Telit Jupiter SE868V2 Hardware User Guide r2
Telit Jupiter SE868V2 Hardware User Guide r2
Telit Jupiter SE868V2 Hardware User Guide r2
APPLICABILITY TABLE
PRODUCT
SE868 V2
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Contents
1.
Introduction ......................................................................................... 8
1.1.
Scope ....................................................................................................... 8
1.2.
Audience.................................................................................................. 8
1.3.
1.4.
1.5.
Text Conventions..................................................................................... 9
1.6.
1.7.
2.
2.1.
2.2.
Capacitance........................................................................................... 12
2.3.
2.4.
2.5.
3.
3.1.
4.
4.1.
4.2.
5.
6.
6.1.
6.2.
6.3.
7.
7.1.
7.2.
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7.3.
7.4.
7.5.
7.6.
7.7.
7.8.
7.9.
7.10.
RF Interference ................................................................................. 26
7.11.
Shielding ............................................................................................ 27
8.
9.
9.1.
Internal LNA.......................................................................................... 30
9.2.
9.2.1.
9.2.2.
TricklePowerTM ....................................................................................... 31
9.2.3.
Push-To-Fix .............................................................................................. 31
9.3.
9.4.
9.5.
9.6.
9.6.1.
Static Navigation....................................................................................... 33
9.6.2.
9.7.
9.7.1.
9.7.2.
SBAS ......................................................................................................... 34
9.7.3.
10.
11.
11.1.
11.2.
ESD .................................................................................................... 38
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11.3.
Reflow ................................................................................................ 38
11.4.
12.
13.
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1.
Introduction
1.1.
Scope
The SE868-V2 is an 11mm by 11mm integrated GNSS receiver module using
SiRFstar V technology. This document expands upon the data sheet(s) to
highlight particular areas to allow the hardware engineer to achieve a successful
design implementation.
1.2.
Audience
This document is intended for helping customer in the integration of the Telit
SE868 GNSS module.
1.3.
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1.4.
Document Organization
This document contains the following chapters (sample):
Chapter 1: Introduction provides a scope for this document, target audience,
contact and support information, and text conventions.
Chapter 2: Powering the SE868-V2 gives an overview about power supply.
Chapter 3: Example Implementation describes the Startup and shutdown
Chapter 4: SE868-V2 ROM features describes the new ROM features code to
ROM version.
Chapter 5: Updating Patch Code describes updating patch code in SPI Flash
Chapter 6: Main serial interface describes the serial interfaces.
Chapter 7: RF Front End Design describes in details the characteristics of the
Front end.
Chapter 8: Reference Design gives an overview about the reference design.
Chapter 9: Firmware configuration describes the configuration settings.
Chapter10:Operating Conditions and Electrical Specifications describes
electrical Specifications
Chapter 11: Handling and soldering describes packaging and soldering of the
module.
Chapter 12: PCB layout details describes the mechanical design of the
module.
Chapter 12: Document History describes the history of the present product.
1.5.
Text Conventions
Danger This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning Alerts the user to important points about
integrating the module, if these points are not followed, the module
and end user equipment may fail or malfunction.
Tip or Information Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
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1.6.
1.7.
Related Documents
The JF2 flash variant used the BOOT pin to program the device. The
Boot pin will be a no connect on the SE868-V2 module the same as the
JF2 ROM variant.
The SE868-V2 does not support EEPROM. It uses an internal SPI flash.
The Baud rate and protocol will be NEMA 4800 on initial boot and any
subsequent ON-OFF cycles unless a software patch is loaded in the
Serial SPI Flash.
The SE868 V2 does not support DRI2C or MEMs devices because the
DRI2C port is now used by the internal SPI flash. For this reason, the
GPIO0, GPIO1, GPIO3 and GPIO4 lines must not be connected in
customer applications, otherwise operation with the SPI flash can fail.
The current JF2 EVK will not work properly with an SE868-V2 module
unless hardware changes are made. The JF2 antenna detect circuitry uses
GPIO2 and GPIO3. The SE868-V2 uses GPIO3 for the internal SPI flash.
For the SE868-V2 the change in level on GPIO8 no longer affects the
functionality of the ON-OFF signal as it did on JF2 modules. The GPIO8
pin is now used for external antenna use select. GPIO8 is read at power
up to determine whether the SE868-V2 is to be placed in high gain or
low gain mode. Pull low for low gain mode, leave floating or pulled high
for high gain mode. Typically pull low if an external LNA or active
patch antenna used.
The SE868 V2 adds a new power pin. For compatibility to the JF2 flash
and ROM variants a zero ohm jumper has been added internally so this
pin will not need to be powered. However, we recommend it be
connected to 1.8V. The previous JF2 variants had this pin as a noconnect. If the customer grounded this pin in their design, it will short
the 1.8 volt supply directly to ground.
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2.
2.1.
2.2.
Capacitance
Aluminum electrolytic capacitors are not recommended at the input to the
SE868-V2 due to their high ESR. Tantalum capacitors are recommended with a
minimum value of 10uF in parallel with a 0.1uF ceramic capacitor. Ceramic
capacitors alone can be used, but make sure the LDO is stable with such
capacitors tied to the output.
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2.3.
2.4.
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Prior
Event/State
First power
applied
RTC running
Symbol
Min
Typ
Max
Unit
T1
299
1000
ms
T2
THIGH
10
3
TRTC
TRTC
The host can wait a fixed duration. In most cases, the time-to-ready
interval can be on the order of 300ms. If the system temperature is very low,
the RTC startup time may be as long as 5 seconds.
The host can issue ON-OFF pulses repeatedly every 100ms and monitor for
JF-2 SYSTEM-ON output to go HIGH. Note that issuing an ON-OFF pulse
once the system is running may cause the firmware to initiate the shutdown
process.
The host can issue ON-OFF repeatedly every one second and wait for serial
messages to be output within the one second. Note that issuing an ON-OFF
pulse once the system is running may cause the firmware to initiate the
shutdown process.
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2.5.
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3.
Example Implementations
This section illustrates the implementations that meet the rules for the SE868-V2.
Telit recommends assessing the risks when making implementation decisions
3.1.
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4.
4.1.
4.2.
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5.
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6.
UART
PU
Leave floating or PU
I2C
Leave floating or PD
PD
SPI
Leave floating
Leave floating
6.1.
UART Mode
The GPIO6 pin should be pulled high through a 10K resistor to the 1.8 volt
supply. The GPIO7 pin can be left open or pulled to 1.8V. Upon power up, the
SE868-V2 will communicate using a standard asynchronous 8 bit protocol with
messages appearing on the TX line, and commands and data being entered on
the RX line. Note the GPIO6 and GPIO7 lines are read at power up or reset only
and are not used afterwards. In particular, no flow control operations are
performed.
6.2.
I2C Mode
The GPIO7 pin should be pulled low through a 10K resistor to GND. The
GPIO6 pin can be left open or pulled low. Upon power, the SE868-V2 acts as a
master transmitter and a slave receiver. Pull-ups to a 1.8V to 3.6V power supply
in the range of 1K to 2.2K are required on the RXA and TXA lines when used in
I2C mode. In this mode, the pins are defined below:
Signal
Name
RXA
TXA
I2C Function
I2C Data (DIO)
I2C Clock (CLK)
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time, as the I2C bus allows for contention resolution between SE868-V2 and a
host vying for the bus.
6.3.
SPI Mode
If both the GPIO6 and GPIO7 pins are left floating, the SE868-V2 will power up
in slave SPI mode, supporting both SPI and Microwire formats. In this mode, the
four pins are defined below:
Signal
Name
SPI Function
GPIO7
GPIO6
RXA
TXA
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7.
7.1.
RF Signal Requirements
The SE868-V2 can achieve Cold Start acquisition with a signal level of -146
dBm at its input. This means the SE868-V2 can find the necessary satellites,
download the necessary ephemeris data and compute the location within a 2
minute period. In the GNSS signal acquisition process, downloading and
decoding the data is the most difficult task, which is why Cold Start acquisition
requires a higher signal level than navigation or tracking signal levels. For the
purposes of this discussion, autonomous operation is assumed, which makes the
Cold Start acquisition level the important design constraint. If assistance data in
the form of time or ephemeris aiding is available, then even lower signal levels
can be used to compute a navigation solution.
The GPS signal is defined by IS-GPS-200E. This document states that the signal
level received by a linearly polarized antenna having 3 dBi gain will be a
minimum of -130 dBm when the antenna is in the worst orientation and the
satellite is 5 degrees or more above the horizon.
GLONASS signal is defined by GLONASS ICD 2002 Version 5.1. This
document states the power level of the received RF signal from GLONASS
satellite at the output of a 3dBi linearly polarized antenna is not less than -161
dBW (-131dBm) for L1 sub-band provided that the satellite is observed at an
angle 5 degrees or more above the horizon.
In actual practice, the GPS satellites are outputting slightly more power than
specified by IS-GPS-200E, and the signal level typically goes higher as the
satellites have higher elevation angles.
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The SE868-V2 will display a reported C/No 40 dB-Hz with a GPS signal level
of -130 dBm into the RF input. This assumes a SEN (system equivalent noise) of
the receiver of 4dB. System Equivalent Noise includes the Noise Figure of the
receiver plus signal processing or digital noise. For an equivalent GLONASS
signal level the GLONASS signal will report a C/No approximately 39 dB-Hz.
This is due to the receivers higher losses (NF) for GLONASS signals and a
higher signal processing noise for GLONASS signals.
Each GNSS satellite presents its own signal to the SE868-V2, and best
performance is obtained when the signal levels are between -125 dBm and -117
dBm. These received signal levels are determined by
The first three items in the list above are specified in IS-GPS-200E, online while
the GLONASS signal is defined by GLONASS ICD 2002 Version 5.1 readily
available from multiple sources
IS-GPS-200E specifies a signal level minimum of -130 dBm will be presented to
the receiver when using a linearly polarized antenna with 3 dBi gain.
GLONASS ICD 2002 Version 5 states the the power level of the received RF
signal from GLONASS satellite at the output of a 3dBi linearly polarized
antenna is not less than -161 dBW for L1 sub-band provided that the satellite is
observed at an angle of 5 or more
The GNSS signal is relatively immune to rainfall attenuation and does not really
need to be considered.
However, the GNSS signal is heavily influence by attenuation due to foliage,
such as tree canopies, etc. as well as outright blockage caused by building,
terrain or other items in the line of sight to the specific GNSS satellite. This
variable attenuation is highly dependent upon GNSS satellite location. If enough
satellites are blocked, say at a lower elevation, or all in a general direction, the
geometry of the remaining satellites will result is a lower accuracy of position.
The SE868-V2 reports this geometry in the form of PDOP, HDOP and VDOP.
For example, in a vehicular application, the GNSS antenna may be placed
embedded into the dashboard or rear package tray of an automobile. The metal
roof of the vehicle will cause significant blockage, plus any thermal coating
applied to the vehicle glass can attenuate the GNSS signal by as much as 15 dB.
Again, both of these factors will affect the performance of the receiver.
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7.2.
7.3.
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ground plane required and any external matching components. Failure to follow
these requirements could result in very poor antenna performance.
It is important to note that GNSS antenna gain is not the same thing as external
LNA gain. Most antenna vendors will specify these numbers separately, but
some combine them into a single number. It is important to know both numbers
when designing and evaluating the front end of a GNSS receiver.
For example, antenna X has an antenna gain of 5 dBiC at azimuth and an LNA
gain of 20 dB for a combined total of 25 dB. Antenna Y has an antenna gain of 5 dBiC at azimuth and an LNA gain of 30 dB for a combined total of 25 dB.
However, in the system, antenna X will outperform antenna Y by about 10 dB
(refer to Section 9.4 for more details on system noise floor).
An antenna with higher gain will generally outperform an antenna with lower
gain. Once the signals are above about -130 dBm for a particular satellite, no
improvement in performance would be gained. However, for those satellites that
are below approximately -125 dBm, a higher gain antenna would improve the
gain and improve the performance of the GNSS receiver. In the case of really
weak signals, a good antenna could mean the difference between being able to
use a particular satellite signal or not.
7.4.
7.5.
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However, an active antenna has a low noise amplifier (LNA) with associated
gain and noise figure. In addition, many active antenna have either a pre-select
filter, a post-select filter or both.
7.6.
RF Trace Losses
RF Trace losses are difficult to estimate on a PCB without having the
appropriate tables or RF simulation software to estimate what the losses would
be. A good rule of thumb would be to keep the RF traces as short as possible,
make sure they are 50 ohms impedance and dont contain any sharp bends.
7.7.
7.8.
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The external LNA should have a noise figure better than 1 dB. This will give an
overall system noise figure of around 2 dB assuming the LNA gain is 14 dB. If
higher the low gain mode is selected within the SE868-V2.
The external LNA, if having no pre-select filter, needs to be able to handle
signals other than the GNSS signal. These signals are typically at much higher
levels. The amplifier needs to stay in the linear region when presented with these
other signals. Again, the system designer needs to determine all of the
unintended signals and their possible levels that can be presented and make sure
the external LNA will not be driven into compression. If this were to happen, the
GNSS signal itself would start to be attenuated and the GNSS performance
would suffer.
7.9.
This additional loss occurs after the LNA so it is generally not significant unless
the circuit is being designed to work with either an active or a passive antenna.
7.10.
RF Interference
RF Interference into the GNSS receiver tends to be the biggest problem when
determining why the system performance is not meeting expectations. As
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mentioned earlier, the GPS signals are at -130 dBm and lower. If signal higher
than this are presented to the receiver it can be overwhelmed. The SE868-V2 can
reject up to 8 CW in-band jamming signals, but would still be affected by nonCW signals.
The most common source of interference is digital noise. This is created by the
fast rise and fall times and high clock speeds of modern digital circuitry. For
example, a popular netbook computer uses an Atom processor clocked at 1.6
GHz. This is only 25 MHz away from the GPS signal, and depending upon
temperature of the SAW filter, can be within the passband of the GNSS receiver.
Because of the nature of the address and data lines, this would be broadband
digital noise at a relatively high level. Such devices are required to adhere to a
regulatory standard for emissions such as FCC Part 15 Subpart J Class B or
CISPR 22. However, these regulatory emission levels are far higher than the
GNSS signals.
7.11.
Shielding
Shielding the RF circuitry generally is ineffective because the interference is
getting into the GNSS antenna itself, the most sensitive portion of the RF path.
The antenna cannot be shielded because then it cant receive the GNSS signals.
There are two solutions, one is to move the antenna away from the source of
interference or the second is to shield the digital interference to prevent it from
getting to the antenna.
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8.
Reference Design
The SE868-V2 Reference Design is presented in the figure below.
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9.
Firmware Configuration
The SE868-V2 can be configured by means of firmware in order to fit better into
the overall system. This section describes certain aspects of the receiver that
can be configured.
9.1.
Internal LNA
The SE868-V2 offers two modes of operation, high gain mode and low gain
mode, for the internal LNA. The high gain mode is the default mode and
provides 16 to 20dB of gain. The low gain mode provides 6 to 10dB of gain.
The SE868-V2 can be used with an external LNA such as what might be found
in an active antenna. GPIO 8 is external LNA detect during boot up. If an
External LNA is to be used then GPIO8 should be pulled low. When GPIO8 is
left floating the internal LNA will be used. This is a onetime detect on startup
and is not dynamic.
In general, the high gain mode is intended for use with passive antennas, while
the low gain mode is used when there is an external LNA as part of the RF front
end (e.g. active antenna). The recommended external LNA gain is 20dB.
The Tracker Config message (OSP MID178, SID2) can also be used to change
the LNA mode, but note that the use of this message is not recommended,
because an incorrect parameter could render the SE868-V2 inoperable. Contact
Telit technical support if this approach is required in your system.
9.2.
9.2.1.
Full Power
This mode consumes the most average power, but it is the most accurate
navigation mode and supports the most dynamic motion scenarios.
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9.2.2.
TricklePowerTM
This mode is a duty-cycling mode. It provides navigation updates at a fixed rate
and retains a high quality of GNSS accuracy and dynamic motion response, but
at a lower average power cost as compared to Full Power operation.
TricklePower mode produces significant power savings in strong signal
conditions.
9.2.3.
Push-To-Fix
This mode provides for even lower power consumption than TricklePower. It is
intended for applications that require infrequent position reports. The position
is reported periodically by the receiver (once every 30 minutes by default) and
also when requested. To request a position update, a pulse is asserted on the
ON-OFF pin.
9.3.
9.4.
9.5.
OSP Considerations
The higher baud rates are used for OSP. OSP offers a richer set of commands
and more types of data output than does NMEA. Use the Set Serial Port
(PSRF100) NMEA command to switch the protocol from NMEA to OSP. The
minimum recommended baud rate for OSP is 38400, provided that debug data
messages are not enabled. If data debug messages are enabled, the minimum
baud rate is 115200 in order to prevent data from being dropped. The protocol
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can be switched back to NMEA using the Switch to NMEA Protocol command
(Message ID 129).
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9.6.
Motion Dynamics
9.6.1.
Static Navigation
Static navigation, also called position pinning, is a mechanism that it is used by
the receiver to freeze, or pin, the position when the velocity falls below a
threshold indicating that the receiver is stationary. The heading is also frozen,
and the velocity is reported as 0. The solution is then unpinned when the
velocity increases above a threshold or when the computed position is a set
distance from the pinned position, indicating that the receiver is in motion again.
Note that these velocity and distance thresholds cannot be changed.
By default static navigation is disabled. It can be enabled by sending a Static
Navigation message (Message ID 143) with the static navigation flag set to 1.
This feature is useful for applications in which very low dynamics are not
expected, the classic example being an automotive application.
9.6.2.
Velocity Dead-Reckoning
Velocity dead-reckoning refers to the use of the last known velocity to propagate
the navigation solution when there are insufficient measurements to calculate an
updated solution. It serves to mitigate the effects of blocked satellite signals by
continuing to provide a position output. Note that the receiver outputs status
information which indicates whether a solution is being maintained using deadreckoning.
By default the receiver operates in dead-reckoning mode for up to 15 seconds
before invalidating the position. This timeout value is considered to be
appropriate for most applications. It can be changed using the Mode Control
message (Message ID 136). Valid timeout values are in a range from zero,
which disables dead-reckoning, to two minutes.
9.7.
Advanced Features
9.7.1.
CW Jamming Detection
The SE868-V2 module detects, tracks, and removes narrow-band interfering
signals (jammers) without the need for external components or tuning. It
monitors a frequency band that is +/- 4MHz from the L1 frequency for jammers.
Any number of jammers that occur outside of a +/-1MHz center band are
removed by the SE868-V2 with a 2MHz band pass filter. Up to eight jammers
inside this center band are removed using a notch filter.
Data regarding detected jammers is output using OSP messages. Message ID 92,
Sub ID 1, reports up to eight of the most recently detected interferers. This
feature is useful both in the design stage and during the production stage for
uncovering issues related to unexpected jamming.
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9.7.2.
SBAS
The SE868-V2 receiver is capable of using Satellite-Based Augmentation
System (SBAS) satellites as a source of both differential corrections and satellite
range measurements. These systems (WAAS, EGNOS, MSAS) use
geostationary satellites to transmit regional differential corrections via a GNSScompatible signal. The use of SBAS corrections can improve typical position
accuracy to 3m or less in open-sky applications.
Note that only an SBAS can be used as source of differential corrections. Other
sources such as data from RTCM beacons are not supported.
By default the SE868-V2 does not attempt to acquire SBAS satellites. This can
be changed by sending in a DGPS Source command (MID 133) and specifying
the source of DGPS corrections as SBAS. When the receiver acquires SBAS
satellites, it will demodulate and use corrections data from the satellite signal.
The receiver can be configured to compute SBAS satellite range measurements
and use them in the navigation solution. This can be enabled through a control
bit in the OSP Mode Control command (MID 136). See the OSP Manual for
details.
9.7.3.
2-D Acquisition
By default, the SE868-V2 will compute a 2-D solution when possible when
performing initial acquisition. In a 2-D solution, the receiver assumes a value
for altitude and uses it to estimate the horizontal position. Under warm and hot
start conditions, the receiver uses the last known value of altitude, which is a
good assumption in most situations. However under cold start conditions, the last
position is unknown, and the receiver assumes a value of 0. In situations where
the true altitude is significantly higher than that, the horizontal position estimate
will be noticeably impacted. To accommodate applications for which these
situations are a concern, a version of SE868-V2 firmware is offered that requires
a calculated altitude, i.e. a 3-D navigational solution, in order for the receiver to
first enter navigation.
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10.
VDDAC
VDDAC
Parameter
Operating
Temperature
Supply
voltage input
Supply
voltage
ripple ,AC
coupled
Supply
voltage
ripple , AC
coupled
Min
Typ
Max
Unit
-40
+85
1.75
1.8
1.85
54
mV(rms)
f=03Mhz
15
mV
(rms)
f>3Mhz
Parameter
Min
Current Usage
Idd(max)
IDD(peak)
IDD(Acq)
IDD(ave)
IDD(ave)
84
-
43
mA
mA
54
38
ma
45
mA
53
9.5
IDD(Hib)
IDD(ATP)
VOL
0.4
VOH
0.75*VDD
VIL
-0.3
0.45
VIH
0.7*VDD
3.6
mA
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RPU
50
86
157
RPD
51
91
180
LI
-10
10
LO
-10
10
CI
pF
Parameter
RF Input
Voltage
RF Input Power
ESD Voltage
CDM
JESD22-C101E
ESD Voltage
HDM
JEDEC JS-0012012
1.8V Main
Supply Voltage
I/O Pin Voltage
Storage
Temperature
Symbol
Rating
Units
All RF inputs
1.5
All RF inputs
10
dBm
All Pins
+/- 1100
All Pins
+/-500
VDD_18
2.2
3.60
150
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Page 36 of 41
Mod. 0805 2011-07 Rev.2
11.
11.1.
Moisture Sensitivity
The SE868-V2 module has a moisture sensitivity level rating of 3 as defined by
IPC/JEDEC J-STD-020. This rating is assigned due to some of the components
used within the SE868-V2.
The SE868-V2 is supplied in trays or tape and reel and is hermetically sealed
with desiccant and humidity indicator card. The SE868-V2 parts must be placed
and reflowed within 168 hours of first opening the hermetic seal provided the
factory conditions are less than 30C and less than 60% and the humidity
indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above
10%, then the parts will need to be baked prior to reflow. The parts may be
baked at +125C 5C for 48 hours. However, the trays, nor the tape and reel
can withstand that temperature. Lower temperature baking is feasible if the
humidity level is low and time is available. Please see IPC/JEDEC J-STD-033
for additional information.
Additional information can be found on the MSL tag affixed to the outside of the
hermetical seal bag.
NOTE:
JEDEC standards are available for free from the JEDEC website
http://www.jedec.org.
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Mod. 0805 2011-07 Rev.2
11.2.
ESD
The SE868-V2 is an electrostatic discharge sensitive device and should be
handled in accordance with JESD625-A requirements for Handling Electrostatic
Discharge Sensitive (ESDS) Devices. Although the SE868-V2 is a module, the
expecting handling of the SE868-V2 during assembly and test is identical to that
of a semiconductor device.
Note: JEDEC standards are available for free from the JEDEC website
http://www.jedec.org.
11.3.
Reflow
The SE868-V2 is compatible with lead free soldering processes as defined in
IPC/JEDEC J-STD-020. The reflow profile must not exceed the profile given
IPC/JEDEC J-STD-020 Table 5-2, Classification Reflow Profiles. Although
IPC/JEDEC J-STD-020 allows for three reflows, the assembly process for the
SE868-V2 uses one of those profiles. Thus the SE868-V2 is limited to two
reflows.
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Page 38 of 41
Mod. 0805 2011-07 Rev.2
Note: JEDEC standards are available for free from the JEDEC website
http://www.jedec.org.
When re-flowing a dual-sided SMT board, it is important to reflow the side
containing the SE868-V2 module last. This prevents heavier components within
the SE868-V2 becoming dislodged if the solder reaches liquidus temperature
while the module is inverted.
11.4.
Assembly Issues
Due to the piezo-electric components within the SE868-V2 the component
should be placed close to the end of the assembly process to minimize shock to
the module. During board singulation, pay careful attention to unwanted
vibrations and resonances introduced into the board assembly by the board router.
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Page 39 of 41
Mod. 0805 2011-07 Rev.2
12.
0.45
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Page 40 of 41
Mod. 0805 2011-07 Rev.2
13.
Document History
Revision
1
2
Date
2013-09-04
2013-10-07
Changes
First issue
Section 1.7.5 edited for clarity, Section 2.4 edited for
content. Header corrected. Document history corrected.
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Page 41 of 41
Mod. 0805 2011-07 Rev.2