5 - HyperLynx E1

HyperLynx Product Update
Steve Gascoigne
Application Engineer Consultant Global Distribution Channel November 2012
A Complete Analysis Solution

Address multiple design areas through virtual prototyping Integrated technologies to accelerate adoption Ease-of-use enables ALL engineers to perform analysis
PCB designers thru SI/PI specialists
2012 Mentor Graphics Corp. Company Confidential
www.mentor.com
Signal Integrity Concerns

Traditional signal integrity
Crosstalk, overshoot, timing, impedance
DDRx design
Timing, ODT selection
Multi-gigabit SerDes technologies

Loss management, via design, length matching, impedance discontinuities
www.mentor.com
HyperLynx: LineSim SI

Industry-renowned ease of use Accurate modeling of trace impedance, coupling, and frequency-dependent losses Terminator wizard recommends optimal termination strategies Identify SI issues, perform crosstalk analysis, parametric sweeps Stackup planning Integrated timing analysis for DDR, DDR2, and DDR3
Industry-leading support for high-speed serial interface (SERDES), including fast eye diagram analysis, S-parameter simulation, and BER prediction
Advanced via modeling Provides an early look at likely EMC failures Integration with the constraint editing system
www.mentor.com
HyperLynx: BoardSim SI
Simulate post-routed data from your host PCB system Run interactive simulations on individuals nets Run a comprehensive batch simulation on many nets at once Parametric sweeps Verify DDR/2/3 bus structures (single and multi-board setups) Crosstalk analysis Advanced Timing Analysis Interactive EMC Analysis Run SERDES Fast-eye analysis Run IBIS-AMI channel analysis
5 HyperLynx Product Update
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HyperLynx DDRx Simulation

Validate LPDDR and DDRx timing and SI designs
Analyze timing for both address and data buses Measurements for clock to strobe skew Measure timing and SI on all signal edges Advanced crosstalk simulation
Analysis is simplified through an interview process

www.mentor.com
Multi-Gigabit Channel Analysis

Fast time domain and statistical analysis
Simulate millions to billions of bits for accurate BER prediction
Generate the channels worst case bit sequence

PRBS or 8B/10B protocol dependant Always produces a maximally closed eye Bounds Dj (deterministic jitter)
Validate BER
Eye density plots BER plots
Support for IBIS-AMI, SPICE, S-Parameters

www.mentor.com
Full-Wave 3D Via Modeling

Some designs require more accurate via models
Can contribute significant loss at higher frequencies
Need the ability to accurately tune the via design

Separation, stitching, entry angle, etc.
3D simulation provides highly accurate models up to 100+ Gbps frequencies

www.mentor.com
3D Full-Wave EM Modeling
HyperLynx 3D EM

Based on IE3D technology

Fastest, highest-capacity, full 3D EM simulation in the market Zeland Software, Inc. acquired February 2010 Frequency-dependent parasitic extraction of metallic structures s-parameter models
NEW product for Mentor Graphics Creates high-frequency parasitic models needed for circuit simulation
Highly respected for EM design & verification
Over 1600 customers

Long history (since 1992) of production proven use
Employs a Unique 3D Integral Equation Method to Solve Maxwells Equation Governing Electrical Behavior of Metallic Structures
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Application of HyperLynx 3D EM
EM Simulation is Used in All High-Frequency Design Applications
Wireless
Cell phone, routers, Bluetooth, GPS, LTE, wimax (802.16)
Antenna and antenna arrays RFID/zigbee tag design
Hi speed digital
10G/40G+ internet, Fibrechannel, XAUI, PCIE, Infiniband
On-chip SerDes, package DDR2/DDR3 memory I/F channel
Military/aerospace
Secure communications/network Large phase array/imaging antenna Compact multi-band antenna Materials research
www.mentor.com
HyperLynx 3D EM Value
Fastest commercial 3D EM simulator Has the largest design capacity Accuracy matches measurement Packaged for widespread deployment
Fastest EM design closure

More simulations/hour accelerates design convergence Higher capacities alleviate need to manually partition design
Lower EM design costs

Unique, scalable distributed EM simulation Replace less-capable, more-expensive competitive alternatives Reliable, predictable results reduces risks of costly design iterations
Improve design quality - minimize EM design re-spins

Higher simulation coverage helps ensure nothing was missed
Higher capacity detect hard-to-find EM design flaws prior to prototype Reliable, predictable results increases designer confidence
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Power Integrity Analysis

DC drop analysis
Identify excessive voltage drop and high current densities Determine if there is enough copper & stitching vias Batch analysis of all power nets
AC power plane analysis

Optimize capacitor selection and mounting
Verify power supply impedance at IC power pins Analyze voltage ripple on power nets
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IR Drop Design Issues

Common problems:
Not enough voltage getting to ICs from power supplies
Leads to IC malfunction
High current densities in voltage island neck-downs and vias

Leads to dielectric or via breakdown and board failure
High Current Density

Excessive Voltage Drop

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Decoupling Design
Develop decoupling methodologies to
Properly design stackup for power Design capacitor mounting structures Make intelligent capacitor selections
Goal = Achieve IC Target Impedances for power

Set by voltage ripple requirements
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Plane Noise Analysis

HyperLynx Plane Noise can help identify voltage ripple exceeding IC power pin specifications Plane noise is a result of target impedance and switching currents (V=I*R) Amount of voltage noise is dependant on edge rate (frequency) of current and impedance at that frequency
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Thermal Analysis
Allows engineers and PCB designers to identify component and PCB hot spots What-if analysis on
Component placement
Stackup design Mechanical cooling techniques
Quick and accurate analysis including

All PCB copper Packages, Pins, vias, screws, etc Environment including enclosure
Package to Board, Pin to Board junctions

Heat sinks and Airflow
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Analog Simulation
Scalable simulation solution built on DxDesigner Analog and full mixed signal simulation capability
Support for analog and digital primitives
Standard language support

VHDL, VHDL-AMS, Spice, & Verilog-A
Power ADMS and Eldo simulation kernels
Full featured waveform viewing with EZWave

Including complex waveform calculations
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EMI / PCB Verification

PCB Design Validation
Rules-based verification of the PCB Finds problems before building prototypes Create custom design rules to identify your common problems
1. DRCs
5. Board Display
4. Advice 3. Problem
Automates the design review process

Enables consistency Minimizes human error Reduces design review time investment
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2. Violation List
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Crossing Domains
Sometimes independent analysis addresses only part of the issue Integrated Analysis flow allows for simulation across domains
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Simulating Via-to-Via Crosstalk

Mixed signal and power integrity simulation
Via crosstalk through power planes
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PI/Thermal Co-Simulation
HyperLynx Thermal within the existing
HyperLynx SI and PI environment Co-Simulation capabilities between PI and Thermal
Power Integrity engine (DC drop) simulates power nets provides power density map to thermal solver Thermal solver runs thermal analysis with component power dissipation and results from PI simulation System runs several iterations of above process with PI simulator using updated resistances(based on temp) until convergence
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Analysis is Core to the Design Process

PCB design is more than schematic and layout
We know designs are becoming more complex
HyperLynx is now mandated as part of our PCB design process. - SEAKR Engineering
To meet reliability and time-to-market Project engineers must do PCB Analysis
Schematic
PCB Analysis
Constraints
PCB Analysis
Layout
PCB Analysis
Prototype Test /Bring-up
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HyperLynx Analysis Environment

Comprehensive suite of analysis technologies
Reduce design cycle time
Develop constraints for first time right design
Improve design reliability

Validate design intent before prototyping
Verification in multiple domains

Accurate & fast time-to-results
HyperLynx enables ALL engineers to drive analysis
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SI Enhancements
Usability improvements
Auto placement of s-parameter ports in LineSim Easy generation of mixed-mode and differentialmode S-parameters
8.2
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SI Enhancements
8.2
Time domain view of S/Y/Z data from Touchstone Viewer
25
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SI Enhancements
Usability improvements - BoardSim
Quickly find components Automatic association of diff-pairs by net name
8.2
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SI Enhancements
Multi-gigabit channel design Improvements
Export of via-in-pad from BoardSim to LineSim Support for custom pad shapes
Both viewing and electrically
8.2
Improve via models (add stub L, etc.)

Current stub modeling does not include L (only C)
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SI Enhancements
Open/Import .ccz data within BoardSim
8.2
Adds support for currently unsupported custom pads within the .hyp import to BoardSim flow Allows us to leverage CAMCAD translators increasing number of supported design/layout packages
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SI Enhancements
Cascading S-parameters
Chained s-parameter models can cause inaccuracy
Different frequency sampling points in models
8.2
Different frequency range
Automatic conversion to transfer function

Produces high-accuracy composite model
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SI Enhancements
Improved eye density viewing
Eye mask Voltage/time grid
8.2
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SI Enhancements
FastEye and IBIS AMI crosstalk
Higher accuracy BER predictions Include asynchronous and synchronous crosstalk effects
8.2
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SI Enhancements
AMI-model parameter sweeping
8.2
Sweeping allows user to optimize channel and I/O for low BER
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SI Enhancements
Integration of LineSim to HyperLynx 3D EM / IE3D
IE3D technology will help robust high-speed simulations at 10 Gbps and
above
But in its native form, its much too complex for most customers to understand/use
8.2
HyperLynx will front-end the process of 3-D model creation
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SI Enhancements
3D via modeling
8.2
Differential and single ended 3D via models 0, 2, or 4 stitching vias supported Entry trace automatically removed from adjoining transmission line segments in schematic All via geometry information directly driven from standard HL via visualizer 3D viewing of via structure
www.mentor.com
SI Enhancements
BoardSim export to HyperLynx 3D EM
8.2
Allows users to select small areas of a design for export to HyperLynx 3D EM for detailed 3D modeling
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PI Enhancements
PDN editor net awareness
8.2
Requested by CSD as one of themost-critical-to-fix-problems in v8.2
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www.mentor.com
PI Enhancements
Multi-core simulation support
Up to 16 additional cores can be used on a single machine
8.2
Intel math libraries 64-bit Linux

4,5 4 3,5 Speedup (X) 3
HL_8.2 Using Different Cores
BEST 2,5 WORST AVERAGE
2
1,5 1 1 core 2 cores 4 cores Core Numbers 8 cores 16 cores
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Integrating HyperLynx Thermal and Power Integrity

More accurate IR drop analysis
Capture increased resistivity due to heating
More accurate PCB thermal analysis

Incorporate heating due to power current density
Accurate PDN DC drops & current densities
HyperLynx Power Integrity
HyperLynx Thermal Analysis
Accurate resistivity & signal integrity Accurate PCB thermal analysis
Iterate to Convergence
Common Data Model

www.mentor.com
Integrating Power Integrity and Thermal Gives More Accurate Results

Standalone Thermal Analysis Max Temperature Thermal with Current Density
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Hottest Spots
www.mentor.com
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PI/Thermal Enhancements
Power integrity/FloTHERM interface
Exports a detailed description of dissipated power distribution Information will be imported into FloTHERM
Provides a more complete 3D PCB model
8.2
Resulting temperature predictions will then be available to judge the risk of thermo-mechanical related trace/net failure
Including effects such as local heating effects of high powered actives, heat loss due to air convection etc.
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HyperLynx DRC
6.0
Design Rule Checks

Automates design checks, eliminating errors from manual inspection Reduces days of manual design checks to a few hours
Includes built-in rules

Design rule checks for EMI, SI, PI
Items not quickly/easily simulated
Allows for rule customization

Easily access database objects through automation Advanced geometric operations Script writing/debugging environment
HyperLynx DRC 6.0 release plan

Release in summer 2012
www.mentor.com
HyperLynx DRC Fully Customizable

Subject matter experts create custom rules
Distribute to multiple users/sites Uniform design reviews across organization
Complete DRC creation environment

Supports VBScript, JavaScript Script debugger Extensive documentation on AOMs, DRC writing guidelines
Design access through Automation Object Models (AOM)

Allows for powerful, flexible custom rules Can develop any kind of rule imaginable
Built-in rules included

Can be used as examples
www.mentor.com
HyperLynx DRC Built-in DRCs

22 built-in DRCs included EMI examples
Traces crossing splits, reference plane changes Nets near edge, coupling to I/O nets
w
d
h h
SI examples
Long nets (SI risk), termination check Number of vias, shielding
Excess current can radiate and cause EMI/EMC problems
PI examples
Power net width, decoupling cap proximity
Future plans include

Schematic DRCs Mixed schematic/layout DRCs Integrated Field Solver
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HyperLynx 9.0
Deliver one product with Mentors best technology
Re-use technology wherever possible
Integrate existing compelling technologies within HyperLynx

Improved trace modeling Results management Faster simulator
Results processing
Ease-ofuse
Trace Modeling
HyperLynx
Simulation chain
DC drop results viewing improvements Pre-layout DDRx Release timeline

Alpha testing in select accounts since December 2011 Open Beta started summer 2012 Release in Q4 2012
www.mentor.com
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HyperLynx Product Update

A Complete Analysis Solution

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

Signal Integrity Concerns

Multi-gigabit SerDes technologies

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

HyperLynx DDRx Simulation

Analysis is simplified through an interview process

Multi-Gigabit Channel Analysis

Generate the channels worst case bit sequence

Support for IBIS-AMI, SPICE, S-Parameters

Full-Wave 3D Via Modeling

Need the ability to accurately tune the via design

3D simulation provides highly accurate models up to 100+ Gbps frequencies

Based on IE3D technology

Highly respected for EM design & verification

Over 1600 customers

Fastest EM design closure

Lower EM design costs

Improve design quality - minimize EM design re-spins

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

Power Integrity Analysis

AC power plane analysis

IR Drop Design Issues

High current densities in voltage island neck-downs and vias

High Current Density

Excessive Voltage Drop

Goal = Achieve IC Target Impedances for power

Plane Noise Analysis

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

Quick and accurate analysis including

Package to Board, Pin to Board junctions

Standard language support

Power ADMS and Eldo simulation kernels

Full featured waveform viewing with EZWave

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

EMI / PCB Verification

Automates the design review process

2012 Mentor Graphics Corp. Company Confidential

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

Simulating Via-to-Via Crosstalk

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

2012 Mentor Graphics Corp. Company Confidential

HyperLynx Product Update

Analysis is Core to the Design Process

To meet reliability and time-to-market Project engineers must do PCB Analysis

Prototype Test /Bring-up

HyperLynx Product Update

2012 Mentor Graphics Corp. Company Confidential

HyperLynx Analysis Environment