Vango Tech V9261F Datasheet
Vango Tech V9261F Datasheet
Vango Tech V9261F Datasheet
Revision History
Date Version Description
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2016.05.19 0.4 Updated 7.2 Baud Rate Configuration
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In order to obtain the best metering performance and temperature
performance during normal metering, Bandgap Circuit must be
2018.03.12 5.0 configured according to the calculated result. The calculation method,
please refer to Bandgap Circuit chapter.
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Modify the formula of Phase Compensation.
2018.05.31 5.1
HPF cannot be bypassed in M channel, modify figure of Energy Metering.
Features
5.0 V power supply, wide range: Supporting programmable no-load
3.0 V ~ 5.5 V detection threshold
Internal reference: 1.188 V (Typical drift Accelerating meter calibration when low
10 ppm/°C) signal is applied
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Support UART communication interface,
baud rate: 4800 bps Package: 16–SOP
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Crystal frequency: 6.5536 MHz or
3.2768 MHz
Total/Fundamental
raw/instantaneous/average
current and voltage RMS
Total/Fundamental
raw/instantaneous/average active
and reactive power
Positive/Negative energy,
selectable active/reactive power
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Specifications
All maximum/minimum specifications apply over the entire recommended operation range
(T = -40°C ~ +85°C, VDD5 = 5.0V ±10%) unless otherwise noted. All typical specifications are at
T = 25°C, VDD5 = 5.0 V, unless otherwise noted.
Analog Input
ADC
DC Offset 10 mV
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Resolution 23 Bit Sign bit is included.
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Bandwidth (-3dB) 1.6 kHz
On-chip Reference
Power Supply
AVCC
Current 30 mA
Power-Down Detection
2.8 V Error: ±5%
Threshold
Current 35 mA
POR Detection
1.45 V Error: ±10%
Threshold
3.2768
Crystal Frequency MHz
6.5536
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Total Reactive Energy
0.1 % Dynamic Range 5000:1 @ 25°C
Metering Error
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Total Reactive Energy
1.6 kHz
Metering Bandwidth
Fundamental Active
0.1 % Dynamic Range 10000:1 @ 25°C
Energy Metering Error
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Fundamental Active
Energy Metering 65 Hz
Bandwidth
Fundamental Reactive
0.1 % Dynamic Range 5000:1 @ 25°C
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Fundamental Reactive
Energy Metering 65 Hz
Bandwidth
Fundamental VRMS/s
1 % Dynamic Range 5000:1 @ 25°C
Metering Error
Fundamental VRMS
65 Hz
Metering Bandwidth
Fundamental IRMS/s
1 % Dynamic Range 5000:1 @ 25°C
Metering Error
Fundamental IRMS
65 Hz
Metering Bandwidth
Frequency Measurement
Range 40 70 Hz
Error 0.01 Hz
CF Pulse Output
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Output Frequency 102.4 kHz
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160 ms
Temperature Measurement
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Storage Temperature -55 +150 ˚C
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Pin Descriptions
DVCC
AVCC
VSS
CTO
CTI
RX
TX
CF
16
15
14
13
12
11
10
9
V9261F
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1
8
VDD5
IBN
UP
UN
IAN
IAP
REF
IBP
No.
1
Mnemonic
VDD5
Type
Power
Description
On-chip reference
8 REF Input/Output This pin must be connected to a 1-μF capacitor, and then analog
grounded.
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REF
1.188V
REF
V9261F
UP
APGA ADC U
UN
CF
IAP
APGA ADC I
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Energy
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Calculation Unit TX
UART
MUX
IBP
M
ADC RX
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APGA
IBN
Temp. sensor
SysCtrl
VSS
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OSC AVCCLDO DVCCLDO POR
AVCC
CTI
CTO
DVCC
VDD5
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Table of Contents
Revision History ..................................................................................................................... 2
Features ................................................................................................................................. 3
Specifications ......................................................................................................................... 5
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Table List ............................................................................................................................. 15
1. Reset ........................................................................................................................... 17
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1.1. Power-On Reset (POR) .............................................................................................. 17
1.2. RX Reset ................................................................................................................. 17
1.3. Global Software Reset ............................................................................................... 18
1.4. Registers ................................................................................................................. 19
2. Clock ........................................................................................................................... 20
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2.1. Crystal Oscillation Circuit ........................................................................................... 20
2.2. 3.2-MHz RC Oscillator ............................................................................................... 21
2.3. 32-kHz RC Oscillator ................................................................................................. 22
2.4. Registers ................................................................................................................. 22
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8. Interrupt ..................................................................................................................... 66
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8.1. System Control Register Self-Checking Interrupt .......................................................... 66
8.2. Configuration Verification Interrupt ............................................................................. 66
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8.3. Zero-Crossing Interrupt ............................................................................................. 68
8.4. Current Detection Interrupt ....................................................................................... 68
8.5. Registers ................................................................................................................. 69
9. Registers ..................................................................................................................... 72
9.1. Analog Control Registers............................................................................................ 72
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9.2. System Control Register ............................................................................................ 78
9.3. Metering Control Registers ......................................................................................... 81
9.4. Data Registers.......................................................................................................... 85
9.5. Registers for Calibration ............................................................................................ 92
9.6. Checksum Register ................................................................................................... 94
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Figure List
Figure 1-1 Timing of POR ........................................................................................................................................... 17
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Figure 6-2 Analog Input of Current Channels .................................................................................................. 39
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Figure 6-4 Channel Selection for Current Signal Processing .................................................................... 42
Figure 6-6 Digital Input and DC Removement (Current Signal is Taken as an Example.) ........ 44
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Figure 6-7 Total / Fundamental RMS Calculation .......................................................................................... 46
Table List
Table 1-1 Reset Related Registers ......................................................................................................................... 19
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Table 3-6 Effects on ADCs Power Dissipation .................................................................................................. 31
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Table 3-8 Power Dissipation of Measurement Channel ............................................................................... 32
Table 6-9 Registers for Energy Accumulation and CF Pulse Output ..................................................... 50
Table 7-2 Structure of Data Byte (B7:B0) From Master MCU to V9261F on Write Operation .. 63
Table 7-3 Structure of Data Byte (B7:B0) From V9261F to Master MCU on Write Operation .. 63
Table 7-5 Structure of Data Byte (B7:B0) From V9261F to Master MCU on Read Operation ... 64
Table 7-6 Structure of Data Byte (B7:B0) From Master MCU to V9261F on Broadcast Operation
......................................................................................................................................................................................... 65
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Table 9-5 Metering Control Register 0 (0x0183, MTPARA0) .................................................................... 81
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Table 9-7 Registers for DC Component (R/W) ................................................................................................ 85
Table 9-9 Registers for RMS Values of Total/Fundamental Signals (R/W) ...................................... 86
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Table 9-10 Total/Fundamental Active/Reactive Power Registers (R/W) ......................................... 89
Table 9-14 Registers for Presetting Bias for Direct Current/Voltage .................................................. 92
Table 9-18 Register for Bandpass Filter Coefficient Configuration (0x0125, BPFPARA, R/W) 94
1. Reset
In V9261F, the chip will be reset to the Default State when a POR, RX reset, or global software reset
occurs.
When a POR event occurs, the bit “RSTSRC” (bit[26:24] of SysCtrl, 0x0180) will be reset to
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“0b001”.
In the reset state, the master MCU and the Vango metering architecture cannot access RAM. When the
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chip exits from the reset state, RAM will implement the self-checking in about 1.25 ms. If there is no error
occurring, RAM can be accessed.
In the reset state, the UART serial interface is idle. The UART serial interface starts to run immediately
once the chip exits from the reset state.
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DVCC
1.45V
VSS
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Internal reset
signal
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Reset state
RAM
self-check
RAM access 1.25ms
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When output voltage on pin DVCC is
higher than 1.45V, the RAM can be
1.75ms accessed in about 1.75ms.
UART
communication
1.2. RX Reset
The input on pin “RX” must be driven low for at least 64 ms to force the chip into the reset state. Pull
to the logic high, and 900 μs later the chip will exit from the reset state and get back to the Default State.
In the reset state, the master MCU and the Vango metering architecture cannot access RAM. When the
chip exits from the reset state, RAM will implement the self-checking in about 1.25 ms. If there is no error
occurring, RAM can be accessed.
In the reset state, the UART serial interface is idle. The UART serial interface starts to run immediately
once the chip exits from the reset state.
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high, the chip will exit from the reset
state in 900 µs and get back to the
Default State.
Reset state
500 μs
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RAM
self-checking
RAM access 1.25 ms
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When the input on pin “RX” is
2.15 ms pulled high, RAM can be accessed
in 2.15 ms.
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UART
communication
Reset State, and the chip will exit and get back to Default State in 650 μs.
When the global software reset occurs, the bit “RSTSRC”(bit[26:24] of SysCtrl, 0x0180) will be reset
to “0b100”.
In the Reset State, the master MCU and the Vango metering architecture can not access RAM. When
the chip exits from the Reset State, RAM will implement the self-checking in about 1.25 ms. If there is no
error occurring, RAM can be accessed.
In the Reset State, the UART serial interface is idle. The UART serial interface starts to run
immediately once the chip exits from the Reset State.
Internal reset
signal
Reset state
500 μs RAM
RAM access self-checking
1.25 ms
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later RAM can be accessed.
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UART
communication
0x0180 Bit[26:24]
0 0 0 Reserved.
SysCtrl RSTSRC
0 1 1 An RX reset event occurred.
0 1 0 Reserved.
0x01BF, SFTRST
Readable and writable, in the form of 32-bit 2’ complement.
Software Reset Control
Write “0x4572BEAF” to the register to reset the system.
Register
2. Clock
The on-chip RC oscillator circuits and the crystal oscillation circuit provide clocks for V9261F:
On-chip crystal oscillation circuit: An external 6.5536-MHz or 3.2768-MHz crystal connects to the pins
“CTI” and “CTO” to generate the clock, “CLK1”, which works as the clock source for the Vango
metering architecture, ADCs, and UART serial interface. After a POR, RX reset, or global software
reset, this oscillation circuit starts to run.
On-chip 3.2-MHz (The deviation is within ± 30% from chip to chip for mass production. The
temperature deviation from -40~85 degree for each specific chip is less then 3%.) RC oscillator
generates the clock, “CLK2”, which works as an optional clock source for the Vango metering
architecture, ADCs, and UART serial interface. This circuit can be disabled. After a POR, RX reset, or
global software reset, this circuit stops running.
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On-chip 32-kHz (±50%) RC oscillator generates the clock, “CLK3”, which works as the clock source
for the wake-up circuit, internal crystal supervising and stimulating circuit, and the filters for some
key IO ports. This circuit keeps on working until the system is powered off.
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6.5536 MHz/ Metering clock
6.5536 MHz/ “CLK1” MDIV
3.2768 MHz ½ DIV* “MEACLK”
3.2768 MHz 3.2768 MHz
XT
UART clock
UDIV
“UARTCLK”
ON
“CLK2” ADC clock
3.2-MHz (±30%) RC ADIV
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Supervising OFF “ADCCLK”
and stimulating
circuit
Wake-up
“CLK3”
32-kHz(±50%) RC
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IO ports filter
*The Vango metering architecture and ADCs can work normally only when the “CLK1” frequency is 3.2768 MHz. Thus, the 1/2
divider must be enabled to divide “XTCLK” by 2 when a 6.5536-MHz crystal is used, or the 1/2 divider must be disabled when a
3.2768-MHz crystal is used.
When being powered on, the crystal oscillation circuit will start to run to generate a clock “XTCLK” to
be the source of clock “CLK1”. The “CLK1” frequency is divided by different clock scalars to generate
clocks for the Vango metering architecture (“MEACLK”), ADCs (“ADCCLK”), and UART serial interface
(“UARTCLK”). The master MCU can configure the bit “XTALPD” (bit20 of ANCtrl0, 0x0185) to disable
the oscillation circuit. When the oscillation circuit stops working, the on-chip 3.2-MHz (±30%) RC
oscillator will start to run automatically to generate clock “CLK2” to replace “CLK1” to provide clock
pulses for the metering architecture, ADCs, and UART serial interface. However, please note that the
“CLK2” frequency is not accurate enough for the UART communication.
Please note the 1/2 divider is enabled after a POR, RX reset, or global software reset occurs. So the UART
interface will communicate at a half of the expected baud rate when 3.2768-MHz crystal is used. Users
must disable the 1/2 divider via the bit “XTAL3P2M” (bit19 of ANCtrl0, 0x0185).
Users can adjust the clock frequency for ADCs and metering architecture via bits
“ADCCLKSEL<1:0>” (bit[17:16] of ANCtrl0, 0x0185) and “CKMDIV” (bit1 of SysCtrl, 0x0180).
The typical power dissipation of the crystal oscillation circuit is 130 μA. When a 3.2768-MHz crystal is
used, users must set bit “XTALLP” to ‘1’ to lower the power dissipation to a half. When a 6.5536-MHz
crystal is used, setting this bit has no effect on the power dissipation of this circuit. When a crystal of
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higher than 60-Ω ESR (Equivalent Serial Resistance) is used, users must set the bit “XRSEL<0>” (bit18
of ANCtrl2, 0x0187) to ‘1’ to improve the driving ability of the oscillation circuit to ensure the crystal to
work, which needs additional 55-μA load current.
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In the Metering Mode, some errors can stop the oscillation circuit. So, an internal supervising and
stimulating circuit, which is sourced by “CLK3”, is designed to monitor the crystal all the time. When the
crystal stops oscillating, this circuit will generate a 1-ms wide pulse every second to stimulate the crystal
to restore oscillating. The stimulating function of this circuit is disabled by default. Users can set the bit
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“XRSTEN” (bit21 of ANCtrl0, 0x0185) to ‘1’ to enable this function.
In the Sleep Mode, this crystal oscillation circuit stops working, and it will not get back to work
automatically even though the system is woken up from the Sleep Mode to get to the Current Detection
Mode.
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When the crystal stops working, an interrupt signal will be generated and the flag bit “HSEFAIL”
(bit27 of SysCtrl, 0x0180) is set to ‘1’, which will be cleared when the crystal restores to work.
Please note that the “CLK2” frequency is not accurate enough for the UART communication, so the
master MCU cannot read the actual state of the flag bit “HSEFAIL”.
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After a POR, RX reset, or global software reset occurs, this circuit stops running. To enable this circuit,
it is mandatory to enable the Bandgap and global biasing current circuits firstly which provide the biasing
current and reference voltage for the 3.2-MHz RC oscillator.
In the Sleep Mode, this circuit stops running, and it will get back to work automatically when the chip
is woken up from the Sleep Mode to get to the Current Detection Mode.
2.4. Registers
Table 2-1 Clock Generation Related Registers
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enable the Bandgap circuit and biasing circuit firstly. The value
of the bit is uncertain when the system is reset.
Bit29 In the Sleep Mode, this bit is set to ‘1’ automatically. In the
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N/A
PDRCCLK Current Detection Mode, this bit is cleared automatically.
Set this bit to ‘1’ to enable the Bandgap circuit to provide ADCs
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Both in the Sleep Mode and the Current Detection Mode, this bit
is set to ‘1’ automatically.
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enable the 1/2 divider.
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bit to ‘1’ to lower the power dissipation of the crystal oscillation
Bit18
0 circuit to a half.
XTALLP
When a 6.5536-MHz crystal is used, this bit must hold its default
value.
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To select the sampling frequency of the oversampling ADC (ADC
clock, “ADCCLK”)
When the chip operates with full functions in the Metering Mode,
their default values are recommended to be used for the best
performance.
When the chip operates with full functions in the Metering Mode,
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By default the load capacitance is 12 pF.
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XCSEL<1:0> 01: +2 pF
10: +4 pF
11: +6 pF
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When the “MEACLK” frequency is 3.2768 MHz, clear this bit to
Bit28 inform the CF pulse generation circuit to work at 3.2768 MHz.
0
CLKSEL When the “MEACLK” frequency is 819.2 kHz, set this bit to ‘1’
0x0183 to inform the CF pulse generation circuit to work at 819.2 kHz.
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When the external crystal stops running, this bit will be set and
Bit27 hold the state till the crystal starts to oscillate again.
0
HSEFAIL When the crystal stops running, the UART serial interface is
sourced by the 3.2-MHz RC clock (“CLK2”) that is not accurate
enough for the UART communication, so the master MCU cannot
0x0180 read the value of this bit to detect the state of the crystal.
0: 3.2768 MHz
Bit0 Set this bit to ‘1’ to disable “CLK1” and “CLK2” and force the
0
SLEEP system to enter the Sleep Mode.
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3. Operation Modes
When V9261F is powered off, the chip will stop working and it will get to the Default State when being
powered on.
When the chip is working, it can be reset to the Default State when a POR, RX reset, or global software
reset occurs. Table 3-1 lists the states of functional units in V9261F in the Default State.
In the Default State, the typical load current is 500 μA. Some easy configurations can drive the chip
to work in the Metering Mode or Sleep Mode.
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Crystal oscillation circuit Enabled
32k-Hz RC oscillator
Bandgap circuit
Biasing circuit
Enabled
Disabled
Disabled ec
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Power supply monitoring circuit Enabled
LDO Enabled
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ADC Disabled
Enabled
Interrupt management circuits Output the system control register self-checking interrupt and
configuration verification interrupt only.
Enabled
UART serial interface When a 3.2768-MHz crystal is used, the actual baud rate is a half
of desired baud rate.
Power on
SLEEP = ‘1’
Reset
Current
Metering Mode
Detection Mode
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Current
Reset detection is
completed.
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“RX” input to
SLEEP = ‘1’ Sleep Mode wakeup the system
To select “CLK1” to source the clocks of the Vango metering architecture (“MEACLK”), UART serial
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To enable or disable ADCs, to configure the sampling frequency to 819.2 kHz or 204.8 kHz, and to
adjust the global biasing current to lower the power dissipation of ADCs
To configure the “MEACLK” frequency to 3.2768 MHz or 819.2 kHz that must be four or eight times
of the “ADCCLK” frequency, and to configure the function of the Vango metering architecture
In the Metering Mode, when a reset event, such as a POR, RX reset, or global software reset, occurs,
the chip will get back to the Default State.
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Enabled
LDO Configure the DVCCLDO to lower power dissipation of the Vango metering
architecture.
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Enable ADCs, configure the sampling frequency, and adjust the global biasing
ADC
current to lower the power dissipation, to meet the application requirements.
Temperature
Enable or disable to meet the application requirements.
measurement circuit
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Vango metering It is mandatory to enable this unit, and configure its functions to meet the
architecture application requirements.
Enabled
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Interrupt management Output system control register self-checking interrupt and configuration
circuits verification interrupt all the time, and output the desired interrupts to meet
the application requirements.
LDO Enabled
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Enabled
Interrupt management circuits It is recommended to mask all interrupt output before Sleep Mode,
except system control register self-check interrupt, which outputs all
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the time.
In the Sleep Mode, the clock generation circuits, except for the 32-kHz RC oscillator, stop working, so
the Vango metering architecture and ADCs stop working, the UART interface is idle, but the interrupt
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management circuits keep working. In this mode, the pin “CF” outputs the low logic, and the pin “TX”
outputs the high logic. It is recommended to disable the interrupt output before entering the Sleep Mode
except for the system control register self-checking interrupt.
In the Sleep Mode, a low-to-high transition (Holding low for 250 μs and then high for 250 μs) on the
pin “RX” can wake up the system to work in the Current Detection Mode; when a reset event, such as a
POR, RX reset, or global software reset, occurs, the system will get to the Default State.
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The 3.2-MHz RC oscillator generates “CLK2” to source “MEACLK”, “ADCCLK”, and “UARTCLK”.
The RC oscillator will oscillate in 1 ms.
The “MEACLK” frequency is fixed at 3.2768 MHz to ensure that the current signal is sampled 256
times every cycle.
Only the current channel ADC is enabled. To lower the power dissipation and speed up the detection,
it is recommended to lower the sampling frequency to 204.8 kHz, lower the global biasing current by
66%, and decrease the DVCCLDO output voltage by 0.2 V. All these configurations can lower the
power dissipation to 0.85 mA.
In the Current Detection Mode, all interrupt outputs, except for those of system control register
self-checking interrupt, configuration verification interrupt, and current detection interrupt, are masked.
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Enabled automatically
Biasing circuit It is recommended to lower the global biasing current by 66% to lower the
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power dissipation.
Temperature
Disabled automatically
measurement circuit
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Vango metering Enabled and configured to compute for configuration verification and current
architecture detection only automatically.
Enabled
Interrupt management All interrupt outputs, except for those of system control register self-checking
circuits interrupt, current detection interrupt, and configuration verification interrupt,
are masked.
Affected by
Load
Functional Unit DVCCLDO current
Global biasing
output ADCCLK MEACLK
current (μA)
voltage
Bandgap circuit × × × × 79
Biasing circuit × × × × 69
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Crystal oscillation circuit × × × × 130*
3.2-MHz RC oscillator × × × × 40
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X: No effects on the power dissipation
*When a crystal of higher than 60-Ω ESR is used, it is recommended to set the bit “XRSEL<0>” (bit18
of ANCtlr2, 0x0187) to ‘1’ to improve the driving capability of the oscillation circuit. This configuration
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will lead to additional 55-μA load current. When a 3.2768-MHz crystal is used, it is mandatory to set the
bit “XTALLP” (bit18 of ANCtrl0, 0x0185) to ‘1’ to lower its power dissipation to a half.
Functional Unit ADCCLK Global Biasing Current Adjustment Load Current (μA)
0 289
819.2 kHz
Voltage channel ADC -33% 215
0 420
819.2 kHz
Current channel ADC -33% 309
The “MEACLK” frequency can affect the power dissipation of the Vango metering architecture. But lower
the “MEACLK” frequency weakens the metering accuracy, and slows down the voltage and current RMS
update. So in the Metering Mode, users should not adjust the “MEACLK” frequency to lower the power
The configuration of bits “MEAS” (bit[7:5] of SysCtrl, 0x0180) has effects on the power dissipation of
the various signal measurement channel.
Configuration of “MEAS”
Test Condition Load Current (μA)
Bit[7:5] of SysCtrl, 0x0180
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3.2768 MHz
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The following table lists the typical power dissipation in each operating mode.
Configuration Configuration
1 2
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4. Power Supply
Analog
Oscillator
circuits
4.7 μF 0.1 μF
monitor
DVCCLDO DVCC
Digital circuits
4.7 μF 0.1 μF
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Figure 4-1 Power Supply Architecture
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The V9261F supports single power input 5V (3.0~5.5V). The analog circuits, such as ADCs, Bandgap
circuits, and the oscillators, are powered by the output of AVCCLDO. And the digital circuits are powered
by the output of DVCCLDO, the digital power supply circuit.
When the input voltage is higher than 3.3V, the internal LDO circuit (AVCCLDO) will keep the power of
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AVCC 3.3V output to prevent the performance variation in analog circuit caused by the ripple from the
VDD5 source. When VDD5 is lower than 3.3V, V9261F will disable the AVCCLDO automatically, and then
the power of AVCC will be switched to VDD5 power.
The driving capability of AVCC is 30mA. It means AVCC could keep stable output voltage when the
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power consumption is less than 30mA. Otherwise, the output voltage of AVCC will drop when the load
current in analog circuit increased. AVCC should be connected to one parallel circuit combined with a ≥
4.7uF capacitor and a 0.1uF decoupling capacitor.
In the V9261F, an internal power supply monitoring circuit is designed to supervise the power AVCC.
When the AVCC is lower than 2.8V (±5%), a power-down interrupt signal is triggered, and the flag bit PDN
(bit28 of SysCtrl, 0x0180) is set to 1, that will be cleared automatically when the power down event
disappears.
When the voltage on pin AVCC is less than 2.8V, “PDN_R” (bit22,0x0180) is set to ‘1’, that will be fix
as “1”, when the power supply is higher than 2.8 V (±5%), until user clear it by writing any data to SysCtrl
register (0x0180).
When the voltage on pin AVCC is lower than 2.8V, if “CF PROT” (Bit7,0x0183) is set to ‘1’, the output
of CF will be fixed as ‘0’. And the energy counter/CF counter will remain operating to realize the under
voltage protection of CF output.
AVCC
2.8V(±5%)
PDN flag
CLR operation
PDN_R flag
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CF
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Figure 4-2 Power-Down Interrupt
This DVCCLDO has a driving capability of 35 mA, which means when the load current on the digital
circuits is less than 35 mA, this DVCCLDO will output a stable voltage; but when the load current is higher
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It is recommended to decouple the pin “DVCC” externally with a ≥ 4.7-μF capacitor in parallel with
a 0.1-μF capacitor.
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4.3. Registers
Table 4-1 DVCCLDO Output Voltage Adjustment
000: No adjustment
001: -0.1 V
ANCtrl2 Bit[14:12]
0 010: +0.2 V
0x0187 LDOVSEL<2:0>
011: +0.1 V
100: -0.4 V
101: -0.5 V
111: -0.3 V
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5. Bandgap Circuit
In V9261F, the Bandgap circuit outputs a reference voltage and bias voltage, about 1.188 V with a
typical temperature coefficient of 10 ppm/˚C, for ADCs and the 3.2-MHz RC oscillator. The Bandgap circuit
must be enabled before ADCs and the RC oscillator, and typically, this circuit consumes about 0.08 mA.
By default the Bandgap circuit is disabled. Users can set the bit “BGPPDN” (bit27 of ANCtrl0, 0x0185)
to ‘1’ to enable the Bandgap circuit. In the Sleep Mode, this circuit is disabled automatically; and in the
Current Detection Mode, this circuit is enabled automatically.
Users can configure “bit[14:12]” and “bit[9:8]” of “ANCtrl0” register (0x0185) to adjust the
temperature coefficient to reduce the temperature coefficient drift introduced by the external components,
with the following steps:
1) Assume the current settings of relative bits are REST<2:0>=’010’ and RESTL<1:0>=’00’, which
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means an additional +20ppm for temperature coefficient of Bandgap.
2) Measure meter errors in high and low temperature conditions. Assume user has calibrated the
meter error to 0 at 20℃, and the measuring errors are 0.6% at 80℃ and -0.4% at -40℃ separately. Then
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a -(0.6%-(-0.4%))/2=-0.5% measuring error needs to be compensated relative to high temperature
working condition, equivalent to -0.5%/(80-20)=-5000/60=-83ppm, rounding to -80ppm.
3) As measuring error is minus two times of REF temperature coefficient error, to compensate a
-80ppm error, an additional +40ppm of Bandgap REF temperature coefficient adjustment is needed.
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Taking the initial +20ppm setting into consideration, the actual adjustment should be +60ppm. According
to the lookup table of RESTL<1:0> and REST<2:0>, user should set register RESTL<1:0> to ‘01’ and
REST<2:0> to ‘111’, whose combination equals to a +60ppm temperature coefficient adjustment.
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A temperature coefficient drift of “x” in the Bandgap circuit results in a drift of “-2x” in the measurement
error.
Set this bit to ‘1’ to enable the Bandgap circuit to provide ADCs and the
3.2-MHz RC oscillator with the reference voltage and biasing voltage.
Therefore, in the Metering Mode, this bit must be set to ‘1’ before enabling
Bit27
ADCs and the 3.2-MHz RC oscillator. By default the Bandgap circuit is
BGPPDN disabled.
In the Sleep Mode, this bit is cleared automatically. In the Current Detection
ANCtrl0,
Mode, this bit is set to ‘1’ automatically.
0x0185,
R/W To finely adjust the temperature coefficient of the Bandgap circuit. In order
to obtain the best metering performance and temperature performance
Bit[14:12] during normal metering, it must be configured according to the calculated
result. The calculation method, please refer to Bandgap Circuit chapter.
REST<2:0>
000: No adjustment
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result. The calculation method, please refer to Bandgap Circuit chapter.
Bit[9:8]
00: 0
RESTL<1:0>
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01: +70 ppm
6. Energy Metering
The Vango metering architecture in V9261F has features:
- 3 independent oversampling Σ/Δ ADCs: One for voltage (U), one for current (I) and one for various
signal measurement (M)
Less than 0.1% of active energy metering accuracy over dynamic range of 10000:1
Less than 0.1% of reactive energy metering accuracy over dynamic range of 5000:1
- Various measurements:
h
Total/Fundamental raw/instantaneous/average voltage/current RMS
ec
Positive/Negative energy, active/reactive selectable
- CF pulse output
- Current detection
ot
- Supporting calibrating meters via software
RMS Calculation
BIAS LP
DC
F
-
UP
APGA ADC DPGA
Phase compensation
LP
UN U F
HPF AC Inst.
Total
LP Watt
F Avg.
Va
DC
BIAS LP
F
Inst.
Fund.
SIGN
Watt
-
IAP
Avg.
APGA ADC I LP
HPF AC
DPGA P_Engy_Acc
IAN F
MUX
LP DATACP
F CF
Inst.
Phase shift
Total N_Engy_Acc
Current detection
90˚
VAR
Avg.
DC
LP
IB Inst.
phase shift
F
Fund.
90˚
VT VAR
RMS Avg.
ADC
MUX
APGA LP
DPGA
calculation
M HPF AC
VDC1 F
Freq.
Measurement
VDC2
Temp. Sensor
For the current channels, a current transformer (CT) or shunt resistor can be used for analog inputs.
CT R1
IP
C1
R3
h
C3
R4
C2
IN
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R2
N L
CT
Load R1
IP
ot
C1
C3
Resistor
R2
Shunt
C2
IN
ng
N L Shunt Resistor
inputs.
PT UP
R1 C1
C2
UN
R2
N L
Potential Transformer
UP
Ra
R1 C1
R2 C2
UN
h
L N
ec
Figure 6-3 Analog Input of Voltage Channels
To match the output signal of the transformers to the measurement scale of ADCs, Analog
Programmable Gain Amplifiers (APGA) with possible gain selection of 1, 4, 16, and 32 for current input,
ot
and of 1 and 4 for voltage input, are set. The analog PGA gain is determined by the output signal of the
transformer. The product of the output signal and PGA gain (Including digital and analog PGA) must be no
higher than the voltage reference. Equation 6-1 depicts the signal processing of current and voltage:
where PGAu and PGAi is the analog PGA gain for voltage and current; Au and Ai are the amplitude of the
input signals (V); DCu and DCi are the DC components of the raw voltage and current.
01: ×16
10: ×4
11: ×1
Users should confirm PGA according to the output signal of sensor and
make sure the product of the biggest signal and PGA is smaller than
the Bandgap voltage.
bit[5:4]
0 00: ×4
GM<1:0>
01: ×1
10: ×32
11: ×16
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6.3. Analog-to-Digital Conversion
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Second-order Σ-ΔADCs are applied in the voltage and current channels in V9261F. Σ-ΔADCs can be
enabled or disabled via configuring the “ANCtrl0” register (0x0185).
Set this bit to ‘1’ to enable Voltage Channel ADC. The Bandgap circuit
Bit26 must be enabled before this ADC.
0
ng
ADCUPDN Both in the Sleep Mode and in Current Detection Mode, this bit is
cleared automatically.
Set this bit to ‘1’ to enable Current Channel ADC. The Bandgap circuit
Bit24 must be enabled before this ADC.
ANCtrl0 0
ADCIPDN In the Sleep Mode, this bit is cleared automatically. In the Current
Va
bit25 Before enabling ADC, the Bandgap circuit must be enabled first. By
0 default M channel ADC is disabled.
ADCMPDN
No matter in the Sleep Mode or Current Detection mode, M channel
ADC is disabled automatically.
The sampling frequency of ADCs, or ADC clock (“ADCCLK”), is derived from “CLK1”. By default, it is
819.2 kHz, a quarter of the metering clock (“MEACLK”), and can be adjusted via “bit[17:16]” of
“ANCtrl0” (0x0185).
In the Current Detection Mode, these bits must be set to “0b10” to lower
the power dissipation.
h
When the chip operates with full functions in the Metering Mode, their
default values are recommended to be used for the best performance.
ec
When M Channel ADC is configured to process the current signal input on the pins “IBP” and “IBN”,
the two current signals from ADCs can be transferred to Channel I or Channel M separately for the digital
signal processing.
U
Compensation
ot
U ADC DPGA
Phase
I
IA ADC DPGA
M
IB ADC DPGA
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The signal output from ADCs must be input to a phase compensation circuit to correct the phase error
between the current and voltage signal introduced by the mismatch of the transformers and ADCs.
Bit18 Set this bit to ‘1’ to delay voltage for phase compensation.
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MTPARA1 0
PHCIU Clear this bit to delay current for phase compensation.
0x0184
To set the absolute value for phase compensation.
ec
Bit[15:8]
0 By default the resolution is 0.0055°/lsb, and a phase error of up to 1.4°
PHC
can be calibrated.
ot
I I
PHC_U_I
PHC_U_I
Time-delay circuit
U U
ng
3011 fsmpl
N = Round ( × E× )
2 819200 Equation 6-2
where
correction range
N value configure fsmpl(Hz) resolution(°/lsb)
(°)
LPF2 DC
BIAS
Current
detection
Figure 6-6 Digital Input and DC Removement (Current Signal is Taken as an Example.)
h
The 1-bit code stream output from the oversampling Σ/ΔADC can be enabled to be sent to the
decimation filter to suppress the high-frequency noise and to lower the sampling frequency to get the raw
waveform of each signal. The raw waveform is transferred to a subtractor to remove the direct drift
ec
introduced by the external components and ADCs, with the help of the DC bias preset in registers “ZZDCI”
(0x0123) and “ZZDCU” (0x0124). Then, the signals are processed as follows:
- The signals are transferred to the low-pass filter “LPF2” to obtain the DC components of the signals
that can be read out from registers for DC components located at “DCI” (0x0114) and “DCU”
ot
(0x0115).
- By default the signals are transferred to a high-pass filter “HPF” to remove the DC components of the
raw waveforms and obtain the AC components to calculate the power and RMS.
- In Channel I, the current signal is transferred for the current detection. Please refer to “Current
ng
The registers for DC components of voltage and current, located at addresses of “0x0114” and
“0x0115”, are in the format of 32-bit 2’ complement. When the “MEACLK” frequency is 3.2768 MHz, the
data will be updated in 160 ms and settled in 300 ms; when the “MEACLK” frequency is 819.2 kHz, the
data will be updated in 640 ms and settled in 1200 ms. The signal input to the decimation filter is enabled
Va
or disabled via configuring “bit[17:16]” of “MTPARA1” (0x0184). When this function is enabled, the
code stream will be accumulated to the filter; when this function is disabled, a constant ‘0’ will be input for
the digital signal processing. Users can disable this HPF via configuring the bit “BPHPF” (“bit20” of
“MTPARA1”, 0x0184).
To enable digital signal input of current channel for digital signal processing
Bit17
1: Enable.
MTPARA1 ONI
0: Disable. When this bit is cleared, a constant ‘0’ is input for digital signal processing.
0x0184
Bit16 To enable digital signal input of voltage channel for digital signal processing
ONU 1: Enable
0: Disable. When this bit is cleared, a constant ‘0’ will be input for the digital signal
processing.
Digital Programmable Gain Amplifiers (DPGA) with possible gain selection of 1/32~32, via
“MTPARA1” (0x0184), are applied to digital signals output from the high-pass filter to amplify the
signals. The product of the signal and PGA gains (Including digital and analog PGA) must be no higher
than the voltage reference.
h
0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16; 0101:
0
PGAI ×1/32;
MTPARA1 1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
ec
0x0184 To set digital PGA gain of voltage input
Bit[3:0] 0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16; 0101:
0
PGAU ×1/32;
ot
1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
PGAi × Ai ×sin(ωt + φ)
I = PGAdi×
1.188
Where,
2. The fundamental current and voltage RMS calculation after being processed by the low-pass filter
“BPF” that introduces a gain of 0.85197
The values of the total current and voltage RMS are acquired from the following equations:
2 PGAu ×Au
Urms = ×0.99992 ×PGAdu ×
2 1.188 Equation 6-5
And the fundamental current and voltage RMS are acquired from the following equations:
2 PGAi ×Ai
BIrms = ×0.85197 ×PGAdi × Equation 6-6
2 1.188
2 PGAu ×Au
BUrms = ×0.85197 ×PGAdu ×
2 1.188 Equation 6-7
Where,
h
PGAdi and PGAdu are the digital PGA gains of current and voltage.
PGAi and PGAu are the analog PGA gains of current and voltage.
ec
Ai and Au are the amplitude of current and voltage inputs.
S
AVG ABRTI
LPF
ng
x BRTI
Gain
Multiplier LPF Calibration
AVG AARTI
AC of IA(t) 32 x ARTI
Va
WARTI
Where,
RMS’ is the raw current or voltage RMS, calculated via the above equations.
S is the gain calibration, set in registers located at addresses “0x012C”, “0x0132”, “0x0126”, and
“0x012B”.
When the “MEACLK” frequency is 3.2768 MHz, registers for raw and instantaneous RMS will be
updated in 160 ms and settled in 500 ms; and registers for average RMS will be updated in 1.28 s and
settled in 3 s.
When the “MEACLK” frequency is 819.2 kHz, registers for raw and instantaneous RMS will be
updated in 640 ms and settled in 2000 ms; and registers for average RMS will be updated in 5.12 s and
settled in 12 s.
h
The alternating component (AC) of the current and voltage can be used for:
ec
2. The total reactive power calculation after a phase shift by 90 degrees via the Hilbert filter
And after being processed by the low-pass filter, the current and voltage signal are used to compute
the fundamental active and reactive power.
ot
WBPT
WWBPT
S
LPF AVG
ABP
Offset Cali IBP
ng
S WWAPT
WAPT
Va
WBQT
S WWBQT
LPF AVG
ABQ
Offset Cali IBQ
AAQ
AC of IA(t) 32
90˚
WWAQT
S
WAQT
Where,
PGAdi and PGAdu are digital PGA gains of current and voltage.
PGAi and PGAu are analog PGA gains of current and voltage.
h
θ is the phase difference between voltage and current signals.
ec
Filtered by the band-pass filter, the signals are used to calculate the fundamental active and reactive
power.
Where,
ng
PGAdi and PGAdu are digital PGA gains of current and voltage.
PGAi and PGAu are analog PGA gains of current and voltage.
The active or reactive power must be gain and offset calibrated, as depicted in the following equation,
Where,
P’ is the raw active or reactive power calculated via the above equations.
After gain and offset calibration, the instantaneous active and reactive power, which will be averaged
to obtain the average active and reactive power, is stored in the total and fundamental active/reactive
power registers. All the registers are in the format of 32-bit 2’-complement.
When the “MEACLK” frequency is 819.2 kHz, registers for the raw and instantaneous power will be
updated in 640 ms and settled in 2000 ms; and registers for the average power will be updated in 5.12 s
and settled in 12 s.
h
In the Vango metering architecture, configure the bit “ENGSEL” (“bit[23:22]” of “MTPARA0”,
0x0183) to select an average power to transfer to the register “DATACP” (0x0189). The content of this
register will be accumulated to the positive or negative energy accumulator (“PEGY” at 0x01A1 and
ec
“NEGY” at 0x01A2) depending on the sign. When the “MEACLK” frequency is 3.2768 MHz, the
accumulation frequency will be 204.8 kHz; when the “MEACLK” frequency is 819.2 kHz, the
accumulation frequency will be 102.4 kHz.
Clear bit “CKSUM” (“bit22” of “MTPARA1”, 0x0184) and set bit “IDET” (“bit21” of “MTPARA”,
0x0184) to ‘1’ to force the Vango metering architecture to compute for the configuration verification and
ot
current detection. In this condition, write a value to register “DATACP” (0x0189) for the energy
accumulation based on the constant.
Preset a threshold in the register “EGYTH” (0x0181). When the content of energy accumulator is
higher than the preset threshold, the energy accumulator will overflow, and a value equal to the threshold
ng
will be subtracted from the energy accumulator. An energy pulse is generated and the CF pulse counter
increments by ‘1’ every two accumulator overflows.
Please note that the CF pulse generation circuit is an independent functional unit. So users must set the
bit “CLKSEL” (“bit28” of “MTPARA0”, 0x0183) to inform the CF pulse generation circuit to work at the
set “MEACLK” frequency.
Va
When a low signal is input, users can reduce the energy threshold to increase the pulse generation
rate to quicken the energy calibration via configuring bits “CFFAST” (“bit[25:24]” of “MTPARA0”,
0x0183).
When the power-down interrupt occurs, the latch of “PDN”, “RPDN” (bit22,0x0180) is set to ‘1’. If “CF
PROT” (Bit7,0x0183) is set to ‘1’, the output of CF will be fixed as ‘0’. And the energy counter/CF counter
will remain operating to realize the under-voltage protection of CF output.
When the power-down event disappears, PDN will become ‘0’, RPDN will remain ‘1’, and CF output will
be ‘0’. At the same time, resetting the chip or any write operation to “0x0180” can set “RPDN” to ‘0’. The
CF output will restore to the normal state.
Set the bit “CFEN” (“bit31” of “MTPARA0”, 0x0183) to ‘1’ to enable the CF pulse output on the pin
“CF”. When the “MEACLK” frequency is 3.2768 MHz, the maximum CF pulse output frequency will be
102.4 kHz, and the normal pulse width will be 80 ms. If a pulse width is less than 160 ms, pulses of 50%
duty cycles will be output.
32
ENG_ACC_N CNT 32
IAP SIGN
32
DATACP
IAQ TH
1
MUX 32 32
0 CF
IBP
32
IBQ
PCFCNT
32 ENG_ACC_P CNT 32
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Bit31
0 By default this function is disabled, and the pin “CF” outputs “logic
CFEN
0”.
ec
Bit30 Set this bit to ‘1’ to enable energy accumulation and energy-to-pulse
0
EGYEN conversion. By default this function is disabled.
When the “MEACLK” frequency is 3.2768 MHz, clear this bit to inform
Bit28 the CF pulse generation circuit to work at 3.2768 MHz.
ot
0
CLKSEL When the “MEACLK” frequency is 819.2 kHz, set this bit to ‘1’ to
inform the CF pulse generation circuit to work at 819.2 kHz.
00: ×1
Bit[25:24]
0 01: ×4
CFFAST
10: ×8
11: ×16
Select the power and transfer it to this register as the source for
0x0189 DATACP 0
energy accumulation.
DATACP
0x0181
EGYTH 0 Set a threshold for energy-to-pulse conversion.
EGYTH
There is an anti-creeping accumulator in the no-load detection circuit. When the no-load detection is
enabled, 1s will be accumulated in this accumulator constantly at the same frequency of the energy
h
accumulation.
When the no-load detection is enabled, the constant 1s will be accumulated into the embedded
ec
anti-creeping accumulator, and the energy accumulators will accumulate the content of register
“DATACP” (0x0189). Preset a threshold for the no-load detection in the register “CTH” (0x0182), and a
threshold for energy-to-pulse conversion in the register “EGYTH” (0x0181). Compare the accumulation
rate. If the energy accumulator overflows sooner, the anti-creeping accumulator will be cleared, and the
Vango metering architecture will start to meter the energy. Otherwise, the Vango metering architecture
ot
will enter the creeping state. Users can read the bit “CFCRP” (“bit31” of “SysCtrl”, 0x0180) to detect
the state.
The threshold register for the no-load detection are of actual 32-bit length. It will be padded with a
string of 4 0s on the right to work as a 36-bit register.
ng
0x0182
0 Set a threshold for no-load detection.
CTH
In the line frequency measurement circuit, the fundamental voltage signal is sampled at a frequency
of 3200 Hz for the negative-to-positive zero-crossing detection, and the number of the samples among
3200
f= Equation 6-14
FREQ
Where, f is the line frequency to be measured; FREQ is the content of the instantaneous line frequency
register (0x019A), in the form of decimal.
The instantaneous line frequency will be accumulated 256 times every 1.28 s to be averaged to
acquire the average line frequency per second:
3200 ×256
f' = Equation 6-15
ASFREQ
Where, f’ is the line frequency to be measured; ASFREQ is the average line frequency per second read out
of the register (0x011D), in the form of decimal.
h
To improve the measurement accuracy, the above average line frequency per second will be
accumulated 8 times every 10.24 s to be averaged to acquire the average line frequency:
ec
3200 ×256 ×8
f' ' = Equation 6-16
AFREQ
Where, f’’ is the line frequency to be measured; AFREQ is the average line frequency read out of the
register (0x011E), in the form of decimal.
ot
In V9261F, a band-pass filter is applied to remove the direct component, the noise and the harmonic
wave of the voltage signal to obtain the fundamental voltage for line frequency measurement. The
performance of the band-pass filter is affected by the number of bits to be shifted and the filter coefficient.
When fewer bits are shifted, the filter needs less time to respond, is less sensitive to the frequency
deviation, and has less capability to depress the noise and harmonics.
ng
Bandpass filter
Shift bits (0x0183, MTPARA0) Frequency deviation
coefficient
Group
Va
BPFSFT, Bits to be
BPFPARA, 0x0125 47.5Hz(db) 150Hz(db)
bit[14:13] shifted
DC
LP
F
IB
MUX
APGA ADC M LP
HPF AC
DPGA X2 RMSM Cal LP
AVG RMSM
F F
Temp.
sensor
h
Table 6-12 Registers for M Channel Configuration
ec
Set this bit to ‘1’ to enable Measurement Channel ADC. The Bandgap
Bit25 circuit must be enabled before this ADC.
0
ADCMPDN Both in the Sleep Mode and Current Detection Mode, this bit is cleared
automatically.
ot
To set analog PGA gain of analog input of Measurement Channel ADC
0x0185 The analog PGA gain is determined by the output signal of the sensor.
The product of the output signal and PGA gain (Both analog and
ANCtrl0 digital) must be no more than the voltage reference.
Bit[5:4]
ng
0 00: ×4
GM<1:0>
01: ×1
10: ×32
11: ×16
Va
To set digital PGA gain for various signal input of Measurement Channel
Bit[31:28] 0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16;
0
PGAM 0101: ×1/32;
1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
0x0184
To enable digital signal input of Measurement Channel for digital signal
MTPARA1
processing
Bit27
0 1: Enable
ONM
0: Disable. When this bit is cleared, a constant ‘0’ will be input for the
digital signal processing.
h
Channel ADC.
ec
0
SysCtrl MEAS 001/010/011: Reserved
100: Temperature
101/110/111: Ground
ot
To select the analog input for signal processing in Measurement
Channel ADC
0
ANCtrl1 MEAS 100: Temperature
101/110/111: Ground
Register Description
When the “MEACLK” frequency is 3.2768 MHz, this register will be updated in 160
0x0116 DCM ms, and settled in 300 ms.
When the “MEACLK” frequency is 819.2 kHz, this register will be updated in 640
ms and settled in 1200 ms.
When the M Channel is used to process the current signal input from pins
“IBP”/“IBN” or “IAP”/“IAN”, this register “DCM” (0x0116) will be the backup
0x00F9 DCIM
of the content of register “DCM” (0x0116), and the master MCU should read this
register for the measurement.
When Measurement Channel (M) is used to measure temperature, this register will
0x0101 DCTM be the backup of the content of register “DCM” (0x0116), and the master MCU
should read this register for the measurement.
0x0106 ARRTM When the “MEACLK” frequency is 3.2768 MHz, the register will be updated in
160 ms and settled in 500 ms. When the “MEACLK” frequency is 819.2 kHz, the
register will be updated in 640 ms and settled in 2000 ms.
0x010F ARTM When the “MEACLK” frequency is 3.2768 MHz, the register will be updated in
160 ms and settled in 500 ms. When the “MEACLK” frequency is 819.2 kHz, the
h
register will be updated in 640 ms and settled in 2000 ms.
When Measurement Channel (M) is used to process the current signal input from
pins “IBP”/“IBN” or “IAP”/“IAN”, this register will be the backup of the content
ec
0x00F8 ARTIM
of register “ARTM” (0x010F), and the master MCU should read this register for the
measurement.
When Measurement Channel (M) is used to measure temperature, this register will
0x0100 ARTMM be the backup of the content of register “ARTM” (0x010F), and the master MCU
ot
should read this register for the measurement.
0x0117 AARTM When the “MEACLK” frequency is 3.2768 MHz, the register will be updated in
1.28 s and settled in 3 s. When the “MEACLK” frequency is 819.2 kHz, the register
ng
6.12. Calibration
Va
0x011B AARTU The average total voltage RMS R/W 32-bit 2’-complement
0x011C AARTI The average total current RMS R/W 32-bit 2’-complement
0x0121 ABRTU The average fundamental voltage RMS R/W 32-bit 2’-complement
0x0122 ABRTI The average fundamental current RMS R/W 32-bit 2’-complement
0x0119 AAP The average total active power R/W 32-bit 2’-complement
0x011A AAQ The average total reactive power R/W 32-bit 2’-complement
0x011F ABP The average fundamental active power R/W 32-bit 2’-complement
0x0120 ABQ The average fundamental reactive power R/W 32-bit 2’-complement
0x012C WARTI Set a value to gain calibrate the total current RMS. R/W 32-bit 2’-complement
0x0132 WARTU Set a value to gain calibrate the total voltage RMS. R/W 32-bit 2’-complement
0x012E WAPT Set a value to gain calibrate the total active power. R/W 32-bit 2’-complement
h
Set a value to gain calibrate the total reactive
0x0130 WAQT R/W 32-bit 2’-complement
power.
ec
0x012F WWAPT Set a value to offset calibrate the total active power. R/W 32-bit 2’-complement
0x0181 EGYTH Set a threshold for energy-to-pulse conversion. R/W 32-bit 2’-complement
Va
0x0182 CTH Set a threshold for no-load detection. R/W 32-bit 2’-complement
Where, V is the RMS value of the input signal; G is the gain; and K is a coefficient, 1.486×109 for
Where, Vi and Vv are the input current and voltage; Gi and Gv are the analog PGA gains for current and
voltage respectively; cosθ is the power factor; Bp is a coefficient, 1.419×109 for total active power and
1.030×109 for fundamental active power.
Where, Vi and Vv are the input current and voltage; Gi and Gv are the analog PGA gains for current and
voltage respectively; θ is phase difference between current and voltage; Bq is a coefficient, 1.111×109 for
h
total reactive power and 0.514×109 for fundamental reactive power.
ec
The value acquired by Equation 6-17, Equation 6-18, or Equation 6-19 is the theoretical value of the
register of RMS or power. It must be multiplied by a ratio to get the actual value (Accurate to the second
decimal place).
Vn
ot
D=
Value
Equation 6-20
Where, Value is the theoretical value of the registers acquired by Equation 6-17, Equation 6-18, or
Equation 6-19; D is the ratio; and Vn is the rated voltage/current/power.
ng
3011 fsmpl
N = Round ( × E× )
2 819200 Equation 6-21
Where
Va
1 204800
PGAT = P' ×T × × = P' ×T ×6.25 Equation 6-22
2 214
Where, P’ is the power calculated by Equation 6-18 or Equation 6-19; T is a time constant acquired via
Equation 6-23:
3600 ×1000
T= Equation 6-23
P ulse C onsta n t ×Un ×Ib
1 1
S = 231( - 1) + S1( ) Equation 6-24
1+ e 1+ e
Where, S is the content to be set in the registers for gain calibration of active/reactive power or
current/voltage RMS, in the form of 2’-complement; S1 is the original value of the registers; e is the error:
when this equation is used for the power gain calibration, e is equal to the error displayed on the LCD
screen of the calibration equipment (E); when this equation is used for the RMS gain calibration, e is equal
to the error (Eu/Ei) calculated by Equation 6-25 and Equation 6-26:
U1 - Un
Eu =
Un Equation 6-25
I - Ib
Ei = 1
Ib Equation 6-26
h
Where, U1/I1 is the voltage/current RMS displayed on the LCD screen of the meter to be calibrated, Un is
the rated voltage, and Ib is the base current.
ec
8. Equation for power offset calibration registers
Where, E is the error displayed on the LCD screen when a%Ib are applied at power factor 1.0; and P is
ot
value calculated via Equation 6-18.
1 204800 3600×1000
GATECP = T × × = ×6400
2 24 1
Un × Is ×PulseConstant
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2 Equation 6-28
Where, Un is the rated voltage; Is is the starting current, equal to 0.4%Ib generally. A half of Is is defined
to detect no-load.
Va
6.12.3.Calibration Steps
Users must configure the following parameters when designing an energy meter:
- Parameters for a meter, including basic current, rated voltage, pulse constant, and accuracy class
- Parameters for design, including the current and voltage RMS when rated current and rated voltage
are applied
- The ratio (D) of RMS and power calculated via Equation 6-20.
- The threshold for energy pulse generation calculated via Equation 6-22.
When the above parameters are set, no changes should be done to them.
For example, at power fact of 1.0, apply 100% Ib and 100% Un to the calibration equipment.
Get the gain calibration value of the power data (E), and read the value of the gain calibration register
WAPT (0x012E), (the raw value for gain calibration, S1) and then calculate the value for gain calibration
via Equation 6-24 and write it to the register WAPT (0x012E).
2. Phase compensation
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After completing the power gain calibration, in the case of PF = 0.5L, apply 100% Ib and 100% Un to
the calibration equipment for the phase calibration.
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During the gain calibration, “bit[15:8]” of register “MTPARA1” (0x0184) must be cleared first. Get
the gain calibration value of the power data (E), calibrate the values of phase compensation according to
Equation 6-21, and write to the corresponding bit of the register.
3. Read the current RMS “I1” shown on the LCD screen of the calibration equipment (“I1” is the product
Va
4. Calculate the value to gain calibrate current RMS via Equation 6-24.
Note: When the current through the energy meter is less than the starting current, the current RMS “I1”
will not be shown on the LCD screen.
3. Read the voltage RMS “U1” shown on the LCD screen of the calibration equipment (“U1” is the
product of the value of RMS registers and the coefficient “D”).
4. Calculate the value to gain calibrate voltage RMS via Equation 6-24.
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Va
7. UART Interface
V9261F supports the communication with the master MCU as a slave via the UART serial interface. The
UART serial interface has the following features:
A 11-bit byte, composed of 1-bit Start bit, 8-bit Data bits, 1-bit Parity bit (Odd), and 1-bit Stop bit
Least significant bit (lsb) shifted in or out firstly when the chip receives or transmits a byte
When a reset event, such as a POR, RX reset, or global software reset, occurs, the UART serial
interface will be reset. In the Sleep Mode, the interface is idle.
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7.1. Data Byte
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The data byte received and transmitted via the UART serial interface of V9261F is composed of 11 bits,
including 1-bit Start bit (Logic low), 8-bit Data bits, 1-bit odd Parity bit, and 1-bit Stop bit (Logic high), as
shown in Figure 7-1. When V9261F receives or sends a data byte, the least significant bit will always be
shifted in or out firstly.
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START B0 B1 B2 B3 B4 B5 B6 B7 P STOP
communication.
Address
Head Byte Control Byte Data Byte 0 Data Byte 1 Data Byte 2 Data Byte 3 Check Byte
Byte
V92xx receives a command frame and sends a respond frame Receive and send
the next frame
// //
START
RX START STOP START 8-bit data, 1-bit parity STOP
// //
tF tR
//
TX START 8-bit data, 1-bit parity STOP START STOP
//
1st to 7th bytes tRB
of the command frame
tRF tRTD tTB tTBD tTRD
tTF
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Parameter Description
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11
tRB tRB=
baudrate
The maximum time between two bytes when receiving a command frame on pin “RX”
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16
tRF=
baudrate
tRF
Where, baudrate is the actual baud rate. Baudrate=4800bps,tRF=3.33ms.
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After a timeout event, the UART serial interface is idle and waits for the next command
frame.
The delay between command frame reception on pin “RX” and respond frame transmission
on pin “TX”.
0 ms ≤ tRTD ≤ 20 ms
Va
tRTD
Please note that no respond frame will be transmitted in the broadcast communication, and
at least 2-ms delay is recommended between two continuous command frames for
broadcast communications.
Time to transmit a respond frame in read or write operation, depending on the structure of
tTF
the frame
11
tTB tTB=
baudrate
The delay between respond frame transmission on pin “TX” and the next command frame
tTRD
reception on pin “RX”. More than 2 ms is recommended.
The master MCU needs a command frame, composed of 8 data bytes, to write of a 32-bit data to the
register of V9261F. When it receives the command frame, V9261F will transmit a respond frame,
composed of 4 data bytes, to reply to the master MCU. On both transmission and reception, the lsb is
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shifted in or out firstly.
Table 7-2 Structure of Data Byte (B7:B0) From Master MCU to V9261F on Write Operation
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Order Byte B7 B6 B5 B4 B3 B2 B1 B0
1 Head Byte 1 1 1 1 1 1 1 0
The checksum. Add the above 7 data bytes, invert the sum, and then add it to
8 Check Byte
“0x33” to obtain the checksum.
Va
Table 7-3 Structure of Data Byte (B7:B0) From V9261F to Master MCU on Write Operation
Order Byte B7 B6 B5 B4 B3 B2 B1 B0
1 Head Byte 1 1 1 1 1 1 1 0
The checksum. Add the above 3 data bytes, invert the sum, and then add it to
4 Check Byte
“0x33” to obtain the checksum.
The master MCU needs a command frame, composed of 8 data bytes, to read of a 32-bit data of a
Table 7-4 Structure of Data Byte (B7:B0) From Master MCU to V9261F on Read Operation
Order Byte B7 B6 B5 B4 B3 B2 B1 B0
1 Head Byte 1 1 1 1 1 1 1 0
2 Control Byte The higher 4 bits of the target register address (D1) 0 0 0 1
3 Address Byte The lower 8 bits of the target register address (D1)
The length (N, in unit of “Word”) of the data to be read from the registers
located at the addresses beginning with the target address (D 1) given by the
Control Byte and Address Byte. When Data Byte 0 is ‘0’, it means 1 data word
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(4 bytes) is read out.
4 Data Byte 0 When the master MCU reads of the target address only, N is ‘1’.
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When more than one registers located at continuous addresses beginning with
the target address (D1), N is equal to the number of the address. The
maximum value of N is 255, which means no more than 255 continuous
registers can be read at a time.
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5 Data Byte 1
7 Data Byte 3
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The checksum. Add the above 7 data bytes, invert the sum, and then add it to
8 Check Byte
“0x33” to obtain the checksum.
Table 7-5 Structure of Data Byte (B7:B0) From V9261F to Master MCU on Read Operation
Order Byte B7 B6 B5 B4 B3 B2 B1 B0
Va
1 Head Byte 1 1 1 1 1 1 1 0
2 Control Byte The higher 4 bits of the target register address (D1) 0 0 0 1
N, equal to Data Byte 0 sent from master MCU to V9261F on read operation.
3 Length Byte
When Data Byte 0 is ‘0’, N is equal to ‘1’.
… … …
The checksum. Add the above 4×N+3 data bytes, invert the sum, and then add
4×N+4 Check Byte
it to “0x33” to obtain the checksum.
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The master MCU needs a command frame, composed of 8 data bytes, to write a 32-bit data to the
registers of more than one V9261F in the broadcast communication. When receiving a command frame,
V9261F should not transmit a respond frame to reply to the master MCU to avoid the communication error.
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On receiving a data frame, the lsb is shifted in or out firstly.
Table 7-6 Structure of Data Byte (B7:B0) From Master MCU to V9261F on Broadcast Operation
Order Byte B7 B6 B5 B4 B3 B2 B1 B0
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1 Head Byte 1 1 1 1 1 1 1 0
The checksum. Add the above 7 data bytes, invert the sum, and then add it to
8 Check Byte
“0x33” to obtain the checksum.
8. Interrupt
In V9261F, 7 events can trigger interrupt signals that will set the interrupt flag bits to 1s.
Zero-crossing interrupt: The voltage sign bit is output as the zero-crossing interrupt; interrupt
output can be masked.
Current detection interrupt: Interrupt output cannot be masked in the Current Detection Mode,
and can be masked in other operation modes.
Power down interrupt: Interrupt output can be masked. Please refer to “Power Supply
Monitoring Circuit” for more detailed information.
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External crystal failure interrupt: Interrupt output can be masked. Please refer to “Crystal
Oscillation Circuit” for more detailed information.
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REF capacitor damage alarm interrupt: Interrupt output can be masked.
system operation mode, and “bit[24:16]” are designed as the backup of these bits. Invert the values of
“bit[8:0]”, and write them into “bit[24:16]” sequentially. The internal self-checking circuit compares
the content of these bits all the time. If they are opposite to each other sequentially, it indicates the
configurations are right; otherwise, an interrupt signal will be triggered, the flag bit “SYSERR” (“bit20”
of “SysCtrl”, 0x0180) is set to ‘1’. The flag bit holds the state until the self-checking is corrected.
Va
The register “CKSUM” should be written of the difference between “0xFFFFFFFF” and the sum of
the content of the other 24 registers.
Default
No. Address Register R/W
Value
4 0x0126 WBRTI To set gain calibration of the fundamental current RMS R/W 0
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To set gain calibration of the fundamental reactive
7 0x0129 WBQT R/W 0
power
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To set offset calibration of the fundamental reactive
8 0x012A WWBQT R/W 0
power
9 0x012B WBRTU To set gain calibration of the fundamental voltage RMS R/W 0
10 0x012C WARTI To set gain calibration of the total current RMS R/W 0
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To set a value to gain calibrate the RMS value of
11 0x012D WARTM R/W 0
various signal in Measurement Channel
12 0x012E WAPT To set gain calibration of the total active power R/W 0
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13 0x012F WWAPT To set offset calibration of the total active power R/W 0
14 0x0130 WAQT To set gain calibration of the total reactive power R/W 0
15 0x0131 WWAQT To set offset calibration of the total reactive power R/W 0
16 0x0132 WARTU To set gain calibration of the total voltage RMS R/W 0
Va
When the voltage signal crosses the zero point, a zero-crossing interrupt will be triggered, the sign bit
“USIGN” (“bit17” of “SysCtrl”) will toggle following the voltage signal.
Voltage
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USIGN_flag bit
Voltage sign
output_INT
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Figure 8-1 Zero-Crossing Interrupt
V9261F integrates a current detection circuit, and supports the current detection interrupt.
Set the bit “IDETEN” (“bit12” of “MTPARA0”, 0x0183) to ‘1’ to enable the current detection. The
detection circuit will compare the preset threshold for the current detection (“IDETTH”, 0x0134, R/W)
with the absolute value of the current signal, from which the DC component introduced by the external
Va
components and internal ADCs has been removed. Equation 8-1 depicts the signal processing:
LPF2 DC
BIAS
Current
detection
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samples of the current signal are higher than the threshold can the current signal be strong enough for
measurement and can a current detection interrupt signal be triggered. The interrupt signal will set the
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flag bit “DETCST” (“bit18”, “SysCtrl”) to ‘1’, which can be cleared by writing ‘0’ when the absolute
value of the current signal is lower than the threshold. In the Current Detection Mode, this interrupt
output cannot be masked.
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Threshold
DETCST_flag bit
Va
current detection
interrupt_INT
8.5. Registers
Table 8-2 Interrupt Flag Bits
When the external crystal stops running, this bit will be set and hold the
Bit27 state till the crystal starts to oscillate again.
R
HSEFAIL When the crystal stops running, the UART serial interface will be sourced
by the 3.2-MHz RC clock (“CLK2”) that is not accurate enough for the
UART communication, so the master MCU cannot read the value of this bit
to detect the state of the crystal.
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The reading remains ‘0’.
Bit23
R/W Invert the value of “bit7” of “SysCtrl” and write it to “bit23” for the
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Reserved
system control register self-checking.
The latch of “PDN”. When the reset occurs, it will be ‘0’. After the reset, the
value will be determined by the working environment.
Invert the value of “bit6” of “SysCtrl” and write it to “bit22” for the
system control register self-checking.
When the leakage occurs in the external capacitor of “REF”, this bit will be
set to high. Otherwise, this bit will be set to low. The level of this bit will
Bit21 not be changed by the read/write operation.
Va
R/W
REF The default value is relevant to the working environment.
Invert the value of “bit5” of “SysCtrl” and write it to “bit21” for the
system control register self-checking.
Read this flag bit for the state of the system control register self-checking.
By default it is read out as ‘1’. If the values of “bit[8:0]” and
“bit[24:16]” are opposite to each other bit by bit, the system control
register self-checking will pass, and this bit will be read out as ‘0’;
Bit20
R/W otherwise, the self-checking will fail, and this bit will be read out as ‘1’.
SYSERR Only writing the exact opposite values of “bit[8:0]” to “bit[24:16]” can
clear this bit.
Invert the value of “bit4” of “SysCtrl” and write it to “bit20” for the
system control register self-checking.
Bit19 R/W Read this bit for the state of configuration verification
Invert the value of “bit3” of “SysCtrl” and write it to “bit19” for the
system control register self-checking.
When some continuous samples of the current signal are higher than the
Bit18 preset threshold, this bit will be set to ‘1’ to indicate that a current signal
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R/W is caught. This bit can be cleared only by writing ‘0’ to it when the current
DETCST samples are lower than the threshold.
Invert the value of “bit2” of “SysCtrl” and write it to “bit18” for the
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system control register self-checking.
1: Negative
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Bit17 0: Positive
R/W
USIGN Read this bit to detect the sign of the voltage. This bit toggles following
the sign of the voltage.
Invert the value of “bit1” of “SysCtrl” and write it to “bit17” for the
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9. Registers
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Bit Default Function Description
Bit[31:30] Reserved 0 These bits must be set to “0b11” for proper operation.
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Clear this bit to enable the 3.2-MHz RC Clock. It is mandatory
to enable the Bandgap circuit and biasing circuit firstly. The
value of the bit is uncertain when the system is reset.
Set this bit to ‘1’ to enable the biasing circuit to provide the
global biasing current for ADCs and the 3.2-MHz RC oscillator.
Therefore, in the Metering Mode, when the chip operates with
full functions, this bit must be set to ‘1’ before enabling ADCs
Bit28 BIASPDN 0 and the 3.2-MHz RC oscillator. By default the biasing circuit is
disabled.
Va
Set this bit to ‘1’ to enable the Bandgap circuit to provide ADCs
and the 3.2-MHz RC oscillator with the reference voltage and
biasing voltage. Therefore, in the Metering Mode, when the
chip operates with full functions, this bit must be set to ‘1’
Bit27 BGPPDN 0 before enabling ADCs and the 3.2-MHz RC oscillator. By default
the Bandgap circuit is disabled.
Set this bit to ‘1’ to enable Voltage Channel ADC. The Bandgap
Bit26 ADCUPDN 0 circuit must be enabled before this ADC.
Both in the Sleep Mode and the Current Detection Mode, this
Set this bit to ‘1’ to enable Current Channel ADC. The Bandgap
circuit must be enabled before this ADC.
Bit24 ADCIPDN 0
In the Sleep Mode, this bit is cleared automatically. In the
Current Detection Mode, this bit is set to ‘1’ automatically.
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Bit[23:22] Reserved 0 These bits must hold their default values for proper operation.
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external crystal when it stops running. One stimulating signal
with 1-ms pulse width will be generated every 1 second under
Bit21 XRSTEN 0 this condition. By default this function is disabled.
Both in the Sleep Mode and the Current Detection Mode, this
bit is set to ‘1’ automatically.
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Bit15 Reserved 0 This bit must hold its default value for proper operation.
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temperature performance during normal metering, it must be
configured according to the calculated result. The calculation
method, please refer to Bandgap Circuit chapter.
000: No adjustment
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001: +10 ppm
Bit[14:12] REST<2:0> 0
010: +20 ppm
00: No adjustment
01: by -33%
10: by -66%
11: by -75%
Bit[11:10] IT<1:0> 0
In the Current Detection Mode, it is recommended to set these
bits to “0b10” and lower the “ADCCLK” frequency to 204.8
kHz to accelerate the detection.
00: No adjustment
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Bit7 GU 0 0: ×4 (Recommended)
1: ×1
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Bit6 Reserved 0 This bit must be set to ‘1’ for proper operation.
00: ×4
01: ×1
10: ×32
11: ×16
Va
Bit[3:2] Reserved. 0 These bits must hold their default values for proper operation.
01: ×16
10: ×4
11: ×1
Bit[31:30] Reserved 0 These bits must hold their default values for proper operation.
00: No adjustment
01:+33%
11: +100%
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performance and temperature coefficient.
Bit[27:23] Reserved 0 These bits must hold their default values for proper operation.
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To select the analog input for signal processing in Measurement
Channel ADC
001/010/011: Reserved
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Bit[22:20] MEAS<2:0> 0
100: Temperature
101/110/111: Ground
Bit[19:0] Reserved 0 These bits must hold their default values for proper operation.
Bit[31:30] Reserved 0 These bits must hold their default values for proper operation.
When the chip operates with full functions in the Metering Mode,
it is recommended to hold their default values for the best
performance.
Bit[23:20] Reserved 0 These bits must hold their default values for proper operation.
Bit18 - 0 These bits must hold the default value for proper operation.
00: No adjustment
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Bit[17:16] XCSEL<1:0> 0
01: +2 pF
10: +4 pF
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11: +6 pF
Bit15 Reserved 0 This bit must hold its default value for proper operation.
001: -0.1 V
010: +0.2 V
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100: -0.4 V
101: -0.5 V
110: -0.2 V
Va
111: -0.3 V
Bit11 Reserved 0 This bit must hold its default value for proper operation.
Bit9 Reserved 0 This bit must hold its default value for proper operation.
Bit[7:0] Reserved 0 These bits must hold their default values for proper operation.
In V9261F, “bit[8:0]” of register “SysCtrl” (0x0180) are used for key configuration for the operation
mode, and “bit[24:16]” are designed as the backup of their configurations. Invert the values of
“bit[8:0]”, and write them into “bit[24:16]” sequentially. The internal self-checking circuit compares
the content of both parts all the time. If they are opposite to each other bit by bit, it indicates the
configurations are right; otherwise, an interrupt signal will be triggered, and the flag bit “SYSERR” (bit20
of SysCtrl) will be set to ‘1’.
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0x0180, System Control Register, SysCtrl
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Flag for Staring/Creeping State indication
1: Start metering
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Bit30 Reserved R N/A It is meaningless to read of this bit.
Bit28 PDN R 0 When the input voltage on the pin “AVCC” is lower than
2.8±0.14 V, this bit will be set to ‘1’. When the power down
event is disappeared, this bit will be cleared.
When the external crystal stops running, this bit will be set and
hold the state till the crystal starts to oscillate again.
Bit27 HSEFAIL R 0 When the crystal stops running, the UART serial interface is
sourced by the 3.2-MHz RC clock (“CLK2”) that is not accurate
enough for the UART communication, so the master MCU
cannot read the value of this bit to detect the state of the
crystal.
0 0 0 Reserved.
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Bit24 R/W Read of “bit24” together with “bit[26:24]” to detect the
reset source.
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for the system control register self-checking.
bit21 REF R/W N/A When the leakage occurs in the external capacitor of “REF”, this
bit will be set to high. Otherwise, this bit will be set to low. The
level of this bit will not be changed by the read/write operation.
Read this flag bit for the state of the system control register
self-checking. By default it is read out as ‘1’. If the values of
“bit[8:0]” and “bit[24:16]” are opposite to each other bit by
Bit20 SYSERR R/W 1
bit, the system control register self-checking will pass, and this
bit will be read out as ‘0’; otherwise, the self-checking will fail,
and this bit will be read out as ‘1’. Only writing the exact
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read out as ‘0’; otherwise, the verification will fail, and this bit
will be read out as ‘1’.
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Invert the value of “bit3” of “SysCtrl” and write it to “bit19”
for the system control register self-checking.
1: Negative
0: Positive
Va
001/010/011: Reserved
Bit[7:5] MEAS R/W 0
100: Temperature
101/110/111: Ground
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By default these bits are read out as “0b001”. These bits are
writable, but it is meaningless to write of them.
Bit[4:2] Reserved R/W 1
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Invert the values of these bits and write them to “bit[20:18]”
for the system control register self-checking.
Invert the value of this bit and write it to “bit17” for the system
control register self-checking.
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Set this bit to ‘1’ to disable “CLK1” and “CLK2” and force the
system to enter the Sleep Mode.
Bit0 SLEEP R/W 0
Invert the value of this bit and write it to “bit16” for the system
control register self-checking.
Va
Bit31 CFEN 0 Set this bit to ‘1’ to enable CF pulse output. By default this function is disable
Bit30 EGYEN 0 Set this bit to ‘1’ to enable energy accumulation and energy-to-pulse convers
Bit29 CRPEN 0 Set this bit to ‘1’ to enable no-load detection. By default this function is disab
When the “MEACLK” frequency is 3.2768 MHz, clear this bit to inform the CF
Bit28 CLKSEL 0 3.2768 MHz. When the “MEACLK” frequency is 819.2 kHz, set this bit to ‘1’ t
work at 819.2 kHz.
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To accelerate the CF pulse generation rate
00: ×1
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Bit[25:24] CFFAST 0 01: ×4
10: ×8
11: ×16
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To select the power for energy accumulation
Bit[21:15] Reserved N/A These bits must be set as ‘0’ for proper operation.
00: 8 bits
01: 9 bits
Bit[14:13] BPFSFT 0 10: 10 bits
11: 11 bits
The fewer bits are shifted, the less time the filter needs to response, and th
deviation is.
0: Disable
Bit[6:0] Reserved 0 These bits must hold their default values for proper operation.
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Bit Default Function Description
To set digital PGA gain for various signal input of Measurement Channel
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0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16; 0101:
Bit[31:28] PGAM 0
×1/32;
1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
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To enable digital signal input of Measurement Channel for digital signal
processing
0: Disable. When this bit is cleared, a constant ‘0’ is input for the digital
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signal processing.
To select current channels for digital signal processing when pins “IBP”
and “IBN” are used
Bit[24:23] Reserved 0 These bits must be set to their default values for proper operation.
When the bit “CKSUM” (bit22) is cleared, set this to ‘1’ to activate the
Bit21 IDET 0 configuration verification and current detection only; clear this bit to
execute all computations.
When “CKSUM” is set to ‘0’ and “IDET” is set to ‘1’, users can preset
a value in the register “DATACP” (0x0189) for energy accumulation.
When both “CKSUM” and “IDET” are cleared, users can select an
average power to transfer it to register “DATACP” for the energy
accumulation.
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When this bit is set to ‘1’, the high pass filter is disabled.
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Set this bit to ‘1’ to delay voltage for phase compensation. Clear this
Bit18 PHCIU 0
bit to delay current for phase compensation.
0: Disable. When this bit is cleared, a constant ‘0’ is input for the digital
signal processing.
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0: Disable. When this bit is cleared, a constant ‘0’ is input for the digital
Va
signal processing.
0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16; 0101:
Bit[7:4] PGAI 0
×1/32;
1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
0000: ×1; 0001: ×1/2; 0010: ×1/4; 0011: ×1/8; 0100: ×1/16; 0101:
Bit[3:0] PGAU 0
×1/32;
1000: ×1; 1001: ×2; 1010: ×4; 1011: ×8; 1100: ×16; 1101: ×32.
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will be updated in 640 ms and settled in 1200 ms.
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When the “MEACLK” frequency is 3.2768 MHz, this
register will be updated in 160 ms, and settled in 300 ms.
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and quality of the signal.
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When the “MEACLK” frequency is 3.2768 MHz, this register
32-bit, will be updated in 10.24 s; when the “MEACLK” frequency
0x011E AFREQ R
2’-complement is 819.2 kHz, this register will be updated in 40.96 s. The
settling time for the register is determined by the amplitude
and quality of the signal.
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Table 9-9 Registers for RMS Values of Total/Fundamental Signals (R/W)
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The raw fundamental current RMS
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register will be updated in 160 ms and settled in 500 ms.
When the “MEACLK” frequency is 819.2 kHz, the register
will be updated in 640 ms and settled in 2000 ms.
32-bit,
0x010A BRRTI R/W
2’-complement When Current Channel is used to process the current signal
ot
input from pins “IAP”/“IAN” (IA), this register will be
used to store the raw RMS value of fundamental IA. When
Current Channel is used to process the current signal input
from pins “IBP”/“IBN” (IB), this register will be used to
store the raw RMS value of fundamental IB.
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32-bit,
0x010E ARTI R/W
2’-complement When Current Channel is used to process the current signal
input from pins “IAP”/“IAN” (IA), this register will be
used to store the instantaneous RMS value of total IA.
When Current Channel is used to process the current signal
input from pins “IBP”/“IBN” (IB), this register is to store
the instantaneous RMS value of total IB.
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The instantaneous fundamental voltage RMS
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2’-complement register will be updated in 160 ms and settled in 500 ms.
When the “MEACLK” frequency is 819.2 kHz, the register
will be updated in 640 ms and settled in 2000 ms.
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Measurement Channel
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the
0x0117 AARTM R/W
2’-complement
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register will be updated in 1.28 s and settled in 3 s. When
the “MEACLK” frequency is 819.2 kHz, the register will be
updated in 5.12 s and settled in 12 s.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x0107 RBP R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
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The raw fundamental reactive power
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x0108 RBQ R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
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“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
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0x010B IAP R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x010C IAQ R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
Va
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x0110 IBP R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x0111 IBQ R/W be updated in 160 ms and settled in 500 ms. When the
2’-complement
“MEACLK” frequency is 819.2 kHz, the register will be updated
in 640 ms and settled in 2000 ms.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x0119 AAP R/W be updated in 1.28 s and settled in 3 s. When the “MEACLK”
2’-complement
frequency is 819.2 kHz, the register will be updated in 5.12 s
and settled in 12 s.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x011A AAQ R/W be updated in 1.28 s and settled in 3 s. When the “MEACLK”
2’-complement
frequency is 819.2 kHz, the register will be updated in 5.12 s
and settled in 12 s.
h
The average fundamental active power
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
0x011F ABP R/W be updated in 1.28 s and settled in 3 s. When the “MEACLK”
2’-complement
ec
frequency is 819.2 kHz, the register will be updated in 5.12 s
and settled in 12 s.
32-bit, When the “MEACLK” frequency is 3.2768 MHz, the register will
ot
0x0120 ABQ R/W be updated in 1.28 s, and settled in 3 s. When the “MEACLK”
2’-complement
frequency is 819.2 kHz, the register will be updated in 5.12 s
and settled in 12 s.
ng
32-bit, This register is physically 46-bit, but only the most significant 32 bits
0x01A1 PEGY R/W are active. When the “MEACLK” frequency is 3.2768 MHz, the
unsigned.
accumulation frequency will be 204.8 kHz. When the “MEACLK”
frequency is 819.2 kHz, the accumulation frequency will be 102.4
kHz.
32-bit, This register is physically 46-bit, but only the most significant 32 bits
0x01A2 NEGY R/W are active. When the “MEACLK” frequency is 3.2768 MHz, the
unsigned.
accumulation frequency will be 204.8 kHz. When the “MEACLK”
frequency is 819.2 kHz, the accumulation frequency will be 102.4
kHz.
h
a power and transfer it to this register for the normal energy
accumulation.
ec
When a Power-On Reset (POR), RX reset, or global software reset occurs, all registers for calibration
will be reset to their default states. If not specifically noted, all the default values in the following tables
ot
are in the format of hexadecimal. Their contents must be verified all the time.
2’-complement
verified.
h
Table 9-16 Registers for Calibrating Active/Reactive Power (R/W)
ec
Set a value to gain
32-bit
0x012E WAPT 0 R/W calibrate the total
2’-complement
active power.
h
When the current detection is enabled, the current
detection circuit will compare the absolute value of
ec
the instantaneous current signal to the preset
32-bit
0x0134 IDETTH 0 R/W current detection threshold in this register. When
2’-complement
some continuous samples of the current signal are
higher than the threshold, it means a current
signal is caught.
ot
The content of this register must be verified.
Table 9-18 Register for Bandpass Filter Coefficient Configuration (0x0125, BPFPARA, R/W)
h
ec
ot
ng
Va
A
A
θ3
A X
A1
Dimensions (Unit: mm)
D
Symbol Min. Nom. Max.
16 9 A 1.40 1.73
θ1
A1 0.05 0.18
A2 1.35 1.55
h
h θ4 E 5.84 6.24
E1 3.84 4.04
D 9.90 10.10
L 0.40 0.70
e 1.27TYP
θ2 L
b 0.36 0.46
L1
E1
b1 0.36 0.46
E
b c 0.2TYP
c1 0.2TYP
“X” b1
θ1 8°TYP
θ2 8°TYP
θ3 4°TYP
c1
c
h
θ4 15°TYP
1 2 3 e
8 A-A
Index Area (0.25D+0.75E)
ec
ot
ng
Va