Datasheet

WHITE beet P
ver.1.02c

WHITE beet P module is intended to add full ISO/IEC 15118 functionality

to electrical vehicles side (PEV/BEV or HPEV).
The module contains coupling transformer with 1:1:1 winding ratio
and Control Pilot EV side functionality.

*Available for purchase from CODICO GmbH

WHITE beet P module provides the necessary hardware to support ISO 15118-3 HomePlug GreenPHY
powerline communication over Control Pilot (CP) wire and Protective Earth (PE). The module includes
STM32 MCU for executing the ISO/IEC 15118 / DIN 70121 / SAE J2847/2 software stack on it, use
Ethernet and SPI as Host Control interfaces as well and Control Pilot for PLC communication.

In addition WHITE beet P module provides IEC 61851-1 / SAE J1772 functionality for EV on-board side.

*** CODICO Confidential ***

 Contents

1. Features ..........................................................................................................................................................3

2. Block diagram ..............................................................................................................................................4

3. Operational conditions .............................................................................................................................5

4. Module pinout and pin description .....................................................................................................6

5. Reference design schematics .............................................................................................................. 10

6. Module marking information .............................................................................................................. 11

7. Mechanical characteristics .................................................................................................................... 12

8. Reflow profile information.................................................................................................................... 14

9. Evaluation board ...................................................................................................................................... 15

10. Packaging and ordering information ............................................................................................. 16

11. Document revision history ................................................................................................................. 17

WHITE-beet-P Datasheet *** CODICO Confidential *** 2

 1. Features

WHITE beet P module comes in three software configurations:

 SLAC/Bridging Mode as closed system
 Embedded ISO15118 Mode as a closed system
 SDK Open Mode – no embedded firmware

E-mobility transparent bridging/SLAC software

Allows Ethernet frames bridging between Ethernet / SPI interface and powerline, as well as processing
a SLAC exchange mechanism. System is closed, so customer cannot add any own application software.
E-mobility ISO 15118 / DIN 70121 / SAE J2847/2 stack software
Software stack supports V2G EMI (Vehicle to Grid, External Identification Means), PnC (Plug & Charge),
TLS 1.2, BPT (Bipolar Power Transfer). It includes ISO 15118-2 EMI and DIN 70121 / SAE J2847/2
software stack as well as all necessary network protocols and services. Host controller is accessible
using Ethernet or SPI interface via API messages. System software is closed, so the customer cannot
add any own applications.
OCPP 1.6 and 2.0 planned for the near future software releases.
E-mobility SDK Open (no embedded firmware)
Modules with “open” software option come not programmed. However, there is a SDK which allows
developers to integrate their own applications into the module‘s STM32 MCU.
Both other software options can be available as a source code directly from our Software partner per
request (is a subject to license fees to be agreed with the Software partner).
SDK software features include but not limited to QCA700x SPI driver, SLAC (to offload external host
system from time critical real-time operations), ISO 15118-2, DIN 70121, PnC, SAE J2847/2 (future
option), ISO 15118-20 (future option), TCP/IPv6, TLS, OCPP communication stacks (future option).

WHITE beet P module is based on Qualcomm QCA7005-AL33 HomePlug Green PHY automotive IC
and together with its TCXO generator it makes possible operation temperature up to +105°C.
The other important key facts about the module:

 STM32F745VGH6 MCU with 1MB internal Flash

 4MB external NOR Flash Memory on-board (3MB could be available for user applications)
 Ethernet / SPI host control interfaces
 UART debug output and configurable GPIOs
 IEC 61851-1 / SAE J1772 EV functionality
 Optimized low noise DC/DC power supply for QCA7005
 Very low noise floor implementation on PLC side providing a maximum of SNR for
communication
 Optimized PLC line coupling and overvoltage protection circuitry to provide maximum SNR
 Operation board temperature range -40°C to +105°C
 Operation ambient temperature range (estimation) -40°C to +85°C
 TCXO generator 25.000 MHz, +/-25ppm tolerance including full operation temperature
range and 15 years of aging

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  Half via pins in order to allow optical inspection of the soldering of the module and higher
mechanical stability for rough environments (e.g. heavy duty machinery)
 Separated dual, low ripple 3.3V DC/DC power supply for QCA7005 and STM32
 Green PHY Firmware options by boot-straps for FW v1.1.0-02 and latest available firmware
(currently FW v3.0)
 ARM Serial Wire Debug interface (SWD)
 50 mm x 50 mm SMD package
 Weight 9.9±0.1 g

NOTE: This documents does not contain any WHITE-beet-P software features related information.
Software documentation is provided separately.

2. Block diagram

FIGURE 3-1. WHITE-BEET-P (PEV) BLOCK DIAGRAM

BPF and
Pi-filter and protection Control Pilot
+5V DC DC-DC 3.3V Transformer Coupling &
decoupling QCA7005
low noise 1:1:1 protection
capacitors TX amplifier
load and
protection LF-pass
GPIO bootstrap configuration QCA7005 filter &
SPI protection
Ethernet HCI
SPI HCI PWM sensing
USB
1300R & 270R
CAN STM32F745
UART debug VGH6 Proximity Pilot
PP sensing
I2C
GPIOs NOR Flash 4MB

DC-DC 3.3V
for MCU
SWD

NOTE: HCI = Host Control Interface;

Interfaces which have grey text color are not supported in the software at the moment.

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 3. Operational conditions

TABLE 3-1. STANDARD OPERATING CONDITIONS

Parameter Min Typical Max Units

Power supply voltage (VDD) 4.9 5 5.2 V
GPIOs, communication interfaces input voltage - 3.3 3.46 V
Power consumption (at +25 °C) - 1 1.6 W
Operating (board) temperature -40 - +95 °C
Ambient temperature (approximation) -40 - +85 °C
Control Pilot voltage (CP) -12 - +12 V

TABLE 3-2. ABSOLUTE MAXIMUM CONDITIONS

Parameter Min Typical Max Units

Power supply voltage (VDD) 4.75 5 5.25 V

Power supply noise and ripples voltage - - 40 mVp-p
GPIOs, communication interfaces input voltage -0.3 - 3.6 V
Operating (board) temperature -40 - +105 °C
Storage temperature -40 - +150 °C
Control Pilot voltage (CP) -13 - +13 V
RESETN input pulse duration 0.3 - - us

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 4. Module pinout and pin description

TABLE 4-1. WHITE-BEET-P MODULE PINOUT INFORMATION

Main
WHITE-BEET-PS
Pin WHITE-BEET-PO function Main function description
WHITE-BEET-PI
type
PAD 1 HEART-BEAT HEART-BEAT / PC0 O Heard-beat signal for LED
PAD 2 GND - Ground connection
PAD 3 ETH_MDC ETH_MDC / PC1 O Ethernet HCI MII Clock
PAD 4 ETH_MDIO ETH_MDIO / PA2 I/O Ethernet HCI MII Data
PAD 5 ETH_RXD0 ETH_RXD0 / PC4 I Ethernet HCI MII Receive Data[0]
PAD 6 ETH_REF_CLK ETH_REF_CLK / PA1 I Ethernet HCI MII Receive Clock
PAD 7 ETH_RXD1 ETH_RXD1 / PC5 I Ethernet HCI MII Receive Data[1]
PAD 8 ETH_CRS_DV ETH_CRS_DV / PA7 I Ethernet HCI MII Receive Data Valid
PAD 9 ETH_TXD1 ETH_TXD1 / PB13 O Ethernet HCI MII Transmit Data[1]
PAD 10 ETH_TX_EN ETH_TX_EN / PB11 O Ethernet HCI MII Transmit Enable
PAD 11 ETH_TXD0 ETH_TXD0 / PB12 O Ethernet HCI MII Transmit Data[0]
PAD 12 GND - Ground connection
PAD 13 ETH_RSTN ETH_RSTN / PA6 I Ethernet Chip Reset (active Low)
PAD 14 HCI_GPIO_27 PA3 I/O HCI GPIO 27 controlled via API
PE7 pin of STM32F745
PAD 15 RESERVED PE7 I/O
Connect to GND if not used or reserved
PAD 16 HCI_GPIO_26 PB0 I/O HCI GPIO 26 controlled via API
PAD 17 HCI_GPIO_24 PB1 I/O HCI GPIO 24 controlled via API
PE8 pin of STM32F745
PAD 18 RESERVED PE8 I/O
Connect to GND if not used or reserved
PAD 19 HCI_GPIO_21 PE9 I/O HCI GPIO 21 controlled via API
PAD 20 HCI_GPIO_20 PE11 I/O HCI GPIO 20 controlled via API
PE13 pin of STM32F745
PAD 21 RESERVED PE13 I/O
Connect to GND if not used or reserved
PE12 pin of STM32F745
PAD 22 RESERVED PE12 I/O
Connect to GND if not used or reserved
PE10 pin of STM32F745
PAD 23 RESERVED PE10 I/O
Connect to GND if not used or reserved
PAD 24 SPI_CLK PD3 I SPI HCI Clock
PB10 pin of STM32F745
PAD 25 RESERVED PB10 I/O
Connect to GND if not used or reserved
PB8 pin of STM32F745
PAD 26 RESERVED PD8 I/O
Connect to GND if not used or reserved
PE15 pin of STM32F745
PAD 27 RESERVED PE15 I/O
Connect to GND if not used or reserved
PD9 pin of STM32F745
PAD 28 RESERVED PD9 I/O
Connect to GND if not used or reserved
PD10 pin of STM32F745
PAD 29 RESERVED PD10 I/O
Connect to GND if not used or reserved

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 TABLE 4-1 (CONTINUATION). WHITE-BEET-P MODULE PINOUT INFORMATION

Main
WHITE-BEET-PS
Pin WHITE-BEET-PO function Main function description
WHITE-BEET-PI
type
PD15 pin of STM32F745
PAD 30 RESERVED PD15 I/O
Connect to GND if not used or reserved
PAD 31 RESETN I Module Reset (active Low)
QCA7005 FW and PIB version selection
PAD 32 BS_1 I (“H” = v3.0, “L” = v1.1.0-02)
Has internal pull-down resistor 10k Ohm
PAD 33 +5V - 5V power supply
PAD 34 GND - Ground connection
PAD 35 SPI_MISO SPI2_MISO / PB14 O SPI HCI Master-Input/Slave-Output
PAD 36 SPI_MOSI SPI2_MOSI / PB15 I SPI HCI Master-Output/Slave-Input
PAD 37 SPI_RX_READY PD4 O SPI HCI Slave is ready
PAD 38 SPI_TX_PENDING PD11 O SPI HCI Slave transfer date is ready
PAD 39 GND - Ground connection
PAD 40 CAN_TX CAN1_TX / PD1 O CAN Transmit Data
PAD 41 CAN_RX CAN1_RX / PD0 I CAN Receive Data
CAN Normal/Silent mode selection
PAD 42 CAN_INH CAN1_INH / PC8 O
(“0” = Normal, “1” = Silent)
PC9 pin of STM32F745
PAD 43 RESERVED PC9 I/O
Connect to GND if not used or reserved
PC7 pin of STM32F745
PAD 44 RESERVED PC7 I/O
Connect to GND if not used or reserved
PAD 45 GND - Ground connection
PAD 46 USB_DN USB_DN / PA11 I/O USB Data Negative Signal
PAD 47 USB_DP USB_DP / PA12 I/O USB Data Positive Signal
PAD 48 GND - Ground connection
PA9 pin of STM32F745
PAD 49 RESERVED PA9 I/O
Connect to GND if not used or reserved
PA10 pin of STM32F745
PAD 50 RESERVED PA10 I/O
Connect to GND if not used or reserved
Boot memory selection (used for SW
PAD 51 BOOT I
development, please connect to GND
PAD 52 SWDIO I/O Serial Wire Debug Data
PAD 53 SWCLK I Serial Wire Debug Clock
PC12 pin of STM32F745
PAD 54 RESERVED PC12 I/O
Connect to GND if not used or reserved
PAD 55 PP_IN I Proximity Pilot
PAD 56 NC - No connection on the module
PAD 57 CP Control Pilot
PAD 58 CP Control Pilot
PAD 59 PE Protected Earth
PAD 60 PE Protected Earth

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 TABLE 4-1 (CONTINUATION). WHITE-BEET-P MODULE PINOUT INFORMATION

Main
WHITE-BEET-PS
Pin WHITE-BEET-PO function Main function description
WHITE-BEET-PI
type
PAD 61 NC - No connection on the module
PAD 62 NC - No connection on the module
PAD 63 NC - No connection on the module
PAD 64 NC - No connection on the module
PAD 65 NC - No connection on the module
PAD 66 NC - No connection on the module
PAD 67 NC - No connection on the module
PAD 68 NC - No connection on the module
PAD 69 NC - No connection on the module
PAD 70 NC - No connection on the module
PAD 71 NC - No connection on the module
PAD 72 I2C_SDA I2C1_SDA / PB7 I/O I2C Serial Data
PAD 73 HCI_GPIO_22 PD5 I/O HCI GPIO 22 controlled via API
PAD 74 HCI_GPIO_23 PD7 I/O HCI GPIO 23 controlled via API
PAD 75 UART_RX (debug) UART8_RX / PE0 I UART Receive Data
PAD 76 UART_TX (debug) UART8_TX / PE1 O UART Transmit Data
PAD 77 SPI_NSS SPI2_NSS / PB9 I SPI HCI Slave Select (active Low)
PAD 78 I2C_SCL I2C1_SCL / PB8 O I2C Clock
PAD 79 HCI_GPIO_25 PC13 I/O HCI GPIO 25 controlled via API
Reserved for further software features
PAD 80 RESERVED PC14 I/O
Connect to GND if not used or reserved
Reserved for further software features
PAD 81 RESERVED PC15 I/O
Connect to GND if not used or reserved
Reserved for further software features
PAD 82 AIN_0 PA5 I/O
Connect to GND if not used or reserved
Reserved for further software features
PAD 83 RESERVED PC3 I/O
Connect to GND if not used or reserved
HCI interface selection pin 1
PAD 84 IF_SELECT_1 PA4 I/O
should be always “0“
HCI interface selection pin 0
PAD 85 IF_SELECT_0 PC2 I/O
“0”=Ethernet, “1”=SPI
PAD 86 THERMAL PAD - Thermal pad, has to be connected to GND

NOTE: 1) Pins marked as RESERVED are STM32F745 GPIO reserved for future software features.
On WHITE-BEET-PS and WHITE-BEET-PI modules RESERVED should be connected to GND.
2) Pins with the same name (except RESERVED) have internal connection on the module.

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 IMAGE 4-1. MODULE PIN ASSIGNMENTS (BOTTOM VIEW)

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 5. Reference design schematics

Please follow design recommendations given in the WHITE-BEET reference design schematic and PLC
Design Guide documents in the PLC documentation area on https://downloads.codico.com/misc/plc

IMAGE 5-1. PLC DOCUMENTATION AREA LOGIN PAGE

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 6. Module marking information

Model: WHITE beet EI

MAC: C493000FEA47
SN: PWL6004172000001
Made in EU

Each module is marked with a label containing the following data:

1. Ordering code
2. QCA7005 MAC Address (contains no separator, OUI C49300)
3. Serial Number in a format PWL600VWWYYNNNNNN, where:
PWL600 - product code for WHITE beet
V - module configuration:
1 for WHITE-beet-H,
2 for WHITE-beet-EO,
3 for WHITE-beet-PO,
4 for WHITE-beet-EI,
5 for WHITE-beet-PI,
6 for WHITE-beet-ES,
7 for WHITE-beet-PS,
WWYY - data code as a calendar week of production followed by a year
NNNNNN - serial number in a production lot
4. QR-code containing MAC Address
5. Additionally each label contains 8Devices logo which also indicates pin 1 position

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 7. Mechanical characteristics

IMAGE 7-1. PIN DIMENSIONS (BOTTOM VIEW)

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 IMAGE 7-2. PCB FOOTRINT (TOP VIEW)

IMAGE 7-3. SOLDERING PASTE FOOTPRINT (TOP VIEW)

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 8. Reflow profile information

Reflow profile recommendation

Ramp up rate 3°C/second max

Maximum time maintained above 217°C 120 seconds
Peak temperature 250°C
Maximum time within 5°C of peak temperature 20 seconds
Ramp down rate 6°C/second max

Reflow profile

250

200
Temperature, °С

150

100

50

0
Time

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 9. Evaluation board

WB-CARRIER-BOARD is an evaluation and development board for WHITE-beet modules. It contains

WHITE-BEET module populated on the carrier board and protected with a plastic cover.
IMAGE 9-1. WB-CARRIER-BOARD (TOP VIEW)

16 15

14
2 6

7 17

3
13

4 8

5 9
10 12
11

TABLE 9-1. WB-CARRIER-BOARD MAIN SECTIONS

Item number Description

1 J15 Ethernet interface RJ45 connector
2 J11 USB-C connector for UART debugging console
3 J12 USB-C connector for +5V DC power supply and USB communication
4 J16 CAN interface connector
5 J5 Alternative +5V DC power supply connector
6 J10 4-pin UART debugging console header
7 SW1 Micro switch to select active QCA7005 firmware version
8 S1 RESET button and (S2) Boot button (required for software development)
9 J13 Jumper for +5V DC power supply source selection
10 J1 20-pin GPIOs header #2
11 J8 6-pin SPI interface header
12 J9 10-pin SWD interface header for programming and debugging
13 Control Pilot (CP) and Protected Earth (PE) connectors
14 Zero-cross input (ZC_L / ZC_N) connectors
15 J7 4-pin I2C interface header
16 J4 20-pin GPIOs header #1
17 Plastic cover for WHITE BEET module (placed for a safety reasons)

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 10. Packaging and ordering information

WHITE beet modules are packed into trays. Each tray fits 15 modules. Every 5 trays are vacuum sealed
and one standard packing box contains 375 modules.

TABLE 10-1. MODULE ORDERING OPTIONS

Part number Description

WHITE-BEET-ES
EVSE side e-mobility HW with transparent bridging / SLAC software
#292206
WHITE-BEET-EI EVSE side e-mobility HW with ISO 15118 / DIN 70121 / SAE J2847/2 software
#292207 stack (support of V2G, EMI, PnC, BPT)
WHITE-BEET-EO
EVSE side e-mobility without embedded software included, SDK open option
#292208
WHITE-BEET-PS
PEV side e-mobility HW with transparent bridging / SLAC software
#292210
WHITE-BEET-PI PEV side e-mobility HW with ISO 15118 / DIN 70121 / SAE J2847/2 software
#295426 stack (support of V2G, EMI, PnC, BPT)
WHITE-BEET-PO
PEV side e-mobility without embedded software included, SDK open option
#295427
WHITE-BEET-H
Home control / smart grid HW with transparent bridging software
#292209

More PEV / EVSE - configured eMobility related products can be found in CODICO Sample Shop:
https://www.codico.com/en/products/powerline-communication

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 11. Document revision history

Revision Revision Date Description

0.2 2020.06.01 Product brief (preliminary information)
0.9 2020.11.05 Draft pre-release
1.00 2020.11.27 Customer release
1.01 2020.12.04 Table 4-1 and Table 10-1 correction
Correction over all the chapters including block diagram and pin
1.02 2021.07.28
descriptions (Table 4-1).
1.02c 2022.06.30 Table 4-1, PAD32 correction

*** The confidential information is provided “as is”. The discloser makes no representations or warranties,
express or implied, with respect to the information, and disclaims all warranties including, without
limitation, the warranties of merchantability, and fitness for a particular purpose. ***

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