AU9510

USB Smart Card Reader Chip

Technical Reference Manual

Revision 1.0

2000-2002 Alcor Micro Corp.

All Rights Reserved
Copyright Notice
Copyright 1998 - 2001
Alcor Micro Corp.
All Rights Reserved.

Trademark Acknowledgements
The company and product names mentioned in this document may be the trademarks or registered trademarks of their manufacturers.

Disclaimer
Alcor Micro Corp. reserves the right to change this product without notice.
Alcor Micro Corp. makes no warranty for the use of its products and bears no responsibility for any errors that appear in this
document. Specifications are subject to change without notice.

Contact Information:

Web site: http://www.alcormicro.com/

Taiwan
Alcor Micro Corp.
4F-1, No 202, Kang Chien Rd., Nei Hu,
Taipei, Taiwan, R.O.C.
Phone: 886-2-8751-1984
Fax: 886-2-2569-7723

San Jose Office Los Angeles Office

2901 Tasman Drive, suite 206 9400 Seventh St., Bldg. A2
Santa Clara, CA 95054 Rancho Cucamonga, CA 91730
Phone: (408) 845-9300 Phone: (909) 483-9900
Fax: (408) 845-9086 Fax: (909) 944-0464
Table of Contents

1.0 Introduction ...................................................................................................... 1

1.1. Description ............................................................................................................. 1
1.2. Features ................................................................................................................. 1
2.0 Application Block Diagram.............................................................................. 3
3.0 Pin Assignment ................................................................................................ 5
4.0 System Architecture and Reference Design.................................................. 9
4.1. AU9510 Block Diagram......................................................................................... 9
4.2. Sample Schematics................................................................................................. 9
5.0 Programming Interface.................................................................................... 12
6.0 Electrical Characteristics ................................................................................ 15
6.1. Absolute Maximum Ratings................................................................................... 15
6.2. Recommended Operating Conditions .................................................................... 15
6.3. General DC Characteristics .................................................................................... 15
6.4. DC Electrical Characteristics for 5 volts operation................................................ 16
6.5. Crystal Oscillator Circuit Setup for Characterization............................................. 17
6.6. USB Transceiver Characteristics………………………………………………….17
6.7. ESD Test Results…………………………………………………………………. 21
6.8. Latch-Up Test Results……………………………………………………………..22
7.0 Mechanical Information ................................................................................... 25

TABLE OF CONTENTS i
TABLE OF CONTENTS i
1.0 Introduction
1.1. Description
The AU9510 is a self-contained single chip USB Smart Card controller chip. It can be used
in a stand-alone USB Smart Card reader or in an embedded USB device in the downstream
port of an USB hub. Its high integration enables the lowest BOM cost of an USB Smart Card
reader. The dedicated hardware smart card block and full speed bulk transfer mechanism
ensures the highest performance.

1.2. Features
• Fully compliant with the Universal Serial Bus Specification, version 1.1.
• Based on ISO7816 implementation
• PC Smart Card industry standard – PC/SC 1.0 compliant
• Supports Microsoft Smart Card for Windows
• Meet Microsoft WHQL USB Smart Card Reader requirements
• Include WDM driver to work on Windows 98 and Windows 2000
• Support T0, T1 protocol and I2C memory card
• Dedicated hardware block implementation for IC and memory card protocols for highest
performance
• Implemented as an USB full speed device with bulk transfer endpoint
• Built-in 3.3v regulator for single 5v operation
• Built-in PLL for USB and Smart Card clocks requirement
• Support EEPROM for USB descriptors customization, including VID/PID
• Available in 28-SSOP

INTRODUCTION 1
This Page Intentionally Left Blank

INTRODUCTION 2
2.0 Application Block Diagram
The AU9510 is a single chip USB smart card controller chip. It can be used in a standalone
USB Smart Card reader or in an embedded USB device in the downstream port of a USB hub.

Application Programs
Corporate Network
Access
Internet/Intranet Access
Electronic Cash
PC with USB Host Controller
Credit and Debit
Loyalty
GSM

ISO7816
USB Keyboard Hub USB SmartCard Reader Compliant
Smart Card

USB
Downstre
am Port
Smart Card
Solutions

APPLICATION BLOCK DIAGRAM 3

This Page Intentionally Left Blank

APPLICATION BLOCK DIAGRAM 4

3.0 Pin Assignment

VCC3V 1 28 GNDIO

USB_DM 2 27 VCC5IO

USB_DP 3 26 XTAL_2

E2PCLK 4 25 XTAL_1

E2PDATA 5 24 VCCAP

GPIO_0 6 23 GNDAP
ALCOR MICRO
GPIO_1 7 22 RSTN
AU9510
GPIO_2 8 USB SMARTCARD 21 TESTEN0
28-SSOP
GPIO_3 9 20 GPIO_4

GPIO_6 10 19 SCARDDETECTN

SCARDDATA 11 18 GPIO_5

GPIO_7 12 17 SCARDCLK

GNDK 13 16 SCARDRST

VCC5K 14 15 SCARDPWRN

PIN ASSIGNMENT 5
 Table 3-1. Pin Descriptions for the 28-pin SSOP

Pin # Pin Name I/O Description

1 VCC3V O Regulated 3V for DP pullup resistor

2 USB_DM I/O USB Downstream port D-

3 USB_DP I/O USB Downstream port D+

4 E2PCLK I/O I2C Eeprom Clock signal

5 E2PDATA I/O I2C Eeprom Data signal

6 GPIO_0 I/O General purpose IO

7 GPIO_1 I/O General purpose IO

8 GPIO_2 I/O General purpose IO

9 GPIO_3 I/O General purpose IO

10 GPIO_6 I/O General purpose IO

11 SCARDDATA I/O Smart_Card Serial Data

12 GPIO_7 I/O General purpose IO

13 GNDK GND Ground

Kernel

14 VCC5K 5V VCC +5V power supply

Kernel

PIN ASSIGNMENT 6
 Table 3-1 (continued). Pin Description for the 28-pin SSOP

Pin # Pin Name I/O Description

15 SCARDPWRN O Smart_Card power enable (active low for power

switch)

16 SCARDRST O/Tri Smart_Card Reset

17 SCARDCLK I/O Smart_Card Clock

18 GPIO_5 I/O General purpose IO

19 SCARDDETECTN I Smart_Card Inserted (active low)

20 GPIO_4 I/O General purpose IO

21 TESTEN0 I Testenable

22 RSTN I Hardware reset (active low)

23 GNDAP Analog Analog ground

Ground
Output

24 VCCAP Analog Analog VCC

Input

25 XTAL_1 I 12 MHz crystal input

26 XTAL_2 O 12 MHz crystal output

27 VCC5IO 5V VCC +5V power supply

I/O

28 GNDIO 5V GND Ground

I/O

PIN ASSIGNMENT 7
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PIN ASSIGNMENT 8
4.0 System Architecture and
Reference Design

4.1. AU9510 Block Diagram

Alcor Micro - AU9510 Smart Card Reader Block Diagram

Card Eject
USB USB USB 256 byte Smart Card
XCVR

Card Reset
Upstream SIE FIFO RAM Control
Port Card Insert

Card Data
8 K byte EEProm Smart Card
Processor
ROM Interface FIFO Card Clock

3.3 V
3.3 V Voltage Optional
Regulator 256 Bytes
EEPROM

12MHz
Reset
XTAL

SYSTEM ARCHITECTURE AND REFERENCE DESIGN 9

4.2. Sample Schematics

VCC
VCC3.3

FB F2 FB F3
C2 C3 R1 C4 C5 VCC
U1
0.1UF 10UF 1UF 0.1UF
1.5K 1 12 R17 47K
J1 VCC3V GPIO_7 10 R18 47K
1 GPIO_6 18 R19 47K
VCC 2 R2 39 2 GPIO_5 20 R20 47K
DATA- 3 R3 39 3 USB_DM GPIO_4 9 R21 47K
DATA+ 4 VCC USB_DP GPIO_3 8 R22 47K
GND 5 GPIO_2 7 R23 47K
FGND1 6 FB F4 GPIO_1 6 R24 47K
FGND2 C7 C8 24 GPIO_0
23 VCCAP
USB-A 0.1UF FB 0.1UF GNDAP
F5 R7 R8

VCC 19 SCARDETECTN
SCARDETECTN 16 R9 150 SCARDRST
27 SCARDRST 15 SCARDPWRN
VCC5IO SCARDPWRN 20K 20K
C10 17 R10 150 SCARDCLK
28 SCARDCLK 11 R11 150 SCARDDATA
0.1UF GNDIO SCARDDATA

VCC
21
FB F6 TESTEN0
C11 C12 14
13 VCC5K
0.1UF FB F7 0.1UF GNDK VCC
U2
8 1
7 VCC A0 2
4 6 WP A1 3
39PF E2PCLK 5
C13 R14 39 25 5 SCL A2 4
XTAL_1 E2PDATA SDA GND
Y1
R25 C15
AT24C08
VCC
12MHZ 26 22 R16 470K
C16 39PF 1M XTAL_2 RSTN 0.1UF
R15 39
C17
AU9510
0.1UF

JP1 SMDC035
F1
5 1 Q1
SCARDDRST
SCARDDATA 6 2 SCARDCLK C1
7 3 9012
8 4
SCARDETECTN 9 10 0.1UF

SCARD SOCKET

VCC
R4 R5
S1 C6

R6 47K 0.1UF 100K 4.7K

VCC

SCARDPWRN

Title
AU9510 USB SMARTCARD READER CONTROLLER

Size Document Number Rev

A4 ALCOR MICRO AU9510 REFERENCE DESING A

Date: Wednesday , May 23, 2001 Sheet 1 of 1

Disclaimer: This schematic is for reference only. Alcor

Micro Corp. bears no responsibility for any error that
appear in this document. Specifications are subject to
change without notice.

SYSTEM ARCHITECTURE AND REFERENCE DESIGN 10

5.0 Programming Interface
AU9510 is a dedicated single chip USB SmartCard reader controller. In addition to silicon
itself, Alcor Micro provides WDM drivers on Windows 2000 and Windows 98 platforms to
ensure Microsoft PC/SC compliance. However, for non-Windows application platforms,
software driver developers may wish to access the reader directly. This document describes
Alcor’s vendor unique USB commands. Table 1-1 shows all commands. (For details of the
USB request specification, please refer to USB spec. Chapter 9 )

USB request Description

(bRequest)
20h Warm Reset
21h Cold Reset
22h Power Down
10h Write SmartCard
11h Read SmartCard
30h Host Abort
31h Set Protocol
AU9510 Vendor Unique USB Requests

Warm Reset

bmRequestType bRequest Wvalue wIndex wLength Data

11000000B 00100000B Zero Zero Two ATR Length &
TA2 Present

Device will perform a “warm reset” and return two bytes data. The first byte indicates the
ATR byte length and the second byte returns 00000001B if TA2 present (specific mode of
card operation). Following this command, host can use Endpoint 2 (Bulk Transfer) to get
ATR information. The number of bytes to transfer is indicated by “ATR Length”.

PROGRAMMING INTERFACE 11
Cold Reset

bmRequestType bRequest WValue wIndex wLength Data

11000000B 00100001 Zero Zero Two ATR Length
B &
TA2 Present

Device will perform a “cold reset” and return two bytes data. The first byte indicates the ATR
byte length and the second byte returns 00000001B if TA2 present (specific mode of card
operation). Following this command, host can use Endpoint 2 (Bulk Transfer) to get ATR
information. The number of bytes to transfer is indicated by “ATR Length”.

Power Down

bmRequestType bRequest wValue wIndex wLength Data

01000000B 00100010B Zero Zero Zero None

This command will reset the device and deactivate the SmartCard

Write SmartCard

bmRequestType bRequest wValue wIndex wLength Data

01000000B 00010000B Number of Zero Zero None
bytes to
transfer

Following this command, host can use Endpoint 2 (Bulk Transfer) to transfer data to
SmartCard. The number of bytes to transfer is indicated by “Number of bytes to transfer”.

Read SmartCard

bmRequestType bRequest wValue wIndex wLength Data

01000000B 00010001B Number of Zero Zero None
bytes to
transfer

Following this command, host can use Endpoint 2 (Bulk Transfer) to transfer data from
SmartCard. The number of bytes to transfer is indicated by “Number of bytes to Process”.

PROGRAMMING INTERFACE 12
Host Abort

bmRequestType bRequest wValue wIndex wLength Data

01000000B 00110000B Zero Zero Zero None

Host timeout, current command will be aborted.

Set Protocol

bmRequestType bRequest wValue wIndex wLength Data

01000000B 00110001B Zero Zero Two Protocol
Type,
FI & DI

Host will send two bytes data. The first byte codes the protocol type (T). The second byte
codes Clock rate conversion factor (FI) over the most significant half byte, and Bit rate
adjustment factor (DI) over the least significant half byte.

PROGRAMMING INTERFACE 13
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PROGRAMMING INTERFACE 14
 6.0 Electrical Characteristics

6.1. Absolute Maximum Ratings

SYMBOL PARAMETER RATING UNITS
VCC Power Supply -0.3 to 6.0 V
VIN Input Voltage -0.3 to VCC+0.3 V
VOUT Output Voltage -0.3 to VCC+0.3 V
˚
TSTG Storage Temperature -40 to 125 C

6.2. Recommended Operating Conditions

SYMBOL PARAMETER MIN TYP MAX UNITS

VCC Power Supply 4.5 5.0 5.5 V
VIN Input Voltage 0 VCC V
O
TOPR Operating Temperature -5 85 C

6.3. General DC Characteristics

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS

IIL Input low current no pull-up or pull-down -1 1 µA
IIH Input high current no pull-up or pull-down -1 1 µA
IOZ Tri-state leakage current -10 10 µA
CIN Input capacitance 4 ρF
COUT Output capacitance 4 ρF
CBID Bi-directional buffer capacitance 4 ρF

ELECTRICAL CHARACTERISTICS 15
 6.4. DC Electrical Characteristics for 5 volts operation

( Under Recommended Operating Conditions and VCC=4.5v ~ 5.5v , Tj= -40OC to + 85OC )
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIL Input Low Voltage TTL 0.8 V
VIL Input Low Voltage CMOS 0.3*VCC V
VIL Schmitt input Low Voltage TTL 1.10 V
VIL Schmitt input Low V oltage CMOS 1.84 V
VIH Input High Voltage TTL 2.2 V
VIH Input Hight Voltage CMOS 0.7*VCC V
VIH Schmitt input High Voltage TTL 1.87 V
VIH Schmitt input High Voltage CMOS 3.22 V
VOL Output low voltage IOL=2, 4, 8, 12, 16, 24 mA 0.4 V
VOH Output high voltage IOH=2, 4, 8, 12, 16, 24 mA 3.5 V
RI Input Pull-up/down resistance Vil=0V or Vih=VCC 50 KΩ

6.5. Crystal Oscillator Circuit Setup for Characterization

The following setup was used to measure the open loop voltage gain for crystal oscillator
circuits. The feedback resistor serves to bias the circuit at its quiescent operating point and
the AC coupling capacitor, Cs, is much larger than C1 and C2.

ELECTRICAL CHARACTERISTICS 16
6.6. USB Transceiver Characteristics
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS LIMITS UNIT
MIN MAX
VCC DC supply voltage 3.0 3.6 V
VI DC input voltage range 0 5.5 V
VI/O DC input range for I/Os 0 VCC V
VO DC output voltage range 0 VCC V
˚
TAMB Operating ambient temperature See DC and AC 0 70 C
range in free air characteristics for
individual device

ABSOLUTE MAXIMUM RATINGS (Notes 1 and 2)

In accordance with the Absolute Maximum Rating System, Voltages are referenced to GND (Ground=0v)
SYMBOL PARAMETER CONDITIONS LIMITS UNIT
MIN MAX
VCC DC supply voltage -0.5 +6.5 V
IIK DC input diode current Vi<0 -50 mA
VI DC input voltage Note 3 -0.5 +5.5 V
VI/O DC input voltage range for I/Os -0.5 Vcc V
+0.5
IOK DC output diode current Vo> Vcc or Vo<0 +/-50 mA
VO DC output voltage Note 3 -0.5 Vcc V
+0.5
IO DC output source sink current for Vo=0 to Vcc +/-15 mA
VP/VM and RCV pins
IO DC output source or sink current Vo= 0 to Vcc +/-50 mA
for D+/D- pins
ICC, IGND DC Vcc or GND current +/-100 mA
˚
TSTO Storage temperature range -60 +150 C
PTOT Power dissipation per package mW

NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress
ratings only and functional operation of the device at these or any other conditions beyond those
indicated under "Recommended Operating Conditions" is not implied. Exposure to absolute
maximum rated conditions for extended periods may affect device reliability.
2. The performance capability of a high performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum
junction temperature of this integrated circuit should not exceed 150˚C.
3. The input and output voltage ratings may be exceeded if the input and output clamp current ratings
are observed.

ELECTRICAL CHARACTERISTICS 17
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (Ground=0V).
SYMBOL PARAMETER TEST CONDITIONS LIMITS
-40˚C to +85˚C UNIT
MIN TYP MAX
VHYS Hysteresis on inputs Vcc=3.0V to 3.6V (Note 3) 0.3 0.4 0.5 V
VIH HIGH level input Vcc=3.0V to 3.6V (Note 3) 1.5 2.0 V
VIL LOW level input Vcc=3.0V to 3.6V (Note 3) 0.8 1.1 V
RoH Output impedance (HIGH state) Note 2 28 34 43 ohm
RoL Output impedance (LOW state) Note 2 28 35 43 ohm
VOH HIGH level output Vcc=3.0V Io=6mA 2.2 2.7 V
(Note 3) Vcc=3.0V Io=4mA 2.4
Vcc=3.0V Io=100µA 2.8
VOL LOW level output Vcc=3.0V Io=6mA 0.3 0.7 V
(Note 3) Vcc=3.0V Io=4mA 0.4
Vcc=3.0V Io=100µA 0.2
IQ Quiescent supply current Vcc=3.6V VI=Vcc or GND 330 600 µA
Io=0
Isup Supply current in suspend Vcc=3.6V VI=Vcc or GND 70 µA
Io=0
IFS Active supply current (Full Vcc=3.3V 9 14 mA
Speed)
ILS Active supply current (Low Vcc=3.3V 2 mA
Speed)
ILeak Input leakage current Vcc=3.6V VI=5.5V or GND, +/- +/-0.5 µA
not for I/O Pins 0.1
IOFF 3-state output OFF-state current Vi=Vih or ViL; Vo=Vcc or +/-10 µA
GND

NOTES:
1. All typical values are at Vcc=3.3V and Tamb=25˚C.
2. This value includes an external resistor of 24 ohm +/-1%. See "Load D+ and D-" diagram for
testing details.
3. All signals except D+ and D-.

SYSTEM ARCHITECTURE AND REFERENCE DESIGN 18

AC ELECTRICAL CHARACTERISTICS
GND=0V, tR = tF =3.0 ns; CL =50 pF; RL=500 Ohms
SYMBOL PARAMETER WAVEFORM
LIMITS (TAMB)
0˚C to +25˚C 0˚C to +70˚C UNIT
MIN TYP MAX MIN MAX
tpLH VMO/VPO to D+/D- 1 0 12 0 14 ns
tpHL Full Speed 0 12 0 14
trise Rise and Fall Times 2 4 9 20 4 20 ns
tfall Full Speed 4 9 20 4 20
tRFM Rise and Fall Time 90 110 90 110 %
Matching
Full Speed
tpLH VMO/VPO to D+/D- 1 120 300 300 ns
tpHL Low Speed 120 300 300
trise Rise and Fall Times 2 75 300 75 300 ns
tfall Low Speed 75 200 75 200
tRFM Rise and Fall Time 70 130 70 130 %
Matching
Low Speed
tpLH D+/D- to RCV 3 9 16 16 ns
tpHL 9 16 16
tpLH D+/D- to VP/VM 1 4 8 8 ns
tpHL 4 8 8
tpHZ 12 12 ns
tpZH OE# to D+/D- RL = 4 12 12
tpLZ 500ohm 10 10
tpZL 10 10
tsu Setup for SPEED 5 0 ns
Vcr Crossover point1 3 1.3 2.0 1.3 2.0 V

NOTES:
1. The crossover point is in the range of 1.3V to 2.5V for the low speed mode with a 50 pF
capacitance.

ELECTRICAL CHARACTERISTICS 19
ELECTRICAL CHARACTERISTICS 20
6.7. ESD Test Results
Test Description: ESD Testing was performed on a Zapmaster system using the Human-
Body-Model (HBM) and Machine-Model (MM), according to MIL-STD 883 and EIAJ IC-
121 respectively.
• Human-Body-Model stresses devices by sudden application of a high voltage supplied by
a 100pF capacitor through 1.5k-ohm resistance.
• Machine-Model stresses devices by sudden application of a high voltage supplied by a
200pF capacitor through very low (0 ohm) resistance.

Test Circuit & Condition

- Zap Interval: 1 second
- Number of Zaps: 3 positive and 3 negative at room temperature
- Criteria: I-V Curve Tracing

ESD Data
Model Mode S/S Target Results
HBM Vdd, Vss, I/C 15 6000V PASS
MM Vdd, Vss, I/C 15 200V PASS

ELECTRICAL CHARACTERISTICS 21
6.8. Latch-Up Test Results
Test Description: Latch-Up testing was performed at room ambient using an IMCS-4600
system which applies a stepped voltage to one pin per device with all other pins open except
Vdd and Vss which were biased to 5Volts and ground respectively.
Testing was started at 5.0V (Positive) or 0V (Negative), and the DUT was biased for 0.5
seconds.
If neither the PUT current supply nor the device current supply reached the predefined limit
(DUT=00mA, Icc=100mA), then the voltage was increased by 0.1Volts and the pin was tested
again.
This procedure was recommended by the JEDEC JC-40.2 CMOS Logic standardization
committee.

Notes:
1. DUT: The device under test.
2. PUT: The pin under test.

Test Circuit: Positive Input/Output Overvoltage/Overcurrent

ELECTRICAL CHARACTERISTICS 22
 Test Circuit: Negative Input/Output Overvoltage/Overcurrent

Supply Overvoltage Test

Latch-Up Data
Mode Voltage (V)/Current (mA) S/S Results
+ 11.0 5 Pass
Voltage 11.0 5 Pass
-
+ 200 5 Pass
Current 200 5 Pass
-
Vdd - Vxx 9.0 5 Pass

ELECTRICAL CHARACTERISTICS 23
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ELECTRICAL CHARACTERISTICS 24
7.0 Mechanical Information
Following diagrams show the dimensions of the AU9510 28-pin SSOP. Measurements are in
inches. Dimensions do not include mold flash and dambar protrusion; allowable mold flash is
0.010 inch.

MECHANICAL INFORMATION 25
 REV. DESCRIPTION BY DATE
ORIG. 1. REGENERATED FROM PO-P402 VERSION"A" JIMMY 97.04.21
2. ADD GAUGE PLANE
c ADD CROSS SECTIONA-A" DRAWING STEVEN 97.07.31
d MODIFY 0.020 TO 0.002 IRIS 97.08.21
e ADD E-PIN IRIS 98.06.10
CHANGE PIN "I" DOT DIMENSION

SYMBOL
COMMON DIMENSION COMMON DIMENSION
MILLIMETERS INCH
MIN. NOM. MAX. MIN. NOM. MAX.
A 2.00 0.079
A1 0.05 0.002
A2 1.65 1.75 1.85 0.065 0.069 0.073
b 0.22 0.38 0.009 0.015
b1 0.22 0.30 0.33 0.009 0.012 0.013
c 0.09 0.25 0.004 0.010
c1 0.09 0.15 0.21 0.004 0.006 0.008
E 7.40 7.80 8.20 0.291 0.307 0.323
E1 5.00 5.30 5.60 0.197 0.209 0.220
e 0.65 BSC 0.0256 BSC
L 0.55 0.75 0.95 0.021 0.030 0.037
L1 0.25 REF. 0.050 REF.
R1 0.09 0.004
θ 00 40 80 00 40 80

N 14 16 18 20 24 28
0 ± 0.30 6.20 6.20 7.20 7.20 8.20 10.20
MO-150 MO-150 MO-150 MO-150 MO-150 MO-150
JEDEC NO.
AB AC AD AE AG AH

UNLESS DECMAL ANGULAR UNIT MM SCALE : 10:1

X
OTHERWISE ORENT SEMCONOUCTOR ELECTRONICS
XX .10 30 SHEET:1 OF1
SPECIFIED XXX .05
DRAWN IRIS 98.06.10 TITLE FILE: PD-P503C A3
CHECKED SSOP 14/16/20/21/28L ( 209 MIL ) DWG. NO. :
APPROVED PACKAGE OUTLINE PD-P503C

MECHANICAL INFORMATION 26