Sel Prod

No-nonsense tools for the busy EE
SEPTEMBER 2013
electronicproducts.com A Hearst Business Publication
IN THIS ISSUE:
Industry Exclusive: FIRST member creates low-cost prosthetic leg
Working with Microsofts Windows

Embedded Compact RTOS
Precision-circuit semiconductors drive gains in energy harvesting

Hearst Business Media
P.O.Box 3012
Northbrook, IL 60065-3012
In what format would you like to continue to receive
your FREE Electronic Products Subscription?
Print or Digital
Signature________________________________ Date_________
Tel.: (_________) ______________________________________
Email Address: _________________________________________
Check here if current mailing address has changed and indicate
changes on the mailing label on the reverse.
Number of employees at this address:
(01) Under 25 (02) 25 - 99
(03) 100 - 499 (04) 500 - 999
(05) 1,000 - 1,999 (06) Over 2,000
Which of the following products, if any, do you
authorize, recommend or specify in your job?
(Check all that apply)
1.
2.
What is the PRIMARY End Product (or Service
performed) at this location? (Please check ONLY ONE.)
3.
4.
5.
6.
AFFIX
1st CLASS
POSTAGE
Elect ronic
PRODUCTS
Yes, I want to renew my FREE subscription to
Electronic Products Magazine.
No, thank you.
Please print clearly.

(01) Computers, Servers, Peripherals
(03) CAE/CAD/CAM Systems
(04) Software Manufacturer/Developer
(05) Computer Systems Integrator
(06) Ofce & Business Machines
(07) Communications Systems &
Equipment - Wired & Wireless
(08) Industrial Controls, Systems,
Equipment & Robotics
(09) Electronic Instrumentation, ATE
Equipment, Test & Measurement
(10) Medical Electronic Equipment
(11) Avionics, Marine, Space & Military
Electronics, Government
(13) Automotive and Transportation
(14) Consumer Electronics &
Appliances, Security/Surveillance
(31) Energy Generation/Conversion,
Storage & Distribution
(17) Electronic Sub-Assemblies (boards,
modules, hybrids, power supplies)
(15) ICs and Semiconductors
(16) Other Components, Materials,
Hardware, and Supplies
(19) Independent/Academic Research &
Development Laboratory
(20) Technical/Engineering Consulting
Firms
(99) Others Allied to the Field
(please specify):
_______________________________
ICs & SEMICONDUCTORS
(01) Microprocessors, Microcontrollers,
Digital Signal Processors
(02) SoCs, ASICs, Programmable Logic
(incl. FPGAs)
(04) Logic & Interface ICs
(05) Memory ICs
(06) Communications ICs
(07) Analog/Mixed-Signal ICs
(09) Discrete Semiconductors
(35) Power Management ICs
(36) Wireless & RF/Microwave
(43) Multimedia (Audio, Video, Graphics)
COMPONENTS
(10) Resistors, Capacitors and
Potentiometers
(11) Inductors & Transformers
(12) Switches & Relays
(13) Sensors & Transducers
(14) Display Devices & Indicators
(15) Optoelectronic Devices
(16) Circuit Protection Devices
(17) RF/Microwave Devices
PACKAGING & INTERCONNECTIONS
(18) Interconnection Devices
(20) Cabinets & Enclosures
(21) Cooling Products (Fans, Heat
Sinks, etc.)
(22) Wire & Cable
INSTRUMENTATION &
POWER SOURCES
(23) Test & Measurement
Equipment
(25) Data Acquisition Hardware/
Software
(37) Oscilloscopes
(38) Logic/Waveform Analyzers
(26) Power Supplies
(27) Batteries

COMPUTER &
COMPUTER PERIPHERALS
(29) Computer Peripherals
(32) Displays, Devices &
Subassemblies
(33) Computer Boards
SERVICE & TOOLS
(39) EDA, CAD, CAE Tools &
Software
(40) Embedded Development
Tools & Software
(41) Design Services
(34) None of the Above
PLEASE complete the form above and mail, or renew online at www.electronicproducts.com/ep/RENEW
Please Fold & Tape DO NOT STAPLE
What is your Principal Job Function?

(Please check ONLY ONE.)

Design and Development Engineering
(91) Management/Executive (99) Other Staff (Specify)
(92) Engineering _________________________
RENCVRSEP13
electronicproducts.com
A Hearst Business Publication
SEPTEMBER 2013
Also In This ISSUE:
Industry Exclusive: FIRST member
creates low-cost prosthetic leg
Working with Microsofts Windows
Precision-circuit semiconductors
drive gains in energy harvesting
p.34
Best performance in a leading role.
Histogram for a statistical view Trend chart to see trends over time
Introducing the much-anticipated Agilent Digital Multimeters with Truevolt technology.
All have a large display and revolutionary interface. And only Agilent Truevolt DMMs let
you measure with unquestioned Truevolt condence and display results as youve never
seen before. Plus you can advance to the next level 34401A DMM with 100% assurance.
For metrology-level performance and unequaled measurement integrity, its easy to see
why these DMMs are winning fans everywhere.
Agilent and our
Distributor Network
Right Instrument.
Right Expertise.
Delivered Right Now.
Free DMM software to capture and
view data anywhere with a single click
www.metrictest.com/agilent/dmm.jsp
866-436-0887
www.metrictest.com/agilent
Agilent 34461A 6 digit Truevolt DMM
Agilent Technologies, Inc. 2013
CoilcraftMLSFinalAd.indd 1 4/26/10 7:50:01 AM
Accelerating Your Success!
1 800 332 8638 | www.avnetexpress.com | @avnetdesignwire

CONNECTED.
E-COMMERCE SOLUTIONS FROM AVNET
Biggest inventory, best prices, proven design services online.
AvnetExpress.com provides the largest catalog of components from leading manufacturers
to meet all of your design, prototyping, and production needs; one right after the other.
With Avnet Express, 5 million parts and unlimited technical design resources are a mere
click away. Same-day shipping ensures you get the products you need faster than a
speeding bullet. All aboard for your trip to design success.
What can we do for you? www.avnetexpress.com
Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100,
Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing offices. Electronic Products is distributed at no charge to qualified persons actively engaged in
the authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any sub-
scription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue,
$6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.
Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-7317
2013 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVED
Publications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5
4 Contents
SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS
Features
20
Wire & Cable:
40 Gbits/s over twisted-pair copper cable is on the way
24
Real-Time Software Design:
Working with Windows Embedded Compact RTOS
28
Portable Test Support:
Working on remote RF remotely
30
Energy-Saving Initiative:
Precision-circuit semiconductors drive gains in energy harvesting
Vol. 56, No.4 September 2013
Cover Story
34
Getting started with ARM embedded MCU design
Analog & Digital ICs
38
Myths about endpoint security for embedded devices
42
Tripling the power of PoE
Touch Points
6
Viewpoint: Its a brave new world for next-generation
processors
8
The Story Behind the Story: NIs PXIe-5644R RF vector
signal transceiver
11
Outlook (Technology News):
Device can detect disease in just one drop of blood
Autotestcon looks to innovate in tight budgets

14
Industry Exclusive: FIRST member creates low-cost
prosthetic leg
48
Product Trends: Medical electronicsSensor fusion and
potential healthcare benefits
50
Product Roundup: LEDs: Technology gains, price
reductions
52
Industry Innovators: Bruno Maisonnier, founder and CEO
of Aldebaran Robotics
New Products
55 Power Sources 62 Test & Measurement
58 Components & Subassemblies 63 Optoelectronics
59 Packaging & Interconnections
38
11
50
Only Online
Electronicproducts.com
Education Center:
Boost and monitor brain fitness or control
things wirelessly with your mind
Water-based gels used to create bend-
able, soft robots
The pros and cons of retrofit LED bulbs
Handheld point-and-shoot 3D scanner
creates a model out of anything
C
o
v
e
r

I
m
a
g
e
s

c
o
u
r
t
e
s
y

o
f

A
R
M

(
w
w
w
.
a
r
m
.
c
o
m
)

a
n
d

T
e
x
a
s

I
n
s
t
r
u
m
e
n
t
s

(
w
w
w
.
t
i
.
c
o
m
)
.

D
i
g
i
t
a
l

i
m
a
g
e
r
y

b
y

D
o
n

W
i
l
b
e
r
.
6 Viewpoint
Its a brave new world for
next-generation processors
I
'm going to make a wild prediction. Soon, Intel will bring
out a new processor that is NOT 50% faster and 50% lower
power than the last one. Yes, it's true. Unbelievable as it
may seem, that's my prediction. I predict that the next Core
processor will ONLY be 25% faster and 25% lower power. This
will, of course, set off near panic in what's left the PC process-
ing world. The end is near for Mr. Moore's law.
I'm so used to Intel upping the stakes with every new Core
CPU release. I just expect it. So, of course I was
shocked. Intel's recently announced Has-
well Core processor, which is
at 22 nm and uses Tri-gate 3-D
transistors, actually didn't really
provide much of a performance
boost at all. Just somewhere
around 10% at most. It had to
happen someday.
Te way Intel put this was in-
teresting. "Te 4th generation Intel
Core vPro processors are up to 2x
faster for business productivity ap-
plications over 4-year-old systems."
Tat's one way to look at it I guess.
Te really interesting thing is that nobody cares. You see, PCs
have gotten fast enough. Everyone is totally happy with their
machines (except the gamers, of course). We don't need any
more speed. Lower power, yes, always, but not higher speed.
It's a brave new world.
Intel has addressed a lot of other stuf with this 4th-gen-
eration Core family, including graphics performance (yes,
another big step up for integrated graphics) and security.
And, the lower power chips means ultrabook laptops can be
fanless by running at a scenario design point (SDP) of 4.5 W.
Te new 1.4-GHz Core i5-4200Y version has a max thermal
design power (TDP) of 11.5 W and SDP of 6 W with 4.5-W
versions coming soon. Other versions of Haswell go as high as
84-W TDP.
SDP is said to be an operational profle representative of
a tablet computer. MacBook Air laptops with Haswell are
expected in September with the slim 13-in. display model
boasting of an incredible 12-hour battery life.
Meanwhile, the semiconductor in-
dustry overall is going along nicely.
International Data Corp. raised its
worldwide semiconductor revenue
forecast for the year and projected
further growth for 2014, as demand
for smartphones and tablets remain
strong. IDC expects worldwide
semiconductor revenue to improve
6.9% to $320 billion this year. Te
company raised that from a pre-
diction of 3.5% in May. Te market
researcher also forecast semiconduc-
tor revenues to be up another 2.9% in 2014.
Intel chips are in a lot of embedded apps, of
course. But, over in the other corner, it seems as though
ARM CPU cores are taking over embedded processing.
Every MCU maker has 'em. Oh no! I was just imagining
that ARM had placed a disable command in every processor
it's ever produced (let's start a rumor). And, they have a
switch in Cambridge that they can throw any time they like
and shut 'em all down. The European Union better not try
pushing ARM around like they do Google and Microsoft.
No sir. Do it and they'll throw the switch.
Jim Harrison
Advanced semiconductor solutions to fuel your creativity.
Come to Mouser rst for whats next from these industry leaders.
Its
to be
square.
Authorized distributor of semiconductors
and electronic components for design engineers.
Mouser and Mouser Electronics are registered trademarks of Mouser Electronics, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
The Newest Products for Your Newest Designs
mouser.com
8 Story Behind the Story
A look at the making of POY award winners
Electronic
PRODUCTS
EDITORIAL STAFF
516-227-1300 FAX: 516-227-1901
Content Operations Director Bryan DeLuca
516-227-1379 [email protected]
Managing Editor John Filippelli
Senior Editor Paul OShea
Technical Editor Jim Harrison
Editor Richard Comerford
Editor Lauren Leetun
Contributing Editors Michael Kawa
Steve Evanczuk
Chief Copy Editor Leonard Schiefer
Data Analyst and Writer Jeffrey Bausch
Associate Editor Nicolette Emmino
Editorial Assistants/Interns Nicole DiGiose
Max Teodorescu
Yolanda Sutherland
Daniella Garrisi
Art Director Don Wilber
Artist Estelle Zagaria
Group Production Manager Thomas Young
Client Services Account Managers Amy Fischeri
Marisa Giordano
Client Services Assistant Account Manager
KellyAnne Zarcone
Audience Development Director Carolyn Giroux
Subscriber Service 1-866-813-3752
Group Publisher Steve Cholas
Electronics Group
Director of Online Sales Robert McIntosh
and Operations
Published by
Hearst Business Communications, Inc.
UTP Division
A Unit of The Hearst Corporation
50 Charles Lindbergh Blvd.,
Suite 100 Uniondale, NY 11553
TEL: (516) 227-1300 FAX: (516) 227-1901
Robert D. Wilbanks
Treasurer
Catherine Bostron
Secretary
William Barron
Vice President, Publishing Director,
Electronics Group
Adriana Marzovilla
Business Manager
THE HEARST CORPORATION
Steven R. Swartz
President & Chief Executive Officer
William R. Hearst, III
Chairman
Frank A. Bennack, Jr.
Executive Vice Chairman
HEARST BUSINESS MEDIA
Richard P. Malloch
President & Group Head
Robert D. Wilbanks
Group Controller
F
or years, RF instruments have used FPGAs to
implement the instruments capabilities and con-
trols their so-called firmware personalities
but the development of these personalities had been
done by specialized HDL engineers and presented to the
user in locked-up form. On the other hand, National In-
struments was providing programmable FPGAs in data
acquisition and control products such as the R Series and CompactRIO. Using LabVIEW
to program the FPGAs, users could define an instruments functionality, making the devel-
opment of these complex applications accessible to the novice. With the PXIe-5644R RF
vector signal transceiver (VST), NI decided to take the next step in instrument evolution.
Te core development of the VST was a joint efort between R&D, manufacturing,
product marketing, and sales. Together, the departments jointly defned and evolved the
product from concept to release. Each of these groups needed to be involved in the concept
and development to ensure that the product was comprehensive in its ability to meet the
needs of a broad range of applications in the RF industry.
Ten years ago, on the RF instrumentation front, NI brought high-performance vector
signal analysis to PXI, thereby enabling a fast, modular approach to RF test applications. As
the test challenges evolved at an increasing pace, NI saw an opportunity to integrate these
separately successful technologies to produce a fast, fexible, extensible instrument that
boasts performance among the best in the industry. Te design cycle for the VST was con-
sistent with NIs historical trend of 1 to 3 years. Very early in the development of the VST,
NI felt it had an excellent product coming together, and work done with lead users indicat-
ed that it would be successful. For example, Qualcomm Atheros improvedits WLAN test
speed 200x, which gaveQualcomm better insight intoits device under test using the VST.
Te VST is designed around a high-performance FPGA that defnes the core function-
ality of the instrument, and evolution of FPGA technology has provided increasing power.
Not only did NI take advantage of the latest FPGA technologies, but the company also
had to design a uniquely architected programming API, the Instrument Design Libraries,
to expose the VSTs sofware-designed functionality to the user. (For whitepapers on the
hardware and sofware architectures, visit ni.com/vst.) Another key to opening the instru-
ments power to customers in an easy-to-use way was heavy reliance on LabVIEW FPGA.
Without it, it would be almost impossible for customers to modify the VSTs frmware
the main thing NI expected users to do without extensive help from NI.
For the VST, the manufacturing team developed unique manufacturing processes to
handle the complex manufacturing and testing requirements demanded by the VST. For
example, the manufacturing team created a new production cell that uses NI instrumen-
tation almost exclusively, reducing capital costs and manufacturing overhead. Tis added
enormous value to the production process and removed the need for costly traditional box
instruments.
So far, the VST has won seven global industry awards and has been extremely success-
ful in applications from production test to research. Customers are also using the VST for
applications NI had never dreamt of and, in terms of revenue, afer the frst nine months
it is the most successful new hardware product in NIs history. NI says that, when you set
about to something as bold as giving customers the ability to rewrite the frmware of an RF
instrument, you have to have a little doubt that its possible and ef cient. VST taught the
company that it was not only possible but, when done correctly, extremely empowering for
users. And instead of increasing NIs support burden for simple frmware modifcations,
the VST actually reduced it; customers can now do the modifcations themselves (success-
fully) without asking NI, freeing the company to deliver new innovations. .
Richard Comerford
NIs PXIe-5644R RF vector
signal transceiver
Well-connected.
Newark element14 makes it easy to nd all your electronics products and solutions fast. newark.com
WWW.COILCRAFT.COM
US MAGAZINES
1 EDN 7.75 x 10.5
EE Times 7.75 x 10.5
2 Electronic Design 7.75 x 10.625
3 Microwaves & RF 7.75 x 10.75
RF Technology 7.75 x 10.75
Power Electronics Technology 7.75 x 10.75
RFTI 7.75 x 10.75
4 Microwave Journal 7.8125 x 10.75
5 Electronic Products 7.875 x 10.5
6 Power Systems Design Nor Am 8 x 10.75
High Frequency Electronics 8 x 10.75
7 Wireless Design & Development 9 x 10.875
ECN 9 x 10.875
8 Electronic Design Square 10.5 x 10.5
9 Letter size 8.5 x 11
EUROPE MAGAZINES
10 Power Systems Design Europe 7.99 x 10.75 203 x 273
11 EDN Europe 8.11 x 10.75 206 x 273
12 Power Electronics Europe 8.27 x 11.69 210 x 297
EE Times Europe 210 x 297
Elektronik 210 x 297
13 Markt & Technik 9.06 x 11.69 230 x 297
14 Electronic Product News 10.32 x 10.55 262 x 268
11/2/2012
Our web tools help you quickly pick the perfect inductor.
Then get free samples overnight!
We make picking inductors
fast, easy, and almost fun!
Start with a quick para-
metric search for parts that
meet your specs. (We even
show you volume pricing.)
Click to instantly compare
core and winding losses for
multiple inductors.
Want to see actual L and I
curves at a specic tempera-
ture? Theres a tool for that!
When youve picked your
inductors, just click to get
free samples. Do it by 5:00
p.m. CST and theyll ship to
you the same day!
See how fast you can go
from search to samples. Visit
coilcraft.com/tools
From Search to Samples
in Seconds
Outlook 11
Innovations impacting product, technology and applications
ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013
Device can detect
disease in just one
drop of blood
Carbon nanotube creates prototype lab-on-a-chip
for physicians
A New Jersey Institute of Technology professor known for his cutting-edge work
with carbon nanotubes is overseeing the making of a prototype lab-on-a-chip that
may someday enable a physician to detect disease or virus from just one drop of
liquid, including blood. Professors ReginaldFarrow and Alokik Kanwal, his former
postdoctoral fellow, have created a carbon nanotube-based device to noninvasively
and quickly detect mobile single cells with the potential to maintain a high degree of
spatial resolution.
NJIT researchers
evaluated three diferent
types of cells using three
diferent electrical probes.
"It was an exploratory
study and we don't want
to say that we have a
signature," Farrow said.
"What we do say here
is that these cells difer
based on electrical prop-
erties. Establishing a sig-
nature, however, will take
time. We do know that
the distribution of elec-
trical charges in a healthy
cell changes markedly
when it becomes sick."
Te device uses
standard CMOS technologies for fabrication, allowing it to be easily scalable down to
a few nanometers. Nanotubes are deposited using electrophoresis afer fabrication in
order to maintain CMOS compatibility. Te devices are spaced by6 m, which is the
same size or smaller than a single cell. To demonstrate its capability to detect cells, the
researchers performed impedance spectroscopy on mobile human embryonic kidney
(HEK) cells, neurons from mice, and yeast cells. Measurements were performed with
and without cells and with and without nanotubes. Nanotubes were found to be cru-
cial to successfully detecting the presence of cells.
Te carbon nanotubes are very strong, electrically conductive structures a single
nanometer in diameter, or approximately the size of10 hydrogen atoms in a row.
Farrow's breakthrough is a controlled method for frmly bonding one of these submi-
croscopic crystalline electrical wires to a specifc location on a substrate. His method
also introduces the option of simultaneously bonding an array of millions of nanotubes
and efciently manufacturing many devices at the same time. For more information, go
towww.njit.edu/news/2013/2013-218.php.
Jim Harrison
NJIT researchers have created this prototype lab-on-a-chip
that may someday enable a physician to detect disease or
virus from just one drop of liquid.(Photo: NJIT.)
C
M
Y
CM
MY
CY
CMY
K
EMCO_AD_Electronic_Prod_Mag_0813.pdf 1 7/29/13 5:04 PM
Outlook 12
Innovations impacting product, technology and applications
www.picomax.us/samplebox
Try it for free...
Request your
sample box at:
Autotestcon looks to innovate in tight budgets
Te largest U.S. conference focused on automatic test equip-
ment for U.S. military systems, IEEE Autotestcon will be held in
Schaumburg, IL, from September 16 to19. Te theme for this, the
48th annual conference, is "ATS Innovation
in the Era of Challenging Budgets." General
Conference Chair M. Kay Burch of Northrop
Grumman notes that the theme "is especially
relevant in today's changing environment. As
afordability is a key factor in this changing
economy, technical sessions including stan-
dardization, life-cycle cost reduction, reusable
sofware, interoperability, and multinational support will appeal
to a wide audience. When beginning to identify afordability,
it is important that we challenge ourselves to fnd new ways to
lower operating, development, and implementation costs. We are
being ofered an unprecedented opportunity to participate in this
transformation. . ." She also notes that "virtually every signifcant
company in the industry" will be represented, with approximately
170 exhibit booths and over 80 papers being presented.
Te technical program kicks of on Monday with a full day of
seminars that ofer insights into a wide range of topics, including
built-in test, integrated diagnostics, ATE technology and manage-
ment, and instrumentation and sofware standards.
Tuesday begins with a keynote session featuring Jefrey Q.
Palombo, the Sector Vice President and General Manager of
Northrop Grumman's Land and Self Protection Systems (L&SPS)
Division. TeL&SPSis a diverse organization specializing in land
forces, rotary wing survivability systems, inter-
national and U.S. military ground-based tactical
radars, communications systems, infrared counter-
measure systems, automatic test equipment and
simulation, and the Laser Systems business unit ca-
pabilities. Te division is based at multiple locations
around the United States and the United Kingdom,
with headquarters in Rolling Meadows, IL.
Tuesday through Tursday have an array of papers and panel
sessions: arranged into three tracks that explore topics in:
Technologies, trends, and applications in instrumentation
Automatic test systems, test programs, testability, and management
Diagnostics, prognostics, and health management.
Some papers will be theoretical, most will be practical, "and all
will be informative. Tese presentations will capture and hold your
interest," notes the Technical Chair, Teresa Lopes of Teradyne, Inc.
In addition, there will be four panel sessions hosted by techni-
cal leaders in their feld, exploring the following topics: testability,
synthetic instruments, modular instruments, and IVI & LXI.
For more information about attending, visit www.autotestcon.com.
Richard Comerford
V
IN
12V
V
OUT
0.8V @ 2.5A
PV
IN
INTV
CC
T
THERMAL LIMIT
T
MONITOR
I
MONITOR
FB
PGND
SW
BOOST
F
SW
= 2MHz
1.5H
47F
47F
20V, 2.5A SWITCHER
+
Info & Free Samples
The LTC
3626 SWITCHER
+
is the first member of a new switcher family featuring programmable input and output
current limits, as well as on-chip die temperature monitoring with programmable thermal shutdown. These features
provide enhanced system level protection, control and real time status readings. Plus, its unique controlled on-time
architecture is ideal for high step-down ratios where high switching frequencies and fast transient response are essential.
The LTC3626 combines up to 3MHz switching with a small, compact solution footprint.
www.linear.com/product/LTC3626
1-800-4-LINEAR
Output Current Monitor Error
Features
2.6V to 20V Input Voltage
Wide Output Voltage Range:
0.6V to 97%V
IN
95% Efficient
Up to 2.5A Output Current
- Average Input and Output Current
Monitoring (IMON
IN
, IMON
OUT
)
- Programmable Average Input/Output
Current Limit
- Die Temp Monitor and Programmable
Limit (TSET)
Programmable Input & Output Current Limits and
Monitoring with Die Temp Sensing
, LT, LTC, LTM, Linear Technology and the Linear logo are
registered trademarks and Switcher+ is a trademark of Linear
Technology Corporation. All other trademarks are the property
of their respective owners.
cds.linear.com/docs/Design%20Note/dn511.pdf
Output Current (A)
1
M
e
a
s
u
r
e
d

O
u
t
p
u
t

C
u
r
r
e
n
t

E
r
r
o
r

(
%
)
1.25 1.5 1.75 2 2.25
5
4
3
2
1
0
1
2
3
4
5
2.5
T
A
= 85C
T
A
= 25C
T
A
= 40C
14 Industry Exclusive
FIRST member creates low-cost
prosthetic leg
BY JIM HARRISON
L
ast fall, Parker Owen was a senior at the Alabama
School of Math and Science in Mobile, AL, and a
member of FIRST Robotics Competition (FRC) Team
3469 and FIRST Tech Challenge (FTC) Team 4260. Parker
invented a low-cost prosthetic leg that he sees being able to
help perhaps thousands of people who can't afford the profes-
sional device.
Parker Owen won this year's Future Innovator Award.
Tis award recognizes creativity in efectively solving a
real-world complex problem through the invention of a unique
solution beyond the requirements of the FIRST competition
season. Tis award directly links to the FIRST mission to inspire
young people to be science and technology leaders and to the
FIRST vision to transform the culture by creating a world where
science and technology are celebrated. Te award is sponsored by
the Abbott Fund. See more about FIRST at www.usfrst.org and
www.electronicproducts.com/News/You_need_to_know_about_
FIRST.aspx?terms=%22You%20need%20to%20know%22).
Last fall, Parker was talking with a friend who had tak-
en mission trips to Honduras. Te friend told Parker about
the need in Honduras for prosthetic legs, which cost around
$10,000 each. Parker went to his FIRST robotics team, and the
team started looking at available prosthetics on their computers
- all of which were very expensive.
Parker was thinking about this and then watched a few
videos of "third-world countries" on his computer. He noticed
there were bicycles everywhere.
"Afer staring at a bicycle diagram
for a few hours, I had an idea in my
head about how the parts might ft
together," he told me. Te following Sat-
urday afernoon he went to a thrif store
and bought a $20 bike. He took it home
to his dad's shop and tore it apart. He then
put various parts together in the form of
a prosthetic leg and it came together very
well. He decided to use the bike's inner tube
as a pneumatic actuator to adjust the ft for
diferent size people and to allow the wearer
to adjust it as his/her body and strength may
change. It seemed to work.
His friend Greg knew of a prosthetic expert
in the next town. Tis expert had been part of the
Honduras trips, and Parker called him and
then took his new device over to show him.
Very impressed, the expert agreed to advise
Parker on getting some of the details in place.
Parker went to Honduras with a prototype, but stif legal and
safety regulations precluded getting the leg in use there. He is now
working on getting the documentation and testing done. Patents
are in place or in process. He credits FIRST with giving him the
perspective and enthusiasm needed for ideas such as this.
Parker Owen earned the Future Innovator Award sponsored by the
Abbott Fund for his invention, the Cycle-Leg. Pictured here (from L to R)
are Parkers dad, Scott; Dean Kamen, founder of FIRST; Parker Owen;
and Dr. Woodie Flowers, chairman of the FIRST Advisory Board.
Parker Owens
invention, the
Cycle-Leg.
Power Connectors
and Cord Sets
SCHURTER's V-Lock cord retaining system is easy,
safe and cost effective.
- wide range of international plugs; NEMA 5-15 standard
plug or hospital grade version
- hundreds of V-Lock compatible inlets, outlets and
power entry modules with or without filters
(shown with KEA power entry module and extra-safe fusedrawer
with integrated 2-pole circuit protection)
- ideal for IT, audio and medical equipment where
cord retention is required
- cUL and ENEC approved
schurterinc.com/new_PEMS
v-lock.schurter.com
800 453 6202
>> Accelerate your productivity at ni.com/measurements-platform
2013 National Instruments. All rights reserved. LabVIEW, National Instruments, NI, ni.com, and NI CompactDAQ are trademarks of National Instruments.
Other product and company names listed are trademarks or trade names of their respective companies. 12123
NI data acquisition products are the most trusted computer-based measurement
devices available, offering superior accuracy and maximum performance.
NI CompactDAQ systems feature more than 50 measurement-specic modules and
complete breadth and depth of I/O. Coupled with the analysis and signal processing
capabilities of NI LabVIEW software, this platform puts the power of graphical system
design at your command so you can build any measurement system faster.
The Trusted Leader
for Any Measurement
LabVIEW offers powerful
analysis functions for
sensor and signal
data, simplies GUI
development, and helps
you program the way
you thinkgraphically.
16 Engineering Distribution
IN PARTNERSHIP WITH
RFID & NFC
A
D
V
E
R
T
I
S
E
M
E
N
T
RFID and NFC Punctuate
Our Daily Lives
T
he use of RFID and NFC technology to access and share
data is burgeoning as the number of devices and killer
apps continue to swell. The technologies date back to
World War II, but their applications are up to the minute. Radio-
frequency identification (RFID) is based on a small chip with
an antenna that provides a unique identifier
for an object to be scanned for data retrieval.
Near-field communication (NFC),
in comparison, allows devices to
communicate via radio signals in
close proximity or when touching
two NFC-based devices together.
Todays RFID system is
composed of a scanning antenna, a transceiver with a decoder
to interpret data, and an RFID tag, or transponder, programmed
with data to be read. When an RFID tag passes through the feld
of a scanning antenna, the antenna delivers an activation signal
and the chip wakes up and transmits the data, which is picked
up by the antenna.
RFID improves on barcode technology, as tags can be read up
to 300 f, compared with approximately 15 f for barcodes, and
do it faster with read rates of approximately 40 tags per second
compared with a barcodes half second per read.
RFID permeates everyday life and includes baggage tracking,
smart passports, animal subdermal tracking, access, retail
antithef tags, warehouse and inventory management, and
heavy-duty transponders that track shipping containers, trucks,
railroad cars, and heavy machinery. RFID tags also perform well
in such harsh environments as oil and gas, chemical, mining, and
construction. RFID tags combined with sensors are opening up
a new wave of applications as they work dynamically, adding a
level of intelligence never before available.
Near-feld communications (NFC) is resident on the majority
of smartphones, where its used primarily for mobile payments.
By waving an NFC-based smartphone, or digital wallet, over
an NFC-based payment terminal, the phone provides ATM
functionality. It can be used to pay for parking at NFC-based
meters, or as a transit, boarding, or security pass. NFC wirelessly
shares data between two NFC-resident smartphones. Androids
Beam, BlackBerry, and Windows phones have such sharing
features. Google estimates that by next year, NFC-based
smartphones will account for 50% of the market.
One of the most compelling uses for NFC technology is in
the medical feld. Imagine checking into a hospital or clinic or
even a doctors ofce with a smartphone, fnding instructions
on our prescriptions as usage and side-efects info appears on
our phone. Medical professionals can use
their NFC phones to make sure they are
seeing the right patient, for access to areas,
and that patients are receiving the prescribed
care. Already diagnostic skin tags exist that
monitor a patients environment, measuring
glucose, UV light, or temperature and
transmitting the data via a smartphone.
While both RFID and NFC technologies have existed
for quite some time, there has never been the number of
applications as there are today. Tese killer apps, providing
secure access and sharing of information at our fngertips, are
ensuring that both technologies will be seen in almost every
aspect of our lives.
BY CAROLYN MATHAS
Fig. 2: Block diagram of the Texas Instruments TRF7970A 13.56-
MHz RFID and NFC transceiver IC. (Source: Datasheet.)
Fig. 1: RFID development kits from DLP Designs.
Engineering Distribution 17
IN PARTNERSHIP WITH
As RFID Gains Traction,
Design Opportunities Proliferate
B
y the time you arrived in the office this morning, you
may have used radio frequency identification (RFID)
four times without being aware of it: when you inserted
the key in your car, disabling the immobilizer circuit; when you
drove through an unmanned toll booth, automatically paying
your fee; when you used your cell phone to pay for your morning
cappuccino; and when your ID badge registered your entry into
the office. RFID may not be everywhere, but it is getting there.
Te market for RFID tags is growing rapidly and is expected
to accelerate. IDTechEx forecasts that the number of passive
RFID tags will rise from fewer than three billion units in 2011 to
approximately 250 billion units in 2021.
For businesses, RFID ofers an unprecedented opportunity for
increasing productivity and improving customer experience by
providing data at a very granular level and by automating ser-
vices such as payments and record keeping. From an engineering
perspective, RFID is not a single technology, and the technology
varies with the frequency. Table 1 summarizes the applications
and reading range of the three major RFID bands.
Table 1: RFID bands and applications.
Although a subset of RFID technology, near-feld communi-
cation (NFC) has some distinctive features. NFCs shorter read
range and encryption prevent unauthorized access of a link.
NFC also requires minimal user intervention to create links and
supports communication with passive RFID devices such as
smart cards.
As a result, NFC applications will grow rapidly with mobile
phones as the main driver. According to IMS Research, NFC-en-
abled mobile phones will reach up to 1.2 billion units by 2017
as manufacturers adopt wireless communications and payment
technology as a de facto standard.
Most RFID system design activity is focused on reader sys-
tems and specifc reader characteristics are driven largely by the
application and the charac-
teristics of the transponders
(tags).
Semiconductor
manufacturers are now
ofering highly integrated
reader solutions. One-chip
RFID readers such as ams
AS3993 UHF reader chip
ofer high performance and
low power. In NFC system
design, the controller chip plays a central role.
Among other typical tasks, it has to monitor
and control the transceiver, power management,
and host computer interface. New controllers
and transceivers from NXP (PN544) and TI
(TRF7970) improve time-to-market and are
suitable for a wide range of applications.
Although RFID applications are typically not
high-performance, high-speed designs, there is
a good deal of complexity at the system level due
to diferent standards, frequency options, and
most important application requirements.
Once system architecture is carefully thought
out, however, there are numerous design tools and development
kits to provide a clear path to a successful project.
Learn more about RFID and NFC technology as well as the
latest products at www.mouser.com/applications/rfd-nfc/.
By Jack Shandle for Mouser Electronics, www.mouser.com
Fig. 1: RFID tag showing the chip
with coiled antenna.
Learn more at mouser.com/applications/rd-nfc/
A
D
V
E
R
T
I
S
E
M
E
N
T
SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS Advertisement
Q WHAT IS SPECIAL ABOUT
UFS FLASH MEMORY
DEVICES?
A Universal Flash Storage
(UFS) uses a very fast serial
interface and is based on a
JEDEC standard (in 2011).
UFS chips have a built-in
flash controller, like e-MMC.
UFS uses MIPI M-PHY and
MIPI UniPro interfaces
and is said to be faster
and more energy efficient
than the current e-MMC
interface. Initial versions of
UFS devices (Ver1.1) have
been sampling in the market
since early 2013 to enable
chipset and OS development
for this new standard. The
large photo and video data
files being moved around
from smartphone and tablet
computers are driving the
industry to find faster, more
secure transfer mechanisms.
Q ARE THERE ADVANTAGES
THAT UFS HOLDS OVER
THE E-MMC MEMORY
INTERFACE?
A The increasing demand for
fast data transfers in phone
and tablet platforms will favor
the rising usage of UFS over
the next couple years.
I talked with Scott Beekman,
Director, Managed NAND
Memory Products, Toshiba
America Electronic
Components, Inc. and he
noted, UFS not only provides
a faster interface relative
to e-MMC, it also enhances
overall system performance
with capabilities such as
full duplexing, enabling both
reading and writing
between the host
system and UFS
device at the same
time. Toshiba was
the rst to introduce
embedded devices
supporting the UFS
interface and has
been sampling since
early 2013. Going forward,
we will continue to maintain
a leadership position in UFS
solutions.
So, UFS Ver2.0 has data
transfer speeds of up to
2.9 Gbits/s per lane, and
Electronic Products
Technical Editor, Jim Harrison,
explores some frequently
asked questions regarding the
future of embedded memory
for consumer
electronics.
multi-lane congurations
can be supported. With
two lanes we have 5.8
Gbits/s almost double
the maximum interface that
can be supported against
the latest e-MMC standard
Ver 5.0, which can support
DDR 200 MHz with eight
I/O (3.2 Gbits/s). UFS uses
the SCSI command set and
architecture model, and has
a roadmap for even faster
transfer speeds in the not-
too-distant future.
The UFS device supports
multiple commands with
command-queuing features
and enables a multithreaded
programming paradigm.
This differs from e-MMC
and other embedded ash
NAND FLASH
Q
+
A
V
UF S T h e Ne x t Ge n e r a t i o n Of E mb e d d e d St o r a g e
ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013 Advertisement
solutions, which process
one command at a time
limiting random read/write
access performance.
Q WILL UFS SOON REPLACE
E-MMC?
A Initially, UFS parts will be
higher priced than e-MMC,
and early on will likely be
adopted by higher-end
applications, that need
enhanced performance,
before migrating to mid-
and lower-tier products in
the future as the price gap
decreases. For this reason,
e-MMC is expected to remain
in the market for some time
in parallel with UFS.
Q I KNOW TOSHIBA HAS
BEEN SAMPLING A UFS
FLASH MEMORY. WHEN
WILL THERE BE GENERAL
AVAILABILITY?
A The UFS system has the
backing of Toshiba, Micron
Technology, Nokia, Samsung,
Sony Ericsson, Spansion,
STMicroelectronics, and
Texas Instruments. Toshiba
has been sampling the UFS
Ver1.1 64-Gbyte devices,
THGLF0G9B8JBAIE, since
January. These devices come
in a 169-ball 12 x 16 x 1.2-
mm FBGA package. More
UFS devices are expected to
be introduced later this year,
and mass production for UFS
is expected to ramp more
broadly in the market in early
2014.
NAND FLASH MEMORY Embedded
| Storage
I nnovat i on t hat Enabl es Your Desi gn
W H E N T O S H I B A M O V E S,
T E C H N O L O G Y M O V E S.
Considering NAND Flash to enable your
design? As the worlds most experienced
provider of NAND Flash memory, Toshiba
understands your NAND design challenges better than anybody else.
With evolving NAND manufacturing processes, ECC is becoming
more sophisticated and putting heavier burdens on the host
processor. By offering NAND Flash memory with built-in ECC, fully
managed NAND solutions, and the industrys frst UFS module
fully compliant with the JEDEC UFS Ver.1.1 standard Toshiba makes
it easier than ever to integrate advanced, high-performance NAND
into your next consumer, mobile, enterprise or industrial design.
Visit us at memory.toshiba.com to learn more.
Managed
NAND
Enterprise
NAND
NAND with
ECC
Removable
NAND
SLC
NAND
dotted line: software
solid line: hardware
NAND Flash Solutions with Embedded ECC
HS-MMC I/F
Bad Block Management
Wear Leveling
Garbage Collection
ECC
NAND I/F
MLC NAND Chip
HS-MMC driver (ATA alike)
HS-MMC I/F
CPU
UFS I/F
Wear Leveling
Garbage Collection
ECC
NAND I/F
MLC NAND Chip
UFS driver
UFS I/F
CPU
ECC
NAND I/F
NAND I/F
MLC NAND Chip
MLC NAND driver
Wear Leveling
Garbage Collection
NAND I/F
CPU
7136_EP_Sept_4.125x8.625.indd 1 7/29/13 3:39 PM
Product Closeup
20 Wire & Cable
40 Gbits/s over twisted-pair
copper cable is on the way
Category 8 cable and 40GBASE-T standards are in process
BY FRANK STRAKA
Product Development Manager
Panduit, www.panduit.com
R
ecently the IEEE P802.3bq Task
Force was formed to create a
standard for 40-gigabit Ether-
net over copper twisted-pair cabling
(40GBASE-T). This is the next gen-
eration following 10-gigabit Ether-
net over copper twisted-pair cabling
(10GBASE-T). The BASE-T families
of standards are regarded as one of the
most successful and deployed Ether-
net standards in the world today. They
feature cost advantages and ease of de-
ployment with auto-negotiation and the
ubiquitous RJ45 connector for seamless
backward compatibility. The IEEE is
the main standards body for BASE-T,
focusing on both the equipment and
cabling. In support of the development
of 40GBASE-T, the cabling standards
bodies (TIA and ISO/IEC) have also
been working hard on creating Category
8 cabling and connector specifications.
Tere is a distinct trade-of between
the cabling specifcations and the equip-
ment specifcations. Cables that are
easier to design and manufacturetend
to have worse performance, requiring
more advanced equipment, while more
advanced and harder to manufacture ca-
bles will likely have better performance,
requiring less advanced equipment. Te
goal of the standards body is to come
together and try to fnd the optimum
trade-ofs between these elements to
optimize the time to market and power
consumption for the user and maintain
a broad market potential.
Collaboration required
40GBASE-T is a great example where
both the equipment vendors and
cabling vendors are working together
to try and fnd the optimum scenario.
Cabling vendors,such asPanduit, want
to ensure that our customers continue
to enjoy the advantages of BASE-T stan-
dards. We need to ensure that the cable
specifcation has sufcient reach and
usability so it can be used in as many
scenarios as possible.
While there are no ofcial standards
yet developed, it is clear that 40GBASE-T
will require the most advanced twist-
ed-pair cabling technology yet. It will
require a bandwidth of between 1,500
to 2,000 MHz. As a point of reference,
10GBASE-T only requires Category 6A/
Class EA components with a bandwidth
of 500 MHz. Even the European ISO/
IEC standards for Category 7A/Class FA
only have a bandwidth of 1,000 MHz.
Te diference in magnitudes can be seen
in Fig. 1.
Another change with 40GBASE-T
over traditional BASE-T standards
is that the channel length had to be
reduced from 100 m to 30 m in order
to reduce power consumption and
equipment complexity. (Channel is
the term for the combination of cables
and connectors.) All prior Categories
and BASE-T Ethernet standards allowed
for lengths of up to 100 m. In order to
properly service as broad a market as
Fig. 2: Maximum lengths compared.
Fig. 1: Existing cabling standards versus
40GBASE-T (Category 8).
WE BUILD SUPERIOR QUALITY INTO
EVERYTHING WE MAKE
AND WE MAKE EVERYTHING WE SELL.

Our components fit like they were made for each other. Thats because they were.
The exceptional quality found in every Mill-Max Interconnect product results directly from the control we exercise over
every step of the manufacturing process. From the receipt of raw materials to the shipping of finished components, each
operation is performed in-house to the highest standards for quality and precision
in the industry. You can depend on Mill-Max interconnects to mate perfectly
and perform reliablyevery time. See the whole Mill-Max story at
www.mill-max.com/videos.
Mill-MaxisNorthAmericaslargest
manufacturerofmachined-pininterconnects.
2013 MILL-MAXMFG. CORP. 190PINEHOLLOWROAD OYSTERBAY, NY11771 PHONE: (516) 922-6000 Maximum Quality.
22 Wire & Cable
possible, companies worked
to ensure the maximum
channel length was at least
30 m designed to support
both end of row and top of
rack topologies and provide
data center customers with
maximum fexibility. While
this length can change since
there is no standard published,
at this point 30 m is assumed
to be the likely maximum cable
length (see Fig. 2).
Available next year
What this highlights is that
there are no existing cabling
standards that are close
to meeting the needs for
40GBASE-T. Cabling compa-
nies have been working hard
to develop new Category 8
cables and connectors. Tere
has been much progress from
a multitude of cabling vendors
like Panduit showing connec-
tors and cabling with 2,000 MHz bandwidths (see Fig. 3).
It is expected that products will be available in late 2014
to early 2015 when the standards become more developed. At
this point the standards are in a state of constant fux so it is
still too early to supply products.
Table 1 highlights the diferent categories of cables and the
applications they are designed to support, as well as the up-
grade path through the diferent data rates. 1000BASE-T will
run on Category 6, 10GBASE-T will run on Category 6A, and
40GBASE-T will run on the yet to be fully defned Category
8. Tere are no specifc Ethernet applications for Category 7
or Category 7A. Since 40GBASE-T standards are in state of
fux and no existing standards come close to meeting these
requirements, it is recommended that today if someone is
looking to install 10GBASE-T that they use Category 6A
cabling and connectors.
40GBASE-T is becoming an excellent example of difer-
ent industries collaborating together in order to provide our
customers with the optimum products with the fastest time to
market. Cabling companies like Panduit are working hard and
doing our part to design next-generation cabling and connec-
tors so that 40GBASE-T becomes another successful member
of the BASE-T Ethernet family.
Currently, the state of the art for twisted-pair copper
cabling is running 10GBASE-T over Category 6A cabling.Te
Panduit MaTriX Category 6A solution, including the PUP6A-
04BU-UG cable with CJ6X88TG-style jacks, is an example of
an available Cat 6A system good for lengths up to 100 m with
a bandwidth of 500 MHz.
Table 1: Category cable standards overview with supported data rates and upgrade path
Fig. 3: Category 8 prototype test results.
MEGA Electronics Inc.
4B Jules Lane
New Brunswick, NJ 08901
tel 732.249.2656 fax 732.249.7442
www.megaelectronics.com
[email protected]
Wall Adapters with Interchangeable
Plug Option
Desk Top to 200W
Open Frame with PFC
DIN Rails to 960W
LED Drivers
Medical Approvals
Power Supplies & Cords
MILL-MAX HAS THE CAPACITY TO TAKE ON
THE LARGEST PRODUCTION RUNS
AND THE SMALLEST ONES, TOO.

Flexible, high-volume manufacturing to meet any customers needs.
With more than 200 high-speed, Swiss screw turning machines running 24 hours a day, Mill-Max can manufacture
over 100 million interconnect components every week. Since precision milling requires no tooling or dies, we
also have the ability to produce modified or custom-designed components in quantities too small for other
suppliers to touch. And every step in the fabrication process is monitored
for superior quality in our 150,000-square-foot manufacturing facility.
See the whole Mill-Max story at www.mill-max.com/videos.
Over 800 Varieties of Pins, Contacts,
and Receptacles in Stock
2013 MILL-MAXMFG. CORP. 190PINEHOLLOWROAD OYSTERBAY, NY11771 PHONE: (516) 922-6000
Maximum Capacity.
24 Real-Time Software Design
Working with Windows
This small-footprint operating system can be customized to meet the
targeted requirements of a specialized device on multiple chipset options
BY JUSTINE COATES
Technical Evangelist
Microsoft, www.microsoft.com
W
indows Embedded Com-
pact 2013 differentiates
itself from other operat-
ing systems by providing a real-time,
small-footprint operating system that
can be customized to meet the targeted
requirements of a specialized device on
multiple chipset options, including both
x86 and ARM. With an emphasis on
"non-PC" solutions, Windows Embed-
ded Compact is not trying to create
multi-purpose desktop, but instead
focuses on devices such as industrial
controllers, medical imaging units,
printers, digital signs, and retail scan-
ners, to name a few.
Te specifc characteristics of a
device, like a small touchscreen or no
screen at all (headless), plus its sin-
gle-purpose functionality, make it a
"specialized device." As you can imagine,
there are thousands of possibilities and
you probably interact with these special-
ized devices every day without realizing
it. When you want to design a device to
serve a specifc purpose and build it to
meet a cost objective, Windows Embed-
ded Compact is a great place to start.
Minimally, as a 32-bit operating
system, Windows Embedded Compact
requires a 32-bit CPU with a memory
management unit. Along with support-
ing multiple architectures, the latest
versions support symmetric multipro-
cessors, allowing developers to control
which processor does the work or let the
operating system balance the workload
across multiple cores.
OS advantages
Embedded device manufacturers can and
do take advantage of the logical separa-
tion of operating system design and the
hardware. Developers in charge of the
sofware features of their design can start
their operating system and application
prototyping on a Virtual PC-based plat-
form while hardware-level board-sup-
port package (BSP) development is done
in tandem (see Fig. 1). Te modular
design of the OS is uniquely geared so
that designers can select only the compo-
nents needed for their targeted scenario
and it easily allows for the integration of
third-party or custom features as well.
Windows Embedded Compact gives all
of the benefts of a Win32 API, coupled
with the freedom to make the OS have
only the features that are absolutely
required.
Windows Embedded Compact
development is done using tools hosted
in Visual Studio. Tis allows embedded
developers to use the latest in Microsof
developer tools when creating their
platform.
Te Windows Embedded Com-
pact OS design tool, Platform Builder,
provides access to a catalog of features
and the ability select only those sofware
components that are absolutely neces-
sary for the targeted solution. Applica-
tion Builder (formerly Visual Studio for
Devices) allows application developers
to create rich, targeted device applica-
tions without requiring the full platform
development toolset. Not only is Win-
32 available in Windows Embedded
Compact, but ATL, MFC, DirectDraw,
OpenGL, and XAML are also available
if the designer includes the required
components.
A "compact" version of the .NET
Framework is selectable in the Windows
Embedded Compact catalog to support
Visual Basic and C# development for
devices. Te Microsof .NET Compact
Framework enables the device to host
managed applications and use web ser-
vices. It includes an optimized common
language runtime (CLR) and a subset
of the .NET Framework class library
that supports features such as Windows
Communication Foundation (WCF)
and Windows Forms. It also contains
classes that are designed exclusively for
the .NET Compact Framework.
When and why would I use

Windows Embedded Compact?
Embedded operating systems, unlike
their desktop counterparts, usually
bundle the operating system and the re-
quired application together into a single
Fig. 1: Developers in charge of the sofware features of their design can start their operating
system and application prototyping on a Virtual PC-based platform while hardware-level
board-support packagedevelopment is done in tandem.
WELL CUSTOM DESIGN THE INTERCONNECT
YOU NEED ASSUMING, OF COURSE,
ITS NOT ALREADY IN STOCK.

Prototyping and concurrent engineering are part of Mill-Max support.
Despite an industry-leading inventory of stock products, application-specific interconnects represent about
half of our business, and were very good at it. Mill-Max engineers work directly with our customers
engineers. We look for ways to enhance functionality, simplify manufacturing,
eliminate secondary operations, and reduce costs. Fast prototyping is
a specialty and were happy to do it even on short-run projects.
Mill-Max manufactures a wide variety of both
standard and application-specifc interconnects.
2013 MILL-MAXMFG. CORP. 190PINEHOLLOWROAD OYSTERBAY, NY11771 PHONE: (516) 922-6000
Maximum Support.
26 Real-Time Software Design
executable image for purpose-driven
devices. Using less space and only in-
cluding required sofware allows Win-
dows Embedded Compact to run on
small-footprint devices needing fexible
hardware and hard, real-time support.
In short, you would use Windows
Embedded Compact to create lower
cost, purpose-driven devices where you
need the reliability of a trusted Micro-
sof platform with support for up to 15
years.
A fully featured image for Win-
dows Embedded Compact is about 45
Mbytes, but the size will vary based on
what you include. It is recommended
that a designer download the Compact
2013 kit (it is free at www.Windowsem-
bedded.com/Compact) and try it out
using the Virtual PC.
Microsof recently posted a blog that
discusses real-time in some detail and
has links to the real-time studies done
on Compact 7 (http://blogs.msdn.com/b/
windows-embedded/archive/2013/07/17/
the-hard-and-sof-facts-behind-real-
time.aspx).
Te blog, in general, has a number of
interesting postings at http://blogs.msdn.
com/b/windows-embedded.
Windows Embedded Compact ofers
encryption and networking security op-
tions, and Windows CE supports creat-
ing a trusted app execution environment
using certs etc. See http://msdn.microsof.
com/en-us/library/ee498894.aspx.
Downloads of all Windows Em-
bedded oferings are available at www.
microsof.com/windowsembedded/en-us/
downloads.aspx.
When you want
to design a device
to serve a specific
purpose and build it to
meet a cost objective,
Windows Embedded
Compact is a great
place to start.
Get On-Board
with Power Resistors
fromKOA Speer
Most of you know us as the world leader in thick film resistors.
And many are aware of the world class standards our Quality 1st
program has set for product quality, customer support and on-time
delivery. But did you know we offer a complete line of high
performance power resistors that are supported by the same
Quality 1st commitment?
Ceramic Fixed Power Leaded Resistors HPC/PCF- 1/2W~ 5W power
ratings, resistance range: 3.3~ 390K, 10%, 20% tolerance
High Power Rectangular Wirewound Resistors BGR, BWR, BSR -
1W ~ 40W power ratings, resistance range: 0.1~ 75K,
1% ~ 10% tolerance, uses flame-retardant insulated ceramic case
Miniature Precision Power Wirewound Resistors RW-
0.5W ~ 10W power ratings, resistance range: 0.1 ~ 62K,
0.5% ~ 5% tolerance
Power Carbon Film Leaded Resistors SPR(X) - 0.25W ~ 5W power
ratings, resistance range: 0.1 ~ 110K, 1% ~ 5% tolerance
Get On-Board with KOA Speer power resistors,
call 814-362-5536 or visit KOASpeer.com
Ask for your
FREE Samples!
PowerResAd_EP12_11_Layout 1 11/10/11 4:49 PM Page 1
WE MAY BE UNCOMPROMISING WHEN IT
COMES TO QUALITY, BUT THAT DOESNT
MEAN WERE HARD TO DEAL WITH.

Online or on the phone, our customer service is the best in the business.
Our dedicated technical support specialists and application engineers are adept at resolving the most challenging
interconnect requirements. So our customer service specialists can concentrate their time on making happy
customers happier. They turn quotes around quickly and confirm most orders
in an hour. Theyll see you get all the technical support and free samples
you need. And when they make you a promise, theyll keep it.
Order our new catalog or check
out the robust online version today.
2013 MILL-MAXMFG. CORP. 190PINEHOLLOWROAD OYSTERBAY, NY11771 PHONE: (516) 922-6000 Maximum Service.
28 Portable Test Support Portable Test Support 29
Working on remote
RF remotely
Recently, a number of companies have introduced
ways to ease the burden on field personnel by
letting them control RF instruments from afar
BY RICHARD COMERFORD
W
ith widespread deployment of
RF systems such as celluar and
radar equipment in some of the
most remote locals on earth, field engineers
and technicians often need to be able to
perform sophisticated RF measurements in
places and under conditions that can best
be described by the expression, "I wouldn't
send a dog out on a night like this." Yet
these systems are so critical to business
and everyday life that not maintaining
them is not an option.
Recently, a number of instrumenta-
tion companies have introduced ways to
ease the burden on feld personnel by
allowing them to control RF equip-
ment remotely, say from within the com-
fort of a truck cab, while the instrumenta-
tion is doing its job in precarious locations
and/or exposed to the elements.
For example, with Option 030, the
FieldFox handheld analyzers from Agilent
Technologies (www.agilent.com) can now
be remotely controlled via an iOS device
such as an iPad or iPhone, which enables
viewing and control of the instrument
via the Remote Viewer iOS app. With a
wireless LAN or cellular broadband data
connection and an iOS device, the analyz-
ers can now be placed in areas where users
do not wish to stay long due to extremely
harsh or unsafe conditions. Additionally,
if one technician or engineer has trouble
making a measurement or determining
the source of a problem, another can step
in to remotely troubleshoot and solve the
problem. Once users launch the Remote
Viewer, they can also access technical
literature such as user guides, application
notes, and datasheets, as well as demo
videos. Tis lets users quickly fnd the data
they need to resolve network issues as they
arise in the feld.
Also new to the instrument are a
spectrum analysis time-gating option (Op-
tion 238) and support for Agilent's USB
peak-power sensors (Option 302). Te
spectrum analysis time-gating function is
specifcally geared toward engineers testing
the pulse characteristics of their radar
systems. Unlike
competing solu-
tions, the instrument's time-gating func-
tion allows users to view both frequency
and time domain at the same time, and it
can measure very narrow pulses (less than
1us wide) with sweep time as small as 8 us.
Enhanced trigger functions (burst trigger
and pre-trigger, for example) further ease
the signal-measurement challenge.
Peak power measurements are needed
to test pulsed transmissions. Te pow-
er meter option supports Agilent USB
peak-power sensors so engineers can
measure peak and average power to 18 or
40 GHz with the same accuracy as with
traditional peak-power meters. By extend-
ing frequency measurements to 40 GHz,
the power meter option suits engineers
maintaining and troubleshooting radar
communications equipment and networks.
Anritsu (www.anristsu.com) too has
introduced remote capability, in the
form of its Wireless Remote Tools for
its touchscreen PIM Master, Site Mas-
ter, Spectrum Master, and VNA Master
handheld instruments. With the sofware
installed, feld technicians and engineers
can remotely view screens and control the
FieldFox handheld analyzers can
now be operated remotley using
iPads or iPhones.
2013 Measurement Computing Corporation
10 Commerce Way, Norton, MA 02766
[email protected]
Contact us
1. 800. 234.4232
mccdaq.com/BTH1208
a data acquisition
device for
tablets and PCs.
FINALLY...
New BTH-1208LS
Bluetooth and USB
connectivity
Android

and Windows

software support
8 SE/4 DIFF analog inputs
1 kS/s sampling
8 digital I/O, one 32-bit counter
Rechargeable batteries, over
8 hours of continuous use
OEM version available

Only
$
199
Turn your Android tablet or phone
into a low-cost data logger.
Collect data wirelessly with the
BTH-1208LS DAQ device
28 Portable Test Support Portable Test Support 29
industry-leading feld instruments using
a Windows-based tablet, laptop, or PC to
simplify deployment and maintenance of
2G/3G/4G wireless networks.
Available for free download from the
Anritsu Tool box web page, Wireless
Remote Tools makes conducting feld
measurements, such as sweeps, spectrum
analysis, PIM, and S-parameters, easier
and more efcient. For example, operators
can now remain on the ground and use a
Site Master cable-and-antenna analyzer to
conduct sweeps on jumpers at the top of
the tower. Remote spectrum monitoring
can also be done more efectively, espe-
cially if the interference is caused by an
intermittent signal. Users can now monitor
and control a Spectrum Master handheld
spectrum analyzer at a remote location,
such as a desk, using the sofware.
Wireless Remote Tools initially sup-
ports the Site Master S331E/S332E and
S361E/S362E; VNA Master MS2024B/
MS2025B and MS2034B/MS2035B hand-
held vector network analyzers; Spectrum
Master MS2712E/MS2713E and MS2720T;
and PIM Master MW82119A Passive
Intermodulation analyzer. Te handheld
instruments can be connected remotely
via a Wi-Fi link using a pocket Wi-Fi
router for local remote control or from the
Ethernet port on the analyzer through the
Internet.
Te Model RTR 2727 Talon RF/IF sig-
nal recording and playback system from
Pentek (www.pentek.com) is a rugged
portable recorder suitable for military and
aerospace applications. Te system fea-
tures recording and playback of IF signals
up to 700 MHz with signal bandwidths to
200 MHz, and it can be confgured with
500-MHz 12-bit A/Ds or 400-MHz 14-bit
A/Ds and an 800-MHz 16-bit D/A. Avail-
able I/O includes audio and VGA video,
RS-232/422/485 serial, multiple USB 2.0
and 3.0, eSATA, and dual Giga-
bit Ethernet connections.
Te instrument's System-
Flow sofware allows turnkey
operation through a graphical
user interface, while System-
Flows API provides for remote
system control and integration
of the recording sofware into
custom applications. Te sofware also
includes a virtual oscilloscope and spec-
trum analyzer to monitor signals before,
during, and afer data collection. Record-
ed fles are stored in native Windows
NTFS format, so they can be used without
post-recording fle conversion. At the
heart of the recorder are the Cobalt Series
Virtex-6 sofware-radio boards.
Powering your next design.
Let us be your power expert. We understand that you dont
have the time to master every aspect of electronic design.
As a leading manufacturer of power supplies we are here to
collaborate with you to ensure your next project is a success.
Novum
Advanced Power
Ac-Dc
Power Supplies
Dc-Dc
Converters
www.cui.com/PowerExpert
A number of portable instruments from Anritsu, such as the
SiteMaster seen here on the right, can be operated remotely
using a Windows-based tablet or other Windows device.
an electronic products special series
30 Energy-Saving Initiative
Precision-circuit semiconductors
drive gains in energy harvesting
The precision semiconductor technology delivers markedly improved
system sensitivity, reliability, stability, and functionality
BY ROBERT CHAO, Founder and CEO,
Advanced Linear Devices
www.aldinc.com
A
dvancements in the fields of en-
ergy harvesting, sensor networks,
building automation, and security
systems are making tremendous strides due
to recent innovations in precision circuit
semiconductors. While developers
seek integration for all four system
categories, the precision semicon-
ductor technology delivers mark-
edly improved system sensitivity,
reliability, stability, and functionality.
Growth and interest in these systems
has evolved to the point where the
IEEE is developing protocols for a
more integrated approach to sensor
networks and building automation
so that end solutions are more cost
effective and energy efficient.
Industry standards for such
systems are called for in a document
entitled Building lighting automa-
tion through the integration of DALI
with wireless sensor networks.Te
consumer electronics-focusedTrans-
actionsjournal published the paper
on the integration of Digital Address-
able Lighting Interface (DALI) devic-
es in wireless sensor networks and explores
possible improvements for the technology.
Since diferent manufacturers usually
deal with one aspect of building automa-
tionfor example,heating ventilation and
air conditioning, lighting control, difer-
ent kinds of alarms, etc. fnal building
automation system has diferent subsys-
temsthat are fnally taken to an integrated
building management system.
An economical fully centralized system
Our main purpose is to provide the end
consumer with an economical fully cen-
tralized system in which home appliances
are managed by an IEEE 802.15.4-based
wireless sensor network.
Te case of building automation is
ideal for demonstrating how advances in
semiconductor technology enable break-
through capabilities for these systems.
Operators of large facilities such as ofce
buildings and municipal complexes have
made great strides in cutting cost and
improving energy efciency by using
building automation and security in con-
junction with energy-harvesting systems
and wireless sensor networks.
Large ofce complexes use sensor net-
works to interface with building controls
to turn on power, heating, and ventilation
to individual ofces and cubicles only
when people are present. However, there
is much room for improvement in such
systems as anyone who has had their
ofce lights shut of in the middle of the
working day might attest. By improving
Fig. 1: Current-source circuit diagram constructed with
precision semiconductor devices
the circuits of these systems, its possible
to improve accuracy of the controls that
activate building automations systems
so that they more accurately respond to
real-life situations for which they were
intended.
In practical applications, the technol-
ogy hasnt always worked as designed.
Systems set up to detect the presence
of motion and temperature changes
are limited in their capabilities and
this has undesired results. Tats why
lights turn of even when workers are
present. Te systems have limitations
in accuracy, reliability, andsensitivity
range. Te goal of many in sensor
network and building automation
development isto improve the tech-
nology so that it truly matches the
real-life situations for which they were
designed.
Circuit design progress
One of the most important areas
where designers are making prog-
ress is in the basic building blocks of
circuit design. With better circuits
that aford greater operating dynam-
ics, building automation and security
systems are fnely attuned to real-life
usage models. For example, greater
sensitivity and reliability can prevent cost-
ly false alarms in building security.
Energy harvesting and ultra-low
power are also important features that
enable greater reliability and cost-efective
wireless installation. In building a system,
designers desire extremely low power
circuits, so that as much energy as pos-
sible can be harvested, stored, and used
for some other purpose. If the electronics
consume a prohibitive amount of power,
it is difcult to build high-efciency
systems.
It is important that these circuits con-

Loop 1
Up to 8-ph
Loop 2
Up to 4-ph
SupIRBuck
SupIRBuck
SupIRBuck
PowIRstage
CHiL
Digital Control
SupIRBuck
SupIRBuck
for more information call 1.800.981.8699 or visit us at www.irf.com

International Rectiers PowIRstage
offers
the most efcient solution for multi-phase
converters. Our SupIRBuck
product offers
exible solutions for all Point-of-Load supply
requirements.
Features
Simple design suites for multi-phase
and POL solutions
Simple evaluation using hardware
development tools
Simple layout using digital power,
integrated power stages and
integrated POL solutions
Complete End-to-End
DC-DC Solutions
THE POWER MANAGEMENT LEADER
an electronic products special series
32 Energy-Saving Initiative
sume as little energy as possible so that
the current and voltage that is harnessed
from an ambient source can be maxi-
mized todrive the electronic systems that
they were intended to supply. Greater
power ranges provide building automa-
tion system developers and end-users
with greater fexibility and reliability to
deploy improved solutions.
Today, energy harvesting is a growing
feld because it helps building operators
with the ability to install automation
controls with wireless networks. Tis
helps eliminate cost and complexity
for operators who want to improve the
efciency and reduce the operating cost
of their facilities.
Te research frm IDTechExexpects
the total market of energy-harvesting
devices to rise to more than$5 billion
in 2022. In a report, the frm stated,
Te technology has reached a tipping
point, because the necessary lower power
electronics and more efcient energy
gathering and storage are now sufcient-
ly afordable, reliable, and longer-lived
for a huge number of applications to be
practicable.
An example of this type of advance-
ment is the ALD210800 MOSFET array,
with a gate threshold voltage is exactly
0.00-V 0.001 (10 mV). Tis new
category of device enables breakthrough
analog circuit design parameters, such as:
100-mV minimum operating voltage
1-nA minimum operating current
1-nW minimum operating power
Te ALD210800 is a basic building
block in circuits to enable greater sensor
sensitivity. Each MOSFET is enabled
by fully independent input and output,
source, and drain. Compared to previous
generations, it increases current output by
greater than an order of magnitude. It also
reduces circuit size by 50%, which in turn
helps decrease board real estate and cost.
Te MOSFET array is designed to tap
a number of energy-harvesting sources
thathave less than a 1-Vsupply voltage.
Te array also helps improve energy
efciency and extend battery life. Designed
with precise specifcations, this new catego-
ry of device gives developers a new frontier
of operating voltages, power consumption,
and increased precision. In the analog
world, precision is always welcome.
N-channel current source
Figure 1 depicts a circuit design for a
very basic current source. Actual useful
current and voltage ranges also depend
on the device being used. Te ALD
210800 ofers the highest-precision
performance with the lowest current and
voltage requirements. You can build this
current source with any of the devices
that are listed above or that are current-
ly on the market. Te diference is the
actual specifcations that can be achieved.
Tis marks a new frontier for basic MOS-
FET circuits.
With innovative materials like the
new generation of ultra-precise semi-
conductors, developers of energy-har-
vesting systems and sensor arrays will be
able to make improvements in building
automation security, wireless networks,
and building automation. Sensors will
be given greater dynamic range to detect
motion and heat. Tis will spur greater
sensitivity to detect when people are
present and when they are not, and
aford operators fner granularity in
controlling their facilities.
Te new category of precision circuit
semiconductors will enable the circuits
supporting these systems to be more sta-
ble more reliable and more dependable.
It also allows energy harvesting systems
to make greater use of the ambient ener-
gy and store power when it is not needed
so that systems are ready to be deployed
when they are called into action.
About the author
Robert L. Chao, CEO of Advanced Lin-
ear Devices in Sunnyvale, CA, founded
ALD in 1985 and has been a leading
authority in the analog semiconductor
industry for over 30 years. A founder of
Supertex, Mr. Chao was instrumental
in inventing the analog circuitry that
enabled the home smoke detector.

t-yuden.com/automotive
800-348-2496
Extremely low failure rate
Body and safety system grades
Built with our own raw materials and advanced technology
Quality controlled through entire manufacturing process
Smaller cutting-edge solutions at competitive prices
TS-16949 Certified Factory
AEC
Q200
*Please contact our sales
office for latest information
QUALIFIED*
812-13204 TY_Cap_Automotive(EP)_Layout 1 7/8/13 5:04 PM Page 1
4.8MM BUTTON CELL RETAINERS

THiNK Keystone 4.8mm Button Cell Retainers
for ML414 Micro Batteries
Accepts 4.8mm micro lithium batteries Available in SMT
and THM Ideal for miniature electronic devices Low Prole
Low contact resistance Withstands shock and vibration
Gold Plated Accommodates lead free & low temperature
reow soldering Available on Tape and Reel Unique design
for vacuum pick & place Request Catalog M60.2
E L E C T R O N I C S C O R P.
Theres a keystone in every great invention Follow, THiNK & Learn at:
that counts.
Its whats on the inside
Tel: (718) 956-8900 (800) 221-5510
e-mail: [email protected] Web: www.keyelco.com
EP THiNK Snow+2994.indd 1 8/8/13 4:00 PM

34 Cover Story
C
hoosing the right processor is a
critical decision as it defines a
products capabilities. When a
processor is correctly sized, it supports
the full suite of a products functions and
leaves headroom for growth. Overspeci-
fying the processor will drive system cost
up unnecessarily. An incorrectly chosen
processor may run out of performance
during the design cycle, leading to key
features being eliminated or downsized.
In a worst-case scenario, an improperly
sized device in the field may not have the
capacity for a critical update.
Sofware is also a very important con-
sideration and ofen represents a majority
of the development investment, both in
terms of cost and time, so the optimal
processor for an application also must
have the right development resources sup-
porting it. Finally, an application-specifc
perspective is required to determine how
the needs of particular markets also afect
processor and sofware requirements.

Making sense of the ARM cores
ARM ofers several licensable cores to meet
a wide range of application requirements.
Microcontroller manufacturers obtain an
ARM core architectural license to modify
the core and design a complete proces-
sor or SoC around the ARM core. Tis
includes integrating peripherals and mem-
ory, as well as adding application-specifc
features that can enhance performance
and power efciency. While many vendors
design their own processor ofering an
ARM core, the resulting processors are not
equal. ARM Cortex processors are used
most frequently for embedded processing
designs that need to feature low-power.
Tese Cortex processors also provide a
large amount of compatibility and scalabili-
Getting started with ARM
embedded MCU design
Choosing the right ARM Cortex-based processor
BY SANGMIN CHON
Central Marketing Director
Texas Instruments, www.ti.com
ty among each other.
Selecting the right ARM-Cortex proces-
sor for your application involves more than
just estimating performance requirements.
Te frst step in selecting the right ARM
core for an application is to understand the
three primary ARM-Cortex core families
and the basic diferences between them.
Here is a description of each of the
ARM cores in a nutshell:
ARM Cortex-A: Application processors
based on the Cortex-A series core ofer
low power, along with exceptional 32-bit
performance. Tis architecture supports
multicore confgurations, as well as option-
al advanced foating-point capabilities. Te
Cortex-A ofers up to 13-stage technology
with 1.5 to 2.5 DMIPS/MHz per core with
advanced branch prediction. Its Neon
integer and foating-point SIMD engine
enable advanced media performance for
applications. Te series is tuned for memo-
ry streaming with one- to two-cycle cache
access, pipelined loads and stores, and
coupled (or integrated) level-2 caches.
With their high performance and
advanced memory, Cortex-Abased MCUs
are well suited for any product that needs
to incorporate and run an advanced oper-
ating system, such as Windows, Linux, or
Android. In addition, Cortex-A processors
provide additional benefts through a few
available technology extensions Trust-
Zone security extensions for secure com-
puting applications and Jazelle technology
for accelerating execution environments,
such as Java, .Net, MSIL, Python, and Perl.
Because they are designed to serve as an
application processor, common appli-
cations for Cortex-Abased processors
include digital TV, home gateways, auto in-
fotainment systems, industrial automation,
base stations, and cloud computing.
ARM Cortex-R: Cortex-R was devel-
oped for real-time applications where low
power and responsive-interrupt handling
are needed. High performance is enabled
with features such as high clock frequency,
dual-core multiprocessing (AMP/SMP)
confgurations, and hardware SIMD
instructions for high-performance DSP
and media functions.
Fig. 1: TI ofers six platforms that contain ARM-based processors with a wide range of cores to
address varying performance, power, and cost requirements across nearly all application markets.
Economy oscilloscopes redened.
Oscilloscopes Redened. With its brilliant 8.5-inch screen, fast update rate, full
upgradability and 5-in-1 instrument integration, the Agilent 2000 X-Series oscilloscope
is already rst in class. Now with more memory depth, new serial decode options and
5-year warranty, its accelerating ahead. Experience the complete InniiVision line for
oscilloscope features and performance you need at prices that will surprise you.
See the InniiVision
X-Series oscilloscopes
www.newark.com/Agilent_Scopes
Agilent and our
Distributor Network
Right Instrument.
Right Expertise.
InniiVision 2000 X-Series
70 to 200 MHz
New memory depth up to 1 Mpts
New serial decode options*
New 5-year warranty
Starting at $1,258**
100 MHz to 1 GHz
8.5-inch display
Update rate to 1 million wfms/s
Memory depth up to 4 Mpts
*I2C, SPI, CAN, LIN, RS232, UART **Prices are in USD and are subject to change
200 MHz to 1.5 GHz
12.1-inch touch screen
InniiScan Zone touch triggering
Update rate to 1 million wfms/s
Memory depth up to 4 Mpts
800-463-9275
www.newark.com/agilent
36 Cover Story
For real-time control, the Cortex-R
core uses tightly coupled low-latency
memory, which allows a fast response
to real-time events. Tese real-time
response features provide high DMIPS/
MHz benchmark and clock frequency.
Unique to the Cortex-R core is
the memory protection unit (MPU),
dual-core lockstep confguration, and
automated parity checking and error
correction for hard and sof errors.
Tese features set these cores apart for
safety applications such as automo-
tive braking systems, renewable energy,
safety monitors, mass storage controllers,
networks, and printing. For example,
Texas Instruments uses Cortex-R as a
dual lockstep core, on its Hercules MCUs
targeted at functional safety applications.
ARM Cortex-M: Te Cortex-M ar-
chitecture was designed for applications
requiring fast and highly deterministic
interrupt management with the smallest
footprint and low power consumption.
If the end product needs to enable rich
features, ARM Cortex-M cores run at a
lower speed with shorter activity periods
and its special sleep-mode architecture.
Te Cortex-M ofers a high-density in-
struction set and has smaller RAM, ROM,
and fash requirements, which means
smaller amounts of sofware code to lower
silicon costs. If your product needs robust
features while ofering low-power modes,
this is the core of choice. Cortex-M-based
MCUs are excellent for most MCU-based
applications, including mixed-signal
devices, smart sensors, portable health and
ftness devices, metering, and automotive
electronics.
Choosing a vendor for your
ARM-based processor
Because many silicon companies license
the ARM cores, its important to examine
the diferentiating elements the company
includes with their ARM core the pro-
cess technology, integration, peripherals,
intellectual property, and system exper-
tise needed for your specifc application.
Sofware, development tools, and support
are all also very important to keep design
time short and to diferentiate products
using custom sofware tweaks.
For example, TI ofers six platforms
that contain ARM-based processors
with a wide range of cores to address
varying performance, power, and cost
requirements across nearly all application
markets (see Fig. 1).
Many silicon companies ofer scalabili-
ty with ARM portfolios both hardware
(pin compatibility) and sofware. Given
that sofware can drive more than 50% of
a products total development costs, de-
velopers need to be able to create multiple
products on a single development efort.

Beginning development on
ARM designs
Once the correct processor is identifed,
attention turns to the development tools.
A strong tool suite can accelerate design,
test and debug, but a processor that lacks
a strong development environment will
result in developers fghting their tools.
Tis can delay a products launch or require
key diferentiating features to be dropped
Our GRN Series is Growing!
www.ipdpower.com [email protected]
570-824-4666 Fax: 570-824-4843
300 Stewart Road
Wilkes-Barre, PA 18706
ipdpower.com
GRN 45 & GRN 60 Series Power Supply
For Medical and Industrial applications
45 Watt Multi Output: 60 Watt Single Output:
2.5 x 4.25 x 1.0 Size 2.0 x 3.0 x 1.0 Size
86% Peak Efciency >90% Peak Efciency
<
1 Watt No-Load Input Power
<
0.3 Watt No-Load Input Power
EN 60601-1 & EN 60950-1 Safety EN 60601-1 & EN 60950-1 Safety
GRN 80 Series Power Supply
For Medical and Industrial applications
80 Watt Multi Output: 80 Watt Single Output:
3.0 x 5.0 x 1.0 Size 2.5 x 4.25 x 1.0 Size
87% Peak Efciency 89% Peak Efciency
<
1 Watt No-Load Input Power
<
0.3 Watt No-Load Input Power
EN 60601-1 & EN 60950-1 Safety EN 60601-1 & EN 60950-1 Safety
Accepted
Cover Story 37
in late design cycles.
Important development tool consider-
ations include:
Maturity and completeness of the tool
chain and the development environ-
ment, which helps developers identify
potential issues early in the design cycle
and resolve late-cycle hardware issues
through sofware workarounds.
Availability of a range of development
boards that provide a means for jump-
starting application development while
hardware prototypes are designed.
Use of an OS to manage the multi-
tude of tasks a system must perform.
Feature-rich sofware development kits
supporting each OS should include a
wide range of example applications and
middleware.
Efcient multiprocessing tools man-
age multi-processor, multicore and
multi-threaded programming in a man-
ner that makes much of the complexity
transparent to developers.
An organized development community
that is embraced by the silicon provider
can provide support among its members
through shared code and expertise.
System profling and performance analy-
sis tools provide extended lifetime of the
device by getting more out of the part
without having to buy more expensive
or newer ones.
Some development kits
For hobbyists and engineers alike, one of
the best ways to begin learning to develop
with ARM is to take a hands-on approach
using a basic, low-cost development kit. As
an example, for entry-level development on
ARM-based processors, TI recommends
the following low-cost platforms:
Tiva C Series LaunchPad: Tis evaluation
platform for the Tiva C Series ARM
Cortex-M4 MCU is available for $12.99.
Te platform also supports TIs Booster-
Packs, a series of modular plug-in boards
that can stack on top of the LaunchPad
baseboards, providing additionally
functionality such as wireless, capacitive
touch, and LED control.
Hercules LaunchPad: For designers inter-
ested in ARM Cortex-R development or
functional safety designs, the Hercules
LaunchPad provides a platform at
$19.99. Tis enables developers to evalu-
ate the Hercules MCUs and experiment
with the ARM Cortex-R dual-core very
inexpensively.
BeagleBone Black: Based on TIs Sitara
AM335x, the $45 BeagleBone Black
development board provides an excellent
introduction to both the ARM architec-
ture and open source development. It is
supported by a complete Linux operating
Hi-Speed Digital Optoisolators
A
GNDA
B
GNDB
V
DDA
A
V
DDA
CHANNEL 2
V
DDB
LED
INB2
V
DDA
OUTA2
A
V
DDA
LED
INA1
V
DDB
OUTB1
B
B
V
DDB
V
DDB
CHANNEL 1
1
2
3
4
8
7
6
5
CPC5001
LED
LED
1
2
3
4
8
7
6
5
V
DD
OUT1
OUT2
GND
A1
K1
K2
A2
CPC5002
IXYS Integrated Circuits Division (Formerly Clare, Inc.)
78 Cherry Hill Drive, Beverly, MA 01915, 978-524-6768
Operates From 2.7V to 5.5V Buffered Inputs - No
LED Drive Required Voltage Level Translation Input
Hysteresis for Noise Rejection Slew-Limited Drivers
Reduce EMI 3750V
rms
Galvanic Isolation 5Mbd Data
Rate (typ) Power-Down to Hi-Z Does Not Load Outputs
Buffers Two Independent Signals Output Operates
From 2.7V to 5.5V Power-Down to Hi-Z Does Not
Load Outputs LED Drive Only 1.5mA High Speed
10Mbd (typ) 3750V
rms
Galvanic Isolation
Passing DC signals
without refresh clock
Minimizes EMI and RFI
Pb
e3
system with full-featured web servers,
native compilers and scripting languages,
video analytics libraries and much more.
Many complete operating and develop-
ment environments are supported by
community and third-party developers,
such as Android, OpenEmbedded,
Windows Embedded, QNX, Ubuntu,
Symbian, Debian, Fedora, Gentoo, and
FreeBSD.
38 Special
RTOS and embedded Linux systems need a
custom solution
BY ALAN GRAU
President, Icon Labs, www.iconlabs.com
E
mbedded devices, including factory
control systems, smart-grid control
devices, medical instruments, and
consumer electronic devices, are the fast-
est growing segment on the Internet.One
report predicts that the number of embed-
ded devices on the Internet will be five
times the number of PCs by 2015. Over
half of new embedded designs include
networking.
Te result is a vast array of devices per-
forming critical functions that are at risk
of cyber-attack. One does not have to look
far to fnd examples of successful attacks
against embedded devices.
Endpoint security requirements
Endpoint security is in contrast to network
security, where you assume the device is
safe if it is on a network that is secure (i.e.,
behind a corporate frewall). Unfortunately,
a dedicated hacker can penetrate most cor-
porate frewalls, or the attack could originate
from inside the corporate network. End-
point devices need their own wall of defense.
Te requirements for endpoint security
in embedded devices are the same as for
PCs on a corporate network. If the network
supports a network security manager and/
or a Security Information and Event Man-
ager (SIEM), then the endpoint security
solution should support integration with
these management systems. While the
requirements for embedded devices are
the same as for PCs, the solution must be
diferent. Endpoint security solutions for
Windows or Linux PCs won't work in em-
bedded and RTOS-based systems. RTOS
and embedded Linux systems typically
require a custom solution.
Fig. 1: Attacks
can come from
anywhere.
Myths about endpoint security
for embedded devices
GAN POWER AMPLIFIERS
Wideband 50 Matched Power to 25W
Features
n High Output IP3: +48 dBm
n 35% PAE
-40
-30
-20
-10
0
10
20
30
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5
S21 S11 S22
R
E
S
P
O
N
S
E

(
d
B
)
FREQUENCY (GHz)
PAE vs. Pin
0
5
10
15
20
25
30
35
40
45
50
6 9 12 15 18 21 24 27 30 33
2 GHz 4 GHz 6 GHz
P
.
A
.
E
.

(
%
)
PIN (dBm)
Gain vs. Return Loss
HMC1086
25W POWER AMPLIFIERS 2 TO 6 GHZ
Features
n High Output IP3: +45 dBm
n 24% PAE
PAE vs. Pin
0
5
10
15
20
25
30
35
40
0 3 6 9 12 15 18 21 24 27 30 33
2 GHz
4 GHz
6 GHz
8 GHz
10 GHz
12 GHz
14 GHz
16 GHz
18 GHz
P
.
A
.
E
.

(
%
)
PIN (dBm)
0
2
4
6
8
10
12
14
16
18
20
2 4 6 8 10 12 14 16 18 20
+25C +85C -40C
G
A
I
N

(
d
B
)
FREQUENCY (GHz)
Gain vs. Temperature
HMC1087 HMC1087F10
8W POWER AMPLIFIERS 2 TO 20 GHZ
IN STOCK GaN MMIC POWER AMPLIFIERS
Part
Number
Frequency
(GHz)
Function
Gain
(dB)
OIP3
(dBm)
Psat
(dBm)
Power Gain
@ Psat (dB)
Bias
Supply
Package
HMC1086 2 - 6 GaN MMIC PA, 25W 22 +48 +44.5 14 +28V @ 1100 mA Chip
HMC1086F10 2 - 6 GaN MMIC PA Flange-Mount, 25W 23 +46 +44.5 11 +28V @ 1100 mA F10
HMC1087 2 - 20 GaN MMIC PA, 8W 11 +45 +39 5.5 +28V @ 850 mA Chip
HMC1087F10 2 - 20 GaN MMIC PA, Flange-Mount 8W 11 +43.5 +38.5 6.5 +28V @ 850 mA F10
For General Communications, Test Instrumentation, and Radar Applications.
Analog, Digital & Mixed-Signal
ICs, Modules, Subsystems & Instrumentation
HMC1086F10
2 Elizabeth Drive Chelmsford, MA 01824
978-250-3343 tel 978-250-3373 fax
www.hittite.com [email protected]
Receive the latest product releases - click on My Subscription
Download Hittite at the App Store
40 Special
Why embedded devices lack
comprehensive endpoint security
Historically, embedded device engi-
neersand developers did not believe
they needed comprehensive endpoint
security. Tis philosophy is generally
based on one or more of the following
assumptions:
Embedded devices are not vulnerable
to the common Internet-based threats
such as viruses
and DoS (denial
of service) attacks. Te designs
are special purpose and only
process packets they are ex-
pecting. Since the device is not
listening for packets on gener-
al-purpose ports like a PC, they
are safe from attack.No one is devel-
oping attacks specifcally for embedded
Fig 2: Floodgate Defender
provides protection from cyber-
attacks along with situational
awareness and integration with
security management and SIEM
systems.
devices.Attacks built for one embedded
device will not scale to another device
or class of devices. It doesn't matter if an
embedded device is attacked. It will just
reboot and begin processing again.Te
device is secured by encrypting com-
munication and ensuring remote log-ins
are secure. Tat is all that is needed.Te
device will only be used on a private
network so there is no need to worry
about it being attacked. Each of these
assumptions is based onfaulty or outdated
thinking.
Not vulnerable: While embedded
devices are generally not vulnerable to
Windows viruses, there are a growing
number of other Internet-based attacks
to which they are vulnerable. DoS
attacks are on the rise, and many of these
attacks are general attacks and against IP
addresses.Tey do not necessarily target
a specifc enterprise, domain, or operating
system. New attacks are constantly being
launched, and some specifcally target
embedded systems.
Many embedded devices now have a
web server. Tese embedded web servers
are ofen susceptible to general attacks
against web services.
Attacks will not scale to another
device: Te embedded systems space has
a large percentage of designs based on a
few leading RTOSes or Linux. As a result,
the argument that an embedded device is
secure from Internet-based attacks because
it uses an obscure, difcult to understand
(and therefore difcult to attack) RTOS is
no longer valid.
Attacks built for Linux based systems in
the enterprise area are likely to be efective
against Linux-based embedded systems.
Attacks that are constructed against an
RTOS are also likely to be successful
against many diferent designs built using
that RTOS. Attacks against web services
can be used on any embedded device
with a web server.
Engineering is Our Passion
Engineers solve problems. Our engineers recognize the need for a better
way to calibrate a sensor to its mechanical environment. Melexis builds a
portfolio of programmable sensor ICs; eliminating mechanical fine-tuning
with EEPROM calibration. Programming is done at end-of line production,
normalizing assembly, material and environmental variances.
Re-Programmable For Truly Sustainable Applications
Design change? No worries. An end-user redesign or material change can
make todays sensor module obsolete. Melexis Programmable Sensors make
YOUR products re-programmable for new mechanical or environmental
parameters or even a custom version of your product to YOUR customer.
We Engineer
The Sustainable Future.
n End-User Programmable - EEPROM calibration
for mechanical and temperature compensation.
n End-Of-Line Programming - The output pin(s)
multiplex as programming pin(s) for calibration
in actual operating environment.
n Support Available - Programming hardware,
software and applications support available for
all our innovative programmable sensors.
See All Our Programmable Sensors At:
www.melexis.com/calibrate
WE ENGINEER
Programmable Sensors
For The Sustainable Future
Melexis-Programmable-Sensors-EP-Halfpage-Island.indd 1 4/3/13 4:35 PM
Special 41
A special-purpose design: Embedded designs are
becoming increasingly complex and the argument for security
by simplicity is frequently no longer valid. Tere are ofen
services provided by the OS that developers' are not aware of.
Many systems are designed by large teams where no one person
has a complete view of everything happening on the system.
Future releases of the design may include additional features
not envisioned by the original team and some embedded
designs, such as a cell phone or set top box, are now a platform
on which applications developed by third parties can run.
In these cases the engineer has little or no control over the
possible uses of the device.
Attacks are not on embedded devices:
Many attacks are now script-based and will attack IP addresses in-
discriminately. Tese will attack embedded systems just as happily
as they will a PC or enterprise. Attacks have been launched that
specifcally targeted embedded devices.
My system will just reboot: While this may be true in some
instances, embedded devices now handle critical tasks in all
felds. Even if this statement is true today, it is short sighted. Many
embedded designs are reused as the basis of future systems with
greater capabilities.
I encrypt communication and use logins: While these
steps are critical, they do not protect against attacks on the OS or
those directed against the embedded CPU. Tis is the equivalent of
having a secure phone line into your house and a lock on the front
door, but leaving the windows and the back door wide open.
My device is on a private network: Many attacks originate
from within a network. Tis can be the result of the network being
compromised by a laptop with a Trojan or other infection and you
have to consider an inside attack by someone who is authorized to
access the network. If the device is not connected to the Internet
today, it may be next month, or next year. It is difcult to predict
how a device will be deployed in the future or how network
confgurations will change.
Tere are examples of hackers successfully breaching SCADA
systems, pacemakers, insulin pumps, train control systems, the
emergency broadcast system of several television stations, and a
host of other examples. Te evidence is clear: Embedded devices
need a much higher level of security than has traditionally been
provided.
Implementing endpoint security: Tere are three key
elements that an endpoint security solution must provide:
protection, situational awareness, and management systems
integration.Products are available that provide a solution designed
specifcally for RTOS-based systems. Icon Labs Floodgate
Defender is an example of such aproduct.
A solution such as this incorporates protection of the device
itself along with management and situational awareness. Te
security agent provides integration with security manage-
ment and Security Information and Event Manager systems.
Situational awareness is key, as it allows for visibility of device
attributes and status. Tis visibility has long been a cornerstone
of endpoint security in desktop systems, but has been sorely
lacking in embedded devices.
ep page master 50v.indd 1 7/8/13 11:22:50 AM
42 Special
Tripling the power of PoE
Advanced PMICs enable new PoE products that need up to 90 W
and require intelligent energy management
BY ELIE ANTOUN
President and CEO, Director
Akros Silicon, www.akrossilicon.com
P
ower-over-Ethernet (PoE) has
evolved over the past decade from
the initial 7-W Inline
Power standard that was
introduced by Cisco in 2000, to
the PoE standard (IEEE 802.3af)
of 13 W in 2003, and now to the
current PoE+ (IEEE 802.3at)
standard of 30 W. But todays
PoE standards are quickly ad-
vancing to accommodate much
higher power devices.
In 2011 Cisco introduced
a new 60-W implementation
it calls UPOE (see Fig. 1). And
the IEEE is working on a new
standard aimed at this higher
power requirement. With its 60 W and
potential increases to 90 W of power
that can be delivered over the standard
Ethernet Cat5e/Cat6 cable and RJ-45
connector scheme, 60 to 90-W PoE will
make it possible to power an exceptionally
wide range of products such as thin clients,
IPTVs, IP turrets, remotely controlled vid-
eo cameras, point-of-sale (POS) terminals,
as well other devices currently requiring a
separate power source.
Perhaps the most important beneft of
the PoE evolution is the ability
to intelligently manage energy
consumption over the enter-
prise. By using energy man-
agement ICs in each powered
device (PD), the power-sourc-
ing equipment (PSE) can modu-
late the power delivered on a
node-by-node basis, therefore
enabling a far more efcient use
of the PSE power supply. And as
more and higher power devices
are added to the PoE network,
intelligent energy management
will become more important.
Fig. 1: Te evolution of PoE has moved beyond the current 30-W
standard (Cisco Systems).
Membership
Delivers Savings
ACEC members may receive up
to 12%
*
savings on their annual
health insurance premium.
What if you could pay less for health insurance?
Membership in ACEC offers many perks, including
favorable rates for health benefts through the ACEC
Life/Health Trust insured by UnitedHealthcare.
As an ACEC member, you may beneft from:
Outstanding service Youll have a customer
care team dedicated to your account.
A broad network 98% of the U.S. population
has local access to a UnitedHealthcare provider.
**
Your choice of broker Theres no need to
switch agents.
Streamlined administration Moving from your
current health plan is surprisingly simple.
Learn how your engineering frm can beneft from
membership in ACEC and the ACEC Life/Health Trust
insured by UnitedHealthcare.
Call 1-877-263-3591 for more
information today!
The American Council of Engineering Companies (ACEC), the ACEC Life/Health
Insurance Trust and UnitedHealthcare Insurance Company are three separate
legal operating entities and, as such, the organizations are governed and function
independently. UnitedHealthcares services are provided with the authorization of the
ACEC Life/Health Trust. Questions related to health benefts offered through the Life/
Health Trust should be directed to 1-800-573-0415. HMO products dont apply. ACEC
membership qualifcation is determined by the association.
* Potential 12% savings on annual premiums for businesses with 2-99 employees, as
compared to UnitedHealthcare products sold outside the ACEC Life/Health Trust.
**

Network statistic based on GeoAccess information and UnitedHealthcare standard
network access mileage criteria, 2010.
2013 United HealthCare Services, Inc. Insurance coverage provided by or through
UnitedHealthcare Insurance Company or its affliates.
savings
on annual premium
Up to
12%
*
UHCEW653117-000
Insured and serviced by:
44 Special
access control nodes) and medium-power
devices (for example, IP security camer-
as and wireless access points), as well as
higher-power devices like IPs TVs, POS
terminals and thin client computers. With
this broad range of power requirements, it
now becomes all the more important for
designers to manage the PSE power output
delivered to each node.
Questions they need to consider
include:
What is the maximum power required at
each node in the network?
What are the power losses in the cable to
each node?
Higher-power PoE structure
Te typical implementation of 15-W PoE
(IEEE 802.3af) and 30-W PoE+ (IEE
802.3at) delivers power from the power
sourcing equipment to the powered devic-
es using two of the four twisted pairs in a
standard Cat 5e or Cat 6 cable. Two vari-
ations of this scheme are possible. In the
most common implementation scheme,
power is superimposed on the signal pairs
(see Fig. 2a); in the other, the spare pairs
are used to deliver power (see Fig. 2b). In
either case, the PSE provides nominal 48-
Vdc common-mode power of either polari-
ty to the PD. Each PD extracts the power
using a diode bridge to deliver the power to
the power conversion circuitry.
Te higher-power (60 to 90-W) PoE
uses all four pairs in the cable to provide
power. Te PSE has two separate power
supplies, each capable of delivering 30 to
45 W of power to any PD node. Te two
parallel power sources are then applied
through two diode bridges as input sources
to the PD power management (see Fig. 2c).
Tis power delivery system greatly
expands the range of devices that can be
added to the network. Te PSE will now
have devices that require only a few watts
of power (for example, IP phones and
EUROPE
IXYS GmbH
[email protected]
+46 (0) 6206-503-249
USA
IXYS Power
[email protected]
+1 408-457-9042
ASIA
IXYS Taiwan/IXYS Korea
[email protected]
[email protected]
www.ixys.com
4500V Power MOSFETs
Ideal For Very High Voltage Power Conversion Applications
D
S
G
Features:
Silicon Chip on Direct-Copper Bond (DCB) Substrate
Molding Epoxies meet UL 94 V-0 Flammability Classifcation
Isolated Mounting Surface
High Blocking Voltage
High Voltage Packages
Up to 4500V electrical isolation
Space Savings
High Power Density
4500
4500
4500
4500
4500
4500
2
2
2
9
1
2
750
750
750
95
85
23
256
256
256
1730
1730
6900
10.4
10.4
10.4
40
40
156
1600
1600
1600
1750
1750
1750
78
113
113
165
520
220
1.60
1.10
1.10
0.770
0.240
0.56
V
DSS
Max
(V)
ID(cont)
T
C
=25C
(A)
R
DS(on)
Max
T
J
=25C
()
C
ISS
Typ
(pF)
Q
g
Typ
(nC)
t
rr
Typ
(ns)
P
D
(W)
R
thjc
Max
(C/W)
ISOPLUS i4-Pak
TO-268HV
TO-263HV
ISOPLUS i4-Pak
TO-268HV
ISOPLUS i5-Pak
Package
Style
Part Number
IXTF02N450
IXTT02N450HV
IXTA02N450HV
IXTF1N450
IXTT1N450HV
IXTL2N450
Laser
X-Ray Generators
Semiconductor Equipment
High Voltage Power Supply
(a)
(b) (c)
Fig. 2: Tree implementations of POE are shown here. In the most common implementation scheme of 15-W PoE (IEEE 802.3af) and 30-W PoE+ (IEE 802.3at),
power is superimposed on the signal pairs (a). In another, the spare pairs are used to deliver power (b). Te higher-power (60 to 90-W) PoE uses all four pairs in
the cable to provide power; the two parallel power sources are then applied through two diode bridges as input sources to the PD power management (c).
Generate tthheee eexxaacct waveforms you want.
Introducing AAgiileennt Trueform technology. m
33500B Series Waveform Generators
Sine waves with 5x lower harmonic distortion
Pulses up to 30 MHz with 10x less jitter
Point-by-point arbitrary waveforms with sequencing
16 -bit resolution with 1 mV
pp
to 10 V
pp
amplitude
8 upgradable models in 20 & 30 MHz
Agilent 33500B Series waveform generators
with exclusive Trueform signal generation
technology offer more capability, delity
and choice than traditional DDS generators.
Get the precision and exibility you need to
characterize new components and designs
with superior condence. And accelerate
development from start to nish.
Learn more about the advantages
of Trueform waveform generation
www.testequity.com/Agilent_Function
800-732-3457
www.testequity.com/agilent
Agilent and our
Distributor Network
Right Instrument.
Right Expertise.
46 Special
Is the PD operating on a continuous
basis or can it be on standby at times?
If the PSE is required to supply the
maximum power to each port on a con-
tinuous basis, the size of the PSE power
supply would have to be considerably
larger than needed under most operating
conditions. Te capability of delivering
power to each PD at the level required and
only when required has the dual beneft of
reducing the size of the PSE power supply
and allow the supply to operate at levels
closer to peak efciency.
Implementation of 60- /90-W PoE
Implementation of advanced PoE systems
will require the availability of power sourc-
ing equipment that is capable of delivering
60-W or even 90-W of power, as well as
an efective technology solution for power
device product manufacturers to incorpo-
rate into their new designs.
In order to achieve the requirements
listed above for PoE implementation of
PDs at these higher power levels, a total
energy management approach is needed
that not only provides high-efciency
power conversion ICs, but also focuses
on total system efciency. Te objective
is to dynamically control the power by
monitoring the environment resulting in
truly efcient system designs not just of
power sub-conversion. Additionally, a total
energy management approach minimizes
emissions, systematically, at the source.
Te 60-/90-W PoE implementation at
the PD needs to take into consideration a
number of important factors, including:
Multi-rail power conversion confg-
urable to voltages required for device
sub-systems including LED backlighting.
Real-time energy monitoring such as
input power measurements, power system
health monitoring on a continuous basis.
High-efciency conversion including
light load management, ultra-low stand-
by power and sleep-mode power.
Fast system dynamic response and se-
quencing control including the ability
to rapidly change operating mode of
the device from continuous to discon-
tinuous modes and to rapidly go in and
out of standby and sleep modes; fexible
sequencing control to optimize multi-
ple-rail output power start-up.
Fig. 3:
Interoperability
of Broadcoms
PoE PSE
controller
(BCM59111) and
Akros SoC IC
(AS860).
Special 47
Digital power control such as voltage margining to manage
power consumption under difering performance requirements,
managing standby and sleep requirements.
High-efciency EMI control and mitigation that minimizes ra-
diative and conductive emission noise from the power supplies.
As this list suggests, intelligent energy management takes ad-
vantage of the ability of the PSE and PDs to communicate with each
other to operate the network at optimum efciency. Tis requires the
integration of a large number of functions including power conver-
sion, isolation, communications and control. Integrated system-on-
a-chip (SoC) solutions are becoming available handle all or most
of these requirements; and without an SoC solution higher-power
(60 W and above) PoE PDs would require multiple components,
such as two or three power management ICs, several optocouplers
and custom transformers. In addition to adding component cost,
consuming board space and increasing design complexity, these
approaches are vulnerable to shoot-through issues and losses due to
rectifer diode and reverse recovery.
For example, Akros Silicon has developed a SoC solution that
can accommodate 60 W and above PoE applications using just two
components: one AS1860 SoC and one external FET. Moreover,
by integrating the companys GreenEdge digital isolation technol-
ogy, the AS1860 enables the implementation of many advanced
diagnostic and high-voltage telemetry features that allow operators
to remotely manage power, which in turn enhances reliability and
energy efciency.
PSE to PD interoperability
Te IEEE has instituted a working group to establish a new PoE
standard for the rapidly approaching higher-wattage implemen-
tation. In the meantime, it will be important for designers to be
assured of interoperability between PSE and PD implementation.
Recognizing this, Akros has entered into an interoperability col-
laboration with Broadcom, a leading producer of PoE PSE power
controllers. Broadcoms model BCM59111 and Akros Silicons
AS1860 (see Fig. 3) interoperability was demonstrated at Electroni-
ca in November 2012.
Interoperability is a key factor in achieving intelligent energy
management. Communications between the PSE power man-
agement controller and each PD provides information, including
instantaneous load requirements, cable losses, system status, and
other operational data. Te AS1860 SoC includes I/O functions,
anintegral A/D converter, and on-board digital isolation that com-
bine to provide seamless data communications with the PSE.
As Ethernet bandwidths continue to increase, the nature of the
devices that will require PoE will also increase. With bandwidths
supporting IPTVs, POS terminals and other such devices, the
need to manage system power will become even more important.
Te power requirement for power sourcing equipment will be
managed by having the ability to adjust the power delivered to
the powered devices under widely varying operating conditions.
Te PDs will be required to provide this information in real time
and respond to PSE control inputs. A total energy management
approach can provide a fexible, cost-efective means of responding
to the evolving and increasing demands of PoE systems.
DATA MODUL Inc.
275 Marcus Blvd | Unit K Hauppage | NY 11788 - USA |
Phone: +1-631-951-0800 | www.data-modul.com
THE ONE STOP SUPPLI ER FOR
ALL YOUR DI SPLAY, TOUCH AND
EMBEDDED REQUI REMENTS!
DI SPLAYS AND EMBEDDED SOLUTIONS
Contact us with any of your display, touch or embedded re-
quirements on +1-631-951-0800 / [email protected]
EMBEDDED
TFT, LCD AND OLED DI SPLAYS
TOUCH SCREENS
TOUCH
With in-house design and manufacturing facilities,
DATA MODUL can meet all your requirements for design,
integration or kit supply.
- Qseven, COM Express, 3.5, EPIC, Nano-ITX and Mini-ITX
- based on Intel
i-Core and AMD Embedded G-Series

- Adaptation and integration of all available displays
- ARM Modules
up to
Quadcore
Cortex A9
- Intel
Atom
platforms
EMBEDDED
48 Product Trends
Insight into current product developments
Sensor fusion
and potential
healthcare
benefits
S
ensors are now found in a wide variety of applications, including healthcare. Used al-
most everywhere, sensor technology is now beginning to closely mimic the ultimate
sensing machine: the human being. Te technology that allows this to happen is sen-
sor fusion, which leverages a microcontroller (a brain) to fuse individual data collected
from multiple sensors to get a more accurate and reliable view of the data than one would
get by using the data from each discrete sensor on its own.
How sensor fusion works
Sensor fusion technologies give users an enhanced experience, leveraging and combining
3D accelerometers, 3D gyroscopes and 3D magnetometers (which measure the components
of the magnetic feld in a particular direction, relative to the spatial orientation of a given
device). Each of these sensor types provides unique functionality, but also has limitations:
Accelerometer: x-, y-, and z-axis linear motion sensing, but sensitive to vibration.
Gyroscope: pitch, roll, and yaw rotational sensing, but zero bias drif.
Magnetometer: x-, y-, and z-axis magnetic feld sensing, but sensitive to magnetic
interference.
Sensor fusion takes the simultaneous input from multiple sensors, processes the input and
creates an output that is greater than the sum of its parts. Tat is, by using special algo-
rithms and fltering techniques, sensor fusion eliminates the defciencies of each sensor.
Te most important aspect of sensor fusion is providing context to the situation being
analyzed. It would be impossible to provide situation-appropriate information without
knowledge of the context, and ideally this context can get provided in real time, as the
action is taking place, and without the need for human intervention. Sensor fusion ofen
refers to a combination of a 3D accelerometer, gyroscope and magnetometer. Tis con-
fguration is called a 9-SFA (nine sensor fusion axis) solution (see Fig. 1), which afords the
user 9 DoF (nine degrees of freedom). In 2012, Freescale introduced an Xtrinsic sensor
platform for Windows 8 that supports 12-DoF sensor fusion.
Today a variety of body-worn sensors are being used for ambulatory monitoring of
gait (the pattern of movement of the limbs during locomotion).
A variety of sensors such as ECG, EMG, accelerometers, magne-
tometers, gyroscopes, thermometers, light sensors, and vibration
sensors are being used in wearable devices in clinical settings for
gait monitoring and rehab. Advances in miniaturization of MEMS
devices, powerful yet MCUs capability and energy-efciency , and
low-power connectivity have enabled a new category of wearable
consumer medical devices that focus on continuous monitoring
of personal health, rather than waiting for chronic conditions to
set. Wearable devices, along with gateways that tie together other
types of sensor information, will enable regular biometric readouts
to health care providers and, along with personal health records,
provide cloud-based remote, or telehealth, services (see Fig. 2).
Te potential for wearables has given rise to a movement called
self-quantifcation, where individuals use technology to acquire
data on certain aspects of the daily life of a person being examined.
For more examples of how sensor fusion is afecting medicine, see
http://www.electronicproducts.com/Sensors_and_Transducers/
Sensors/Sensor_fusion_and_potential_heathcare_benefts.aspx
Fig. 1: In this nine-degree-of-freedom
(9-DoF) system block diagram, outputs
of a 3D accelerometer, a 3D gyroscope,
and a 3D magnetometer are combined to
produce more information for the user. Tis
approach was codifed by Microsoffor its
Windows 8 sofware system.
Fig. 2: In this telehealth example, a Bluetooth-based wearable device
links to a mobile handset that communicates with a healthcare
provider who can access medical records on a secure remote server.
BY KAIVAN KARIMI, Executive Director
Global Strategy & Business Development,
Freescale Semiconductor, www.freescale.com
For all the latest
info check the
website
HI -REL I NNOVATI ONS
High Reliability
products from
Syfer Technology
From medical to space
applications it is essential to
have the right product for the
right environment. Syfer has
the experience and know-how
to work with users to ensure
they are condent that they
have the right product, no
matter what the demands of
the application.
Syfers products include
IECQ-CECC, AEC-Q200, Space
and MIL grade surface mount MLC
capacitors, radial MLC capacitors,
planar arrays and discoidals as well as
EMI lter products.
Hi Rel
Hi Rel
50 Product Roundup
LEDs
T
he following are a fewproducts
that demonstrate the technology
gains and price reductions weve
seen recently in the LED market.
Te Vero series of LED array products
from Bridgelux (www.bridgelux.com)
features an industry best 122 lm/W nom-
inal efcacy. Te Vero platform enables
plug and play connectivity for lighting
manufacturers, enabling leading solid
state lighting product performance
capabilities while streamlining
production processes for
lighting manufacturers.
Tese capabilities lead to
shorter product develop-
ment times, lower inven-
tory requirements, reduced
costs and more light with
less energy.Vero arrays are
compatible with a wide variety of
standard drivers (350-mA incre-
ments) and optical components,
providing manufacturers
with greater fexibility and
a wide range of options,
shortening product devel-
opment times, lowering
inventory requirements and
reducing costs.
Wilbrecht (www.wil
brechtledco.com) introduced
the 100/600 series, CR/BR/
CC and CRM/BRM panel
mount LEDs that target
front or rear panel mounting. Te pre-
wired assembly of a red, green or yellow
bipolar LED and a resistor work directly
from 120 or 240 Vac, as an LED power
indicator or as a drop-in replacement for
neon indicators. Te front-mount hous-
ing options include the 100/600 series
domed cylindrical and fush plastic lenses,
or the CR/BR/CC series screw on metal
housings for 0.312-in. holes. Rear mount
housings include the press ft L61 series
for 0.250-in. holes or the screw-on CRM/
BRM metal housing for 0.315-in. holes.
Te waterproof LED down light, GL-
DL06-IP from GlacialLight (www.Gla
cialLight.com) is a compact 6-in. down light
that that is IP54 rated and targets wet spac-
es including bathrooms, spas, and yachts. It
consumes 12 W and features non-dimma-
ble, ac-triac dimmable, and 3-in-1 dimma-
ble functions. All three confgurations have
three color temperature options.
Te LED down light installs in ceilings
by mounting or placing it in a ceiling
board. Te non-dimmable and 3-in-1
dimmable options are suitable for a wide
range of input voltages (100 to 240 Vac),
making them efective solutions for
almost all worldwide locations.
Cree (www.cree.com/lighting) intro-
duced the VG series parking garage
luminaire that deliver optimal,
low-glare illumination by
eliminating direct view of
the LEDs with an optical
system. Te luminaire se-
ries helps create a pleasing
appearance while delivering
high-performance lighting.
Te innovative product lowers
total cost of ownership and can
deliver payback in less than two
years. Te payback is calculated
compared to metal halide
and based on commercial
usage of 24 h/day and the
national average of $0.11/
kWh for electric costs.
Te Larson (www.
larsonelectronics.com) EXP-
LED-HL-DFX explosion
proof dual function LED
headlight can be worn on
a hardhat or directly on
the head, allowing hands-
free illumination for most hazardous
locations. Te headlamp features 120-lm
brightness, an LED lamp ftted with
a Luxeon emitter, and dual operating
modes with high output for maximum
brightness or low output for longer
operating times. It suits mining, utilities,
petrochemical and industrial manufactur-
ing operations.
Te MicroSideled 3806 LED from
Osram (www.osram-os.com) meets the
requirements tablets, ultrabooks and
smartphones that need high brightness
levels and good color rendering without
draining the batteries too rapidly. It is
efcient in white and blue, ofers consis-
tent brightness throughout its lifetime
of 15,000 hours, and can withstand high
temperature and high current.
Paul OShea
Vero LED array
from Bridgelux
Bipolar, panel-mount LEDs
from Wilbrech
Dont waste time searching the web to solve your design
problems.
Access the tools you need to specify the best circuit
protection and power management solutions with one
click.
Product datasheets, white papers and CAD les
Power management design support from in-house
mechanical and electrical engineers
Application advice from market experts with real
world experience
Visit www.e-t-a.com/knowledge today for the vital
resources to complete your design.
Visit www.e-t-a.com/knowledge
- Datasheet library
- CAD les
- Technology white papers
- Direct access to engineers
- Application advice
Circuit protection & power management
resources at the click of your mouse
2013_ad_31313.indd 1 3/14/13 2:54 PM
52 Industry Innovators
Pioneers in technology
As founder and CEO of Aldebaran
Robotics, he created NAO and
Next Gen NAO, programmable
humanoid robots
meet Bruno Maisonnier.
John Filippelli: What inspired the
NAO robot and Next Gen NAO?
Bruno Maisonnier: Te humanoid
shape and curved design are key factors
of the design and allow usersto interact
withthe machine. Cartoons and kids
have been source of inspiration for NAO
we wanted to create a cute robot with
whom you immediately want to interact.
John Filippelli:What upgrades/addi-
tions are included with the NAO Next
Gen robot compared to the original
NAO? Were these the only changes con-
sidered? Why or why not?
Bruno Maisonnier: One of the NAO
Next Gens novel and most remarkable
features is the fact that it is ftted with a
new on-board computer, based on the
powerful 1.6-GHz Intel Atom proces-
sor, which is suitable for multitasking
calculations. It also has two HD cameras
that are attached to a feld-programmable
gate array (FPGA). Tis set-up allows
the simultaneous reception of two video
streams, signifcantly increasing speed
and performance in face-and-object
recognition, even under poor lighting
conditions. As well as its innovative
features with respect to hardware, NAO
Next Gen boasts a new, faster, and more
reliable vocal-recognition program called
Nuance. Tis program is coupled with
a new functionality known as word
spotting, which is capable of isolating
and recognizing a specifc word within a
sentence or a conversation.
John Filippelli: I understand that the

goal is to have a NAO intended for indi-
viduals as opposed to only researchers
and developers what would that world
look like?
Bruno Maisonnier: Te Aldebarans
vision is to create a robot for the devel-
opement and well being of humankind.
In this way, we do all our research
and development turned toward this
objective. Dialogue, for example, is
a very important step for interacting
naturally with NAO. However, the world
of tomorrow will not be as described by
science fction movies with scary robots
killing humans. From the begining of
humanity, the technology gap has been
an anxious moment for people. But all
the time, the help and improvement
thatis given to usthrough technology
is defnitively adopted by society. We
Interviewed by
JOHN FILIPPELLI
To read/see other Industry Innovators
visit electronicproducts.com/innov
BRUNO
MAISONNIER
My vision is to create robots for the
development and well being of humankind.
imagine that will be the same with
robots. Te help that will give us will
be certainly accepted. Imagine, for
example, the possibility for elderly or
handicapped people to be more auton-
omous and independent at home with
their robots. So, the world of tomorrow
with robots would not be so darkas
some people want to believe.
John Filippelli: Can we expect other
members of the NAO family as well?
Why or why not?
Bruno Maisonnier: We are working
on ataller robot (120 cm), Romeo, to
provide it to labsto act as apersonal
assistant.
John Filippelli: What steps would
you recommend to others to become an
Industry Innovator in engineering?
Bruno Maisonnier: Dont stop
dreaming, believe in your innovation,
and strive to improve humanity.
Device Packages
3.05 x 2.05
x 1.0mm
TLM832DS
3.0 x 2.5
x 1.0mm
SOT-23F
4.7 x 4.5
x 1.7mm
SOT-89
6.7 x 7.3
x 1.8mm
SOT-223 SOIC-8
6.18 x 5.01
x 1.71mm
For more information or to request free samples
Call 631-435-1110
or visit: www.centralsemi.com/mpm6
Scan QR reader
barcode for direct
link to product
web page.
Select devices available in bare die form.
Centrals 2.0A thru 6.9A Medium Power MOSFETs
Part
Number
I
D

MAX
(A)
V
DS

MAX
(V)
V
GS
MAX
(V)
r
DS(ON)
@ V
GS

MAX

(m)

(V)
Package
Type
CXDM1002N 2.0 100 20 300 10 SOT-89
CMPDM202PH 2.3 20 12 88 5.0 SOT-23F
CMPDM302PH 2.4 30 12 91 4.5 SOT-23F
CZDM1003N 3.0 100 20 150 10 SOT-223
CMPDM203NH 3.2 20 12 50 4.5 SOT-23F
CMPDM303NH 3.6 30 12 40 4.5 SOT-23F
CTLDM303N-M832DS 3.6 30 12 40 4.5 TLM832DS
CTLDM304P-M832DS 4.2 30 12 70 10 TLM832DS
CWDM305P 5.3 30 16 72 10 SOIC-8
CWDM305PD 5.3 30 16 72 10 SOIC-8
CXDM6053N 5.3 60 20 41 10 SOT-89
CWDM305N 5.8 30 20 30 10 SOIC-8
CWDM305ND 5.8 30 20 30 10 SOIC-8
CXDM4060N 6.0 40 20 31 10 SOT-89
CXDM3069N 6.9 30 12 30 10 SOT-89
In response to todays engineers need for maximum
power density in an energy efficient small form factor,
Central Semiconductor has expanded its MOSFET
portfolio to include innovative energy efficient medium
power devices in a variety of industry standard
packages. Custom solutions, configurations, and
specifications are also possible, so bring your design
challenges to a Central Semiconductor Sales
Engineer today.
Applications include:
Motor controls
DC-DC converters
Charging circuits
Drive circuits
145 Adams Avenue, Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824
Rectifiers Diodes
Small Signal
Transistors
Bipolar Power
Transistors
Protection
Devices
Energy Efficient
Devices
www.centralsemi.com
MOSFETs
Please visit Central
at:
The Hyatt Regency Hotel,
Boston, MA, October 3,
Booth ES 27
www.tracopower.com
TRACOPOWER introduces six new series
of ultra compact isolated DC/DC-converters
for high performance applications
60 Watt in 6-side shielded 1" x2" metal package
30 Watt in 6-side shielded 1" x1" metal package
6 Watt in SIP-8 package
New Products 55
4:1 input dc/dc converter features 60-W output
Te FED60W series dc/dc converter features a 9 to 36 Vdc or
18 to 75 Vdc input range with an input current of 10 mA
at no load. Te converter features outputs of 3.3, 5, 12, 15,
24,12, 15, or 24 Vdc.
Te dc/dc converter has an input/output isolation of
1,600 Vdc and has a six-sided continuous shield in a standard
2 x 1 x 0.40-in package. Te device suits wireless, telecom, industrial
control, distributed power, and semiconductor equipment applications. It provides
under/over-voltage, over-current, short-circuit, and over-temperature protection.
P-Duke Technology: www.pduke.com
5-W USB adapter targets personal electronics
Te PSA05A 5-W, fxed-blade, USB power adapter targets personal elec-
tronics. It is compliant with North American input voltages and
has a Level V efciency compliant output of 5 Vdc and 1 A,
which suits charging lithium-ion batteries in small devices
with touchscreens, including smartphones, tablets, e-read-
ers, GPS, and media players.
Te 5-W USB wall-charger is equipped with overvoltage,
overcurrent, and short-circuit protection. It has a no-load power draw of less than
0.03 W. Te wall plug also features a 5-Star standby power rating, as well as safety
approvals from UL and cUL. It measures 2.29 x 1.69 x 0.83 in. and weighs 3 oz.
Phihong USA: www.phihongusa.com
www.globtek.com
Need Power?
Think
GlobTek
Green Power Supplies Meet Efficiency
Level V Requirements 90W
Desktop style
Power
Supplies with
IEC 60320/
C6, C8 or C14
inlets have
Double-
Enforced In-
sulation Mechanical Configurations, Reg-
ulated Outputs voltage from: 12 to 48Vdc
in 0.1V increments, up to 90W of cotinu-
ous output power. GlobTeks GT-41133
series of enclosed power supplies are
housed in Impact Resistant non-vented
Polycarbonate Case, Thermal conduction
Cooling, Case Dimensions: 62 x 150 x 34
(mm). This Family features: Regulated
output with very low ripple, Built-in
...for more click www.globtek.com
Lithium Ion
(Li-Ion) Battery
Charger
In response to in-
creased concern
and requirements
of portable equip-
ment and device manufacturers for safety
related to Lithium Ion (Li-Ion) batteries,
GlobTeks latest generation battery
charger designs include numerous redun-
dant safety features which when commu-
nicating with electronics in Lithium
(Li-Ion) batteries prevents failure or
damage of the battery pack during charg-
ing. Aside from safety, the charger in-
cludes many features to maintain and
lengthen battery life. The GlobTek GT-
93023-12012(R) is a customized bespoke
multiple-bay battery charger designed to
charge 5 battery packs in unison. The
International Power Cordsets
This wide range of
international power
cordsets are ap-
proved to interna-
tional safety agency
requirements. De-
signs are available
in various lengths,
cable types, conductor gauge, termination,
and jacket color. Cordsets are ideal for
portable equipment, communication,
video, power tools, consumer electronics
or industrial and medical equipment.
Many designs are available
ISO
9001:2008/
13485/14001
Certified
GlobTek Ad B 5.23.13_Electronic Products 5/29/2013 7:44 AM Page 1
Power Sources
56 New Products
High-isolation dc/dc converters offer 105C operating temp
Te PEM series is a family of low-power board mount unregulated dc/dc converters
that provide 3,000 Vdc I/O isolation and an operating temperature range from -40 to
105C. Te series features1-Wand2-Wversions that convert
and isolate dc-rails within a range of applications, such as
medical, industrial control, security, and telecom systems.
Te dc/dc converter series delivers efciencies
to 89%, a 5% increase over the frst-generation. Te
modules limit power draw under light and no load
conditions to further enhance the
performance across the entire load
curve, and reduce dissipated heat. It is housed
in an industry standard seven-pin SIP package measuring 0.77
x 0.28 x 0.39 in. Nominal inputs of 3.3, 5, 12, 15, and 24 Vdc
(10%) and output voltage confgurations of 3.3, 5, 9, 12, 15,
24, 5, 12, 15, and 24 Vdc are available.
CUI Inc: www.cui.com
For more information, call American Power Design
Phone 888/894-4446 , Fax 603/894-4291
Email [email protected]
www.apowerdesign.com
FuIIy ProgrammabIe DCJDC Converters
Outputs to 1000Vdc
M SerIes
` Input Ranges (10-20Vdc, 18-36Vdc)
` 1000Vdc Isolation
` Typical Efficiency 82
` Single Outputs to 1000Vdc
` Dual Outputs to +/- 500Vdc
` Programmable using 0-5Vdc Analog Signal
` On-board 5Vdc Reference
` Case Sizes 1Wx 2Land 2Wx 2Lx 0.4H
Compact constant current LED driver offers 7-W output
Te RACD07 LED driver features a voltage range
from 90 to 295 Vac and is suitable for worldwide
use. Te 7-W modules are available with constant
current outputs of 350-, 500-, or 700-mA.
For applications with limited space the LED
driver simplifes installation ofer both input and
output lead wires integrated into a single side, in-
cluding the mounting bracket. Te driver is IP67
rated and can be used in dry or
damp areas such as bathrooms or even outdoors. Te driver features
an input to output isolation voltage of 3,750 Vac for protection against
short circuit and overload. Te series is certifed to EN61347, EN61000-
3-2, as well as EN5015 Class C, with UL certifcation pending.
Recom Power: www.recom-power.com
Buy Now
Temp controller provides easy access and
data retrieval
Te 5R7-570(A) open-board tempera-
ture controller features a proportional
integral control algorithm to provide
precise control to thermoelectric (Pelt-
ier efect) modules. Te H-bridge con-
trol provides a seamless transition between heating and cooling
to eliminate dead spots. It provides a green LED to indicate heat,
blue for cooling mode, and simultaneous illumination of both to
indicate the load circuit is of due to an open sensor.
Pulse-width modulation helps control the power level in the
thermoelectric module at a base frequency of 1-kHz. It features
250-steps power resolution in the load circuit control. Te
controller measures 1.75 x 3.5 X 3-in., has a 6 to 28-Vdc input
voltage, a 0 to 36-Vdc output, a load current from 0.1 to 12.5
A, a 450-W output power control, control stability of 0.1C,
and a temperature range from -20 to 150C. Te temperature
Power Sources
New Products 57
Changeable-blade PoE
midspan suits global needs
Te Model GT-91085-1548 Power over
Ethernet (PoE) active injector ofers
an IEEE 802.3af-compliant solution
for remote powering of Wireless LAN
(WLAN) Access Points, Voice over IP
phones, and network security cameras.
Te 48-V active injector has automatic
detec-
tion and
protection
of legacy
Ethernet
terminals,
eliminates
the need
for external power supply and its associ-
ated ac/dc power cabling.
Te active injectors are available
with bicolor LED on top of enclosure,
an IEC320/C14 or IEC320/C6 ac-input
inlet, with RJ45 with built-in LEDs, or
with bicolor LED on top of the enclosure,
and changeable wall plug-in ac-blades,
with RJ45 with built-in LEDs. Te PoE
midspan allows users to bring power and
data to an array of devices without the
expense of hiring an electrician to bring
power to additional locations. It is avail-
able in Class II,two-prong, interchange-
able blade confgurations. Te injector
has an input from 90 to 264 Vac, 50 to 60
Hz, and an output of 48 Vdc with a max
power of 15.4-W continuous output.
GlobTek: www.globtek.com
Rectifier features
47-W/in.
3
power density
Te Flatpack S 48-V/1800-W HE (part
number 241122.125) is an extension
to the Flatpack S family. Te family
is designed to ft into applications
with limited depth or limited space.
Te 1,800-W rectifer provides power
density beyond competitive solutions
featuring 47 W/in.
3
in compact housing.
It incorporates telecom specifcations,
high efciency, ORing protection on
output, and high power in a 217-mm
deep box.
Te rectifer meets the power needs
of fber, backbone and wireless data in
the telecomm industry. Te device fts
into a number of compact and fexible
dc power systems with monitoring and
control functions. Te modules are
95.8% efcient, ofer isolation protec-
tion of 3-kVac input to output, 1.5-kVac
input to earth, and 710-Vdc output to
earth. Tey are certifed for CE, UL,
and other local approval bodies.
Eltek: www.eltek.com
controller suits aerospace, automotive,
biomedical, defense, medical and semi-
conductor markets.
Oven Industries: www.ovenind.com
Dont sacrice performance or service for price. Call today for a surprisingly
low cost quotation. For product datasheets or free samples, go to:
TEL: (781) 344-8226 FAX: (781) 344-8481 E-Mail: [email protected]
www.micropowerdirect.com
MicroPower Direct
We Power Your Success - For Less!
Go Direct
At MicroPower Direct we now offer a wide range
of power products designed for use in medical
applications. They include DC/DC Converters and
AC/DC power supplies ranging from 1W to 400W.
All are fully approved to the stringent requirements
of EN 60601. Visit our new website for full infor-
mation on many new products, including
our new medical approved power
supplies and DC/DCs.
MPU-400M
400W AC/DC Supply
EN 60601 Approved
PFC to EN 61000-3-2 D
Low Prole <1U Height
Universal 90-264 VAC Input
Current Share Option
2W DC/DC Converter
EN 60601 Approved
4,000 VAC rms Isolation
Reinforced Insulation
Single & Dual Outputs
Miniature SMT Case
ML200MHI
3W DC/DC Converter
EN 60601 Approved
3,000 VAC rms Isolation
Single & Dual Outputs
Miniature DIP Case
MA300MHI
VISIT OUR NEW WEB SITE!
Need
Assistance
Medical
10W DC/DC Converter
EN 60601 Approved
4.2 kVAC rms Isolation
Wide 2:1 Input Range
<10 A Leakage Current
MB1000MHI
EP1307.indd 1 7/1/2013 9:30:22 AM
Power Sources
58 New Products
HIGHLIGHT OF THE MONTH
eCompass is about the size of four grains of salt
Given that the average size of a grain of common table salt is about 1 mm
3
, the
LSM303C eCompass from ST Micro is about the size of four grains, measuring just
2.0 x 2.0 x 1.0 mm in its LG-12 package. Tus it is the smallest electronic compass
available today, nearly 20% smaller than similar devices.
Designed to provide advanced navigation and motion-detection in such
products as smartphones and wearable devices, the MEM-based chip combines a
three-axis microelectromechanical-system accelerometer and three-axis MEMS
magnetometer in a single package. Te magnetic-feld sensor, with a full-scale mag-
netic-feld strength range of 1,600 T, has a wider dynamic range than alternative
devices, while the accelerometer has selectable full-scale range of 2, 4 or 8 g,
and combines 16-bit resolution with state-of-the-art output accuracy of 40 mg.
In addition, the package is board-compatible with ST's 12-lead accelerome-
ter-only devices, allowing designers to enhance or upgrade the features of more
basic products. Samples are available now, with production quantities becoming
available beginningin December. Pricing will start at $1.10 for orders over 1,000
pieces.
STMicroelectronics: www.st.com
New Input Voltages available
125-475 VDC (Consult Factory)
High Voltage, Isolated Outputs
100-500 VDC
Output Voltages from 500VDC
High Power: to 50 Watts,
Efficiency to 90%
Miniaturized Size package:
2.5" x 1.55" x 0.50"
Safe: Short Circuit, Over/Under
Voltage, and Over Temp. Protected
Options Available: Expanded
Operating Temperature, -55
0
C to
+85
0
C
Environmental Screening, Selected
from MIL Std.883
Ruggedized for Operation in
Harsh Environments
External Bias Control: For Charge
Pump Applications
Custom Modules: Available to
optimize your designs, Special
Input or Output Voltages Available
Rely on Pico for Thousands
of ULTRA Miniature, High
Reliability DC-DC
Converters, AC-DC
Power Supplies,
Inductors and Transformers
www.picoelectronics.com
E-Mail: [email protected]
PICOElectronics,Inc.
143 Sparks Ave, Pelham, NY 10803-1837, USA
High Voltage
to 500 VDC OUT.
High Power
to 50 Watts.
Regulated/Isolated
DC-DC Converters
Call 800-431-1064
QP Series
Isolated
A32_ElecProds2.06x9.5_A32.qxd 8/6/13 8:22 A
Dual MOSFET arrays feature 0 threshold V
Te ALD212900A/ALD212900 family of dual monolithic, n-chan-
nel MOSFET arrays are available in an eight-pin SOI package and
feature zero-threshold voltage. Te devices establish new industry
benchmarks for forward transconductance, output conductance
and drive. Te dynamic range ofered by these devices range from
a few nanoamps to tens of milliamps. Te device features >100,000,000:1 operating current
ranges and a drain current of 30 mA with an input current of 300 pA. It also ofers an input
impedance of 2.5 x 10
10
and a dc current gain >10
8
.
Te MOSFETs are suited for low-voltage and small signal applications and can
work in sub-threshold regions with <5-nA operating supply currents while deliver-
ing higher output drive currents (typ.>50 mA). Te devices gate threshold voltage,
V
GS(th)
, is set precisely at +0.00 V +0.01 V, featuring a typical ofset voltage of 0.001 V.
Te devices are basic building blocks for current sources, diferential amplifer input
stages, transmission gates, and multiplexer applications. When the gate voltage of the
MOSFET is set at 0.00 V, the drain current is +20 A at V
DS
= 0.1 V, which allows a
class of circuit designs with output voltage level biased at or near input
voltage level without voltage level shif. Tey can be used for switching
and amplifying applications in +0.1 to +10-V powered systems where
low input bias current, low input capacitance, and fast switching speed
are desired.
Advanced Linear Devices: www.aldinc.com
4.7-F capacitor handles 100 V in 1206 pkg
Te 12061Z475K ceramic capacitor provides 4.7 F with a
100-V rating in a 1206 SMT package. Te device features
a X7S dielectric for a 22% stability from -55 to 125C.
Te capacitor has a dissipation factor
of less than 2.5% and a package thick-
ness of only 0.70 in. Standard tolerance
is 10% and price is approximately $0.53 ea/2,000.
AVX: www.avx.com
Buy Now
Buy Now
Components & Subassemblies
New Products 59
Small welder lets you make
thermocouples
Te HotSpot PLUS capacitive-discharge
welder provides standard thermocouple
welding functions as well as simple spot,
stud, and pin welding. It can also aid
in wire-harness strapping and insula-
tion-blanket installation, and its con-
trollable weld energy facilitates strain-
gauge attachment. Measuring 3.5 x 8.5
x 11.5 in. (less handle) and weighing
18 lbs, the welder can be moved where
needed.
Stored welding energy is adjustable
from 5 to 525 W-s, max charging time is
less than 10 s, and actual welding time
Small white enclosures
go green
Available in four standard sizes with
external dimensions from 2.00 x 3.23
x 0.55 in. to 3.62 x 5.90 x 1.10 in. and
a standard of-white color (RAL 9002),
the Sof-Case series of handheld enclo-
sures now comes from stock molded in
BIOGRADE biodegradable material.
Tis bioplastic material is CO
2
neutral,
technically compostable and biodegrad-
able, and has similar mechanical and
physical properties to ABS.
Te top of
the enclosure
has a wide
recessed area
for locating an
LCD or mem-
brane keypad,
and a raised
panel on the
long edge
can be used
for mounting
USB, power, or serial connectors and
controls. Te three larger-size cases are
available with battery compartments
for ftting 1.5-V AA or AAA batteries
or 9-V cells. Te cases are assembled
by four self-tapping screws, and screw
pillars are provided inside the top and
base parts for ftting PCBs. Prices start
at $12.
OKW Enclosures:
www.okwenclosures.com
EMI shielding materials
forecast to 2018
The report EMI/RFI: Materials and
technologies reports is an overview
of the global market for products to
deal with electromagnetic interference
(EMI) and radio frequency interfer-
ence (RFI) problems that are encoun-
tered in operation of electronic equip-
ment and implications for plastics and
competitive materials/technologies
used to suppress that interference.
The report considers the need for
conductive coatings and plastics,
laminates, and metal cabinets needed
for the ever-increasing frequencies for
all electronics, especially in wireless
devices. The impact of Bluetooth is
considered as well as the use of EMI
absorptive materials and fiber optics.
Shielding not only closely follows the
demand for electronic devices and
components, but also is a valuable
resource to assist manufacturers in
complying with ever-changing safety
and performance regulations. The
report also discusses the current state
of the electronics and other related in-
dustries, the market for plastics-based
shielding options, key participants,
shielding technologies, patents,
materials, shielding components, a
timeline of global developments,
and examples of worldwide regulatory
standards and environmental issues
confronting the electronic shielding
business. Compound average growth
rates (CAGRs) are provided by square
feet and 2013 dollars. Send an e-mail
to [email protected] for more
information.
Paul OShea
Packaging & Interconnections
60 New Products
is a fraction of a second. Tis capability
permits six or more welds a minute;
welding time for ordinary gauge ther-
mocouples is very short. Priced starting
at $1,250, the welder operates from
120-V, 60-Hz line power (220-V, 50-Hz
optional) and is protected by 1.5-A line
breaker. Te unit can also be driven by a
low-power battery-to-ac converter and
several optional fxturing and welding
attachments are ofered.
DCC Corporation:
www.dcccorporation.com
Optical cabling system
combines power and fiber
Te Fiber+Power-to-the-Antenna system
bundles all signal and power cabling ele-
ments required for installing a functional
FTTA system into a single enclosure.
Compatible with existing tower archi-
800. 424. 9850
401. 823. 5200
www.advanced.com
i n f o @a d v a n c e d . c o m
Made in USA
Automate PCB pin loading
Socket heat sensitive devices
Plan for future device upgrades
Improve solder joint inspection
Ultimate
Design
Flexibility
Peel-A-Way
Removable
Terminal
Carriers

Choose
your shape,
pattern, and
pin styles
www.masterbond.com
Hackensack, NJ 07601 USA +1.201.343.8983 [email protected]
followsuit
Uniform Bond Line Thickness
B-Staged Film Adhesive
Sealant FLM36
Watch Video
Tough and flexible
High temperature resistance
Refrigeration or freezing not required
Thermally conductive, electrically insulative
Holder secures Zhaga and all
50-mm LED modules
Te Mod-Lok LED module holder
secures all 50-mm modules, including
Zhaga products, to provide consistent
contact pressure to the thermal interface
material (TIM) and ensure excellent
thermal performance independent of
plastic creep and screw torque.
Te LED holder also acts as a Zhaga
locking ring to simplify feld replace-
ment. Finger
tabs
allow for
tool-free,
screw-
free installa-
tion and replace-
ment, while integrated springs eliminate
concern for adequate screw-torque
sensitivity. Te hardened stainless-steel
springs ofer consistent interface
pressure over time, and built-in detents
prevent vibration from loosening screws
accidentally.
Ideal Industries: www.idealindustries.com
New Products 61
tecture, the cabling system is designed to
maximize efciency for installing techni-
cians, with plug-and-play assembly input
cables that install directly to the box.
Te system can be installed in a single
day, compared to a three-day installation
using competing products.
Built for harsh conditions and
available in a one-stop shop, the cabling
system connects incoming tower trunk
fber and dc power cables to individual
ODVA 2 or optional ODC-compatible,
fber output radiohead feeder cables and
dc power cables. Te system, which can
feed up to 24 radioheads, not only fea-
tures robust OSP fber cables (3x thicker
than normally specifed fber cables),
but also an efcient NEMA 4X-rated f-
ber-plus-power distribution cabinet from
FiberSource and IP67-rated connectors
from CONEC, all specifcally designed
for applications involving the environ-
mental conditions relative to cell towers.
Talley: www.talleycom.com
Smallest 50-pin QFN socket
offers top performance
Designed for a 5.5 x 7 x 0.8-mm 50-pin
Quad Flat No Lead (QFN) package with
0.4-mm-pitch connections, the SG-
MLF-7078 high-performance elastomer
socket operates at bandwidths to 10 GHz
with an insertion loss of less than 1 dB,
contact resistance typically 20 m per
pin, and current capacity of 2 A per pin.
Te socket is said to have the smallest
footprint in the industry.
Priced at $351 in single quantities,
the socket connects all pins with 10-
GHz bandwidth on all connections and
is mounted on the target PCB using
supplied hardware with no soldering. Te
small footprint allows inductors, resistors,
and decoupling capacitors to be placed very
close to the device for impedance tuning,
and a simple installation method lets ICs
be changed out quickly. Pin self-inductance
is 0.15 nH, mutual inductance is 0.025
nH, capacitance to ground is 0.01 pF, and
temperature range is 35 to 100C.
Ironwood Electronics:
www.ironwoodelectronics.com
Data-center racks are
affordable workhorses
Te HP 11000 G2 Series rack for data
centers deliver high weight capacity, en-
hanced airfow design, and durable con-
struction. Available as a pallet or shock
rack, these 19-in., 42U budget-priced
racks are also compatible with HP Loca-
tion Discovery Services to auto-log and
track server ID and U location during
installation.
Improve-
ments from
earlier HP racks
include im-
proved weight
capacities up to
3,000 lbs static,
an 81% open
perforated door
for enhanced air-
fow and cooling,
and quick-instal-
lation brackets
and cables for
power.A patent-
ed seven-layer
rolled frame de-
sign and welded
steel framehave
been used toen-
able long life.
For high-density
environments,a large cable egresses in
the rack top and a convenience bracket
for tool-less mounting of popular cable
management options and power distri-
bution is included.Internet prices start at
$1,099,but pricing may vary by country
or region.
Hewlett-Packard: www.hp.com
62 New Products
HIGHLIGHT OF THE MONTH
Te MSO/DPO70000DX series of performance mixed-signal oscil-
loscopes (MSO) and digital-phosphor
oscilloscopes (DSO) from Tektronix
consists of six models with four
analog channels whose bandwidths
are 23, 25, or 33 GHz and 20%-to-
80% rise times are 9 ps. Not only
do the scopes have enhanced tools
for debugging digital and analog
circuits, but a new 33-GHz band-
width probe for use with the scopes is said to be the world's fastest
and lowest noise, with industry leading sensitivity. Te probe/scope
combination brings full-bandwidth measurement capability right
down to the leads of the unit under test.
Te new series features a wider dynamic range (600 mV/div, or
6V full scale) at maximum voltage setting, fve times greater than
the previous 70000D scopes. Further, with the option of having
sample memory as great as 1 Gsample/channel on two channels,
achievable record length is now four times as long. Sample rate is 100
Gsample/s on two channels and processor speed hasbeen improved,
which enables faster decode on longer records, and the instruments
support a more-than-300,000-wafeform/s acquisition rate.
Te MSOs have 16 digital channels that provide 80 ps timing
resolution, an industry-best that gives engineers accurate feedback
on logic or protocol performance for serial buses like
USB, I
2
C, and SPI in real-time. Further, the mixed-signal
scopes have iCapture for simultaneous digital-analog acquisition;
this unique feature lets designers easily and quickly verify the analog
characteristics - without changing probes or connections - of any of
the signals connected to the digital channels. Having the ability to
thus observe a greater amount of a design's electrical behavior at one
time shortens debug cycles and system validation time.
With sensitivity to 3.48 mV/div, the 33-GHz P7600 series
TriMode probe (lower bandwidth versions are also available) gives
engineers a single probe setup for diferential, single-ended, and
common-mode measurements with a single coax or solder-down
connection, for more value from each scope channel. Te probes'
"remote head" architecture ofers the shortest path to the input
signal and lowest noise performance in its bandwidth class.
With prices ranging from $178,000 to over $298,000 with
expanded sample memory, the oscilloscopes are available for order
now, with shipments beginning in September. P7600 probes are
available now, with prices for a 33-GHz version starting at $27,000.
Moreover, to preserve investments as needs change, the scopes
ofer customers a variety of upgrade options, including bandwidth
upgrades, product conversions, and trade-up programs. For exam-
ple, digital channels can be added to analog-only DPO70000DX
versions via a customer-installable kit.
Tektronix: www.tek.com
WIth BW to 33 GHz, scopes speed RF, digital design
12 Mpts memory depth
standard, 24 Mpts optional
1GSa/s max. sample rate
30,000 wfms/s max. waveform
capture rate
UltraVision technology
7" WVGA screen
Digital Oscilloscopes
NEW! DS1000Z
Now you can get a
4 channel scope at
2 channel prices!
Integrated 2 channel
source available
Starting at less than
$
600
Check out our latest Best Value
@ RigolScope.com
DS1000ZAd-EP_Layout 1 8/9/13 2:22 PM Page 1
Test & Measurement
63 New Products
Optoelectronics
For more information on IXYS IC Division's IX2113 Gate Driver visit:
www.ixysic.com/Products/HiLoGateDvr.htm
Pb
e3
IXYS Integrated Circuits Division
(formerly Clare, Inc.)
www.ixysic.com
978-524-6768
e
IX2113
Unstoppable!
High-Side/Low-Side
IGBT/MOSFET Gate Driver
Pb Pb
e
Floating Channel for Bootstrap Operation to +600V
with Absolute Maximum Rating of +700V
Outputs Source and Sink 2A
Gate Drive Supply Range from 10V to 20V
Tolerant to Negative Voltage Transients: dV/dt Immune
UnderVoltage Lockout for Both High-Side & Low-Side Outputs
3.3V Logic Compatible
Matched Propagation Delays
LED luminaire has industrys
highest lm/W
Te Appleton Areamaster LED lumi-
naire, a foodlight fxture ofers the
industry's highest lm/W output and a
service life of more than 60,000 h. It
features corrosion-resistant protection
and weighs less than half the previous
Areamaster versions with a smaller
footprint, it targets adverse and hazard-
ous locations (Class I Div.2.). Suggested
applications include petrochemical
plants, pulp
and paper
mills,
sewage
treatment
centers,
and marinas,
as well as out-
door areas such
as parking lots or public spaces where
rough weather is a problem.
Te LED features a universal design
for food or high-bay mounting, making
it suitable for replacing virtually any
HID, fuorescent or incandescent fxture.
Rated at 127 W, it delivers 13,000+
lumens of cool white light in a 131 (hor-
izontal) x 134 (vertical) beam spread.
It does not require the use of external
optics, resulting in system efciencies as
high as 80%. Te LED has a corrected
color temperature of 5650K and a CRI
rating of 70.
Emerson Industrial Automation,
EGS Electrical Group:
www.emerson.com
Benchmark CRI for LEDs
target ceramic metal halide
lighting
Te XLampCXA1304andCXA1816, the
newest members of the CXA LED family,
ofer 95 CRI options, delivering up to
twice the efcacy of equivalent CRI LED
light sources. Tey deliver halogen-like
color and combine high quality light with
high light output and efcacy.
Te CXA1304 LED array is the most
compact member of the family, delivering
up to 1034-lm in a 6-mm optical source
size. Te CXA1816 array enables LED
replacements for up to
70-W ceramic metal
halide in spot lighting
or for 2,000-lm down-
lights with a 12-mm
optical source size. Te
arrays ofer 6,000-h of
LM-80 data published
and are designed to support
TM-21 reported L90 lifetime of
over four years, at 105C. Tey
are available in 5,000K through
2,700K CCTs, and deliver a
typical CRI of 95 with a typical
R9 value of 85 at 3,000K.
Cree: www.cree.com/modules
SEPTMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS
Absopulse Electronics Ltd. 56
Advanced Interconnections Corp. 60
Agilent Technologies, Inc. C2, 35, 45
Allied Electronics Inc. C3
American Power Design, Inc. 56
Avnet Electronic Marketing 3
Central Semiconductor Corp. 53
Coilcraft CPS 2
Coilcraft, Inc. 10
CUI Inc. 29
Data Modul Inc. 47
Digi-Key Corporation C1, 1
EMCO High Voltage Corporation 11
E-T-A Circuit Breakers 51
Floyd Bell Inc. 64
Global Lighting Technologies, Inc. 50
GlobTek, Inc. C1, 55
Hammond Manufacturing
Company Inc. 61
Hittite Microwave Corporation 39
Integrated Power Designs, Inc. 36
International Rectier 31
IXYS Corporation 44
IXYS Integrated Circuits Division 37, 63
Keystone Electronics Corp. 33
KOA Speer Electronics, Inc. 26
Linear Technology Corporation 13
Master Bond Inc. 60
Master Electronics 42
Maxim Integrated C4
Mean Well USA, Inc. 5
Measurement Computing
Corporation 28
MEGA Electronics, Inc. 22
Melexis 40
MicroMo Electronics, Inc. 49
MicroPower Direct, LLC 57
Mill-Max Manufacturing Corp.
21, 23, 25, 27
Minmax Technology Co., Ltd. 55
Mouser Electronics 7, 16, 17
National Instruments 15
Newark/element 14 9
OKW Enclosures, Inc. 59
Pico Electronics, Inc. 58
TRACOPOWER 54
Precision Paper Tube Company 64
Rigol Technologies 62
RTG, Inc. 64
SCHURTER Inc. 14
Syfer Technology Ltd. 48
Taiyo Yuden (USA) Inc. 32
TDK-EPC Corporation 41
TDK-Lambda Americas, Inc. 46
Toshiba America Electronic
Components, Inc. 18
UnitedHealthcare 43
WAGO Corporation 12
Zilog Inc. 38
Product Mart
Electronic Products Presented by the Manufacturer
64 New Products
Optoelectronics
Electrical Insulating Bobbins
Fabricated or molded, hi-dielectric, hi-temp, choice of 12
materials, extra strong, with or without tie-offs, low cost, over
75 years of experience. Made In USA!
To receive literature & details fast:
www.pptube.com
Precision Paper Tube Company
Phone: 847-537-4250
Fax: 847-537-5777
[email protected]
www.pptube.com
More Than 75 Years - The Original
Turbo
Miniature Piezoelectric Alarms

Tiny (approx.1x1) piezoelectric alarms provide LOUD output
with a super-sleek design. Available in variety of voltages and
output up to 103dB! Rugged, tamper-proof, lo-prole panel
mount design is IP68 and NEMA 4X. Optional manual volume
control offers increased attenuation. ISO 9001:2000 registered
company all products made in the USA.
Floyd Bell Inc.
Tel: (614) 294-4000
Fax: (614) 291-0823
[email protected]
www.oydbell.com
For Reprints contact Wrights Media 877-652-5295
ADVERTISER INDEX
This index is provided as an additional service.
The publisher does not assume any liability for errors or omissions.
LED troffer offers low-cost replacement
for T8 tubes
Te LJT LED trofer saves up
to 32% more energy
thanfuorescent prod-
ucts, and is available
in 2 x 2-f and 2 x 4-f
confgurations. Te yearly
lighting cost is $2.38 based on
3,000 h/yr at $0.08/kWh. Te
fxture features six lens
options; two door frame
options, three LED color
choices, and an optional wiHUBB technology, preinstalled. It
provides fxed output, step dimming, or 0 to10-V continuous
dimming.
Te LED trofer has a 5-year warranty and typically qualifes
for EPACT tax deductions and utility rebates. It is built to UL
1598 and 2108 standards, and bear appropriate CSA labels. Te
trofer provides 50,000 hour LEDs at the L70 life cycle, with
3,000-, 3,500-, and 4,000-K color temperature bulbs. Te LEDs
ofer a low-watt output of 4,100 lm or a high-watt output of
5,000 lm at 101 lm/W.
Hubbell Lighting/Spaulding Lighting brand:
www.spauldinglighting.com
Allied Electronics, Inc 2013. Allied Electronics and the Allied Electronics logo are trademarks of Allied Electronics, Inc. An Electrocomponents Company.
MATE-N-LOK, PIDG,TE Connectivity and TE Connectivity (logo) are trademarks.
1.800.433.5700
Keep Your System
in Tip-Top Shape
TE Connectivitys industry-proven
components for both inside and
outside the cabinet keep your
system up and running at its best.
alliedelec.com/teconnectivity
for all your TE Connectivity solutions
PIDG
Terminals
Mini-Universal
MATE-N-LOK
Sealed Connectors
Circular Plastic
Connectors (CPC)
Order your TE Connectivity products by 10 pm ET for same-day shipping
2013 Maxim Integrated Products, Inc. All rights reserved. Maxim Integrated and the Maxim
Integrated logo are trademarks of Maxim Integrated Products, Inc., in the United States and other
jurisdictions throughout the world.
ANALOG
INTEGRATION
ISNT FOR
EVERYONE

Sel Prod

Uploaded by

Copyright:

Available Formats

Sel Prod

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Sel Prod

Uploaded by

Copyright:

Available Formats

No-nonsense tools for the busy EE

Working with Microsofts Windows

Precision-circuit semiconductors drive gains in energy harvesting

Please print clearly.

What is your Principal Job Function?

1 800 332 8638 | www.avnetexpress.com | @avnetdesignwire

Device can detect disease in just one drop of blood

Autotestcon looks to innovate in tight budgets

When and why would I use

for more information call 1.800.981.8699 or visit us at www.irf.com

EP THiNK Snow+2994.indd 1 8/8/13 4:00 PM

i-Core and AMD Embedded G-Series

John Filippelli: I understand that the

Miniature Piezoelectric Alarms

You might also like