Esd Protection Design Guide: Tvs Diode Arrays: ©2012 Littelfuse, Inc 1

ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS
©2012 Littelfuse, Inc 1

This guide was developed to help electronics designers navigate

selection of appropriate TVS Diode Array circuit protection components
for equipment interfaces such USB, HDMI, Ethernet, and keypad.
This document includes consideration factors, example circuits,
applicable standards, and recommended components.
Table of Contents
Introduction:.................................................................................................................................................................................. 3
TVS Diode Array (SPATM) Series Descriptions............................................................................................................................ 4
General Purpose ESD Protection ............................................................................................................................................... 4
Low Capacitance ESD Protection .............................................................................................................................................. 7
Lightning Surge Protection ........................................................................................................................................................ 9
EMI Filter Arrays with ESD Protection ....................................................................................................................................... 11
TVS Diode Array Ordering Guide ................................................................................................................................................ 12
Application Specific Device Selection ......................................................................................................................................... 14
USB1.1 ...................................................................................................................................................................................... 14
USB2.0 ...................................................................................................................................................................................... 15
USB3.0 (Two Device Solution)................................................................................................................................................... 16
USB3.0 (Fully Integrated Solution) ............................................................................................................................................. 17
HDMI ......................................................................................................................................................................................... 18
HDMI (includes protection for Ethernet and 5V power) ............................................................................................................. 19
Display Port ............................................................................................................................................................................... 20
DVI ............................................................................................................................................................................................. 21
10/100/1000 Ethernet, Intra-building Lighting Immunity (GR-1089) ........................................................................................... 22
10/100/1000 Ethernet, Inter-building Lighting Immunity (GR-1089)........................................................................................... 23
10/100/1000 Ethernet, Tertiary Only Lighting Immunity (General)............................................................................................. 24
10/100/1000 Ethernet (ESD only) .............................................................................................................................................. 25
eSATA........................................................................................................................................................................................ 26
1394a/b ...................................................................................................................................................................................... 27
LVDS (Low Voltage Differential Signaling) ................................................................................................................................. 28
Audio (Speaker/Microphone) ..................................................................................................................................................... 29
Analog Video.............................................................................................................................................................................. 30
Keypad/Push Buttons ................................................................................................................................................................ 31
SIM Socket ................................................................................................................................................................................ 32
RS-232 ....................................................................................................................................................................................... 33
RS-485 ....................................................................................................................................................................................... 34
CAN Bus .................................................................................................................................................................................... 35
LCD and Camera Interfaces (Mobile) ......................................................................................................................................... 36
Appendix A ................................................................................................................................................................................... 37
SPA Package Outlines ............................................................................................................................................................. 37

Introduction: Most all manufacturers require that their equipment pass Level 4,
Designers of today’s electronic devices have demanded more or ±8kV, as a minimum, however, some are looking for increased
functionality with greater flexibility and higher levels of user reliability and require that their devices pass a much higher level
interaction. These circumstances have helped in driving the like ±15kV or ±30kV.
development of nanometer chipsets along with a multitude of
user interfaces or ports. The confluence of these two has made
Conclusions:
electronic devices more susceptible to ESD and required the need
The system level ESD test defined by the IEC produces a
for a more robust solution.
substantial increase in peak current compared to the military
standard. If an IC is rated for 0.5kV per the MIL-STD and the
ESD Standards:
equipment manufacturer tests this same IC at 8kV per the IEC
MIL-STD-883, Method 3015
specification, the chip will see nearly a 100 fold increase in peak
Historically, analog and digital designers have been required to
current (i.e. 0.33A vs. 30A)!
have ESD protection “on-chip” to protect the IC during
manufacturing. The most commonly used ESD standard in the Ultimately, hardware or board designers must add supplementary
manufacturing environment is the MIL-STD-883, Method 3015 ESD devices to protect these sensitive chipsets from the high
and it’s also referred to as the Human Body Model (HBM). This level ESD threats seen in the field.
model discharges a 100pF capacitor through a 1500Ω resistor into
the device under test. The table below points out the four test Solutions:
levels as defined in the standard. Littelfuse TVS Diode Arrays (SPATM Family) are an ideal choice for
suppressing ESD as their speed and clamping levels are essential
to protect today’s integrated circuits unlike the previous MLV,
HBM Level Contact Discharge (kV) Peak Current (A)
MOV, and polymer technologies. The SPATM portfolio offers a
1 ±0.5 0.33 wide range of devices to suit the majority of application needs
2 ±1 0.67 available in the market today, and this guide will steer the
3 ±2 1.33 designer toward the appropriate ESD device for the particular
4 ±4 2.67 application they’re trying to protect.
Some of the applications discussed in this guide are:
The maximum level required for a typical IC had been ±2kV up ● USB1.1/2.0/3.0 ● Analog Video
until 2007, but today that level has been drastically reduced to ● HDMI ● SIM Sockets
±0.5kV. Obviously, this has helped chip designers save valuable
● DisplayPort ● RS-232
silicon area for more functionality, but in turn, it has made the IC
● DVI ● RS-485
much more susceptible to damage from ESD.
● 10/100/1000 Ethernet ● CAN Bus
IEC61000-4-2 ● Esata ● Audio (Speaker/Microphone)

Conversely, equipment manufacturers have traditionally used an ● 1394a/b ● Keypad/Push button
ESD standard defined by the IEC (International Electrotechnical ● LVDS ● LCD/Camera display interfaces
Commission) for system or application level testing. This model
uses a 150pF capacitor which is discharged through a 330Ω Many of these applications can be found in electronic devices
resistor. The table below displays the four test levels as defined such as:
in the standard. ● PC’s ● MP3/PMP’s
IEC Level Contact Discharge (kV) Peak Current (A) ● Portable Medical Devices ● PDA’s
1 ±2 7.5 ● Set Top Boxes ● Digital Cameras
2 ±4 15 ● LCD/PDP TV’s ● SIM/SD Cards

3 ±6 22.5 ● Portable Navigation Devices ● External Storage
4 ±8 30 ● Keyboards/Mouse ● Switches/Routers
● Mobile Handsets ● Smart Phone

TVS Diode Array (SPATM) Series Descriptions

General Purpose ESD Protection
I/O Cap
ESD Level Lightning Number of Package
Series Schematic (Example) VR= 0V VRWM
(Contact) (tP=8/20μs) Channels Options
(@ Bias)
SOT23-3
2
SC70-3
3 SOT143
50pF SOT23-5
SP05 ±30kV 5.5V N/A 4
(30pF @ 2.5V) SC70-5
SOT23-6
5
SC70-6
6 MSOP-8
SC70-3
2
SOT553
12pF SC70-5
SP1001 ±15kV 5.5V 2A 4
(8pF @ 2.5V) SOT553
SC70-6
5
SOT563
1 SC70-3
6pF
SP1002 ±8kV 6V 2A
(5pF @ 2.5V)
2 SC70-5
30pF SOD723
SP1003 ±30kV 5V 7A 1
(17pF @ 2.5V) SOD882
6pF
SP1004 ±8kV 6V 2A 4 SOT953
(5pF @ 1.5V)

TVS Diode Arrays (SPATM) Series Descriptions

General Purpose ESD Protection (continued)
I/O Cap
Series Schematic (Example) VR= 0V VRWM
(@ Bias)
30pF 0201
SP1005 ±30kV 6V 10A 1
(23pF @ 2.5V) Flipchip
0201
25pF
SP1006 ±30kV 6V 5A 1 μDFN-2
(15pF @ 2.5V)
0.6x0.3mm
5pF 0201
SP1007 ±8kV 6V 2A 1
(3.5pF @ 5V) Flipchip
6pF μDFN-6
SP1010 ±8kV 6V 1A 4
(3.5pF @ 2.5V) 1.25x1.0mm
μDFN-6
12pF
SP1011 ±15kV 6V 2A 4 1.25x1.0mm
(7pF @ 2.5V)


General Purpose ESD Protection (continued)

Series Schematic (Example) I/O Cap VRWM
30V or SOIC-16
SP720 ±4kV 3pF 3A 14
(±15V) PDIP-16
30V or SOIC-8
SP721 ±4kV 3pF 3A 6
(±15V) PDIP-8
30V or SOIC-8
SP723 ±8kV 5pF 7A 6
(±15V) PDIP-8
20V or
SP724 ±8kV 3pF 3A 4 SOT23-6
(±10V)
30V or
SP725 ±8kV 5pF 14A 4 SOIC-8
(±15V)


Low Capacitance ESD Protection
ESD Level I/O Cap Lightning Number of Package

Series Schematic (Example) VRWM
(Contact) VR= 1.65V (tP=8/20μs) Channels Options
SP3001 ±8kV 0.65pF 6V 2.5A 4 SC70-6
SC70-6
SOT23-6
SP3002 ±12kV 0.85pF 6V 4.5A 4
μDFN-6
1.6x1.6mm
SC70-5
2
SOT553
SC70-6
SP3003 ±8kV 0.65pF 6V 2.5A 4 SOT563
MSOP-10
8 MSOP-10
SP3004 ±12kV 0.85pF 6V 4A 4 SOT563


Low Capacitance ESD Protection (continued)

(Contact) VR= 0V (tP=8/20μs) Channels Options
μDFN-10
SP3010 ±8kV 0.45pF 6V 3A 4
2.5x1.0mm
μDFN-14
SP3011 ±8kV 0.40pF 6V 3A 6
3.5x1.35mm
μDFN-10
SP3012 ±12kV 0.50pF 5V 4A 4
2.5x1.0mm
SP3021
(2012 ±8kV 0.50pF 5V 1A 1 SOD882
release)
SP3031
(2012 ±10kV 0.80pF 5V 5A 1 SOD882
release)


Lightning Surge Protection

16pF
SP03-3.3 ±30kV (8pF 3.3V 150A 2 SOIC-8
I/O to I/O)
9pF
SP03A-3.3 ±30kV (4.5pF 3.3V 150A 2 SOIC-8
I/O to I/O)
16pF
SP03-6 ±30kV (8pF 6V 150A 2 SOIC-8
I/O to I/O)
SPLV2.8 ±30kV 2pF 2.8V 40A 1 SOT23-3
SPLV2.8-4 ±30kV 2pF 2.8V 40A 4 SOIC-8


Lightning Surge Protection (continued)

SP3050 ±20kV 2.4pF 6V 10A 4 SOT23-6
5pF
SP4040 ±30kV (2.5pF 3.3V 75A 2 SOIC-8
I/O to I/O)
SP4060 ±30kV 4.4pF 2.5V 20A 8 MSOP-10
µDFN-10
SP4061 ±30kV 3.5pF 2.5V 20A 4
2.6x2.6mm
µDFN-10
SP4062 ±30kV 3.5pF 3.3V 20A 4
2.6x2.6mm


EMI Filter Arrays with ESD Protection
ESD Level Line Cap Number of Package

Series Schematic (Example) VRWM Attenuation
(Contact) (VR=2.5V) Channels Options
μDFN-8
4
1.7x1.35mm
24pF ≥ -30dB @ μDFN-12

SP6001 ±30kV 6V 6
(CDIODE=12pF) 1GHz 2.5x1.35mm
μDFN-16
8
3.3x1.35mm
μDFN-8
4
1.7x1.35mm
30pF ≥ -30dB @
SP6002 ±30kV 6V
(CDIODE=15pF) 1GHz
μDFN-12
6
2.5x1.35mm
μDFN-8
4
1.7x1.35mm
SP6003
14pF ≥ -20dB @
(not yet ±15kV 6V
(CDIODE=7pF) 1GHz
released)
μDFN-12
6
2.5x1.35mm

TVS Diode Array Ordering Guide
Series Number of Channels Package Orderable Part Number
SOT23-3 SP0502BAHTG
2
SC70-3 SP0502BAJTG
3 SOT143 SP0503BAHTG
SOT23-5 SP0504BAHTG
SP05 4
SC70-5 SP0504BAJTG
SOT23-6 SP0505BAHTG
5
SC70-6 SP0505BAJTG
6 MSOP-8 SP0506BAATG
SC70-3 SP1001-02JTG
2
SOT553 SP1001-02XTG
SC70-5 SP1001-04JTG
SP1001 4
SOT553 SP1001-04XTG
SC70-6 SP1001-05JTG
5
SOT56 SP1001-05XTG
1 SC70-3 SP1002-01JTG
SP1002
2 SC70-5 SP1002-02JTG
SOD723 SP1003-01DTG
SP1003 1
SOD882 SP1003-01ETG
SP1004 4 SOT953 SP1004-04VTG
SP1005 1 0201 Flipchip SP1005-01WTG
SP1006 1 0201 (μDFN-2,0.6x0.3mm) SP1006-01UTG
SP1007 1 0201 Flipchip SP1007-01WTG

SP1010 4 μDFN-6 (1.25x1.0mm) SP1010-04UTG
SP1011 4 μDFN-6 (1.25x1.0mm) SP1011-04UTG
SP3001 4 SC70-6 SP3001-04JTG
SOT23-6 SP3002-04HTG
SP3002 4 SC70-6 SP3002-04JTG
μDFN-6 (1.6x1.6mm) SP3002-04UTG
SC70-5 SP3003-02JTG
2
SOT553 SP3003-02XTG
SC70-6 SP3003-04JTG
SP3003
4 SOT563 SP3003-04XTG
MSOP-10 SP3003-04ATG
8 MSOP-10 SP3003-08ATG
SP3004 4 SOT563 SP3004-04XTG
TVS Diode Array Ordering Guide (continued)
Series Number of Channels Package Orderable Part Number
SP3010 4 μDFN-10 (2.5x1.0mm) SP3010-04UTG
SP3011 6 μDFN-14 (3.5x1.35mm) SP3011-06UTG
SP3012 4 μDFN-10 (2.5x1.0mm) SP3012-04UTG
SP3021 1 SOD882 SP3021-01ETG
SP3031 1 SOD882 SP3031-01ETG
SP3050 4 SOT23-6 SP3050-04HTG
SP4040 2 SOIC-8 SP4040-02BTG
SP4060 8 MSOP-10 SP4060-08ATG
SP4061 4 μDFN-10 (2.6x2.6mm) SP4061-04UTG
SP4062 4 μDFN-10 (2.6x2.6mm) SP4062-04UTG
SP03-3.3 2 SOIC-8 SP03-3.3BTG
SP03A-3.3 2 SOIC-8 SP03A-3.3BTG
SP03-6 2 SOIC-8 SP03-6BTG
SPLV2.8 1 SOT23-3 SPLV2.8HTG
SPLV2.8-4 4 SOIC-8 SPLV2.8-4BTG
4 μDFN-8 (1.7x1.35mm) SP6001-04UTG-1
SP6001 6 μDFN-12 (2.5x1.35mm) SP6001-06UTG-1
8 μDFN-16 (3.3x1.35mm) SP6001-08UTG-1
4 μDFN-8 (1.7x1.35mm) SP6002-04UTG-1

SP6002
6 μDFN-12 (2.5x1.35mm) SP6002-06UTG-1
SP6003 (not 4 μDFN-8 (1.7x1.35mm) SP6003-04UTG-1

released) 6 μDFN-12 (2.5x1.35mm) SP6003-06UTG-1
14 PDIP-16 SP720APP
SP720
14 SOIC-16 SP720AB*G
6 PDIP-8 SP721APP
SP721
6 SOIC-8 SP721AB*G
6 PDIP-8 SP723APP
SP723
6 SOIC-8 SP723AB*G
SP724 4 SOT23-6 SP724AHTG
SP725 4 SOIC-8 SP725AB*G

*Add “T” for Tape and Reel, otherwise parts are packed in tubes

Application Specific Device Selection

USB1.1
Considerations:
● Each port operates at either 1.5Mbps or 12Mbps (low and full speed respectively)
• Parasitic capacitance should be taken into account although these relatively slow speeds can tolerate tens of picofarads
● Requires 2 channels of data line protection per port (i.e. D±)

• A 4 channel device can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible
• VBUS can be protected separately with a single channel device in an 0402 or 0201 form factor (0402 shown)
Application Schematic:
USB Controller
USB Port
VBUS
D+
D+
D-
Outside SP0502
World IC
SP1003
Case GND Signal GND Case GND
Recommended SPA Devices:
ESD Level
Ordering Number I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging
(Contact)
SP0502BAJTG ±30kV 30pF 2 5.5V SC70-3

SP1001-02XTG ±15kV 8pF 2 5.5V SOT553
SP1003-01ETG ±30kV 17pF 1 5.0V 0402 (SOD882)
SP1003-01DTG ±30kV 17pF 1 5.0V 0402 (SOD723)
SP1006-01UTG ±30kV 15pF 1 5.0V 0201 (µDFN-2)


USB2.0
Considerations:
● Each port can operate up to 480Mbps
• The high data rate requires a low capacitance device to preserve signal integrity
● Requires 2 channels of data line protection per port (i.e. D±) which can be done via array or discretely
• A 4 channel device such as the SP3002-04 can be useful if protecting a USB stack of 2 ports to make the ESD footprint as small as possible
• VBUS can be protected by connecting it to the VCC pin on the diode array or by using a separate single channel device like the SP1003
USB Port USB Controller
VBUS
D+
D-
Outside Optional
World IC
SP3003
NC
Case GND Signal GND
VBUS
D
D-
Outside
IC
World
SP3031 (x2)
*Package is shown as transparent
Case GND Signal GND

ESD Level I/O Capacitance @
Ordering Number # of Channels VRWM Packaging
(Contact) VR=1.65V
SP3003-02XTG ±8kV 0.65pF 2 6V SOT553
SP3003-02JTG ±8kV 0.65pF 2 6V SC70-5
SP3031-01ETG (2012 release) ±10kV 0.80pF 1 5V SOD882


USB3.0 (Two Device Solution)
Considerations:
● Each port depending upon what it’s connected to can operate:
• Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX±
• Up to 480Mbps on the legacy data pair, D±
● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±)
● Requires 2 channels of protection for the legacy D± data pair

• VBUS can be protected by connecting it to the VCC pin on the SPA or by using a separate single channel device
VBUS
D+
D-
SP3003
Optional
Outside NC
IC
World
SSTX+
SSTX-
GND SP3012
SSRX+
SSRX-
Case GND Signal GND

(Contact) VR=1.65V
SP3003-02XTG ±8kV 0.65pF 2 6V SOT553

SP3012-04UTG ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm)


USB3.0 (Fully Integrated Solution)
Considerations:
● Each port depending upon what it’s connected to can operate:
• Up to 5Gbps over the new super-speed data pairs, SSTX± and SSRX±
• Up to 480Mbps on the legacy data pair, D±
● Requires 4 channels of ultra-low capacitance protection for the super-speed data pair (i.e. SSTX± and SSRX±) and 2 channels of protection
for the legacy D± data pair. The SP3011 shown below integrates all 6 channels of protection into a small form factor µDFN-14 package.
VBUS
SSTX+
SSTX-
Outside IC
World SSRX+
SSRX-
GND SP3011
D+
D-
Case GND Signal GND
ESD Level
Ordering Number I/O Capacitance @ VR=0V # of Channels VRWM Packaging
(Contact)


HDMI
Considerations:
● Each port has 3 differential pairs of data (i.e. D0±, D1±, D2±) plus a clock (CLK±)
• For HDMI 1.1-1.2 the throughput is a total of 4.95Gbps (1.65Gbps per lane)
• For HDMI 1.3-1.4 the throughput is a total of 10.2Gbps (3.4Gbps per lane)
● To maintain the differential impedance per the HDMI Compliance Test Specification (and consequently signal integrity) a very low
capacitance device must be used
● To maintain the differential impedance the designer should avoid using 90º angles and vias
• This can be accomplished by the use of an ESD device that offers a “straight-through” routing scheme
● Requires 12 channels of protection : 8 TMDS data pairs, SDA, SCL, CEC, and HPD
Chipset
HDMI Port *Package is shown as transparent
D2+
GND
D2-
SP3010
D1+
GND
D1-
D0+
GND
Outside D0- IC
World SP3010
CLK+
GND
CLK-
SDA
SCL
SP3010
CEC
HPD
Signal
Case GND GND

(Contact) VR=1.65V
SP3012-04UTG) ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm)


HDMI (includes protection for Ethernet and 5V power)
Considerations:
● Same as noted on previous page except the protection scheme below includes options for protecting additional Ethernet and 5V power pins.
● Other combinations exist such as using 2, 6 channel SP3011 devices along with 2, single channel discrete
HDMI Port Chipset
D2+
GND
D2-
SP3010
D1+
GND
D1-
D0+
GND
D0- IC
SP3010
Outside CLK+
World GND
CLK-
SDA
SCL
SP3010
CEC
HPD
SP3021
ENET
PWR
SP1003
Case GND Signal GND

Ordering Number ESD Level (Contact) I/O Capacitance @ VR=2.5V # of Channels VRWM Packaging

SP3012-04UTG) ±12kV 0.50pF 4 5V μDFN-10 (2.5x1.0mm)
SP3021-01ETG (2012 release) ±8kV 0.50pF 1 5V 0402 (SOD882)
SP1003-01ETG (SP1003) ±30kV 17pF 1 6V 0402 (SOD882)


Display Port
Considerations:
● Each port has a main link which contains 4 differential pairs or lanes (i.e. ML0±, ML1±, ML2±, and ML3±)
• The total throughput is 10.8Gbps or 2.7Gbps per lane
• The clock signal is embedded in the lanes and does not exist separately as in HDMI
• There is also an auxiliary channel (AUX±), hot plug detect (HPD), and power pin (PWR) as well.
● To maintain the differential impedance (and consequently signal integrity) a very low capacitance device must be used
• To maintain the differential impedance the designer should avoid using 90º angles and vias
● Requires 12 channels of protection per port (ML0±, ML1±, ML2±, ML3±, AUX±, HPD, and PWR)
Display Port Chipset
ML0+
GND
ML0-
SP3010
ML1+
GND
ML1-
ML2+
GND
Outside ML2- IC
World SP3010
ML3+
GND
ML3-
AUX-
GND
AUX+
SP3010
HPD
PWR
Signal
Case GND GND

(Contact) VR=1.65V


DVI
Considerations:
● A DVI port may have single or dual link capability
• Each link has 3 differential lanes of data (i.e. D0±, D1±, D2±) plus a clock (CLK±)
• For single link, the maximum throughput can approach a total of 4.95Gbps or 1.65Gbps per lane
• For dual link, the maximum throughput can approach a total of 8Gbps or 2.67Gbps per lane
● To maintain signal integrity a very low capacitance device must be used
● To maintain the differential impedance the designer should avoid using 90º angles and vias
● Requires 8 channels of protection per port (D0±, D1±, D2±, CLK±)
*Package is shown as
DVI Port transparent
DVI Chipset
SP3003
D2+
GND
D2-
VCC/NC
D1+
GND
Outside D1- IC
SP3003
World D0+
GND
D0-
VCC/NC
CLK+
GND
CLK-
Case GND Case GND
Signal GND

(Contact) VR=1.65V
SP3003-04ATG ±8kV 0.65pF 4 6V MSOP-10


10/100/1000 Ethernet, Intra-building Lighting Immunity (GR-1089)
Considerations:
● 10/100/1000 relates to the data rate in Mbps (i.e. 10Mbps, 100Mbps, and 1000Mbps)
• For 10 Base-T, data is transmitted over 2 UTP (unshielded twisted pairs) using a 10MHz clock
• For 100 Base-TX, data is transmitted over 2 UTP using a 125MHz clock
• For 1000 Base-T data is transmitted over 4 UTP using a 125MHz clock
• For these data rates the parasitic capacitance needs to be taken into account to preserve signal integrity
● The 4 data lines below (Tx± and Rx±) are being protected against intra-building (i.e. 100A, tP=2/10µs) lightning transients by a two-stage
protection scheme
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the
remaining 2 data pair
RJ-45 Ethernet PHY

Connector F1
J1 Tx+
F2
Tx-
Outside
World
Rx+
F3
J8 Rx-
F4
SP03A (x2)
F1:F4 = 0461 1.25 TeleLink Fuse
PHY GND SP3050

ESD Level Lightning I/O Capacitance @

(Contact) (tP=8/20μs) VR=0V
SP03A-xBTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8
SP03-3.3BTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V,6V SOIC-8
SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6


10/100/1000 Ethernet, Inter-building Lighting Immunity (GR-1089)
Considerations:
● The 4 data lines below are being protected against inter-building (i.e. 500A, tP=2/10µs) lightning transients by a two-stage protection scheme.
The 4 channel, SP4061 or SP4062 should be selected based on the operating voltage of the PHY.
● The standoff voltage of the SEP Series device will be dictated by the use of PoE. If PoE is present the SEP0640 should be used; otherwise,
the SEP0080 is ok for non-PoE applications. Note: Higher voltage options are available for atypical PoE voltages.
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme should be replicated for the
remaining 2 data pair
RJ-45
Connector F1 Ethernet PHY
J1 Tx+
F2 Tx-
Outside
SP4062
World
PHY
F3 GND
Rx+
J8 Rx-
F4
Case GND SEP0xx (x2)
F1:F4 = 0461 1.25 TeleLink Fuse

SEP0080Q38CB ±30kV 400A See datasheet 2 6V QFN

SEP0640Q38CB ±30kV 400A See datasheet 2 58V QFN
SP4061-04UTG ±30kV 20A 3.5pF 4 2.5V µDFN-10 (2.6x2.6mm)


10/100/1000 Ethernet, Tertiary Only Lighting Immunity (General)
Considerations:
● Some designers choose to use a robust transformer in their design to act as the first line of protection against an incoming surge event.
This is usually done to minimize the parasitic capacitance on the data line and to save on the cost of the primary protector
● Using such a technique will require a robust PHY side protection device and one such option is the SPLV2.8-4 shown below. It should be
noted that this device will only provide differential protection between the data pairs.
● If longitudinal and differential protection are required, the SP3050-04HTG (with 2 I/O’s tied per line) or SP4060/SP4061/SP4062 can be
considered as alternatives
● Protection for 100Mbps Ethernet (or Fast Ethernet) is shown below. For 1000Mbps (or 1GbE) interfaces two, SPLV2.8-4BTG are required
RJ-45
Connector Ethernet PHY
J1
Tx+
Tx-
Rx+
Rx-
Outside
Ethernet
World
PHY
SPLV2.8-4
J8
Case GND

SPLV2.8-4BTG ±30kV 40A 2.0pF 4 2.8V SOIC-8
SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6
SP4060-08ATG ±30kV 20A 4.4pF 8 2.5V MSOP-8

µDFN-10
SP4061-04UTG ±30kV 20A 3.5pF 4 2.5V
(2.6x2.6mm)
µDFN-10
SP4062-04UTG ±30kV 20A 3.5pF 4 3.3V
(2.6x2.6mm)

10/100/1000 Ethernet (ESD only)
Considerations:
● Some Ethernet ports only need be protected for ESD and not for lightning induced transients
• These are sometimes referred to as “2M” ports or 2 Meter ports that have very short CAT5 cable installations
● Parasitic capacitance should be taken into account especially for 1GbE
● The 4 data lines below (Tx± and Rx±) are being protected against ESD by a low capacitance SP3002 which is suitable for all
Ethernet data rates
• In fact, any low capacitance SP30xx device is suitable for any “ESD only” Ethernet application
● 1000Mbps Ethernet (or 1GbE) will require 8 channels of protection for the 4 differential pair so the below scheme can be replicated or the 8
channel SP3003-08ATG can be used.
RJ-45
Connector Ethernet PHY
J1 Tx+
Tx-
Outside
World
Rx+
J8 Rx-
Case GND NC
Case GND SP3002

(Contact) (tP=8/20μs) VR=1.65V
SP3002-04JTG ±12kV 4.5A 0.85pF 4 6V SC70-6
SP3003-04XTG ±8kV 2.5A 0.65pF 4 6V SOT563
SP3004-04XTG ±12kV 4A 0.85pF 4 6V SOT563
SP3003-08ATG ±8kV 2.5A 0.65pF 8 6V MSOP-10


eSATA
Considerations:
● eSATA is a subset of the SATA protocol that uses 2 differential pairs for communication
• Four lines need to be protected per port (i.e. TX± and RX±)
• Currently eSATA is capable of running raw data rates of 1.5Gbps (Gen 1) and 3.0Gbps (Gen 2)
● These high bus speeds require very low capacitance devices to prevent signal degradation
● To maintain the line impedance the designer should avoid using 90º angles and vias
eSATA Port
GND
eSATA Interface
TX+
TX-
Outside IC
World GND
RX-
SP3012
RX+
GND
Case GND
ESD Level
(Contact)
SP3003-02XTG ±8kV 0.65pF 2 6V SOT553
SP3003-04JTG ±8kV 0.65pF 4 6V SC70-6


1394a/b
Considerations:
● 1394a (FireWire 400 or S400) was the original (1st generation) implementation
• Allowed for two connectors, powered (6 pin) and unpowered (4 pin)
• Data rates up to 400Mbps using 2 differential pair
● 1394b (FireWire 800 or S800) was the 2nd generation

• Required a new 9 pin connector but was backwards compatible to S400
• Data rates up to 800Mbps using 2 differential pair
● 1394b also had provisions for 1600Mbps and 3200Mbps (or S1600 and S3200)
• Uses same 9 pin connector as S800
● S800, S1600, and S3200 require very low capacitance devices for the high speed data rates
• Protection of 4 data lines is needed (i.e. TPB± and TPA±) and can be done with an array or with discrete low capacitance devices
1394b Port SP3003 1394 Interface
TPB-
TPB+
TPA-
TPA+
Outside
World GNDS IC
TPA Shield GND
GND
NC
PWR
GNDS
Case GND TPB Shield GND
ESD Level
(Contact)
SP3003-04ATG ±8kV 0.65pF 4 6V MSOP-10
SP3010-04UTG ±8kV 0.45pF 4 6V μDFN-10
SP3021-01ETG (2012 release) ±8kV 0.50pF 1 5V SOD882


LVDS (Low Voltage Differential Signaling)
Considerations:
● LVDS is a low noise, low-voltage signal scheme that uses a small current (typically 3.5mA) to generate a voltage drop across a 100Ω resistor
to convey information or data
• Data rates can vary per application but the ANSI/TIA/EIA-644-A standard recommends a maximum of 655Mbps
● The medium/high speed bus requires a low capacitance device in 1-6pF range (typically)
• LVDS schemes will vary in terms of the total number of channels used
• Protection of 8 data lines is shown below (i.e. CLK± and Ax±)
LVDS Interface LVDS Controller
CLK+
CLK-
A0+
A0-
Outside
World A1+ IC
A1-
A2+
A2-
Signal GND
Case GND
SP4060
Case GND
ESD Level Lightning

Ordering Number I/O Capacitance @ VR=0V # of Channels VRWM Packaging
(Contact) (tP=8/20μs)
SP4060-08ATG ±30kV 20A 4.4pF 8 2.5V MSOP-10
SP3050-04HTG ±20kV 10A 2.4pF 4 6V SOT23-6


Audio (Speaker/Microphone)
Considerations:
● Audio ports typically have signals that swing above and below GND (i.e. ±2.5V)
• If no DC bias is applied, a bidirectional protection device should be used as these devices will not clip the analog signal
• Protection of 2 data lines is shown below (i.e. Left and Right) with an array and with discrete 0201s
● Some audio ports will bias the data bus so that the signal never swings below GND (i.e. 0-5V)
• If a bias is applied, a unidirectional OR bidirectional protection device could be used as neither device would clip the analog signal
• The SP1001-02XTG is a good option in this case (not shown for Left and Right but is listed below)
Audio Codec
Audio Port
Left
Right
Outside IC
World
SP1002-02
Case GND
Audio Codec
Audio Port
Left
Right
Outside IC
World
Case GND SP1005 (x2)
ESD Level Lightning

SP1002-02JTG ±8kV 2A 5pF 2 6V SC70-5
SP1005-01WTG ±30kV 10A 23pF 1 6V 0201 Flipchip
SP1001-02XTG ±15kV 2A 8pF 2 5.5V SOT553


Analog Video
Considerations:
● Analog video ports typically have signals that swing above and below GND (i.e. ±2V)
• A bidirectional protection device should be used as these devices will not clip the analog signal
● S-Video, Composite, and RF/Coaxial are a few of the common low-speed analog video signals in use today
• Typical bus speeds will not exceed 5MHz so capacitance is not much of a concern
• Protection of the three are shown below (Y, C, Video, and RF)
Video Port Video ADC
Y Luminance
C Chrominance
Outside Video Composite

World
RF Coaxial
IC
SP1004
Case GND
ESD Level Lightning

SP1004-04VTG ±8kV 2A 4.5pF 4 6V SOT953
SP1002-02JTG ±8kV 2A 5pF 2 6V SC70-5
SP1007-01WTG ±8kV 2A 3.5pF 1 6V 0201 Flipchip


Keypad/Push Buttons
Considerations:
● Keypads and push buttons on electronic devices are particularly susceptible to ESD due to constant human interaction
• Most are DC switches that operate at less than 5V, and for most applications capacitance will not be a concern
● The number of ports will vary with the particular application, but as an example, 4 data lines are shown below (i.e.Px)
● For space constrained applications the SP1003 or SP1005 may be considered as they are 0402 and 0201 footprints, respectively
Application Schematics:
Keypads
P1
P2
Outside P3 IC
World P4
SP1006 (x4)
Case GND
Keypads I/O Controller
P1
P2
Outside P3 IC
World P4
SP1001
Case GND
ESD Level Lightning

SP1001-04XTG ±15kV 2A 8pF 4 6V SOT553
SP1003-01ETG ±30kV 7A 17pF 1 5V 0402 (SOD882)
SP1006-01UTG ±30kV 5A 15pF 1 6V 0201 (µDFN-2)


SIM Socket
Considerations:
● The SIM (Subscriber Identification Module) card has 3 data lines that are low-speed and low-voltage
• Given the low speed of the signals, the capacitance will not be a concern
● The low-voltage signal lines are best protected by a device which has a low standoff voltage or VRWM
● Protection of the 3 data lines is shown below (i.e. CLK, DATA, and RESET)
SIM Socket SIM Controller
VBUS
DATA
CLK
Outside RESET IC
World SP3002
Case GND
GND
Signal GND
Case GND
ESD Level Lightning I/O Capacitance @ # of

Ordering Number VRWM Packaging
(Contact) (tP=8/20μs) VR=1.65V Channels
SP3002-04UTG ±12kV 4.5A 0.85pF 4 6V μDFN-6 (1.6x1.6mm)

SP1011-04UTG ±15kV 2A 7pF 4 6V μDFN-6 (1.25x1.0mm)
SP1006-01UTG ±30kV 5A 15pF 1 6V 0201 (µDFN-2)


RS-232
Considerations:
● There are numerous implementations of RS-232
• Most involve 6 wires (as shown below) though some may only include 2, 3, or 5 wires
• The maximum data rate is 20kbps
• Typically bus voltages are bipolar and can swing as high as ±24V though most installations are limited to ±12V or even lower
• For ±12V systems the SP72x Series is recommended and shown below
● Some implementations are a unipolar (i.e. 0-3.3V or 0-5V) or use bus voltages generally below 6V
• In this event the SP1001 Series can be used for ESD protection or the SP03 Series could be used if lightning is the primary threat
● Every application should be evaluated thoroughly before using the recommended devices below
RS-232 Port Controller
RD
TD
RTS IC
Outside
World CTS
DSR
DTR VBUS
SP723
Case GND
Case GND
-V

(Contact) (tP=8/20μs) VR=1.65V
SP721ABTG ±4kV 3A 3pF 6 30V SOIC-8

SP723ABTG (±8kV 7A 5pF 6 30V SOIC-8
SP724AHTG ±8kV 3A 3pF 4 20V SOT23-6
SP725ABTG ±8kV 14A 5pF 4 30V SOIC-8


RS-485
Considerations:
● There are numerous implementations and applications of RS-485
• Most applications involve two wires (i.e. A and B) while a few are four wire (i.e. full duplex)
• Depending on cable length, data rates can vary from 100kbps-10Mbps
• Bus voltages can be unipolar (i.e. 0-6V) or bipolar (i.e. ±3V) and every application should be evaluated thoroughly before using the
recommended devices below
● For a unipolar bus with a voltage ≤ 6V (MAX):

• The SP1001 Series is shown for ESD protection only
• The SP03 Series is shown for lightning/surge protection
● For differential protection between A and B, the GND connection can be removed from the schematics below
● For a bipolar bus with a maximum voltage swing of ±3V:

• The SP1002 or SP1004 Series can be used ESD protection only
• The SP03 Series (x2) can still be used for lightning/surge protection with one I/O tied to GND
RS-485 Port Receiver
A
B
Outside
World IC
SP1001
Case GND
RS-485 Port Receiver
Outside IC
World
B
SP03
Case GND

(Contact) (tP=8/20μs) VR=2.5V/0V
SP1001-02JTG ±15kV 2A 8pF 2 6V SC70-3

SP03-xBTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V, 6V SOIC-8
SP03A-3.3BTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8


CAN Bus
Considerations:
● There are numerous implementations and applications of a CAN bus
• Most applications involve two wires (i.e. CANH and CANL)
• Depending on cable length, data rates can vary from 10kbps-1Mbps
• Most applications do not exceed 0-5V to transmit a Low/High signal, however, every application should be evaluated thoroughly before
using the recommended devices below
● For the described application of unipolar bus with voltages between 0 and 5V:
• The SP1001 Series is shown for ESD protection only
• The SP03 Series is shown for lightning/surge protection
● For differential protection between CANH and CANL, the GND connection can be removed from the schematics below
CAN Port Transceiver
CANH
CANL
Outside IC
World
SP1001
Case GND
CAN Port Transceiver
CANH
Outside IC
World
CANL
SP03
Case GND

(Contact) (tP=8/20μs) VR=2.5V/0V
SP1001-02JTG ±15kV 2A 8pF 2 6V SC70-3
SP03-xBTG ±30kV 150A 8pF (I/O to I/O) 2 3.3V, 6V SOIC-8
SP03A-3.3BTG ±30kV 150A 4.5pF (I/O to I/O) 2 3.3V SOIC-8


LCD and Camera Interfaces (Mobile)
Considerations:
● LCD and camera interfaces in mobile devices are vulnerable to EMI from the cellular band
• Frequencies between 800-3000MHz should be attenuated to prevent distortion on the display
● The pixel clocks vary depending upon the display size but the frequency will typically fall between 5-65MHz
• This corresponds to data rates between 10-60Mbps and with these speeds line capacitances need to be considered
• In the majority of applications line capacitances of 20-40pF will not cause signal integrity issues
● The protection schemes below for data lines Dx are only examples and will vary with the particular application
PCB Connector *Packages are shown as transparent
for LCD Display SP6002-04 Baseband
D1
D2
IC
D3
D4
Camera Module SP6001-06 Baseband
D1
D2
D3 IC
D4
D5
D6
ESD Level Line Capacitance

Ordering Number Cut-off Frequency # of Channels VRWM Packaging
(Contact) @ VR=2.5V
SP6001-0xUTG-1 ±30kV 115MHz 24pF 4/6/8 6V μDFN-8/12/16
SP6002-0xUTG-1 ±30kV 100MHz 30pF 4/6 6V μDFN-8/12
SP6003-0xUTG-1 (not released yet) ±15kV 175MHz 14pF 4/6 6V μDFN-8/12

Appendix A
SPA Package Outlines
PDIP-8
PDIP-16
SOIC-8

SPA Package Outlines (continued)
SOIC-16
MSOP-8
MSOP-10

SOT23-3
SOT143
SOT23-5

SOT23-6
SC70-3
SC70-5

SC70-6
SOT553
SOT563

SOT953
SOD723
SOD882

0201
Flip chip
(0.62x0.32)
0201
µDFN-2
(0.60x0.30)
μDFN-6
(1.25x1.0)

μDFN-6
(1.6x1.6)
μDFN-8
(1.7x1.35)
μDFN-10
(2.5x1.0)

μDFN-10
(2.6x2.6)
μDFN-12
(2.5x1.35)
μDFN-14
(3.5x1.35)

Littelfuse, Inc.
8755 West Higgins Road
O’Hare Plaza, Suite 500
Chicago, IL 60631 USA
Phone: (773) 628-1000
[email protected]
Authored by:
Chad Marak
Technical Marketing Manager
Semiconductor Business Unit


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ESD PROTECTION DESIGN GUIDE: TVS DIODE ARRAYS

©2012 Littelfuse, Inc 1

This guide was developed to help electronics designers navigate

©2012 Littelfuse, Inc 2

IEC61000-4-2 ● Esata ● Audio (Speaker/Microphone)

1 ±2 7.5 ● Set Top Boxes ● Digital Cameras

2 ±4 15 ● LCD/PDP TV’s ● SIM/SD Cards

©2012 Littelfuse, Inc 3

TVS Diode Array (SPATM) Series Descriptions

©2012 Littelfuse, Inc 4

TVS Diode Arrays (SPATM) Series Descriptions

©2012 Littelfuse, Inc 5

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level Lightning Number of Package

©2012 Littelfuse, Inc 6

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level I/O Cap Lightning Number of Package

SP3001 ±8kV 0.65pF 6V 2.5A 4 SC70-6

SP3004 ±12kV 0.85pF 6V 4A 4 SOT563

©2012 Littelfuse, Inc 7

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level I/O Cap Lightning Number of Package

©2012 Littelfuse, Inc 8

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level I/O Cap Lightning Number of Package

SPLV2.8 ±30kV 2pF 2.8V 40A 1 SOT23-3

SPLV2.8-4 ±30kV 2pF 2.8V 40A 4 SOIC-8

©2012 Littelfuse, Inc 9

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level I/O Cap Lightning Number of Package

SP3050 ±20kV 2.4pF 6V 10A 4 SOT23-6

SP4060 ±30kV 4.4pF 2.5V 20A 8 MSOP-10

©2012 Littelfuse, Inc 10

TVS Diode Arrays (SPATM) Series Descriptions

ESD Level Line Cap Number of Package

24pF ≥ -30dB @ μDFN-12

©2012 Littelfuse, Inc 11

TVS Diode Array Ordering Guide

Series Number of Channels Package Orderable Part Number

SP1004 4 SOT953 SP1004-04VTG

SP1005 1 0201 Flipchip SP1005-01WTG

SP1006 1 0201 (μDFN-2,0.6x0.3mm) SP1006-01UTG

SP1007 1 0201 Flipchip SP1007-01WTG

SP1011 4 μDFN-6 (1.25x1.0mm) SP1011-04UTG

SP3001 4 SC70-6 SP3001-04JTG

SP3002 4 SC70-6 SP3002-04JTG

μDFN-6 (1.6x1.6mm) SP3002-04UTG

TVS Diode Array Ordering Guide (continued)

Series Number of Channels Package Orderable Part Number

SP3010 4 μDFN-10 (2.5x1.0mm) SP3010-04UTG

SP3011 6 μDFN-14 (3.5x1.35mm) SP3011-06UTG

SP3012 4 μDFN-10 (2.5x1.0mm) SP3012-04UTG

SP3021 1 SOD882 SP3021-01ETG

SP3031 1 SOD882 SP3031-01ETG

SP3050 4 SOT23-6 SP3050-04HTG

SP4040 2 SOIC-8 SP4040-02BTG

SP4060 8 MSOP-10 SP4060-08ATG

SP4061 4 μDFN-10 (2.6x2.6mm) SP4061-04UTG

SP4062 4 μDFN-10 (2.6x2.6mm) SP4062-04UTG