SC18 Chapter 7 1

CHAPTER 7
ENVIRONMENTAL INFORMATION
page
Introduction 7-2
Explanation of the tables 7-2
General safety remarks 7-5
Substances not used by Philips Semiconductors 7-6
Disposal and recycling 7-7
General warnings 7-7
Chemical content tables:
Diodes 7-8
Transistors 7 - 13
Philips Semiconductors Discrete Semiconductor Packages
Environmental information Chapter 7
INTRODUCTION Whenever possible, the devices have been grouped into

families based on the similarity in composition,
Nowadays, everyone must accept responsibility for
construction and packing method. In this way we were able
keeping the environment clean, from individuals adopting
to limit the number of tables. For each group, one
a responsible attitude to their own waste disposal,
representative is specified in mass percentages of its
however small that may be, to big industries who must take
parts.
proper precautions to avoid releasing large amounts of
damaging waste into the environment. In many cases, a single envelope type will contain a range
of differing leadframes with different die-pad dimensions to
As a leading electronic components manufacturer, Philips
accommodate the active devices. This, however, leads to
Semiconductors has always regarded environmental
only minor changes in the mass percentages. Different
protection as a major issue. The electronics industry, like
materials or techniques are sometimes used to assemble
many others, produces its share of toxic and hazardous
one envelope type, and whenever possible, alternative
materials, and we have long made it our policy to follow
materials are included in the tables. In other cases only the
working practices that cut the chance of these materials
standard or high-volume process is described.
passing into the environment to the absolute minimum.
Per page, the product family is defined and the types
Products supplied by Philips Semiconductors today offer
identified by the Philips package code number.
no hazard to the environment in normal operation and
Additionally, reference is made to usual names or to the
when stored according to the instructions given in our data
JEDEC code (when applicable). The mass in milligrams
sheets. Inevitably, some products contain substances that
(mg), body dimensions in millimeters (mm) and packing
are potentially hazardous to health if exposed by accident
quantity are also specified.
or misuse, but we ensure that users of these components
receive clear warning of this in the data sheets. And where The table itself shows the composition of the group
necessary, the warning notices contain safety precautions representative broken down into the device-parts:
and disposal instructions. • metal parts
This chapter supplements these notices and instructions • crystal
by providing clear and comprehensive information on the • envelope (plastic, glass or ceramic)
composition of representative examples of discrete
packages manufactured by Philips Semiconductors. This • packing materials.
information should form a basis for answering questions The device-parts are specified in milligrams (mg). These
on product safety and disposal and should, moreover, help figures are as accurate as possible for the group
to increase awareness of these aspects, not only representative shown. Other devices from the same group
throughout the Philips Semiconductors organization but may differ considerably in mass. The amount of packing
throughout the semiconductor industry in general. material, specified in grams, per device can be found by
For additional information on the chemical content of dividing the weight of the packing material by the packing
discrete and IC packages, ask your local sales quantity. For more detailed information on packing, refer to
representative for the Philips Semiconductors brochure Chapter 6 Packing Methods.
Chemical content of semiconductor devices, order number
9397 750 04906. Metal parts
The composition of the leadframe material is indicated,
EXPLANATION OF THE TABLES when appropriate, by the method commonly used for
alloys, e.g.:
The following pages provide the chemical constituents of
• FeNi42 means iron alloy containing 42% of nickel
representative groups of discrete semiconductor
(alloy 42).
components down to minor percentages and traces, as far
as these constituents may be important to the use, • CuZn15 means copper alloy containing 15% zinc
destruction or disposal of the components. (tombac).
• Cu alloy indicates copper with a small amount of alloying
The tables contain information about the materials used in
elements such as Fe, Ni, Zn or Ag or combinations of
the semiconductor devices themselves and in the packing
used for storage, transport and assembly. some elements.
May 1999 7-2

Note: the die-attach material in all plastic-encapsulationed Packing material

products contains on average 0.5% Au/AG, which is
Cardboard and paper consist mainly of natural fibres. The
recoverable on recycling.
carbon layer for ESD protection does not hamper the
recyclability of the cardboard.
Crystal
Polyethylene, polypropylene and polystyrene are synthetic
The active device is usually a silicon chip doped with very
polymers made from hydrocarbons.
small amounts of elements such as boron, arsenic or
phosphorus. The back may be metallized with thin layers Polyvinylchloride (PVC), a synthetic polymer made from
of titanium, nickel, platinum, gold or silver to enhance chlorinated hydrocarbons, is used for the tubes in which
die-bonding to the leadframe. many semiconductors are packed. PVC is hazardous to
the environment when burned under certain, ill-controlled
Envelope conditions. PVC is, however, readily recyclable when the
material is collected separately (as a mono-material).
The chip is protected by a glass, ceramic, plastic or metal
Therefore the endpins, turnlocks and soft rubber stoppers
encapsulation. Glass will contain SiO2 plus a number of
in the PVC-tubes are now replaced by PVC to enhance
oxides of Ba, K, Pb, Zn and Mn. These elements are,
recycling.
however, immobilized and will not be extracted by acids,
unless the glass is ground. Re-use of the polystyrene (PS) reels is encouraged by
requesting all our customers to return the reels after use to
The plastic encapsulation is usually based on ortho cresol
SemiCycle - a company set up to collect empty reels after
novolac (OCN) -epoxy or on biphenyl-epoxy, filled with
use and sell them back to us. To facilitate this process, our
quartz particles (fused or crystalline) up to approximately
reels are now manufactured as single-piece units instead
70 mass percent. In all cases (except SOT54), antimony
of the assembled units used formally. Much lighter than
trioxide and tetrabromobisphenol-A (TBBA) are present as
earlier reels, the new reels are more economical to recycle
flame retardants. The TBBA will be incorporated in the
and can be reused an average of 5 times, significantly
epoxy-polymer after curing so that no TBBA is present in
cutting polystyrene usage.
the finished device. It has become a partially brominated
epoxy. The flammability of all moulding compounds rates Recycling symbols and the addresses of your nearest
typically UL94-V0 at 1/8 inch (see page 7-5 for SemiCycle contact are printed on the boxes in which the
explanation). reels are delivered.
To encourage recycling, Philips Semiconductors marks
the packing materials according to ISO 11469 using the
recycling symbols shown in Figs 1 to 1.
MGK022
MGK023
Fig.1 Paper and cardboard. Fig.2 Polyethylene terephthalate.
May 1999 7-3

MGK024 MGK025
Fig.3 Polyethylene, high density. Fig.4 Polyvinylchloride.
MGK026 MGK027
Fig.5 Polyethylene, low density. Fig.6 Polypropylene.
MGK028 MGK029
Fig.8 Other plastics. The acronym of the plastic is

Fig.7 Polystyrene. put under the recycling symbol. In this
example: PA = polyamide.
May 1999 7-4

GENERAL SAFETY REMARKS Underwriters Laboratories (UL)

Oxygen index
UL is the leading third-party certification organization in the
A material’s resistance to burning is expressed by its United States and the largest in North America. As a
oxygen index. This is defined as the minimum non-profit product-safety testing and certification
concentration of oxygen, expressed as volume per cent, in organization, UL has been evaluating products in the
a mixture of oxygen and nitrogen that will just support interest of public safety since 1894. The organization
flaming combustion of the material initially at room specializes in holistic product and company evaluations,
temperature. All plastics used in Philips Semiconductors including safety, performance, energy efficiency,
products are specified with an oxygen index between 28% environmental and public health issues, electro-magnetic
and 35% meeting international flammability requirements compatibility, quality and environmental management
system registration and inspection services. It also
The oxygen index is measured using the standard ATSM
specializes in national and international codes and
test method designated D 2863 - 91. This test method has
standards development and harmonization.
been found applicable for testing various forms of plastic
materials, including film and cellular plastic. According to The UL mark assures acceptance of products in North
this test, the minimum concentration of oxygen that will just America, Europe, Asia Pacific, Asia and around the world
support combustion of the specimen in a mixture of oxygen through the most extensive network of testing, quality and
and nitrogen flowing upward in a test column is measured certification organizations.
under equilibrium conditions of candle-like burning. The
UL94 refers to standard “Tests for Flammability of Plastic
equilibrium is established by balancing the heat lost to the
Materials for Parts in Devices and Appliances”. V0 means
surroundings with the heat generated from combustion of
that the test sample complies with the highest
the specimen as measured either over a specified time of
requirements of the test.
burning or length of specimen burned. The critical oxygen
concentration is approached from both sides (i.e. from
below and from above) to establish the oxygen index.
Beryllium oxide
Despite our constant improvement of components and
processes with respect to environmental demands, some
components unavoidably contain substances such as
beryllium oxide that, if exposed by accident or misuse, are
potentially hazardous to health. Users of the components
are informed of the danger by warning notices in the data
sheets supporting the components. Obviously, users of
these components assume responsibility towards the
consumer with respect to safety matters and
environmental demands.
All used or obsolete components should be disposed of
according to the regulations applying at the disposal
location. Depending on the location, electronic
components are considered to be ‘chemical’, ‘special’ or
sometimes ‘industrial’ waste. Disposal as domestic waste
is usually not permitted.
May 1999 7-5

SUBSTANCES NOT USED BY PHILIPS • picric acid

SEMICONDUCTORS • polybrominated biphenyl oxides (PBBO)
Below are listed the materials and substances that are not • polybrominated biphenyls (PBB/PBBE)
present in Philips Semiconductors’ products and • polychlorinated triphenyls (PCT)
processes(1). This information supplements the chemical
contents tables that follow and is provided to enable • polychlorinated napthalenes
manufacturers assess the environmental impact of • polychlorinated biphenyls (PCB)
products manufactured by Philips Semiconductors. • polycyclic compounds
• polyhalogenated dibenzofurans/dioxins
Substances not used in products
• polyhalogenated bi/triphenyl ethers
• 4-aminodiphenyl and its salts
• selenium
• ammonium salts
• tellurium
• arsenic
• tetrabromobenzylimidazole
• asbestos
• tetrabromoethylene
• benzene
• toluene
• cadmium and compounds
• triethylamine
• chlorinated paraffines
• tris (aziridinyl) phosphinoxide
• creosote
• tris (2,3-dibromopropyl) phosphate
• cyantes
• vinyl chloride monomer
• cyanides
• xylene
• 4,4-diaminophenyl methane
• dibenzofurans Substances not used in manufacturing processes
• epichlorhydrine Philips Semiconductors has eliminated all Ozone
• ethylene glycol ethers Depleting Substances, referred to as Class I and II in the
• formaldehyde Montreal Protocol and its amendments. This means that
our products, in compliance with the US Clean Air Act, do
• halogenated aliphatic hydrocarbons not have to be labelled.
• hydrazine
We have also eliminated, voluntarily, the use of
• mercury and compounds chlorinated hydrocarbons such as perchloro-ethylene and
• N-nitrosoamines trichloro-ethylene from our manufacturing processes.
• 2-naphthylamine and its salts
Substances not used in packing materials
• nickel tetracarbonyl
• N,N-dimethlformamide • laminates with paper
• N,N-dimethylacetamide • bleached paper

• polystyrene flakes (EPS)
• oils and greases
• organometallic compounds (e.g. org. tin compounds)
• ozone-depleting compounds
• pentachlorophenol
• phenol compounds
• (nonyl)-phenol ethoxylates
• phtalates
(1) The lists refer to processes used for manufacturing products
mentioned in this chapter. For information on other products,
contact your sales representative.
May 1999 7-6

Summary of ozone-depleting substances eliminated GENERAL WARNINGS

Class I substances: Products
• fully halogenated chloro-fluorocarbons (CFC) Under the specified operating conditions, no hazardous
• halons materials will be liberated from the products. The general
warnings describe phenomena that can be expected with
• carbontetrachloride
abnormal use (outside the product’s specification). For
• 1,1,1-trichloroethane example:
Class II substances: • If a product is exposed to strong acids, metals contained
• partially halogenated hydrocarbons (HCFC) within it may be partially extracted.
• If a product with an epoxy moulded envelope is exposed
to organic solvents, these may extract part of the resin
DISPOSAL AND RECYCLING
contained in the envelope.
Disposal
• If the product is incinerated, degradation and
Old or used products must be disposed of in accordance condensation reactions in the organic material it
to national and local regulations. contains may cause a number of hazardous substances
to be released into the air in unpredictable amounts.
The products and packing materials must be disposed of
Moreover, metal oxides will be formed and may be
as special waste. This is required, in particular, for parts
released into the air as dust particles.
containing environmentally hazardous materials, for
example beryllium oxide, present in some RF-devices. • If products with beryllium heatsinks (RF transistors) are
damaged, toxic beryllium oxide dust may be released
Smaller quantities of material may be disposed of as into the air.
domestic waste, provided national or local regulations
permit this. Packing material
Recycling • With adequate oxygen supply, packing materials will

give off mainly carbon dioxide and water if burned.
Where legally required, we accept packing materials and However, if they are burned in a limited oxygen supply
products for recycling and/or disposal. However, since the (the general case in a fire), hazardous compounds (for
cost of returning these materials to us must be borne by example carbon monoxide) may be emitted.
the customers, it is often more cost effective for them to
• PVC will form hydrochloric acid gas when incinerated. It
look for a local recycle company. To assist in this we can
will also generate a number of other chlorine
provide customers with the names and addresses of local
compounds, among them the toxic dioxin, when the
recycle companies in their areas.
conditions (temperature, oxygen) are not well controlled.
In many devices, precious metals (gold and silver) are
present. The content maybe 0.5% or higher.
May 1999 7-7

GLASS DIODES/RECTIFIERS, LEADED
REFERENCE PACKAGE CODE(1) MASS (mg) BODY (mm) PACKING QUANTITY

DO-35 SOD27 136 φ 1.9 × 4.3 5000
DO-41 SOD66 344 φ 2.6 × 4.8 5000
DO-34 SOD68 118 φ 1.6 × 3.0 5000
IT(2) SOD81 277 φ 2.2 × 3.8 5000
IT(2) SOD91 121 φ 1.7 × 3.0 5000
Notes
1. All packages have a similar composition, quantities may vary.
2. IT = implosion technology.
Chemical content for group representative SOD68
DEVICE PART SUBSTANCE MASS (mg)

stud FeNi42, cladded with Cu(1) 10.5
wire Fe cladded with Cu 88
SnPb20 plated 2.2
active device doped Si 0.05
encapsulation glass (Pb < 58%, Sb < 0.5%) 16.8
paint/pigment epoxy copolymer 0.1
Note
1. Mo studs for implosion types.
PACKING MATERIAL (AMMO PACK)
PACKING PART SUBSTANCE MASS (g)

box paper 53
tape kraft paper 20
tape polypropylene 19.6
seal acrylate 0.2
May 1999 7-8

GLASS DIODES/RECTIFIERS, SMD

− SOD80 35 φ 1.5 × 3.5 2500
IT(2) SOD87 50 φ 2.1 × 3.5 2500
Notes
2. IT = implosion technology.

stud Mo(1) 19.5
flange Cu 15.0
SnPb20 plated 2.5
encapsulation glass (Pb < 54%, Sb < 0.5%) 15.5
paint/pigment epoxy copolymer 0.1
Note
1. SOD80: FeNi42 cladded with Cu.
PACKING MATERIAL (REEL PACK)

box cardboard 56
reel polystyrene 39
carrier tape polycarbonate, carbon loaded 18.8
cover tape polyester 3.3
May 1999 7-9

GLASS-BEAD RECTIFIERS AND STACKS

− SOD57 356 φ 3.8 × 4.6 2500
EHT-stack SOD61 250 φ 3.0 × 12.5 max.(2) 5000
− SOD64 833 φ 4.5 × 5.0 4000
- SOD116 190 φ 2.5 × 13.5 max. 5000
- SOD118A 178 φ 2.5 × 6.5 5000
Notes
2. Body length depends on reverse voltage and may be less than given here.

stud Mo 51
wire Fe cladded with Cu 252
SnPb20 plated 2
active device doped Si 1(1)
encapsulation glass (Pb < 58%(2), Sb < 0.5%) 50
Note
1. May be greater for EHT stacks.
2. In stacks Pb < 6%, ZnO = 59%.

box paper 53
reel paper 25
tape kraft paper 30
label paper 0.8
seal acrylate 0.2
May 1999 7 - 10
DIODES IN PLASTIC PACKAGE, SMD

− SOD106 66 4.7 × 2.5 × 2.6 1500
− SOD323 4.8 1.7 × 1.3 × 0.9 3000
SC-79 SOD523 1.6 1.3 × 0.8 × 0.6 3000
Note

leadframe Cu, SnPb20 plated 1.23
encapsulation OCN-epoxy polymer 3.5
(SiO2 < 72%, Sb < 2%, Br < 1%)

box cardboard 56
reel polystyrene 74
cover tape polyester 4
labels paper 2.1
seal acrylate 0.2
May 1999 7 - 11
SMALL SIGNAL CERAMIC DIODE, SMD
REFERENCE PACKAGE CODE MASS (mg) BODY (mm) PACKING QUANTITY

− SOD110 10 2.0 × 1.25 × 1.45 3000

envelope Al2O3, SiO2 8.2
plated with Cu+SnPb20 1
encapsulation OCN-epoxy polymer (SiO2 < 70%) 0.8
active device doped Si < 0.1

box cardboard 56
reel polystyrene 74
labels paper 2.1
seal acrylate 0.2
May 1999 7 - 12
FLANGE-MOUNTED CERAMIC RF POWER TRANSISTORS
REFERENCE PACKAGE CODE(1) MASS (g) BODY (mm) PACKING QUANTITY

− SOT119 5.20 13.0 × 25.2 × 7.5 40
− SOT121 5.00 13.0 × 25.2 × 7.5 40
− SOT123 3.90 9.8 × 25.2 × 7.5 40
− SOT160 4.86 9.8 × 25.2 × 7.5 75
− SOT161 3.50 10.2 × 25.2 × 7.5 40
− SOT171 3.60 5.9 × 25.2 × 7.0 40
− SOT262 8.00 10.4 × 34.3 × 5.8 16
− SOT273 6.90 10.4 × 25.0 × 7.2 60
− SOT289 8.20 11.8 × 28.1 × 4.6 40
− SOT324 3.58 6.4 × 19.0 × 4.5 32
Note

flange Cu(1) 4120
leadframe FeNi42(2) 270
brazing alloy AgCu28 20
encapsulation Al2O3 200
heat spreader BeO, plated with Mo/Ni/Au 540
active device doped Si 10
glue polyamide 40
Notes
1. In some types: WCu15 flange.
2. In SOT119A1 and SOT289: FeNiCo leadframe.
PACKING MATERIAL (BLISTER PACK)

box cardboard 157
foam polyethylene 27.2
blisters polystyrene 46
labels paper 0.8
tape polypropylene 1
seal acrylate 0.2
May 1999 7 - 13
STUD-MOUNTED CERAMIC RF POWER TRANSISTORS

− SOT120A 3.00 φ 9.8 × 18.8 40
− SOT122A 1.90 φ 7.6 × 17.0 40
− SOT147 11.40 φ 13.0 × 20.9 40
− SOT172A 1.40 φ 5.4 × 16.0 40
Note
Chemical content for group representative SOD122A

stud Cu 800
nut CuZn37, Ni plated 630
glue polyamide 40
Notes
1. SOT122A2: FeNiCo leadframe.

box cardboard 157
labels paper 0.8
seal acrylate 0.2
May 1999 7 - 14
CERAMIC RF POWER TRANSISTORS IN PILL PACKAGE

− SOT119D 1.60 φ 13.0 × 4.5 40
− SOT122D 0.70 φ 7.6 × 4.1 40
− SOT172D 0.30 φ 5.4 × 3.6 40
Note
1. Ceramic packages without flange or stud (so called “pill”-packages) have a similar composition, quantities may vary.
Chemical content for group representative SOD119D

glue polyamide 20
Note
1. FeNiCo in SOT119A1.

box cardboard 157
labels paper 0.8
seal acrylate 0.2
May 1999 7 - 15
POWER TRANSISTORS IN PLASTIC PACKAGE

TO-220 SOT78 1.950 10.3 × 9.9 × 4.5 1000
− SOT82 0.750 11.1 × 7.8 × 2.8 1000
− SOT93 4.930 15.2 × 12.7 × 4.6 500
− SOT186 1.950 10.2 × 9.5 × 4.6 1000
− SOT186A 2.500 10.3 × 9.4 × 4.6 1000
− SOT199 5.500 15.3 × 21.5 × 5.2 500
pentawatt SOT263 1.700 10.3 × 9.5 × 4.5 1000
− SOT399 5.890 16 × 27 × 5.8 500
Note
Chemical content for group representative SOT93

leadframe Cu 3950
SnPb30 plated 20
solder pellet SnAg25Sb10 25
encapsulation OCN-epoxy polymer 920
(SiO2 < 72%, Sb < 3%, Br < 1%)
PACKING MATERIAL (TUBE PACK)

box cardboard 123
tubes polyvinylchloride 700
turn locks polyvinylchloride 20
labels paper 15
seal acrylate 0.2
May 1999 7 - 16
SURFACE-MOUNT POWER TRANSISTORS IN PLASTIC PACKAGE

D2-PAK SOT404 1.43 10.3 × 9.5 × 4.5 800
− SOT426 1.46 10.3 × 9.5 × 4.5 800
− SOT427 1.49 10.3 × 9.5 × 4.5 800
D-PAK SOT428 0.33 6.2 × 6.7× 2.4 2500
TO-247 SOT429 5.42 15.5 × 20.5× 5.0 500
Note

leadframe Cu, Ni plated 422
solder pellet SnAg25Sb10(1)
(SiO2 < 72%, Sb < 3%, Br < 1%)
active device doped Si
Note
1. Optional PbSn5 solder pellet.

box cardboard 180
reel polystyrene 325
carrier tape polystyrene, carbon loaded 200
cover tape polyester 13.7
labels paper 2.1
seal acrylate 0.2
May 1999 7 - 17
MAGNETIC SENSOR PACKAGES

− SOT453A 230 18.0 × 4.4 × 1.6 1000
− SOT453B 1600 18.0 × 8.2 × 7.0 750
− SOT453C 645 18.0 × 4.4 × 4.5 750
Note
Chemical content for group representative SOT453B

leadframe CuZr0.2 with Ag spot 76
bond-wire Au <0.2
solder layer Sn 7
(SiO2 < 72%, Sb < 3%, Br < 2%)
magnet BaFe12O19 1400
magnetic field sensor device Si with thin metal films 1.2
active device doped Si, Al, TiW 4.8

box cardboard 300
reel polystyrene 350
carrier tape polystyrene, carbon loaded 140
labels paper 5
seal acrylate 1
May 1999 7 - 18
MEDIUM-POWER TRANSISTORS IN PLASTIC PACKAGE

TO-126 SOT32 0.694 11.1 × 7.8 × 2.8 1000
TO-202 SOT128 1.528 11.1 × 7.8 × 2.7 1000
Note

leadframe Cu, Co + Au plated 863
SnPb plated 15
encapsulation silica filled epoxy plastic 640
(Sb < 3%, Br < 2%)
PACKING MATERIAL (TUBE PACK)

box cardboard 123
tubes polyvinylchloride 836
end stops polyvinylchloride 38
labels paper 15
seal acrylate 0.2
May 1999 7 - 19
SMALL-SIGNAL TRANSISTORS AND SENSORS IN PLASTIC PACKAGE
REFERENCE PACKAGE CODE MASS (g) BODY (mm) PACKING QUANTITY

− SOD70 0.2 φ 4.4 × 5.0 1000
TO-92 SOT54 0.250 φ 4.8 × 5.2 2000
− SOT195 0.166 5.0 × 4.4 × 1.6 1000

leadframe CuZn15, Co + Au plated 113
SnPb plated 1.5
encapsulation(1) OCN-epoxy polymer 135
(SiO2 < 72%, Sb < 4%, Br < 0.6%)
Note
1. Alternative: two-shot encapsulation of epoxy and PPS.

box cardboard 97.5
carrier tape kraft paper 110
buffer cardboard 20
May 1999 7 - 20
TRANSISTORS IN METAL PACKAGE

TO-39 SOT5 0.97 φ 8.5 × 6.6 1000
TO-18 SOT18 0.31 φ 4.8 × 5.3 5000
Note

metal envelope + leads FeNi28Co18 240
wires + solder Au 2
solder layer Sn 5
part of encapsulation glass 62
PACKING MATERIAL (BULK PACK)

box cardboard 125.4
bag polyethylene 14.5
label paper 1.4
May 1999 7 - 21
TRANSISTORS IN PLASTIC PACKAGE, SMD

− SOT23 8 2.9 × 1.3 × 0.9 3000
− SOT89 50 4.5 × 2.5 × 1.5 1000
− SOT143 8 2.9 × 1.3 × 0.9 3000
− SOT223 124 6.5 × 3.5 × 1.6 1000
SC70-3 SOT323 5 2.0 × 1.3 × 0.9 3000
− SOT343 6 2.0 × 1.3 × 0.9 3000
SC-59 SOT346 8 2.9 × 1.3 × 1.5 3000
SC70-5 SOT353 5 2.0 × 1.3 × 0.9 3000
SC70-6 SOT363 5 2.0 × 1.3 × 0.9 3000
SC-75 SOT416 2.5 1.6 × 0.8× 0.8 3000
SC-74 SOT457 11 2.9 × 1.0 × 1.5 3000
Note
Chemical content for group representiveSOT23

leadframe FeNi42(1) 2.6
SnPb20 plated 0.3
encapsulation OCN-epoxy polymer 5.0
(SiO2 < 72%, Sb < 2%, Br < 1%)
Note
1. Optional: copper-plated NiFe leadframe.

box cardboard 56
reel polystyrene 74
labels paper 2.1
seal acrylate 0.2
May 1999 7 - 22

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CHAPTER 7

Explanation of the tables 7-2

General safety remarks 7-5

Substances not used by Philips Semiconductors 7-6

Disposal and recycling 7-7

General warnings 7-7

Chemical content tables:

Environmental information Chapter 7

INTRODUCTION Whenever possible, the devices have been grouped into

May 1999 7-2

Environmental information Chapter 7

Note: the die-attach material in all plastic-encapsulationed Packing material

Fig.1 Paper and cardboard. Fig.2 Polyethylene terephthalate.

May 1999 7-3

Environmental information Chapter 7

Fig.3 Polyethylene, high density. Fig.4 Polyvinylchloride.

Fig.5 Polyethylene, low density. Fig.6 Polypropylene.

Fig.8 Other plastics. The acronym of the plastic is

May 1999 7-4

Environmental information Chapter 7

GENERAL SAFETY REMARKS Underwriters Laboratories (UL)

May 1999 7-5

Environmental information Chapter 7

SUBSTANCES NOT USED BY PHILIPS • picric acid

• N,N-dimethylacetamide • bleached paper

May 1999 7-6

Environmental information Chapter 7

Summary of ozone-depleting substances eliminated GENERAL WARNINGS

Recycling • With adequate oxygen supply, packing materials will

May 1999 7-7

Environmental information Chapter 7

GLASS DIODES/RECTIFIERS, LEADED

REFERENCE PACKAGE CODE(1) MASS (mg) BODY (mm) PACKING QUANTITY

Chemical content for group representative SOD68

DEVICE PART SUBSTANCE MASS (mg)

PACKING MATERIAL (AMMO PACK)

PACKING PART SUBSTANCE MASS (g)

May 1999 7-8

Environmental information Chapter 7

GLASS DIODES/RECTIFIERS, SMD

REFERENCE PACKAGE CODE(1) MASS (mg) BODY (mm) PACKING QUANTITY

Chemical content for group representative SOD87

DEVICE PART SUBSTANCE MASS (mg)

PACKING MATERIAL (REEL PACK)

PACKING PART SUBSTANCE MASS (g)

May 1999 7-9

Environmental information Chapter 7

GLASS-BEAD RECTIFIERS AND STACKS

REFERENCE PACKAGE CODE(1) MASS (mg) BODY (mm) PACKING QUANTITY

Chemical content for group representative SOD57

DEVICE PART SUBSTANCE MASS (mg)

PACKING MATERIAL (AMMO PACK)

PACKING PART SUBSTANCE MASS (g)

Environmental information Chapter 7

DIODES IN PLASTIC PACKAGE, SMD

REFERENCE PACKAGE CODE(1) MASS (mg) BODY (mm) PACKING QUANTITY

Chemical content for group representative SOD323

DEVICE PART SUBSTANCE MASS (mg)

PACKING MATERIAL (REEL PACK)