Kara Sherman

Micron Technology unveils QLC NAND #SSD with more than 200 layers 💡 #Micron has launched a 2500 QLC NAND internal fit client product that’s faster than its 2550 TLC predecessor, despite TLC #NAND typically being quicker than QLC NAND. TLC (triple level cell) NAND has 3 bits per cell while QLC (quad level cell) has 4 bits per cell, meaning the #SSD's controller has to negotiate QLC’s 16 voltage states per cell instead of 8 with TLC. It takes longer to read and write individual cells unless the controller #firmware gets clever with such things as a very fast SLC (1 bit/cell) cache, and parallel #data plane access. Micron’s 2500 is claimed to be the first 200-plus layer QLC drive for OEM #desktop and #notebook (client) #computers. It uses 232-layer QLC NAND, and this gives it 30 percent more density, Micron says, than its 2400 176-layer QLC product, and 31 percent more than its 232-layer TLC NAND, as used in the 2550 M.2 format SSD. This was launched in December 2022 so it has taken 16 months to add the extra bit to the 232-layer NAND cells used in the 2500. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eqDvqWmQ #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #chip #chips #it #computer #memory

126

2 Comments

Uncover the power-efficient MPU featuring advanced graphics and audio capabilities, along with EdgeLock® Secure Enclave, SESIP, and PSA Level 2 certifications in this special whitepaper from #NXP!

1

STMicroelectronics Maintains Top Spot with 32.6% Market, onsemi Rises to Second Place in 2023 Revenue Ranking for #SiC Power Devices, Says TrendForce Corporation 💡 TrendForce 集邦科技 reports that the SiC power devices industry maintained strong growth in 2023, driven by the application of #BEVs. The top five suppliers accounted for approximately 91.9% of total revenue; ST lead the pack with a 32.6% market share while onsemi rose from fourth place in 2022 to second place. TrendForce’s analysis indicates that demand from #AI #servers and other fields will significantly increase in 2024. However, the noticeable slowdown in the sales growth of BEVs and weakening #industrial demand are affecting the SiC #supplychain. It is expected that the annual growth rate of industry revenue for SiC power devices will significantly decelerate in 2024 compared to previous years. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ePiyY-nw #semiconductorindustry #semiconductors #semiconductor #technology #semiconductormanufacturing #innovation #automotiveindustry #chip #chips #geopolitics #batterytechnology #battery #electricvehicles #evs

53

3 Comments

#Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND 💡 Samsung Electronics has started mass production of its 9th generation of V-NAND #memory. The first dies based on their latest #NAND #tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with #data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance #SSDs, which will help to solidify Samsung's position in the storage market. Diving right in, Samsung is conspicuously avoiding to list the number of layers in their latest generation NAND, which is the principle driving factor in increasing capacity generation-on-generation. The company's current 8th gen V-NAND is 236 layers – similar to its major competitors – and word on the street is that 9th gen V-NAND ups that to 290 layers, though this remains to be confirmed. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/d6Ge4w47 #semiconductorindustry #semiconductors #semiconductor #innovation #korea #chip #chips #nandflash #flashmemory #ssd #ssds #it #ai #cloud

62

1 Comment

Cadence Design Systems is proud to support PCI-SIG at FMS: the Future of Memory and Storage

25

The Micron 6550 ION has just taken the lead in density, performance, AND efficiency for 60TB SSDs, addressing key challenges for AI-driven data centers. This groundbreaking innovation offers unparalleled high-density performance with up to 12.0 GB/s sequential reads and 5.0 GB/s sequential writes, all while consuming up to 20% less power compared to competition. It's been a pleasure collaborating with leaders across Micron and the industry to bring this revolutionary product to the world. The 6550 ION is set to transform AI workloads, high-performance computing, big data, and analytics environments. Learn more about this game-changing SSD at the link below! hashtag#Innovation hashtag#DataCenter hashtag#SSD hashtag#Micron hashtag#TechNews

15

1 Comment

A very interesting blog by Giuseppe Piccolboni of Weebit Nano Ltd about the use of our #ReRAM for #neuromorphic applications

36

https://lnkd.in/gGR5Q6dW DRAM industry Q2 sales surged 24.8% to $22.9 billion! According to TrendForce, DRAM industry revenue increased significantly to US$22.9 billion in the second quarter of 2024, a month-on-month increase of 24.8%. This surge was mainly due to the expansion of mainstream product shipments, which drove revenue growth for most manufacturers. Contract prices in the second quarter continued to rise, and due to geopolitical factors, the increase in traditional DRAM contract prices in the third quarter is expected to exceed previous forecasts. Major manufacturers Samsung, SK Hynix and Micron all saw an increase in shipments in the second quarter compared to the previous quarter. Average selling prices also continued the upward trend in the first quarter. Driving factors included the earthquake in Taiwan in early April and high demand for high-bandwidth memory (HBM) products, which prompted DRAM buyers to adopt a more aggressive purchasing strategy. As a result, contract prices in the second quarter ultimately increased by 13% to 18%. #realized #China #Oem , #ODM , #OBM #TechbicalSales #IPSales #OwnalltheChipsknowledge #Builddeeplytruthasmyrespondsibility #Microchip #SSD #HDD #DRAM #DDR #Serverparts #HPC #Servercpu #Truth #OneStopShopping #OEM. #OWNTear1Chipsresource #Outstanding #monthlyorder #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation ]#personaldevelopment #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #ssd #dram #ddr

2

Here offer Micron N48R：QLC HBM MT29F1T08GBLCEN48R3WC1-R Q’ty：300K samsung V5 256Gb. 6k EP3C16F484C6N EP3C5F256C8N  M393A4K40EB3-CWE server 1. H5WRAGESM8W-N8L Qty:8,000/pcs USD650/pcs D/C:Within 2 years L/T:10Weeks HK EXW 2. KHAA84901B-JC17 Qty:10,000pcs USD480/pcs D/C:21+ L/T:12-16Weeks HK EXW The HBM4 war begins! Memory chip stacking is difficult to solve, Hybrid Bonding is the key to breakthrough SK Hynix, a major Korean memory manufacturer, participated in COMPUTEX 2024 for the first time, displaying the latest HBM3E memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealed that Hybrid bonding will become a very important part of the chip stack. MR-MUF is a process in which semiconductor wafers are attached to circuits and "EMC" (liquid epoxy molding compound) is used to fill the gaps between wafers or between wafers and bumps when stacking the wafers. At present, MR-MUF technology can make chips closer together, improve heat dissipation performance by 10%, improve energy efficiency by 10%, product capacity reaches 36GB, and can be stacked 12 layers.As for competitors such as Samsung and Micron, which use TC-NCF technology (thermal compression with non-conductive film, non-conductive film thermal compression), it is necessary to convert the material into a solid through high temperature and high pressure, then melt it, and then clean it. The total process More than 2-3 steps, MR-MUF can be completed in one go and no further cleaning is required. Compared with NCF, MR-MUF has about twice the thermal conductivity, which has a great impact on process speed and yield. As the number of stacked layers increases, the HBM package thickness is limited to 775 microns (μm). Therefore, memory manufacturers must think about how to stack more layers within a certain height. This is also a big challenge for current packaging technology, and hybrid bonding (Hybrid bonding) is likely to be one of the solutions.stack more than 20 layers (ie no more than 775 microns) through Hybrid bonding technology. According to Korean media reports, HBM4E will be a 16-20-layer product and is expected to debut in 2028. SK Hynix will use 10-nanometer sixth-generation (1c) DRAM in HBM4E for the first time, and the memory capacity is expected to be significantly increased. (Source of the first picture: Science and Technology News).#china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle]\\

2

ASMPT Ltd Reportedly Provided Demo TC Bonder to Micron Technology for #HBM Production 💡 Driven by #memory giants ramping up high-bandwidth #memory (HBM) production, according to a report from Korean media outlet TheElec, ASMPT, a back-end equipment maker, has supplied a demo thermal compression (TC) bonder for #Micron's HBM production. TC bonders play a pivotal role in HBM production by employing thermal compression to bond and stack #chips on processed wafers, thereby significantly influencing HBM yield. #ASMPT is reportedly collaborating with the #USA memory giant to co-develop a TC bonder for use in #HBM4 production. Notably, ASMPT has supplied TC bonders to SK hynix as well and plans to deliver more units later in the year. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eUcjevBU #semiconductorindustry #semiconductors #semiconductor #technology #tech #it #chip #ic #icdesign #dram #ai #innovation #southkorea #usa #it

107

#Micron Ships Denser and Faster 276 Layer TLC NAND, Arriving First in Micron 2650 Client SSDs 💡 Micron Technology on Tuesday announced that the company has begun shipping its 9th Generation (G9) 276 layer TLC NAND. The next generation of NAND from the prolific #memory maker, Micron's latest NAND is designed to further push the envelope on TLC NAND performance, offering significant density and performance improvements over its existing NAND #technology. Micron's G9 TLC NAND memory features 276 active layers, which is up from 232-layers in case of Micron's previous generation TLC NAND. At this point the company is being light on technical details in their official material. However in a brief interview with Blocks and Files, the company confirmed that their 276L NAND still uses a six plane architecture, which was first introduced with the 232L generation. At this point we're assuming Micron is also string-stacking two decks of NAND together, as they have been for the past couple of generations, which means we're looking at 138 layer decks. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/erXajfbv #semiconductorindustry #semiconductors #semiconductor #tech #it #chip #flashmemory #ssd #nandflash #usa #innovation #geopolitics #ic #ai #iot

151

4 Comments

I’m excited to be part of this webinar with an incredible group of game-changers in the electronics industry! The conversation around technology, digital presence, and AI is more vibrant than ever, driving us to innovate, strategize, and execute with an eye on maximizing efficiency and achieving impressive ROI! Let’s dive in and explore together!

35

2 Comments

I recently had a great conversation with Richard Nass and Vin D'Agostino of Embedded Computing Design on the culture of Infineon Technologies and guidance for young engineers entering our field. You can listen to the full podcast interview here: https://lnkd.in/gw6zXJNh #semiconductors #career #engineers #oktobertech

48

2 Comments

TSMC Starts 3nm Production for Upcoming #Intel #CPUs Both Arrow Lake for desktop and Lunar Lake for mobile will be utilizing TSMC's 3nm process. Intel Corporation has already revealed its next-gen #mobile architecture known as Lunar Lake, and in a first for Intel, its #compute tile is made by #TSMC on its 3nm process. Intel will also be tapping its biggest rival for its upcoming Arrow Lake #desktop #processors as well, and now a report from #Taiwan states TSMC has begun production on the 3nm #chips that will be used for both of Intel's upcoming platforms. TSMC has been cranking out 3nm #chips for a little over a year now, but its initial run was reserved for Apple's #A17 Pro #chip for the #iPhone as well as its #M3 and #M4 #processors. Now TSMC is turning its attention to Intel, which will be using its 3nm process for both Lunar Lake and Arrow Lake. As TechPowerUp notes, although we know Lunar Lake's compute tile is made on TSMC's 3nm process, it's unclear at this time how Intel will be using these chips for Arrow Lake. It is a huge deal for Intel to turn to a competing #foundry to make its #CPUs, so it's unclear if Lunar Lake is just a one-off deal. Plus, Arrow Lake has been touted as the first Intel CPUs to use its cutting-edge Intel 20A process. Thanks again to Josh Norem and www.extremetech.com for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eccAhwXK #semiconductorindustry #semiconductors #semiconductor #technology #tech #it #notebook #laptop #consumerelectronics #computer #taiwan

375

6 Comments

PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

37

JEDEC recently announced JEP198: Guideline for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices. This reflects the industry’s collective effort to ensure the consistent performance of GaN-based devices. PI celebrates this milestone while we remain steadfast in our mission to lead the way in defining reliability for this exciting new technology. Learn more here: https://okt.to/I1ME0t

3

For many, accessible, affordable and high-quality #childcare is a barrier that prevents them from joining or rejoining the workforce. Effective child care options help welcome an inclusive, diverse workforce. As Micron brings leading-edge #semiconductor memory manufacturing to the U.S., we need to cultivate a diverse workforce that can sustain our large-scale plans. This is why child care is a central part of our workforce development strategy. Investments in child care also make strong business sense and can have a real economic impact on the surrounding community. Supporting team members with child care options allows them to focus wholly on their work with reduced worry about their families, which leads to increased performance and productivity. This is not just a women’s issue. It’s a competitiveness issue for Micron and for the country. Thank you to U.S. Secretary of Commerce Gina Raimondo for inviting Micron to be a part of the inaugural National Child Care Innovation Summit to discuss the importance of childcare strategies that advance change across industries.

264

3 Comments

Global #Semiconductor Sales Increase 18.3% in Q2 2024 Compared to Q2 2023; Quarter-to-Quarter Sales Up 6.5% The Semiconductor Industry Association (SIA) announced global #semiconductorindustry sales totaled $149.9 billion during the second quarter of 2024, an increase of 18.3% compared to the second quarter of 2023 and 6.5% more than the first quarter of 2024. Sales in June 2024 were $50.0 billion, an increase of 1.7% compared to the May 2024 total of $49.1 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (#WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. #semiconductor industry by revenue and nearly two-thirds of non-U.S. #chip firms. “The global semiconductor market remained strong during the second quarter of 2024, with quarter-to-quarter sales increasing for the first time since the fourth quarter of 2023,” said SIA President and CEO John Neuffer. “Sales in the month of June were up both month-to-month and year-to-year, with the #Americas market leading the way with growth of 42.8% compared to June 2023.” Thanks again to Semiconductor Industry Association for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ercC9yWG #semiconductors #technology #tech #it #ai #aiot #iot #ic #chips #ev #ml #car #ev #foundry #innovation #datacenter #computer #smartphone #pc #europe #japan #china #consumerelectronics #industrial #automotive

64

2 Comments