INTEGRATED CIRCUITS

DATA SHEET

TDA2613 6 W hi-fi audio power amplifier

Product specication File under Integrated circuits, IC01 July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

GENERAL DESCRIPTION

TDA2613

The TDA2613 is a hi-fi audio power amplifier encapsulated in a 9-lead SIL plastic power package. The device is especially designed for mains fed applications (e.g. tv and radio). Features Requires very few external components Input muted during power-on and off (no switch-on or switch-off clicks) Low offset voltage between output and ground Hi-fi according to IEC 268 and DIN 45500 Short-circuit-proof Thermally protected. QUICK REFERENCE DATA Supply voltage range Output power at THD = 0,5%, VP = 24 V Voltage gain Supply voltage ripple rejection Noise output voltage Po Gv SVRR Vno(rms) typ. typ. typ. typ. 6W 30 dB 60 dB 70 V VP 15 to 42 V

PACKAGE OUTLINE TDA2613: 9-lead SIL; plastic power (SOT110B); SOT110-1; 1996 August 07.

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

TDA2613

Fig.1 Block diagram.

PINNING 1. 2. 3. 4. n.c. n.c. VP/2 n.c. not connected not connected

1

5. 6. 7. 8. 9.

GND OUT +VP INV INV

ground (asymmetrical) or negative supply (symmetrical) output positive supply inverting input non-inverting input

2 VP (asymmetrical) or

ground (symmetrical) not connected

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

FUNCTIONAL DESCRIPTION

TDA2613

This hi-fi power amplifier is designed for mains fed applications. The device is intended for asymmetrical power supplies, but a symmetrical supply may also be used. An output power of 6 watts (THD = 0,5%) can be delivered into an 8 load with an asymmetrical power supply of 24 V. The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread. A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.4, the 100 F capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifier remains in the DC operating mode but is isolated from the non-inverting input on pin 9. Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 C allowing safe operation to a maximum junction temperature of 150 C without added distortion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage Non-repetitive peak output current Total power dissipation Storage temperature range Junction temperature Short-circuit time: outputs short-circuited to ground (full signal drive) Note to the Ratings For asymmetrical power supplies (at short-circuiting of the load) the maximum supply voltage is limited to VP = 28 V. If the total internal resistance of the supply (RS) 4 , the maximum unloaded supply voltage is increased to 32 V. For symmetrical power supplies the circuit is short-circuit proof to VP = 21 V. tsc 1 hour see note see Fig.2 IOSM Ptot Tstg Tj 55 + 150 150 C C 4 A CONDITIONS SYMBOL VP MIN. MAX. 42 V UNIT

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

TDA2613

Fig.2 Power derating curve.

THERMAL RESISTANCE From junction to case HEATSINK DESIGN EXAMPLE With derating of 8 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 and VP = 24 V, the measured maximum dissipation is 4,1 W; then, for a maximum ambient temperature of 60 C, the required thermal resistance of the heatsink is: 150 60 R th h-a = --------------------- 8 14 K/W 4,1 Note: The metal tab (heatsink) has the same potential as pin 5 (GND). Rth j-c = 8 K/W

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

CHARACTERISTICS PARAMETER Supply voltage range operating mode input mute mode Repetitive peak output current VP = 24 V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output power Total harmonic distortion Power bandwidth Voltage gain Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Input impedance Supply voltage ripple rejection Input bias current DC output offset voltage with respect to VP/2 Vos 30 note 2 SVRR Iib 35 44 0,3 RS = 2 k Vno(rms) |Zi| 14 70 20 Po = 4 W THD = 0,5%; note 1 B Gv 29 20 to 16 k 30 THD 0,15 THD = 0,5% THD = 10% Itot Po Po 10 5 6,5 20 6 8,0 IORM 2.2 VP VP 15 4 24 CONDITIONS SYMBOL MIN. TYP.

TDA2613

MAX. 42 10 V V A

UNIT

Operating mode: asymmetrical power supply; test circuit as per Fig.4; 35 0,2 mA W W % Hz dB

31

140 26

V k dB A mV

200

Input mute mode: asymmetrical power supply; test circuit as per Fig.4; VP = 8 V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output voltage Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Supply voltage ripple rejection DC output offset voltage note 2 with respect to VP/2 Vos 40 200 mV SVRR 35 55 dB RS = 2 k Vno(rms) 70 140 V Vi = 600 mV Itot Vout 5 15 2,0 20 2,8 mA mV

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

TDA2613

PARAMETER

CONDITIONS

SYMBOL

MIN.

TYP.

MAX.

UNIT

Operating mode: symmetrical power supply; test circuit as per Fig.3; VP = 12 V; RL = 8 ; Tamb = 25 C; f = 1 kHz Total quiescent current Output power Total harmonic distortion Power bandwidth Voltage gain Noise output voltage (r.m.s. value); unweighted (20 Hz to 20 kHz) Input impedance Supply voltage ripple rejection DC output offset voltage Notes to the characteristics 1. Power bandwidth at Po max 3 dB. 2. Ripple rejection at RS = 0 , f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail. with respect to ground Vos 30 200 mV SVRR 40 60 dB RS = 2 k Vno(rms) |Zi| 14 70 20 140 26 V k THD = 0,5% THD = 10% Po = 4 W THD = 0,5% note 1 B Gv 29 40 to 16 k 30 31 Hz dB Itot Po Po THD 10 5 6,5 20 6 8,5 0,13 35 0,2 mA W W %

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

APPLICATION INFORMATION

TDA2613

Fig.3 Test and application circuit; symmetrical power supply.

Fig.4 Test and application circuit; asymmetrical power supply.

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

Input mute circuit

TDA2613

The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 12 supply voltage (at pin 3) with an internally fixed reference voltage (Vref), derived directly from the supply voltage. When the voltage at pin 3 is lower than Vref the non-inverting input (pin 9) is disconnected from the amplifier. The voltage at pin 3 is determined by an internal voltage divider and the external 100 F capacitor. During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.5).

Fig.5 Input mute circuit; time delay.

July 1994

Philips Semiconductors

Product specication

6 W hi- audio power amplier

PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads

TDA2613

SOT110-1

D1 q P P1 A2

A3 q1 q2

A A4 seating plane E pin 1 index

L 1 Z b2 e b b1 w M 9 Q

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION

ISSUE DATE 92-11-17 95-02-25

July 1994

10

Philips Semiconductors

Product specication

6 W hi- audio power amplier

SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values

TDA2613
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.

This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

July 1994

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