Ecen 5613 Embedded System Design
Ecen 5613 Embedded System Design
Ecen 5613 Embedded System Design
University of Colorado
425 UCB, ECEE 1B55
Boulder, CO 80309-0425
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ECEN 5613 is a 3 credit hour course and is the first course in CU's Professional Certificate in
Embedded Systems.
ECEN 5613 will be offered through the ECEE department during the Spring 2020 semester
on Monday evenings from 6:30-9:00pm in the CU Boulder Engineering Center (see flyer).
In this class, the fundamentals of embedded system hardware and firmware design will be
explored, including:
Processor selection Debugging techniques
Power delivery, Data sheets
decoupling Bus cycles, transaction Device drivers
Clocks and resets types, timing Interrupts and ISR's
Assembly programming diagrams, timing Memory mapped I/O
Embedded C analysis Data conversion (DAC's,
programming Memory maps, chip ADC's)
Incremental select logic Design reviews
development (HW, SW) Serial interfaces (RS- Design trade-offs
Test equipment / 232, I2C, SPI) Entrepreneurship
instrumentation I/O port pin driver Passive components
(oscopes, multimeters, circuits
logic analyzers) In-circuit programming
Each student in the course will develop their own embedded system hardware and firmware
and learn important system integration and debugging skills. This course provides students with
skills and experience necessary to pursue any type of embedded systems career.
Processor Information
The focus of ECEN 5613 Embedded System design is on learning the fundamentals of hardware
and firmware development, and not on learning any particular processor. Students in
Embedded System Design will be using multiple processors, including the Siemens C501, Atmel
AT89C51RC2, and TI MSP432 (ARM Cortex-M4F).
Students are encouraged to read the various course documents below prior to starting the
class. The following documents are also available from Infineon Technologies.
Students will also be using the TI MPSP432 (ARM Cortex-M4F) processor and development
board, in parallel with the 8051 processors above. Datasheets, errata, application notes, and
software tools are available at the TI web site.
TI MSP432P401R Launchpad: LINK
TI MSP432 Launchpad Overview "Meet the MSP-EXP432P401R
Launchpad": LINK (~3.7MB) . Local PDF (~3.7MB)
TI MSP432P401R MCU: LINK
TI Code Composer Studio User's Guide: PDF (~1.7MB)
MSP432 C code examples are available via download from TI: ZIP (~1.2MB)
ARM Application Note 237 "Migrating from 8051 to Cortex
Microcontrollers": PDF (~320KB)
ARM Developer Web Site LINK
Lab #1
Vocabulary: PDF (~13KB)
S2020 Parts Kit Contents: PDF (~27KB)
Laboratory Rules for ECEN 5613: PDF (~9KB)
Standard Resistor and Capacitor Values: PDF (~12KB)
Assembly Language Programming Overview: PDF (~101KB)
Emily52 Overview: PDF (~107KB)
Code Size and Timing Determination: PDF (~8KB)
Voltage Regulator Presentation Handouts (1-26-2005): PDF (~52KB)
Intel Hex Record and Motorola S-Record Formats: PDF (~7KB)
ECEN 5613 PCB Layout and Partial Schematics: PDF (~456KB)
Schematic Best Practices: PDF (~20KB)
Example Perf Board Layout: PDF (~9KB)
Tips for Board Construction: PDF (~6KB)
Development Board Presentation Handouts (1-26-2005): PDF (~426KB)
Metcal Hand Soldering Basics: PDF (~87KB)
SMT Prototyping Lecture: PDF (~229KB)
Heat Sink Basic Overview: PDF (~150KB)
Jonard Industries/OK Industries Wire Wrapping Overview: PDF (~418KB)
Passive Components Presentation Handouts: PDF (~1.8MB)
Handling of Power Plastic Transitors: PDF (~114KB)
Secondary Reference Documents
o Development Board Wire Wrapping ID Labels: DOC (~68KB)
Note: You may need a recent version of Word to edit the drawings much.
o Development Board Wire Wrapping ID Template: Visio
VSD (~831KB) . PDF (~38KB). Enhanced Visio VSD (~912KB) . Enhanced
PDF (~74KB)
Note: You may need to scale the drawing when printing the file.
o Wire Wrapping ID Template (compliments of Paul
Kooros): PDF (~92KB) . PS (~5KB)
Note: Do *NOT* use the "shrink to fit" option when printing the PDF file.
o Chip Pinouts Quick Reference: PDF (~93KB) . DOC (~163KB)
Lab #2
Lab #3
Lab #4
The following documents will be useful for HW #9, HW #10 and Lab #4.
Final Project
Homework Assignments
Useful links
CU Specific:
Electronic Parts:
Reference:
Copyright 2020. Links on these pages to non-university sites do not represent endorsement by
the University of Colorado at Boulder or its affiliates.
Keep watching this space! This web site will be updated throughout the semester.
Last Update: 29-Mar-2020