VPX3 152 3U VPX NXP T2080 Single Board Computer Product Sheet
VPX3 152 3U VPX NXP T2080 Single Board Computer Product Sheet
VPX3 152 3U VPX NXP T2080 Single Board Computer Product Sheet
Overview
Curtiss-Wright Defense Solutions’ VPX3-152 is the latest OpenVPX ™-
compliant 3U processor that combines the performance and the
advanced I/O capabilities of the NXP ® Power Architecture ® QorIQ ™
quad-core AltiVec ™-enabled T2080 processor with an extensive I/O
complement to provide a single board computer (SBC) processor.
Designed for space-constrained applications, the VPX3-152
represents the latest step in the evolution of commercial off-the-
shelf (COTS) modules for rugged, embedded applications, whether
Key Features commercial, aerospace, or military.
• NXP T2080 quad-core 64-bit CPU
up to 1.8 GHz with AltiVec The challenge of high-density computing is to pack the greatest
functionality into the smallest standard form factor, with the lowest
• Up to 16 GB DDR3 memory power possible while retaining maximum flexibility. In conjunction with
• x4 PCIe Gen2 XMC site its processing power, the VPX3-152 easily meets this challenge by
offering an impressive complement of I/O capability in order to satisfy
• Support for Linux® and Wind River® the most demanding application needs with a low power footprint.
VxWorks® 7 For applications that demand the highest levels of hardware and
software protection, the VPX3-152 provides information assurance
• NXP Secure Boot
with NXP Secure Boot technologies and capabilities.
Applications The VPX3-152’s integral high-speed backplane and XMC connectivity
• Commercial allow for multi-GBps data flows from board-to-board through the
backplane interface and from the backplane to XMC site. This
• Control computers
supports the acquisition, processing, and distribution of sensor
• Mission computer applications data such as video, radar, and sonar data. The VPX3-152’s rich I/O
complement includes two Gigabit Ethernet (GbE) ports, four serial
• ISR applications
channels, up to 4 bits of LVTTL discrete digital I/O (DIO) inputs and
• Controllers up to 4 bits of LVTTL outputs, Universal Serial Bus (USB) 2.0 ports,
and an XMC site with 64 bits of I/O mapped to the backplane.
The VPX3-152 is supported by a wealth of software, including
Curtiss-Wright developed U-Boot, Wind River VxWorks 7 and Linux.
INFO: CURTISSWRIGHTDS.COM
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VPX3-152
MVRAM
UART
IPMC
PLD
NOR FLASH
4/8
SPI I2C
4-16 GB
DDR3 SerDes
SDRAM T2080
4-64 GB SATA
eMMC
UART USB SGMII EMIx
x4 PCIe x4 PCIe
Gen2 Gen2
GbE Pn5
PHY
VITA 42 PCIe Switch
24-lane/
XMC
24-port
Pn6
24s x4 x4
20d
(2) x4 PCIe
Gen2
Up to
(8) x1 PCIe
Gen2
P0
P1
P2
(2) (2) MDC/ (2) (2) 1000-KX Card_Fail# PCIE
(2) (2) XMC I/O I2C DIO
RS422/ 1000-BT Or
RS232 USB 1000-BX MDIO SATA
(2) 10GE-KR
DataPlane
RS232
Features
• NXP QorIQ T2080 up to 1.8 GHz • 256 MB of contiguous direct-mapped Flash memory
+ 4 x dual threaded e6500 processor cores + Hardware Flash write protection jumper
+ Each core has AltiVec vector processor • Permanent Alternate Boot Site (PABS) provides back-up
boot capability
+ Each core has 64 KB L1 cache
• 512 KB MRAM NVRAM
+ Shared 2 MB L2 cache
• PCIe fabric ports on the VPX P1 connector, mapped as per
+ 1 x DDR3 memory controllers with 512 KB L3 front side
VITA 65, that can be configured as:
cache ECC
+ Four x2 lane PCIe Gen2 ports, transparent mode
+ 2 x GbE controllers
+ Two x4 lane PCIe Gen2 ports, one non-transparent
+ 2 x DUART controller
capable
+ 2 x I2C channels
+ Eight x1 lane PCIe Gen2 ports, two non-transparent
+ 3 x PCI Express® (PCIe) interfaces capable (other configurations possible, consult factory)
+ Integrated DMA controllers • 1 x XMC (VITA 42.3) site on independent PCIe bus
• Single, high-speed 64-bit DDR3 SDRAM controller with ECC + x4 lane PCIe Gen2 interface
to correct single-bit errors and detect double-bit errors on
+ PN6 pinned out to backplane P2 following VITA 46.9
single memory controller
P2w1-X24s+X8d+X12d
• Up to 16 GB of DDR3 SDRAM with ECC
• Conduction-cooling of XMC site optimized with primary and
• Up to 64 GB of eMMC Flash (optional) secondary thermal interfaces
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VPX3-152
Table 1 below compares the key characteristics and performance gains of the T2080 to the VPX3-133 SBC based on the
QorIQ processor.
Memory
Double Data Rate (DDR3) SDRAM For absolute security against inadvertent Flash programming
or corruption, a hardware jumper is provided to disable
The T2080 provides a single memory controller supporting
writing to Flash. The firmware provides Flash programming
DDR3 SDRAM, which the VPX3-152 uses to provide up to
functions with support for downloading Flash images over
16 GB DDR3 SDRAM. The DDR3 interface operates at a rate
Ethernet.
of 1866 MT/s for 4GB variants and 1600 MT/s for 8 and
16GB variants.
NAND Flash
To preserve data integrity, the VPX3-152 takes advantage of
For applications requiring more non-volatile memory storage
the processor’s memory controller’s ECC circuitry to correct
than can be supported by the NOR Flash memory, the VPX3-
single-bit errors and detect double-bit errors. The DDR is
152 provides up to 64 GB of eMMC NAND flash.
accessible from the processor, as well as the Ethernet and
PCIe interfaces.
Permanent Alternate Boot Site (PABS)
Flash Memory The VPX3-152 is equipped with a Permanent Alternate Boot
Site (PABS) SPI NOR Flash. PABS provides a backup boot
The VPX3-152 is configured with 256 MB of NOR Flash
capability in the event that the firmware in the main Flash
Memory. The Flash will retain data for 20 years at +85°C.
becomes corrupted. This can occur because of an error
Note: these figures assume the sector the data is in has less
during reprogramming or an incorrect image being loaded.
than 1,000 erase cycles. The data retention drops as erase
PABS provides users with a convenient mechanism to
cycle count increases. After 10,000 cycles, data retention is
recover from corruption of the main Flash without removing
for 10 years. After 100,000 cycles, data corruption will likely
the card from the system in which it is installed. An on-board
be noticeable in one year. Read performance of the Flash
jumper is provided to cause the card to boot from PABS,
array is optimized in order to minimize system boot up time
thus allowing a user to reinstall the standard firmware load.
for applications such as avionics mission computers where
fast restarts after power interruptions are critical.
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Thermal Cooling
TherMax-style thermal frame Full-width thermal interface to back-side slot wall
Applicable to conduction-cooled cards, a TherMax thermal To minimize the temperature rise from the mating slot
frame provides an unbroken metallic path from the XMC sites wall of conduction-cooled enclosures to the back-side
and shunted components to the back-side cooling surface thermal interface region of the VPX3-152, the thermal frame
of the card, thereby minimizing the temperature rise to these maximizes the thermal interface area by extending the frame
devices. In comparison, a typical thermal frame simply sits to the full width of the card, as illustrated in Figure 3. This
on top of the PWB and forces heat to flow through the PWB, deviation from the IEEE 1101.2 standard, which calls for
which has a high thermal resistance compared to aluminum. the thermal frame to be notched for compatibility with card
guides in standard air-cooled chassis, has the benefit of
Typical Thermal Frame
lower card operating temperatures and increased long term
Wedgelocks reliability. During test and integration activities where it may
XMC Module be desirable to install a conduction-cooled VPX3-152 into
an air-cooled card-cage, this can normally be accomplished
simply by removing the card guides.
Thermal Frame
Heat Flow
T IEEE 1101.2
Basecard PWB Card-edge
SHIM Heat Rise Profile
Through PWB
Wedgelocks
XMC Module
Thermal Frame
Heat Flow
Basecard PWB
VPX3-152
No PWB
Card-edge
Heat Rise
Profile
Figure 2: TherMax diagram
A TherMax thermal frame eliminates the PWB heat rise Figure 3: Card-edge profile deviates from IEEE 1101.2
inherent in a standard thermal frame VPX3-152 card-edge profile is optimized to provide a full-
width thermal interface to the back-side slot wall
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VPX3-152
Rear Transition Module Note: Air-flow is specified for sea-level conditions. The
temperature refers to the inlet temperature at the card.
To gain access to the backplane I/O signals of the VPX3- The air-flow specifications are for worst case (highest
152, the RTM3-152 rear transition module (RTM) is available power) conditions, with a 20W XMC installed. Curtiss-
to access I/O in a lab environment. There are several variants Wright can supply additional recommendations for specific
of the RTM to match the VPX3-152 variants. Please contact power/temperature/altitude scenarios and pressure drop
the factory for more information. characteristics of the VPX3-152 support the design and
testing of cooling subsystems. Please contact the factory
for assistance.
Specifications
Ruggedization Levels
VPX3-152 Air-cooled Cooling Requirements • Air-cooled cards are available in Levels 0, 100.
• Configuration: Power estimates are for VPX3-152 with no • Conduction-cooled cards are available in Levels 200,
mezzanine installed 300.
• Temperature range: -40°C to 71°C Please see the Curtiss-Wright Ruggedization Guidelines
• Air-flow: 20 CFM product sheet for more information.
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VPX3-152
Ordering Information
The VPX3-152 is ordered with the following part numbers. VPX3-152-UVWXYPZ, where U, V, W, X, Y, P and Z denote cooling
method, temperature range, mechanical format and functional configuration respectively. Not all possible configurations are
offered, consult Curtiss-Wright for available configurations.
© 2017-2019 Curtiss-Wright. All rights reserved. Specifications are subject to change without notice.
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