TC1413/TC1413N

3A High-Speed MOSFET Drivers

Features General Description
• Latch-Up Protected: Withstands 500 mA Reverse The TC1413/TC1413N are 3A CMOS buffers/drivers.
Current They do not latch up under any conditions within their
• Input Withstands Negative Inputs Up to 5V power and voltage ratings. They are not subject to
• Electrostatic Discharge (ESD) Protected: 2.0 kV damage when up to 5V of noise spiking of either
(HBM) and 400V (MM) polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
• High Peak Output Current: 3A
of either polarity being forced back into their output. All
• Wide Input Supply Voltage Operating Range: terminals are fully protected against electrostatic
- 4.5V to 16V discharge (ESD) up to 2.0 kV (HBM) and 400V (MM).
• High Capacitive Load Drive Capability: As MOSFET drivers, the TC1413/TC1413N can easily
- 1800 pF in 20 ns charge a 1800 pF gate capacitance in 20 ns with
• Short Delay Time: 35 ns typical matched rise and fall times. To ensure the MOSFET’s
• Matched Delay Times intended state will not be affected even by large
transients, low enough impedance in both the ‘On’ and
• Low Supply Current
‘Off’ states are provided. The leading and trailing edge
- With Logic ‘1’ Input: 500 µA propagation delay times are also matched to allow
- With Logic ‘0’ Input: 100 µA driving short-duration inputs with greater accuracy.
• Low Output Impedance: 2.7
Package Type
• Available in Space-Saving 8-pin MSOP Package
• Pinout - same as TC1410/TC1411/TC1412 8-Pin MSOP/PDIP/SOIC
VDD 1 8 VDD VDD 1 8 VDD
Applications IN 2 7 OUT IN 2 7 OUT
TC1413 TC1413N
• Switch Mode Power Supplies NC 3 6 OUT NC 3 6 OUT
• Line Drivers GND 4 5 GND GND 4 5 GND
• Pulse Transformer Drive
• Relay Driver 2 6,7 2 6,7

Inverting Non-Inverting
NC = No Internal Connection

Note: For proper operation, duplicate pins

must be connected together.

 2001-2015 Microchip Technology Inc. DS20001392E-page 1

TC1413/TC1413N
Functional Block Diagram

VDD
TC1413
Inverting
Outputs

300 mV

Output

Non-Inverting
Input Outputs
TC1413N
Effective 4.7V
Input C = 10 pF

GND

DS20001392E-page 2  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
1.0 ELECTRICAL † Notice: Stresses above those listed under "Absolute
Maximum Ratings" may cause permanent damage to
CHARACTERISTICS the device. These are stress ratings only and functional
operation of the device at these or any other conditions
Absolute Maximum Ratings† above those indicated in the operation sections of the
Supply Voltage ..................................................... +20V specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
affect device reliability.
Power Dissipation (TA  70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range.............. -65°C to +150°C
Maximum Junction Temperature ...................... +150ºC

DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, TA = +25°C, with 4.5V  VDD  16V.
Parameters Sym. Min. Typ. Max. Units Conditions
Input
Logic ‘1’, High Input Voltage VIH 2.0 — — V
Logic ‘0’, Low Input Voltage VIL — — 0.8 V
Input Current IIN -1.0 — 1.0 µA 0V  VIN  VDD, TA = +25°C
-10 — 10 -40°C  TA  +85°C
Output
High Output Voltage VOH VDD – 0.025 — — V DC Test
Low Output Voltage VOL — — 0.025 V DC Test
Output Resistance RO — 2.7 4.0  VDD = 16V, IO = 10 mA,
TA = +25°C
— 3.3 5.0 0°C  TA  +70°C
— 3.3 5.0 -40°C  TA  +85°C
Peak Output Current IPK — 3.0 — A VDD = 16V
Latch-Up Protection IREV — 0.5 — A Duty cycle  2%, t  300 µs,
Withstand Reverse Current VDD = 16V
Switching Time (Note 1)
Rise Time tR — 20 28 ns TA = +25°C
— 22 33 0°C  TA  +70°C
— 24 33 -40°C  TA  +85°C, Figure 4-1
Fall Time tF — 20 28 ns TA = +25°C
— 22 33 0°C  TA  +70°C
— 24 33 -40°C  TA  +85°C, Figure 4-1
Delay Time tD1 — 35 45 ns TA = +25°C,
— 40 50 0°C  TA  +70°C
— 40 50 -40°C  TA  +85°C, Figure 4-1
Delay Time tD2 — 35 45 ns TA = +25°C
— 40 50 0°C  TA  +70°C
— 40 50 -40°C  TA  +85°C, Figure 4-1
Power Supply
Power Supply Current IS — 0.5 1.0 mA VIN = 3V, VDD = 16V
— 0.1 0.15 VIN = 0V
Note 1: Switching times ensured by design.

 2001-2015 Microchip Technology Inc. DS20001392E-page 3

TC1413/TC1413N
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range (C) TA 0 — +70 ºC
Specified Temperature Range (E) TA -40 — +85 ºC
Maximum Junction Temperature TJ — — +150 ºC
Storage Temperature Range TA -65 — +150 ºC
Package Thermal Resistances
Thermal Resistance, 8L-MSOP JA — 211 — ºC/W
Thermal Resistance, 8L-PDIP JA — 89.3 — ºC/W
Thermal Resistance, 8L-SOIC JA — 149.5 — ºC/W

DS20001392E-page 4  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V.

500 500
TA = +25°C VSUPPLY = 16V
VIN = 3V
400 400
VIN = 3V
ISUPPLY (µA)

ISUPPLY (µA)
300 300

200 200

100 100 VIN = 0V

VIN = 0V

0 0
4 6 8 10 12 14 16 -40 -20 0 20 40 60 80
VDD (V) TEMPERATURE (°C)

FIGURE 2-1: Quiescent Supply Current FIGURE 2-4: Quiescent Supply Current
vs. Supply Voltage. vs. Temperature.

1.6 1.6
TA = +25°C VSUPPLY = 16V

1.5 1.5
VIH VIH
VTHRESHOLD (V)
VTHRESHOLD (V)

1.4 1.4

1.3 1.3

1.2 VIL 1.2 VIL

1.1
1.1
4 6 8 10 12 14 16 -40 -20 0 20 40 60 80
VDD (V) TEMPERATURE (°C)

FIGURE 2-2: Input Threshold vs. Supply FIGURE 2-5: Input Threshold vs.
Voltage. Temperature.

9 9

8 8

7 7
TA = +85°C TA = +85°C
RDS-ON (Ohms)

RDS-ON (Ohms)

6 6

5 TA = +25°C 5
TA = +25°C
4 4

3 3
TA = -40°C
2 2
TA = -40°C
1 1
4 6 8 10 12 14 16 4 6 8 10 12 14 16
VDD (V) VDD (V)

FIGURE 2-3: High State Output FIGURE 2-6: Low State Output
Resistance vs. Supply Voltage. Resistance vs. Supply Voltage.

 2001-2015 Microchip Technology Inc. DS20001392E-page 5

TC1413/TC1413N
Note: Unless otherwise indicated, over operating temperature range with 4.5V  VDD  16V.

70 70
CLOAD = 1800 pF CLOAD = 1800 pF

60 60

50 50
tRISE (nsec)

tFALL (nsec)
TA = +85°C
40 40 TA = +85°C

TA = +25°C TA = +25°C
30 30

20 20
TA = -40°C TA = -40°C
10 10
4 6 8 10 12 14 16 4 6 8 10 12 14 16
VDD (V) VDD (V)

FIGURE 2-7: Rise Time vs. Supply FIGURE 2-10: Fall Time vs. Supply
Voltage. Voltage.

110 100
CLOAD = 1800 pF CLOAD = 1800 pF
100 90
90 80
80 TA = +85°C
70 TA = +85°C
tD1 (nsec)

70 tD2 (nsec)
60
60 TA = +25°C TA = +25°C
50
50
40
40
TA = -40°C 30 TA = -40°C
30

20 20
4 6 8 10 12 14 16 4 6 8 10 12 14 16
VDD (V) VDD (V)

FIGURE 2-8: Propagation Delay vs. FIGURE 2-11: Propagation Delay vs.
Supply Voltage. Supply Voltage.

40 35
TA = +25°C TA = +25°C
tRISE
VDD = 16V 34 VDD = 16V tD2
Propagation Delays (nsec)

30 tFALL
33
tRISE, tFALL (nsec)

tD1
32
20
31

30
10
29

0 28
0 1000 2000 3000 4000 5000 0 1000 2000 3000 4000 5000
CLOAD (pF) CLOAD (pF)

FIGURE 2-9: Rise and Fall Times vs. FIGURE 2-12: Propagation Delays vs.
Capacitive Load. Capacitive Load.

DS20001392E-page 6  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
.

TABLE 3-1: PIN FUNCTION TABLE

Pin TC1413 TC1413N
Description
No. MSOP, PDIP, SOIC MSOP, PDIP, SOIC
1 VDD VDD Supply input, 4.5V to 16V
2 IN IN Control input
3 NC NC No connection
4 GND GND Ground
5 GND GND Ground
6 OUT OUT CMOS push-pull output, common to pin 7
7 OUT OUT CMOS push-pull output, common to pin 6
8 VDD VDD Supply input, 4.5V to 16V

3.1 Supply Input (VDD) 3.3 CMOS Push-Pull Output

The VDD input is the bias supply for the MOSFET driver
(OUT, OUT)
and is rated for 4.5V to 16V with respect to the ground The MOSFET driver output is a low-impedance, CMOS
pin. The VDD input should be bypassed to ground with push-pull style output, capable of driving a capacitive
a local ceramic capacitor. The value of the capacitor is load with 3A peak currents.
chosen based on the capacitive load that is being
driven. A value of 1.0 µF is suggested. 3.4 Ground (GND)
3.2 Control Input (IN) The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
The MOSFET driver input is a high-impedance, capacitor. The ground pins should be tied into a ground
TTL/CMOS-compatible input. The input has 300 mV of plane or have very short traces to the bias supply
hysteresis between the high and low thresholds which source return.
prevents output glitching even when the rise and fall
time of the input signal is very slow. 3.5 No Connect (NC)
No internal connection.

 2001-2015 Microchip Technology Inc. DS20001392E-page 7

TC1413/TC1413N
4.0 APPLICATION INFORMATION

+5V
90%

Input
VDD = 16V
10%
0V
tD1 tD2
tF tR
1.0 µF 0.1 µF VDD
90% 90%
1, 8
Output
2 6, 7 10% 10%
Input Output 0V
CL = 1800 pF
Inverting Driver
TC1413 TC1413
TC1413N
+5V
90%
Input

4, 5 10%
0V
Input: 100 kHz, VDD 90%
square wave, tD1 90% tD2
tRISE = tFALL  10 ns Output tR tF

0V 10% 10%

Non-Inverting Driver
TC1413N

FIGURE 4-1: Switching Time Test Circuit.

DS20001392E-page 8  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
5.0 PACKAGING INFORMATION

5.1 Package Marking Information

8-Lead PDIP (300 mil) Example

XXXXXXXX TC1413
XXXXXNNN e3 256
CPA^^
1318
YYWW

OR

TC1413
CPA256
1318

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 RoHS Compliant JEDEC® designator for Matte Tin (Sn)
* This package is RoHS Compliant. The RoHS Compliant JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over
to the next line, thus limiting the number of available characters for customer-specific
information.

 2001-2015 Microchip Technology Inc. DS20001392E-page 9

TC1413/TC1413N

8-Lead SOIC (3.90 mm) Example

TC1413C
e3 1318
OA^^
256
NNN

OR

TC1413
COA1318
256

8-Lead MSOP (3x3 mm) Example

1413E
318256

DS20001392E-page 10  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N

/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@

1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

D A
N B

E1

NOTE 1
1 2
TOP VIEW

C A A2

3/$1(
L c
A1

e eB
8X b1
8X b
.010 C

SIDE VIEW END VIEW

Microchip Technology Drawing No. C04-018D Sheet 1 of 2

 2001-2015 Microchip Technology Inc. DS20001392E-page 11

TC1413/TC1413N

/HDG3ODVWLF'XDO,Q/LQH3$PLO%RG\>3',3@

1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

ALTERNATE LEAD DESIGN

(VENDOR DEPENDENT)

DATUM A DATUM A

b b
e e
2 2

e e

Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e .100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015 - -
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c .008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b .014 .018 .022
Overall Row Spacing § eB - - .430
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-018D Sheet 2 of 2

DS20001392E-page 12  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2001-2015 Microchip Technology Inc. DS20001392E-page 13

TC1413/TC1413N

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20001392E-page 14  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N


 


 !"#$%&
' 
!
"# $% &"'""
($)

%
*++&&&!

!+$

 2001-2015 Microchip Technology Inc. DS20001392E-page 15

TC1413/TC1413N

8$
1RWH For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20001392E-page 16  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N

UA
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

 2001-2015 Microchip Technology Inc. DS20001392E-page 17

TC1413/TC1413N

8-Lead Plastic Micro Small Outline Package (UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS20001392E-page 18  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
APPENDIX A: REVISION HISTORY

Revision E (February 2015)

The following is the list of modifications:
• Updated the values for electrostatic discharge in
the Features and General Description columns.
• Updated the Pin Description table in Section 3.0,
Pin Descriptions.
• Updated package marking information and draw-
ings in Section 5.0, Packaging Information.
• Minor grammatical and spelling corrections.

Revision D (December 2012)

• Added a note to each package outline drawing.

Revision C (March 2003)

• Undocumented changes.

Revision B (May 2001)

• Undocumented changes.

Revision A (March 2001)

• Original Release of this Document.

 2001-2015 Microchip Technology Inc. DS20001392E-page 19

TC1413/TC1413N
NOTES:

DS20001392E-page 20  2001-2015 Microchip Technology Inc.

 TC1413/TC1413N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX Examples:

a) TC1413COA: 3A Single MOSFET
Device Temperature Package
driver, SOIC package,
Range
0°C to +70°C.
b) TC1413CPA: 3A Single MOSFET
Device: TC1413: 3A Single MOSFET Driver, Inverting driver, PDIP package,
TC1413N: 3A Single MOSFET Driver, Non-Inverting 0°C to +70°C.
c) TC1413EUA713:Tape and Reel, 3A
Temperature Range: C = 0°C to +70°C Single MOSFET driver,
E = -40°C to +85°C MSOP package,
-40°C to +85°C.
Package: OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
a) TC1413NCPA: 3A Single MOSFET
UA = Plastic Micro Small Outline (MSOP), 8-lead * driver, PDIP package,
UA713 = Plastic Micro Small Outline (MSOP), 8-lead * 0°C to +70°C.
(Tape and Reel) b) TC1413NEPA: 3A Single MOSFET
PA = Plastic DIP (300 mil Body), 8-lead
driver, PDIP package,
* MSOP package is only available in E-Temp. -40°C to +85°C.
c) TC1413NEUA: 3A Single MOSFET
driver, MSOP package,
-40°C to +85°C.

 2001-2015 Microchip Technology Inc. DS20001392E-page 21

TC1413/TC1413N
NOTES:

DS20001392E-page 22  2001-2015 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
ensure that your application meets with your specifications.
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
MICROCHIP MAKES NO REPRESENTATIONS OR
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
SST, SST Logo, SuperFlash and UNI/O are registered
IMPLIED, WRITTEN OR ORAL, STATUTORY OR trademarks of Microchip Technology Incorporated in the
OTHERWISE, RELATED TO THE INFORMATION, U.S.A. and other countries.
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR The Embedded Control Solutions Company and mTouch are
FITNESS FOR PURPOSE. Microchip disclaims all liability registered trademarks of Microchip Technology Incorporated
arising from this information and its use. Use of Microchip in the U.S.A.
devices in life support and/or safety applications is entirely at Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
the buyer’s risk, and the buyer agrees to defend, indemnify and CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
hold harmless Microchip from any and all damages, claims, Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
suits, or expenses resulting from such use. No licenses are KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
conveyed, implicitly or otherwise, under any Microchip MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
intellectual property rights. Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-094-3

QUALITY MANAGEMENT SYSTEM Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
CERTIFIED BY DNV Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
== ISO/TS 16949 == devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

 2001-2015 Microchip Technology Inc. DS20001392E-page 23

 Worldwide Sales and Service
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Tel: 630-285-0071 China - Hangzhou Tel: 82-53-744-4301 Netherlands - Drunen
Fax: 630-285-0075 Tel: 86-571-8792-8115 Fax: 82-53-744-4302 Tel: 31-416-690399
Fax: 86-571-8792-8116 Korea - Seoul Fax: 31-416-690340
Cleveland
China - Hong Kong SAR Tel: 82-2-554-7200 Poland - Warsaw
Independence, OH
Tel: 216-447-0464 Tel: 852-2943-5100 Fax: 82-2-558-5932 or Tel: 48-22-3325737
Fax: 216-447-0643 Fax: 852-2401-3431 82-2-558-5934
Spain - Madrid
China - Nanjing Malaysia - Kuala Lumpur Tel: 34-91-708-08-90
Dallas
Tel: 86-25-8473-2460 Tel: 60-3-6201-9857 Fax: 34-91-708-08-91
Addison, TX
Tel: 972-818-7423 Fax: 86-25-8473-2470 Fax: 60-3-6201-9859
Sweden - Stockholm
Fax: 972-818-2924 China - Qingdao Malaysia - Penang Tel: 46-8-5090-4654
Tel: 86-532-8502-7355 Tel: 60-4-227-8870
Detroit UK - Wokingham
Fax: 86-532-8502-7205 Fax: 60-4-227-4068
Novi, MI Tel: 44-118-921-5800
Tel: 248-848-4000 China - Shanghai Philippines - Manila Fax: 44-118-921-5820
Tel: 86-21-5407-5533 Tel: 63-2-634-9065
Houston, TX
Tel: 281-894-5983 Fax: 86-21-5407-5066 Fax: 63-2-634-9069
Indianapolis China - Shenyang Singapore
Tel: 86-24-2334-2829 Tel: 65-6334-8870
Noblesville, IN
Tel: 317-773-8323 Fax: 86-24-2334-2393 Fax: 65-6334-8850
Fax: 317-773-5453 China - Shenzhen Taiwan - Hsin Chu
Tel: 86-755-8864-2200 Tel: 886-3-5778-366
Los Angeles
Fax: 86-755-8203-1760 Fax: 886-3-5770-955
Mission Viejo, CA
Tel: 949-462-9523 China - Wuhan Taiwan - Kaohsiung
Fax: 949-462-9608 Tel: 86-27-5980-5300 Tel: 886-7-213-7828
Fax: 86-27-5980-5118 Taiwan - Taipei
New York, NY
Tel: 631-435-6000 China - Xian Tel: 886-2-2508-8600
Tel: 86-29-8833-7252 Fax: 886-2-2508-0102
San Jose, CA
Tel: 408-735-9110 Fax: 86-29-8833-7256 Thailand - Bangkok
Tel: 66-2-694-1351
Canada - Toronto
Tel: 905-673-0699 Fax: 66-2-694-1350
Fax: 905-673-6509
01/27/15

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