Yelo Laser Diode Reliability Burn in and Lifetest For Photonic Devices Powerpoint

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Yelo Laser Reliability Burn in and Lifetest for

Active Photonic Device


Company History

1983 Yelo founded

2001 Acquired by Mindready Solutions

2008 Mindready acquired by Averna

2010 Management Buyout Out and rebrand Yelo


Clients

Yelo’s clients include Telecom Network Equipment Original Equipment


Manufacturers, Photonic and opto-electronic device manufacturers,
startups and contract manufacturers

Europe: UK, Germany, Sweden, Finland, France

North America: Canada, East and West coast USA

China: Shenzen

Over 110 systems installed with 34 clients globally


Laser Reliability,Burn-in and Lifetest
Expertise

Over 100 man years of photonics experience

Ex Nortel / Bookham / Oclaro engineers

Photonic device manufacturing and QA expertise

Photonic device Qualification/Burn-in/Lifetest Equipment

Thermal Management

Device reliability-Telcordia standards

Device packaging (40Gb / 100 Gb)

Testing and fixturing (40Gb / 100 Gb)


Low Power Module Design

Low Power Module Designs

Probed Devices
• VCSEL Array
• Laser Array 10 channel
• APD

Chip-on Carrier
• Photonics Integrated Circuit (Lasers, Amplifiers, Modulator, Photodiode, Thermistor)
• SOA (Semi conductor Optical Amplifier)
• Lasers
• Laser Arrays
• APD (150V)
• PIN Photodiodes

Packaged
• VCSEL
TO Headers
• Mini DIL
• Butterfly
Why Yelo?

Device fixturing research and development and expertise


including
Tight temperature control of devices
Sufficient downward pressure on devices to ensure good thermal
contact
Accurate electrical probing to drive and measure devices
Optical analysis
Photonics Domain expertise
We have designed, manufactured and tested devices and understand
the constraints
Time to market
Modular approach using standard laser drive cards and standard
flexible software enables new systems to be delivered faster than
building your own
Laser Reliability, Burn-in, Lifetest &
Qualification System

Lifetest and burn-in at different


temperatures

Test different products and


packages in different modules

Suitable for contract manufacturers,


startups and mid volume

One control rack can test up to up to


2,048 devices per rack

Can be expanded by the addition of


up to 2 slave racks as volume
production increases
Independent Temperature Controlled Modules

A drawer can hold up to 8


modules

A module can hold up to 16


devices

This provides for up to 128


devices per drawer

Each module can operate at


different temperature and testing
cycle
Customised Module Design

Each module can hold up to 16


devices

The number of devices per


module depends upon the
complexity of the device

Devices held at temperature on


hot plate

Light detectors can be added and


cooled if required
High Power System

One control rack can test up to


up to 480 devices per rack

Can be expanded by the addition


of up to 2 slave racks as volume
production increases
High Volume Drawer Based System

This system uses the same rack and laser drive cards.

Each rack contains 4 drawers with no modules.

Each drawer contains a customised heating plate allowing


up to 256 devices to be loaded.

Suitable for packaged devices such as TO-CAN.


High Power Module

Uses a liquid-cooled baseplate


with a peltier option
Off-the-shelf fixturing includes
high accuracy pogo pins for
chip-on-carrier devices, clamps
for C-mount and W-mount
devices, connectors for
packaged devices and TO
headers
Liquid-cooled Integrating
spheres dissipate high optical
powers
Automation Software

Over 2 man years of software engineering development


Sophisticated temperature control algorithms
Clear, flexible user interface displaying the status of units under test
including module temperature
Programmable alarm conditions and notification via email
Data recording to any ODBC compliant database
Graphical displays of device performance during testing including
degradation
Laser control constant current or constant power modes
LIV sweep analysis & spot measurements
Burn-in at one temperature & characterize at another, with
programmable cycle times
All module parameters may be set independently (drive current,
temperature, burn-in time etc.)
Main User Interface
Diagnostics & Configuration
Cost Effective Benchtop System

Suitable for laboratory or for


low volume use

2 Modules – not expandable

Up to 32 devices
High Power Module Design

High Power Module Designs

Chip on Carrier
• C Mount – 20 Amp
• BA Mount – 40 Amp

Packaged
• Butterfly – 20 Amp
Probed Photonic Integrated Circuit
/ Laser Bar Test & Qualification

Burn-in and lifetest of a 12 chip


VCSEL array using a probe
card.
Burn In and Life Test – Benefits

Easy reconfiguration for new products


(wide range of modules)

Flexible use –
Burn-in, Lifetest and Qualification at the same time

Automatic in-situ measurement


(reduces handling time)

NIST standard measurement precision for every device

Ease of calibration / maintenance

Each drawer is independent of others


(virtually no single point of failure)

Individual independent temperature zones in groups of 16

Price effective at low volume


(suitable for R+D facilities)

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