MOS Transistor
MOS Transistor
MOS Transistor
Transistors
IBM/Motorola Power PC620
Motorola MC68020
IBM Power PC 601
EE314
1.Construction of MOS
2.NMOS and PMOS
3.Types of MOS
4.MOSFET Basic Operation
5.Characteristics
Polysilicon
n+
Drain
n+
p-substrate
Bulk Contact
Field-Oxide
(SiO2)
p+ stopper
Source
(of carriers)
Gate
Drain
(of
carriers)
Closed (on) (Gate = 1)
Ron
| VGS | < | VT |
| VGS | > | VT |
Source
(of carriers)
Gate
Drain
(of carriers)
G
S
G
S
PMOS Enhancement
B
S
NMOS with
Bulk Contact
Channe
l
Symbol
L = 0.5-10 m
W = 0.5-500 m
SiO2 Thickness = 0.02-0.1 m
Device characteristics depend on L,W, Thickness, doping levels
http://micro.magnet.fsu.edu/electromag/java/transistor/index.html
iD=0
for vGS<Vt0
Schematic
2
i D K 2 v GS Vt 0 v DS v DS
W KP
K
L 2
Device parameter KP for
NMOSFET is 50 A/V2
Tapering
of the
channel
- increments
of iD are
smaller
when
vDS is
larger
i D K v GS Vt 0
i D K 2 v GS Vt 0 v DS v DS
i D K v GS Vt 0
W KP
K
L 2
Channel length
modulation
id depends on vDS in
saturation region
(approx: iD =const in
saturation region)
2
i D Kv DS
Characteristic