Ludovic Rota

imec #ITF2024 - USING PHOTOACOUSTICS TO LOOK DEEPER INSIDE THE BODY: Let's continue our coverage of interesting optical technologies we saw at the recent imec ITF2024 two-day conference in the heart of #Antwerp. On day two, I wandered around the exhibition looking for demos – you know that I love demos. I renewed contact with Hilde Jans, who is R&D Project Manager at imec. Watch the video! She brings us up to date on what Optica Corporate member imec is doing in the field of photoacoustics for (mainly) biomedical applications. This is a non-invasive sensing technique for biomedical applications, such as tumour imaging or glucose sensing. It is based on the photoacoustic principle discovered by Alexander Graham Bell (yes, him), where incoming light is absorbed by a sample and generates sound waves. Looking deeper inside the body Because it focuses with sound, photoacoustics is able to image deeper in tissue than light-based alternatives. When imaging biological tissue, the choice of modality depends on the contrast used for imaging and the trade-off between resolution and depth. Light waves, e.g. used in endoscopy or microscopy, can generate high-resolution images but don’t travel far unperturbed. Deeper in tissue, the light gets scattered, resulting in blurry images. High-energy X-rays form a special case as they penetrate deep into the tissue and yield high-resolution images, but this ionizing radiation limits their use. To circumvent these drawbacks, other options that don’t rely on unperturbed light propagation have also been explored. Acoustic or sound waves are well known to safely monitor foetuses in the womb using ultrasound imaging. These mechanical waves are less scattered than electromagnetic waves of comparable frequencies or wavelengths, so they can reach objects deeper in the tissue. However, ultrasound images typically suffer from a low resolution. MRI images have greater detail than ultrasound images, but they are typically not real-time and static. In the soft spot between these established imaging methods emerges a novel technique with the resolution of light-based imaging and the good depth penetration of sound-based imaging, called photoacoustics (PA). It is capable of imaging finer blood vessels than other techniques without the need for contrast agents or X-ray. More info here: https://lnkd.in/dH2mNMb2

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Optimizing Supply Chains Amid Industry Shifts: The electronics sector is undergoing significant transformations, with recent developments highlighting both challenges and opportunities. For instance, STMicroelectronics has adjusted its financial targets to 2030, citing a persistent slump in demand for industrial and automotive chips.  In this evolving landscape, effective inventory management is crucial. At Gerard EMG, we specialize in transforming surplus components into valuable assets, ensuring manufacturers can: Maximize Returns: Our extensive network connects you with competitive buyers. Streamline Operations: We handle the complexities, allowing you to focus on core activities. Promote Sustainability: By reintroducing components into the market, we reduce waste and support a balanced supply chain. If you're navigating excess inventory amid these industry shifts, let's connect. Reach out via LinkedIn or email [email protected] to explore how Gerard EMG can assist you.

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The European Semiconductor Industry Association (ESIA) calls for a new support package, Chips Act 2.0, to enhance the original EU Chips Act and boost the semiconductor industry. Key requests include increased state aid from 2024 to 2029 and the establishment of a ‘chips envoy’ to guide EU policy decisions. The ESIA emphasizes the need for a cohesive policy strategy to achieve the EU’s goal of increasing semiconductor market share from 10% to 20% by 2030 amid growing global competition. #ESIA #semiconductor #Europe #semiconductormarket #technology #EUChipsAct #chip #chipmaking #technology #industry #research https://lnkd.in/dB7JQ45T

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STMicroelectronics to Build €5 Billion Plant in #Italy with #EU Chips Act Aid STMicroelectronics NV said it plans to spend €5 billion ($5.4 billion) on a #manufacturing plant for #chips and packaging in #Catania, #Italy in a multi-year project that’s being partly funded by the #EuropeanUnion's #ChipsAct. The Italian government, within the Chips Act framework, will give STMicro €2 billion in #subsidies, the company said in a statementon Friday. The plant, which will specialize in silicon-carbide manufacturing as well as testing and packaging, will start production in 2026 and targets hitting full capacity by 2033, it said. Thanks again to Jillian Deutsch and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eDircssY #semiconductorindustry #semiconductor #semiconductors #technology #tech #innovation #geopolitics #automotiveindustry #chip #car #ev #evs

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Dual-core ARM Cortex-A55 SoM starting from $34 https://lnkd.in/eC4M4PUa

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EU Chips Act 2.0 should include legacy chips, says industry group chief : https://lnkd.in/equszzg5 (Reuters) - The European Commission should expand plans to strengthen its computer chip sector to include "foundational and legacy" semiconductors, where much of the region's strengths lie, the head of industry group European Semiconductor Industry Association (ESIA) said on Friday. The Commission is discussing a possible follow up to the European Chips Act which was rolled out in April 2023 as a 43 billion euro ($46.96 billion) subsidy plan to boost Europe's share of the global chip market to 20% by 2030. #semiconductor #manufacturing #technology #innovation #chips  #semiconductormanufacturing #advancedtechnology #engineering #lithography #nanometer #research #development #AI  #mobileprocessors #EUV #DUV

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How do you see Heterogeneous Integration as a key enabler for future applications? 🤔Dimitrios Velenis, Head of the 3D and Silicon Photonics Device and Components Group of imec, explains heterogeneous integration offers two main characteristics: functionality and cost flexibility. During the 3D & Systems Summit Dimitrios represented HiCONNECTS and presented imec's work with the consortium. 📽️ Watch the video to learn how Heterogeneous Integration enables future applications. Stay tuned for more insights from the SEMI 3D & Systems Summit (#3DSummit)! 👉 https://lnkd.in/dpJmjkH

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🔎 At the 2024 IEEE VLSI Technology and Circuits Symposium, Belgium's microelectronics research center IMEC has showcased the first CMOS CFET device, which to be Introduced in 0.7nm A7 Node! 📈 By using front-side lithography techniques for both contacts, IMEC has also demonstrated the feasibility of transferring the bottom contacts to the back side of the wafer, which potentially increases the survival rate of top devices from 11% to 79%. 💡 Dive deeper into IMEC’s research here: https://buff.ly/3xuB25H 🔗 #CFET #IMEC #A7 #0.7nm

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"Yet despite these good products, the company lost money throughout the entirety of the 1970s - $20 million in a good year, $50 million in a bad one. Each year, the government compensated them for exactly the amount of that loss. The government did this because they - like many other people in Europe - thought that semiconductors would always lose money. You must do them because they support critical things like nuclear weapons and other strategic industries. But don't expect to make money from it. In an atomic bomb, who cares if a transistor costs one dollar or a thousand dollars? So just make the best darn transistor you can make, and forget about the cost. So volumes cratered, product lines expanded, and costs rose. This arrangement made sure that everyone stayed employed - not unimportant in Italy those days with its leftist bent - and some high quality products got made. But it also left the company in limbo. They were perfectly satisfied to sell small numbers of chips solely into Europe - itself a declining semiconductor market. .... In 1979, the company hired a new CEO - Pasquale Pistorio. .... Over many years, he worked his way up to be vice president of Motorola's international semiconductor division and the most senior non-American in the world's second largest semiconductor company. The SGS job offered a 40% pay cut and required him to take an armored car thanks to terrorists. But Pistorio embraced the professional challenge of turning around what he called a "basically broken" company that still held national importance to his home country. It would also allow him to move home to be with his aging parents." Extract from excellent article on STMicroelectronics by Jon Y

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The two sides aim at promoting the development of green energy. Infineon will provide FOXESS with its CoolSiC™ MOSFETs 1200 V, which will be used with EiceDRIVER™ gate drivers for industrial energy storage applications.

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The EU Chips Act is nearing implementation and promises to significantly enhance Europe's innovation and competitiveness in the semiconductor sector. Its success hinges on fostering collaboration and investment across the entire value chain. imec, a leading R&D partner for many European companies, plays a crucial role by uniting stakeholders around shared semiconductor roadmaps. This collaboration aims to leverage combined expertise and infrastructure to support Europe’s digital economy. The upcoming event, ITF Chip into the Future, will highlight how the EU Chips Act can benefit the entire semiconductor value chain. Attendees will learn about four pilot lines designed to accelerate research, prototyping, testing, and manufacturing in Europe. Expert presentations will cover key drivers and challenges facing the European semiconductor industry within a global context. Participants can expect insights on how the EU Chips Act can enhance innovation and competitiveness for various industries. The event will also showcase best practices and success stories in developing advanced technologies. A moderated discussion will focus on strategies for bridging the gap from lab to market. Panelists will address access to design tools for SMEs and start-ups, talent development, and building strong partnerships. The forum will gather leading experts and innovators from the semiconductor and ICT sectors, emphasizing the collective importance of collaboration. With the Chips Act's impending rollout, the event presents a vital opportunity to advance semiconductor innovation in Europe. #semiconductor #EU #EUChipsAct #chip #ITF #chipmaking #expo #Europe #digital #economy

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🚀 Nordic Semiconductor Expands nRF54L Series with Enhanced Wireless SoCs Nordic Semiconductor has expanded its nRF54L Series, introducing the nRF54L10 and nRF54L05 to complement the previously announced nRF54L15. These ultra-low-power wireless SoCs deliver enhanced efficiency, processing power, and flexible design options, catering to a wide range of Bluetooth LE and IoT applications. ◾ Key Highlights: ▪ Integrated Design: Combines a 2.4 GHz radio, Arm Cortex-M33 (128 MHz), memory, and peripherals on a single chip, eliminating the need for external MCUs or memory. ▪ Memory Options: nRF54L15: 1.5 MB NVM, 256 KB RAM for demanding applications. nRF54L10: 1.0 MB NVM, 192 KB RAM for mid-range applications. nRF54L05: 0.5 MB NVM, 96 KB RAM for cost-sensitive designs. ▪ Applications: Wearables, smart homes, medical devices, smart tags, and industrial IoT. ▪ Ultra-Compact: A 2.4 x 2.2 mm package option, 50% smaller than the nRF52840. ◾ Advanced Features: ▪ Protocols: Supports Bluetooth LE, Mesh, Thread, Matter, Zigbee, and more, with future-proofing for Bluetooth 6.0. ▪ Security: TrustZone isolation, tamper sensors, and cryptographic accelerators. ▪ Efficiency: Built on TSMC’s 22ULL process, enhancing power savings and supply chain resilience. With production slated for late 2024, Nordic solidifies its leadership in Bluetooth LE solutions. Learn more about the nRF54L Series Development Kit to kick-start your evaluation. Thanks again to New Electronics for the full article with more background and insights click the source link in the comments below 💡 🙏👇 #Semiconductors #IoT #BluetoothLE #Innovation

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Opening plenary talk at #ESSERC 2024 in Bruges: Marc Biron, CEO of Melexis, giving interesting insights into successful innovation. But what’s really remarkable: he is sharing the stage and his talk with two more people, his Innovation Director, and a young engineer and employee, who did her MSc in 2022 and shared her view on innovation in a very inspiring and professional way. Chapeau!

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Great article with insights by Bernard Murphy at SemiWiki.com, "Arteris Frames Network-On-Chip Topologies in the Car." "... while there is plenty of complexity in evolving car architectures and the consequent impact on subsystem chip/chiplet designs, connected on-chip through both coherent and non-coherent networks, the intent behind these systems is quite clear. We just need to start thinking about total car system architecture rather than individual chip functions." #Arteris #NetworkOnChip #Automotive https://bit.ly/3UiKqls

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New era for electromobility thanks to imec. In a new press release, imec announces the development of a high-performance lithium-metal solid-state battery. The battery features a unique "liquid-to-solid" electrolyte and a stunning 1070 Wh/L energy density. It's cost-effective and compatible with current production lines, promising a new era for electromobility.

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