featuring advanced graphics and audio capabilities, along with EdgeLock® Secure Enclave, SESIP, and PSA Level 2 certifications in this special whitepaper from #NXP!

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🚀 #SKHynix: Leading the Charge in #High #Bandwidth #Memory 💻 As the landscape of high bandwidth memory (#HBM) evolves, SK Hynix is firmly positioned at the forefront, emerging as the industry leader. Recent Q3-24 results showcase remarkable financial growth, with 8.2% QoQ and 88% YoYrevenue increases. This momentum is largely driven by the surging demand for #AI #technologies, where HBM plays a pivotal role. 📈✨ Key Highlights: 🔹 Dominance in HBM: Hynix has solidified its role as the primary supplier for #Nvidia’s #H100 #GPU, crucial for #AI #applications. The HBM segment is projected to account for 40% of revenue by Q4-24, emphasizing its strategic importance. 🔹 Impressive Financial Performance: Significant increases in gross profit and operating profit illustrate Hynix’s ability to capitalize on its HBM leadership. As the demand for high-speed memory continues to rise, this trend is expected to persist. 🔹 Challenges Ahead: Despite the strong performance, Hynix faces critical challenges related to underinvestment in capacity. With #Samsung expanding its memory production, Hynix must address potential capacity constraints to meet growing demand and maintain its competitive edge. 🏭⚠️ 🚀 #Strategic Expectations for #Sustaining #Leadership: 1) Increase Capital Investments: To keep pace with rising demand, Hynix needs to prioritize capital expenditures. Investing in new production facilities and upgrading existing ones will be essential for scaling HBM output and enhancing manufacturing efficiency. 2) Innovation in Technology: Continued innovation in memory technology and packaging methods is vital. As the industry evolves, Hynix must lead in developing next-generation HBM solutions that can deliver even higher speeds and efficiency. 3) Strengthen Partnerships: Collaborating with key players in AI and semiconductor ecosystems, such as TSMC and Nvidia, will be crucial for aligning product offerings with market needs and driving mutual growth. 4) Sustainability Initiatives: As environmental concerns grow, focusing on sustainable production practices will not only enhance brand reputation but also ensure compliance with global standards, positioning Hynix favorably in a competitive market. 5) Market Adaptability: Being agile in responding to market fluctuations and customer demands will be essential. Hynix should continuously analyze market trends and be prepared to pivot strategies to maintain leadership. In summary, while SK Hynix has a strong foundation and a promising trajectory, its ability to sustain leadership will depend on strategic investments, technological advancements, and adaptive market strategies. Let’s watch how they navigate these challenges ahead! #SKHynix #HBM #AI #Semiconductors #Innovation #TechnologyLeadership #BusinessGrowth #DataDriven #FutureOfMemory #Sustainability #Partnerships #clausaasholm https://lnkd.in/dyc-S4K3

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1200V 900A Hybrid module. With SiC SBD diode inside，the turn on switching loss is reduced to a very low level.

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For all the #verification folks be careful when you assume! https://lnkd.in/epRzdXKb 💡 Many ways to get assumptions wrong, check out our new #semiconductors #formalverification #vodcasts. https://lnkd.in/e-NszJYj

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#HBM4 set to land sooner than expected 💡 Suppliers and JEDEC are bringing their HBM4 plans forward as they suspect the forecasted Gen #AI boom means incoming NVIDIA GPUs will need it sooner. High bandwidth memory (#HBM) bypasses #X86 socket-connected #DRAM capacity and bandwidth limits by having #memory dies stacked on top of a logic layer, with interconnecting TSV channels, all linked to a #GPU via an interposer component providing higher bandwidth than X86 sockets. The Joint Electron Device Engineering Council (JEDEC) confirms and issues HBM standards, with the current one being its fifth, HBM3E (extended). JEDEC has said it will issue a completed HBM4 spec by the end of this year – just few months ago the schedule was for a 2025 delivery. Preliminary HBM4 characteristics are emerging already. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eZp_wyHB #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #semiconductormanufacturing #it #chip #chips #ic #it

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The market for embedded #NVM is expanding quickly, with various technologies competing for different applications. Want to hear more? Read this article I recently posted on embedded.com. #ReRAM #semiconductor

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STMicroelectronics to Build €5 Billion Plant in #Italy with #EU Chips Act Aid STMicroelectronics NV said it plans to spend €5 billion ($5.4 billion) on a #manufacturing plant for #chips and packaging in #Catania, #Italy in a multi-year project that’s being partly funded by the #EuropeanUnion's #ChipsAct. The Italian government, within the Chips Act framework, will give STMicro €2 billion in #subsidies, the company said in a statementon Friday. The plant, which will specialize in silicon-carbide manufacturing as well as testing and packaging, will start production in 2026 and targets hitting full capacity by 2033, it said. Thanks again to Jillian Deutsch and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eDircssY #semiconductorindustry #semiconductor #semiconductors #technology #tech #innovation #geopolitics #automotiveindustry #chip #car #ev #evs

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Good to see other sectors of the chip industry (other than AI) picking back up. Returning demand for chips used in consumer electronics combined with a decline in surplus chip inventory across sectors, including communication, consumer and industrial, has helped chipmakers see a recovery in orders after a years-long slump.

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https://lnkd.in/dj-b_H4Q If Lunar Lake (Core Ultra 200V series) is truly performing as announced, it's really a remarkable comeback by Intel Corporation, since the benchmark results are extremely competetive and perhaps better than some industry analysts expected. It's somewhat ironic that just when Intel's reputation and financial situation seem to be at a historic low, the company is starting to show real proof of executing like during its hey days, when it comes to product design and process technology. It might not prevent a split up of the company in two separate ones, a product business and a foundry business, which is probably unavoidable looking at the industrial logic, but both the Lunar Lake launch and the progress on the 18A process could provide some hope of a long term turnaround. #intel #lunarlake #coreultra #aipc

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TMC170D is typically cascaded with TMC685D or TMC173D to increase the system gain.

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I really enjoyed this talk with Nitin Dahad of EE Times | Electronic Engineering Times. We walked about the different steps in my career, my management philosophy, and other interesting things. See https://lnkd.in/dAgc_adg

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