INTEGRATED CIRCUITS

DATA SHEET

TDA1013B 4 W audio power amplifier with DC volume control

Product specication File under Integrated Circuits, IC01 July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

GENERAL DESCRIPTION

TDA1013B

The TDA1013B is an integrated audio amplifier circuit with DC volume control, encapsulated in a 9-lead single in-line (SIL) plastic package. The wide supply voltage range makes this circuit ideal for applications in mains and battery-fed apparatus such as television receivers and record players. The DC volume control stage has a logarithmic control characteristic with a range of more than 80 dB; control is by means of a DC voltage variable between 2 and 6.5 V. The audio amplifier has a well defined open loop gain and a fixed integrated closed loop. This device requires only a few external components and offers stability and performance. Features Few external components Wide supply voltage range Wide control range Pin compatible with TDA1013A QUICK REFERENCE DATA PARAMETER Supply voltage Repetitive peak output current Total sensitivity Audio amplier Output power Total harmonic distortion Sensitivity DC volume control unit Gain control range Signal handling Sensitivity (pin 6) Input impedance (pin 8) THD < 1%; DC control = 0 dB Vo = 125 mV; max. voltage gain Vi |Zi| 39 23 45 29 55 35 mV k Vi 1.2 1.7 V |Gv| 80 dB THD = 10%; RL = 8 Po = 2.5 W; RL = 8 Po = 2.5 W Po THD Vi 4.0 100 4.2 0.15 125 0.1 160 W % mV Po = 2.5 W; DC control at max. gain Vi 44 55 69 mV IORM 1.5 A CONDITIONS SYMBOL VP MIN. 10 TYP. 18 MAX. 40 V UNIT Fixed gain High signal-to-noise ratio Thermal protection

PACKAGE OUTLINE 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

TDA1013B

Fig.1 Block diagram.

PINNING 1. power ground 2. amplifier output 3. supply voltage 4. electronic filter 5. amplifier input 6. control unit output 7. control voltage 8. control unit input 9. signal ground (substrate)

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VP IOSM IORM Tstg Tc Ptot PARAMETER Supply voltage Non-repetitive peak output current Repetitive peak output current Storage temperature range Crystal temperature Total power dissipation 55 MIN. 40 3 1.5 +150 +150 see Fig.2 MAX.

TDA1013B

UNIT V A A C C

Fig.2 Power derating curve.

HEATSINK DESIGN EXAMPLE Assume VP = 18 V; RL = 8 ; Tamb = 60 C; Tc = 150 C (max.); for a 4 W application, the maximum dissipation is approximately 2.5 W. The thermal resistance from junction to ambient can be expressed as: Rth j-a = Rth j-tab + Rth tab-h + Rth h-a = T j max T amb max 150 60 ------------------------------------------ = --------------------- = 36 K/W 2.5 P max Since Rth j-tab = 9 K/W and Rth tab-h = 1 K/W, Rth h-a = 36 (9 + 1) = 26 K/W.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

CHARACTERISTICS VP = 18 V; RL = 8 ; f = 1 kHz; Tamb = 25 C; see Fig.10; unless otherwise specied PARAMETER Supply voltage range Total quiescent current Noise output voltage at maximum gain at maximum gain at minimum gain Total sensitivity Audio amplier Repetitive peak output current Output power Total harmonic distortion Sensitivity Input impedance (pin 5) Power bandwidth DC volume control unit Gain control range Signal handling Sensitivity (pin 6) Input impedance (pin 8) Output impedance (pin 6) Note to the characteristics 1. Measured in a bandwidth in accordance with IEC 179, curve A. THD < 1%; DC control = 0 dB Vo = 125 mV; max. voltage gain |Gv| Vi Vi |Zi| |Zo| 80 1.2 39 23 45 90 1.7 44 29 60 THD = 10%; RL = 8 Po = 2.5 W; RL = 8 Po = 2.5 W IORM Po THD Vi |Zi| BP 4.0 100 100 4.2 0.15 125 200 30 to note 1 RS = 0 RS = 5 k RS = 0 Po = 2.5 W; DC control at max. gain Vn Vn Vn Vi 44 0.5 0.6 0.25 55 CONDITIONS SYMBOL VP Itot MIN. 10 TYP. 18 25

TDA1013B

MAX. 40 60 1.4 69

UNIT V mA mV mV mV mV

1.5 1.0 160 500 55 35 75

A W % mV k Hz

40 000

dB V mV k

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

APPLICATION INFORMATION

TDA1013B

Fig.3

Output power as a function of supply voltage; f = 1 kHz; THD = 10% and control voltage (V7) = 6.5 V.

Fig.4

Power dissipation as a function of output power; VP = 18 V; f = 1 kHz; RL = 8 and control voltage (V7) = 6.5 V.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

TDA1013B

Fig.5 Power bandwidth; VP = 18 V; RL = 8 ; THD = 10% and control voltage (V7) = 6.5 V.

Fig.6

Total harmonic distortion as a function of frequency; VP = 18 V; RL = 8 ; Po = 2.5 W and control voltage = 6.5 V.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

TDA1013B

Fig.7

Total harmonic distortion as a function of output power; VP = 18 V; RL = 8 and control voltage = 6.5 V.

Fig.8 Typical control curve.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

TDA1013B

Fig.9

Noise output voltage as a function of the control voltage; VP = 18 V; RL = 8 (in accordance with IEC 179, curve A).

Fig.10 Application diagram.

July 1994

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads

TDA1013B

SOT110-1

D1 q P P1 A2

A3 q1 q2

A A4 seating plane E pin 1 index

L 1 Z b2 e b b1 w M 9 Q

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-02-25

July 1994

10

Philips Semiconductors

Product specication

4 W audio power amplier with DC volume control

SOLDERING Introduction

TDA1013B

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.

July 1994

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