Chris Lee

The Micron 6550 ION has just taken the lead in density, performance, AND efficiency for 60TB SSDs, addressing key challenges for AI-driven data centers. This groundbreaking innovation offers unparalleled high-density performance with up to 12.0 GB/s sequential reads and 5.0 GB/s sequential writes, all while consuming up to 20% less power compared to competition. It's been a pleasure collaborating with leaders across Micron and the industry to bring this revolutionary product to the world. The 6550 ION is set to transform AI workloads, high-performance computing, big data, and analytics environments. Learn more about this game-changing SSD at the link below! hashtag#Innovation hashtag#DataCenter hashtag#SSD hashtag#Micron hashtag#TechNews

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Uncover the power-efficient MPU featuring advanced graphics and audio capabilities, along with EdgeLock® Secure Enclave, SESIP, and PSA Level 2 certifications in this special whitepaper from #NXP!

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why choose NVMe PCIe 4.0 SSD? 1. Ultra-high read and write speed ①Strong sequential read and write performance, up to 7,000𝐌𝐁/𝐬𝐞𝐜 read and 6,500𝐌𝐁/𝐬𝐞𝐜 write speeds. ②Excellent 4K random read and write performance 2. Low power consumption and energy saving ①Link energy saving characteristics ②Efficient power management 3. Good compatibility and versatility 4. Compact size and large capacity 5. Long-lasting stability and reliability #nvme #pcie4 #gamingSSD #ps5storage

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Cadence introduces the Janus NoC for SoC designs.

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Michael Kelly, VP of Chiplets/FCBGA Integration at Amkor Technology, Inc. participated in the Semiconductor Engineering article "What Works Best For Chiplets" by Anne Meixner. Read the article here https://lnkd.in/e6twMDMU The article delves into the #semiconductor industry's efforts to create an open #chiplet ecosystem that integrates #chiplets from different manufacturers into a single package. It highlights the need to solve complex technical challenges around co-optimization of design and assembly processes, as well as the critical importance of fostering collaboration across the entire #supplychain ecosystem to enable designable chiplet-based products. #semiconductormanufacturing #semiconductorindustry

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#Samsung and #SKhynix gain #NAND market share as #Kioxia, #Micron and #WesternDigital lose it 💡 TrendForce Corporation NAND market tracking reveals that Samsung and SK hynix-Solidigm have grown their market share at the expense of the Kioxia-Western Digital joint venture and Micron. Its latest quarterly report positions Samsung as the industry leader (36.9 percent), placing SK Group (SK hynix and Solidigm) in the same position it was placed previously: the second-largest NAND flash supplier (22.1 percent), both by revenue in 2024’s second quarter. The next three suppliers were Kioxia (13.8 percent), Micron (11.8 percent) and Western Digital (WDC – 10.5 percent). The total revenue of $16.8 billion was 14.2 percent higher than Q1’s $14.7 billion. Blocks and Files looked at TrendForce’s previous reports and charted its view of the suppliers’ market share history over the past two years... Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eD8Hut-P #semiconductorindustry #semiconductor #semiconductormanufacturing #datastorage #nandflash #flashmemory #memory #chip #chips #ic #ics #technology #tech #innovation #datacenter #ssd #ssds #geopolitics #it

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We're expanding our edge computing portfolio with the new MCX W wireless MCU series. Dive into this article to learn how these advanced chips are powering smart industrial and IoT devices. #NXP #Semiconductors #IoT

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Samsung Electronics maintains hybrid bonding needed for #HBM 16H 💡 Unlike SK hynix will continue MR-MUF in 16-stack HBM Samsung shared in a recent paper that it believes #hybridbonding was needed to manufacture a 16-stack high-bandwidth #memory (HBM). In its paper published during the 2024 IEEE 74th Electronic Components and Technology Conference held in Colorado last month titled, in Korean, D2W (die to wafer) Copper Bonding #Technology Research for HBM Stacking, the company said hybrid bonding for HBM with 16 stacks and above was a must. Hybrid bonding is a next-generation packaging technology where when #chips are stacked vertically through through-silicon-via (#TSV), or microscopic copper wire, there are no bumps between the stack. They are stacked directly. Hybrid bonding is also called direct bonding for this reason. Thanks again to Noh Tae Min and www.thelec.net for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e4CPS_tg #semiconductorindustry #semiconductors #semiconductor #foundry #ai #tech #chip #ic #artificialintelligence #southkorea #innovation #chips #it

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https://lnkd.in/gGR5Q6dW DRAM industry Q2 sales surged 24.8% to $22.9 billion! According to TrendForce, DRAM industry revenue increased significantly to US$22.9 billion in the second quarter of 2024, a month-on-month increase of 24.8%. This surge was mainly due to the expansion of mainstream product shipments, which drove revenue growth for most manufacturers. Contract prices in the second quarter continued to rise, and due to geopolitical factors, the increase in traditional DRAM contract prices in the third quarter is expected to exceed previous forecasts. Major manufacturers Samsung, SK Hynix and Micron all saw an increase in shipments in the second quarter compared to the previous quarter. Average selling prices also continued the upward trend in the first quarter. Driving factors included the earthquake in Taiwan in early April and high demand for high-bandwidth memory (HBM) products, which prompted DRAM buyers to adopt a more aggressive purchasing strategy. As a result, contract prices in the second quarter ultimately increased by 13% to 18%. #realized #China #Oem , #ODM , #OBM #TechbicalSales #IPSales #OwnalltheChipsknowledge #Builddeeplytruthasmyrespondsibility #Microchip #SSD #HDD #DRAM #DDR #Serverparts #HPC #Servercpu #Truth #OneStopShopping #OEM. #OWNTear1Chipsresource #Outstanding #monthlyorder #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation ]#personaldevelopment #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #ssd #dram #ddr

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Gain exclusive insights into the #semiconductor industry's latest trends, including how #AI is shaping demand and inventory management. Dive into Fusion's report, "From the Source's Mouth," for a comprehensive view of upcoming demand, capacity, and #supply trends from industry insiders. Stay ahead of the curve – explore key insights now>>> https://lnkd.in/eRev4eAC

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#Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND 💡 Samsung Electronics has started mass production of its 9th generation of V-NAND #memory. The first dies based on their latest #NAND #tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with #data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build high-capacity and high-performance #SSDs, which will help to solidify Samsung's position in the storage market. Diving right in, Samsung is conspicuously avoiding to list the number of layers in their latest generation NAND, which is the principle driving factor in increasing capacity generation-on-generation. The company's current 8th gen V-NAND is 236 layers – similar to its major competitors – and word on the street is that 9th gen V-NAND ups that to 290 layers, though this remains to be confirmed. Thanks again to Anton Shilov and AnandTech for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/d6Ge4w47 #semiconductorindustry #semiconductors #semiconductor #innovation #korea #chip #chips #nandflash #flashmemory #ssd #ssds #it #ai #cloud

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Micron Technology unveils QLC NAND #SSD with more than 200 layers 💡 #Micron has launched a 2500 QLC NAND internal fit client product that’s faster than its 2550 TLC predecessor, despite TLC #NAND typically being quicker than QLC NAND. TLC (triple level cell) NAND has 3 bits per cell while QLC (quad level cell) has 4 bits per cell, meaning the #SSD's controller has to negotiate QLC’s 16 voltage states per cell instead of 8 with TLC. It takes longer to read and write individual cells unless the controller #firmware gets clever with such things as a very fast SLC (1 bit/cell) cache, and parallel #data plane access. Micron’s 2500 is claimed to be the first 200-plus layer QLC drive for OEM #desktop and #notebook (client) #computers. It uses 232-layer QLC NAND, and this gives it 30 percent more density, Micron says, than its 2400 176-layer QLC product, and 31 percent more than its 232-layer TLC NAND, as used in the 2550 M.2 format SSD. This was launched in December 2022 so it has taken 16 months to add the extra bit to the 232-layer NAND cells used in the 2500. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eqDvqWmQ #semiconductor #semiconductorindustry #semiconductors #technology #tech #informationtechnology #chip #chips #it #computer #memory

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SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips

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Thunderbolt Share is a groundbreaking software solution that transforms PC-to-PC interactions. Available with select PCs featuring Thunderbolt 4 or Thunderbolt 5 ports, Thunderbolt™ Share offers responsive screen-sharing and swift file transfers, redefining productivity and flexibility in your workflows. Thunderbolt Share not only enhances the capabilities of Intel's products but also provides substantial benefits to #IntelPartners by improving their product offerings, customer satisfaction, productivity, market reach, and innovative leadership. This technology fosters a more connected and efficient environment, which is crucial in today's fast-paced digital landscape. By leveraging Thunderbolt Share, Intel's partners can significantly enhance their competitive edge and meet the evolving demands of their customers. https://lnkd.in/gDsAjzKR

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STMicroelectronics Maintains Top Spot with 32.6% Market, onsemi Rises to Second Place in 2023 Revenue Ranking for #SiC Power Devices, Says TrendForce Corporation 💡 TrendForce 集邦科技 reports that the SiC power devices industry maintained strong growth in 2023, driven by the application of #BEVs. The top five suppliers accounted for approximately 91.9% of total revenue; ST lead the pack with a 32.6% market share while onsemi rose from fourth place in 2022 to second place. TrendForce’s analysis indicates that demand from #AI #servers and other fields will significantly increase in 2024. However, the noticeable slowdown in the sales growth of BEVs and weakening #industrial demand are affecting the SiC #supplychain. It is expected that the annual growth rate of industry revenue for SiC power devices will significantly decelerate in 2024 compared to previous years. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ePiyY-nw #semiconductorindustry #semiconductors #semiconductor #technology #semiconductormanufacturing #innovation #automotiveindustry #chip #chips #geopolitics #batterytechnology #battery #electricvehicles #evs

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KIOXIA Group Finalizes IPO Price, SK hynix Poised to Become Third-Largest Shareholder 💡 - DECEMBER 18 IPO DATE 🤩 According to a report from MoneyDJ, citing Reuters, Japanese #NAND #flash giant #Kioxia will debut on the Tokyo Stock Exchange through an #IPO on December 18. Kioxia has set its IPO price at 1,455 yen per share, giving the company a valuation of 784 billion yen (approximately USD 6.6 billion). The Reuters report also indicates that Kioxia has raised 120 billion yen (approximately USD 800 million) in its initial public offering, including an overallotment, as noted in a securities filing on Monday. The report from MoneyDJ points out that as part of the IPO, Kioxia will issue 21,562,500 new shares. According to Nikkei, filings with Japan’s Financial Services Agency reveal that U.S. investment firm Bain Capital, Kioxia’s largest shareholder, plans to sell 12,651,200 shares in the IPO. This is a 12% reduction from its earlier plan to sell 14,447,400 shares. Bain’s ownership stake, which was expected to decrease from 56% to 51%, is now projected to settle at 52%. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/di629Tcq #semiconductorindustry #semiconductors #chip #chips #memory #it #technology #tech #ssd #ssds #mobile #datacenter #ai #aiot #auto

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How will the trend of Supply Chain in Semiconductor be at 2025?

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Daily News ①Micron's Earnings Guidance Exceeds Expectations, AI Fuels HBM Demand Growth. Micron projects that the total addressable market (TAM) for HBM will grow from approximately $4 billion in 2023 to over $25 billion by 2025. Micron plans to ramp up production of its HBM3E 12H products by early 2025, with increased shipments throughout the year. ②Samsung Delays New Factory Construction, Conservative Investment Strategy Draws Attention. Samsung Electronics has delayed the construction and orders for its fourth plant in Pyeongtaek, South Korea (P4), and its second plant in Taylor, USA. Industry experts believe that Samsung's conservative approach to semiconductor investment may affect the progress of its partners' construction timelines. Samsung has notified its suppliers about postponing major orders for semiconductor equipment and infrastructure for these factories, but no official start date has been announced yet. ③Microsoft to Invest $1.3 Billion in Cloud and AI Infrastructure in Mexico Over the Next Three Years. Microsoft announced plans to invest $1.3 billion over the next three years to build Mexico's cloud computing and artificial intelligence infrastructure. According to the company's statement, the investment will focus on improving connectivity and supporting small and medium-sized enterprises (SMEs) in adopting AI technologies. The initiative aims to benefit 5 million Mexicans and 30,000 local SMEs within three years. ④SK Hynix Launches 12-Layer HBM3E, Boosting Memory Capacity and Speed.  SK Hynix has announced the mass production of its new 12-layer HBM3E memory, stacking 12 3GB DRAM chips while maintaining the same thickness as the existing 8-layer product. The new memory increases capacity by 50% and boosts performance to the highest speed in current memory, reaching 9.6Gbps. SK Hynix will begin delivering these products to customers later this year. #randa #ElectronicComponents #Semiconductors #ic #CPU #GPU #MCU #AI #Servers #HBM #MICRON #Chips #Samsung #Microsoft #SKHynix #Solutions #Trends #SupplyChains #ProcurementStrategies #Autoparts

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How is 800ZR/ZR+ expanding the deployment of pluggable coherent technology? In an upcoming webinar, an expert panel—including Josef Berger, AVP Marketing at Marvell—will delve into the following key topics: ✔ Understand market demands and the evolution from 400G to 800ZRx technology. ✔ Uncover the market potential for pluggable coherent technology and how 800ZRx broadens market opportunities. ✔ Explore how 800ZRx will contribute to the growth of metro datacenter infrastructure for machine learning applications. ✔ Review the latest testing and performance outcomes of 800ZRx prototypes, along with projected network performance. ✔ Gain insights into interoperability considerations and the deployment of 800ZRx in both new and existing network environments. Register now here: https://mrvl.co/3WS1PS9

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