Jan-Philipp Gehrmann

This picture was taken at the exhibition floor at embedded world Exhibition&Conference...in 2022. Last week in Nuremberg, I couldn’t see cars – or too automotive technology for that matter – in display. The different ecosystem players were still there: OEM (the car makers), Tier-1 (the companies that sell systems to the car makers), Tier-2 (the semiconductor companies that mostly sell to Tier-1s) and finally IP and other vendors that are part of the food chain. This at least was the “correct order of things” up until recently. But based on my many discussions last week, it seems the industry is in an active soul-searching:   The traditional car makers bosses – mostly European - are looking west to Tesla and east to China, where cars are designed “top-down”: often starting with the SW in-mind, and then designing the core chips in-house, and buying some of the others. Similar to how mobile-phones are made. The European OEMs often feel that buying from the long-established supply chain of Tier-1s and Tier-2s leave them with undifferentiated cars, primarily in competition with the new players in the market. On the other hand, they have years of legacy and multiple models to support and look with envy on the newcomers that can start with a clean sheet of paper.      That creates a stir that has the potential to disrupt the industry: OEMs thinking of building their own chips, semiconductor companies selling directly to OEMs, Tier-1 players trying to find their way in this puzzle.   Amidst all that, Tesla – the “role model” – yesterday announced shedding 10% of its workforce (14,000 positions!), facing slowing demand and pressure on prices from Chinese competitors. Quite timely, The Economist this week reports that most EV wannabe-Teslas are also in trouble. On the other hand, Xiaomi introduced a few days ago a its first car, a Porsche-like all electrical SU7 model, that sells cheaper that Tesla’s Model-3 in China.   It seems there is a exciting road ahead for the automotive industry, with many twists and turns! 

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🌟 **Unlocking the Future of Health: Beyond Longevity to Wellness!** 🌟 In the wake of COVID-19, our focus has shifted dramatically toward enhancing human health—not just living longer but living healthier! The journey to increase our health span is now powered by innovative technologies that allow us to measure, monitor, and adapt our lifestyles for better well-being. At Infineon Technologies, we’re leading the charge in **Digital Health**. Our mission? To create secure, connected microcontrollers, sensors, memories and solutions that empower individuals in their quest for healthy living. 💪 ✨ **Discover the impact of our PSoC™ 63**—a cutting-edge device designed for health and wellness solutions. 👉 Check out this must-watch documentary from Adrian Mikolajczak (VP – Infineon’s Silicon Valley Innovation Center) to learn more about our commitment to advancing health technology. 📩 Interested in enhancing your health solutions? Reach out to the Infineon team for insights and access to reference designs for continuous glucose & lactate monitoring. Together, let’s redefine health! 🌍💚 #DigitalHealth #Wellness #HealthTech #Infineon #PSoC63 #Innovation #HealthyLiving #Longevity #FutureOfHealth #SiliconValley #HealthSpan 

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The observation that different generations have different attitudes is as old as humanity itself. Lately I've been asked a lot in interpersonal exchanges and interviews what I think about #GenZ. And I think it's an interesting question because it's very multidimensional. My two cents on the subject: Each generation has its own influences and needs. From my perspective, the key is to listen. Valuing diversity also means valuing and integrating different generations. We need to stop pointing fingers and reducing generations to stereotypes. Everyone has a role to play, be it companies or leaders. Leading multi-generational teams is an important part of leadership training at Infineon Technologies. I personally use #ReverseMentoring and have already had many "aha" moments. Changing perspectives is valuable. It opens us up to new ideas from other generations and promotes mutual understanding. What do I take away from my exchanges with younger talents? They are keen to make a difference, take responsibility and pursue their visions with passion - that sounds promising to me. 😉 Let's work together and leverage the power of our differences! Do you have anything to add? #Generation #Diversity #Inclusion #Leadership

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Did you know that we’re expecting an average of more than 40 Bosch semiconductor chips to be integrated in every new vehicle by 2035? What already sounds like quite a lot is only likely to increase in the years to come. 🚀 According to Bosch estimates, 70 percent of all new cars in Europe will likely be purely electric by 2030. Of course, we are well-prepared. We are systematically reinforcing our semiconductor business and expanding our global semiconductor manufacturing network. 🌎 Bosch is specialized in producing semiconductors for the automotive industry in both Dresden and Reutlingen. And we will soon also manufacture these demanded chips in Roseville, California. More precisely, our American colleagues will produce first silicon carbide (SiC) chips on 200-millimeter wafers starting in 2026. Until then, we are ensuring the knowledge exchange between our new fab in California and our wafer fab in Reutlingen, where the first samples on 200-millimeter wafers are currently being produced for customer trials. Read all about this ongoing success story here: https://lnkd.in/eiGexgPR

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🔋 Advancing electric vehicle efficiency with standardized battery management Check out our latest insights on how Intel is pioneering standardized battery management to enhance the efficiency of electric vehicles. By drawing parallels with the PC industry, we aim to implement a centralized energy management approach that promises significant savings and advancements. Learn more about this transformative strategy and its impact on the future of mobility in the latest article from TechTag. Read Article : https://lnkd.in/eeR5UpY9 #ElectricVehicles #BatteryEfficiency #IamIntel

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Five Reasons Why ThinLinc Remote Desktop is a Perfect Fit for EDA Workflows in Semiconductor Design We are excited to share our latest blog post, written by Christoph Balmer and Tobias Oetiker from OETIKER+PARTNER AG. Electronic Design Automation (EDA) is vital in semiconductor chip design, and choosing the right remote desktop solution is crucial for efficiency. Our latest blog explores why Cendio ThinLinc is the ideal choice for EDA environments: Top-Tier Performance on Linux: Optimized for Linux, ThinLinc ensures smooth operation for graphic-intensive EDA applications. Enhanced Security: Secure access via SSH tunneling protects your EDA data and simplifies user management. Seamless Collaboration: Real-time desktop sharing enables effective team collaboration from any location. Flexibility and Customization: Supports various Linux distributions and integrates with existing IT infrastructure. Cost-Effectiveness: Centralized powerful servers reduce hardware costs and extend the reach of expensive EDA tools. https://lnkd.in/dprgvVhB Join the discussion and share your experiences with ThinLinc in your EDA workflows. P.S. Check out the detailed sections on Linux applications used for EDA in the blog!

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Yole Group Viewpoint – Powering the future: #Semiconductor solutions for #automotive #electrification 💡 - by Yole Group We cannot hide that #BEV growth has slowed in all 3 major markets, although we see different root causes. As shown in the adoption of BEV among different customer groups, #China is leading the trend. Although the major #EV markets are experiencing slow growth of BEVs, we are seeing a new wave powered by the 800V adoption, >3C fast charging batteries, and high-power DC chargers. Power #electronics, especially #SiC, are one of the key drivers. Remarkably, China has entered the early majority phase, while both #Europe and the #USA are still in early adopter phases, having not yet crossed ‘The chasm’ into majority customer markets. We conclude that the slowdown in China is mainly due to technological limitations in the #battery. While BEVs can satisfy most user scenarios, they are still challenging in cold weather and long-distance driving (people still remember the hours or even days of standing still in storms during the Chinese New Year holidays). For Europe and the US alike, where wealthy early adopters are the base of EV adoption, however, the hefty price gap between BEV and its ICE counterpart still keeps these 2 markets from a large majority. We conclude that the slowdown in both Europe and the US is mainly due to #battery #supplychain limitations, which still lack local production and cost competitiveness. Thanks again to Yole Group for the full article with more background, charts and insights via the link below 💡🙏👇 https://lnkd.in/eFXX3if6 #semiconductorindustry #semiconductor #semiconductors #auto #car #it #automotiveindustry #automotivetechnology #batterytechnology #ic #chip #chips #informationtechnology #geopolitics #sanctions #it

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Comparing performance of different SoC platforms for DNNs (Deep Neural Networks) processing has been a massive stone in OEMs' shoes for years! The Autonomous Vehicle Computing Consortium, Inc. (AVCC) took notice and, through hard work and collaboration, the Benchmarks Work Group led by Kasper Mecklenburg is able to demonstrate the proof-of-concept of a representative automotive benchmark with MLCommons. It's a great foundation for the entire ecosystem to build upon! However... benchmarks are just a language. They facilitate communication among speakers. If OEMs don't take the lead and embrace these representative benchmarks, suppliers won't care to produce them. Then, OEMs will be left with INT8 TOPS as single number on a datasheet, again! First step, join the webinar below! #ai #automateddriving #benchmarking

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The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on #decarbonization efforts. With recent introduction of CoolSiC™ Thin-TOLL 8x8 and TOLT packages, Infineon Technologies is actively accelerating and supporting these trends. They enable a maximum utilization of the PCB mainboard and daughter cards, while also taking the system’s thermal requirements and space restrictions into account. The company has expanded its portfolio of CoolSiC™ MOSFET discretes 650V with two new product families housed in the Thin-TOLL 8x8 and TOLT packages. They are based on the #CoolSiC Generation 2 (G2) technology, offering significantly improved figures-of-merit, reliability, and ease-of-use. Both product families specifically target high and medium switching-mode power supplies (SMPS), including #AI servers, renewable energy, #EV chargers, and large home appliances. The Thin-TOLL package has a form factor of 8x8 mm and offers the best-in-class Thermal Cycling on Board capability on the market. The TOLT package is a top-side cooled enclosure with a similar form factor to TOLL. Both package types offer developers several benefits: Using them in #AI and server power supply units, for example, reduces the thickness and length of the daughter cards and allows for a flat heat sink. When used in microinverters, 5G PSU, TV PSU and SMPS, the Thin-TOLL 8x8 package allows for a minimization of the PCB area occupied by the power supply devices on the mainboard, while TOLT keeps the junction temperature of the devices under control, given that these applications typically use convection cooling. In addition, TOLT devices complete Infineon's top-side cooled CoolSiC industrial portfolio, namely CoolSiC in Q-DPAK. They enable developers to reduce the PCB footprint occupied by SiC MOSFETs when the power to be delivered to the devices does not require a Q-DPAK package. The CoolSiC MOSFETs 650 V G2 in ThinTOLL 8x8 and TOLT are already available in R DS(on) from 20, 40, 50 and 60 mΩ. Additionally, the TOLT variant is also available with an R DS(on) of 15 mΩ. The product family will be expanded by a more granular portfolio by the end of 2024. Find more information here - https://lnkd.in/dnwaqCTp. And make sure to book a meeting at electronicaFair in November in Munich where Infineon Technologies will showcase its widest #semiconductor portfolio along with the new released products. In case of further questions, don't hesitate to let me know.

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On September 18 join my Infineon Technologies’ colleague Daniel Makus, Global Application Director OBC and Power Conversion Systems, who will speak about the success factors for efficient and yet enduring #electrification of commercial vehicles. He will discuss how to overcome #powerconversion challenges. Demanding operating conditions call for reliability and durability of our components. Learn from concrete examples of DC-DC and charging solutions how Infineon Technologies contributes to a more sustainable transportation industry. ❗ Key takeaways: ➡ Development of high-efficiency power electronics systems capable of handling high voltages and currents; ➡ Tackling demanding operating conditions; ➡ Infineon Technologies’s DC-DC and charging solutions for eCAVs Register here - https://lnkd.in/dSDR9NPb

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🛡️ #NXP is synonymous with top-notch quality and dependability in the realm of functional safety. Through our SafeAssure program, we facilitate collaboration between specialists and designers to exchange extensive expertise in automotive and appliance safety, access a wealth of product development resources, and forge strategic partnerships with leading industry players. Discover more today!

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Sometimes a tiny little semiconductor chip can make a massive difference onto the user's end-application. The unprecedent performance of our 10AS940 ADC is one of them ! Check this short video out to learn more about how this device can enable a significant step in RF softwarization of your system.

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The 2SP0230 dual-channel gate driver boards with advanced protection features can work with 62 mm SiC and IGBT modules up to 1700 V. These scalable, plug-and-play drivers reduce system design and sourcing challenges for railway, EV charging and STATCOM applications. #GateDrivers https://okt.to/Al5m41

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Infineon at IAA TRANSPORTATION 2024: Semiconductors make transportation vehicles clean, safe, and smart It was a pleasure to speak today at the IAA TRANSPORTATION 2024 on the main stage in Hanover, Germany. I emphasized that Infineon is committed to the logistics and transport industry and that we will support drive the transportation evolution towards #decarbonization and #digitalization – in short – help make trucks, buses, and commercial vehicles of all kinds clean, safe, and smart. “clean”: Help meet emission targets, widen range, shorten charging times. “safe”: Advance driver assist functions towards autonomous driving. “smart”: Optimize fleet management, freight travel times, and costs per freight tonnage and kilometer. Given this, I think it’s safe to say: Infineon is shaping the future of transportation, where innovative technologies and sustainable solutions come together to create a better tomorrow for generations to come. #Infineon #IAATRANSPORTATION #Chips4mobility #Electrification #AutonomousVehicles #decarbonization #digitalization #mobility

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STMicroelectronics to Build €5 Billion Plant in #Italy with #EU Chips Act Aid STMicroelectronics NV said it plans to spend €5 billion ($5.4 billion) on a #manufacturing plant for #chips and packaging in #Catania, #Italy in a multi-year project that’s being partly funded by the #EuropeanUnion's #ChipsAct. The Italian government, within the Chips Act framework, will give STMicro €2 billion in #subsidies, the company said in a statementon Friday. The plant, which will specialize in silicon-carbide manufacturing as well as testing and packaging, will start production in 2026 and targets hitting full capacity by 2033, it said. Thanks again to Jillian Deutsch and Bloomberg News for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eDircssY #semiconductorindustry #semiconductor #semiconductors #technology #tech #innovation #geopolitics #automotiveindustry #chip #car #ev #evs

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Great recap #CadenceLive #Cadence #semiwiki “The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest.” — Bernard Murphy, SemiWiki Check out Bernard’s #CadenceLIVE recap here: ⤵️ https://ow.ly/K0Lr50RFXWm

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It’s worth checking out this conversation between my colleague Kedar Kondap and Daniel Newman. #SnapdragonXSeries, within a single generation, has restored performance leadership to the Windows PC, and within the next few months, you’re going to see more and more powerful AI experiences come to the surface, as developers begin to leverage tools like the Qualcomm AI Hub. https://lnkd.in/gcfqPZ5W

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Great article with insights by Bernard Murphy at SemiWiki.com, "Arteris Frames Network-On-Chip Topologies in the Car." "... while there is plenty of complexity in evolving car architectures and the consequent impact on subsystem chip/chiplet designs, connected on-chip through both coherent and non-coherent networks, the intent behind these systems is quite clear. We just need to start thinking about total car system architecture rather than individual chip functions." #Arteris #NetworkOnChip #Automotive https://bit.ly/3UiKqls

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