LM4041 PDF
LM4041 PDF
LM4041 PDF
LM4041-N, LM4041-N-Q1
SNOS641G – OCTOBER 1999 – REVISED JANUARY 2016
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM4041-N, LM4041-N-Q1
SNOS641G – OCTOBER 1999 – REVISED JANUARY 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7 Parameter Measurement Information ................ 17
2 Applications ........................................................... 1 8 Detailed Description ............................................ 17
3 Description ............................................................. 1 8.1 Overview ................................................................. 17
4 Revision History..................................................... 2 8.2 Functional Block Diagram ....................................... 17
5 Pin Configuration and Functions ......................... 3 8.3 Feature Description................................................. 17
8.4 Device Functional Modes........................................ 18
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4 9 Application and Implementation ........................ 19
6.2 ESD Ratings.............................................................. 5 9.1 Application Information............................................ 19
6.3 Recommended Operating Conditions....................... 5 9.2 Typical Applications ................................................ 20
6.4 Thermal Information .................................................. 5 10 Power Supply Recommendations ..................... 27
6.5 LM4041-N-xx 1.2 Electrical Characteristics (Industrial 11 Layout................................................................... 27
Temperature Range).................................................. 6 11.1 Layout Guidelines ................................................. 27
6.6 LM4041-N-xx 1.2 Electrical Characteristics (Industrial 11.2 Layout Example .................................................... 27
Temperature Range).................................................. 7
12 Device and Documentation Support ................. 28
6.7 LM4041-N-xx 1.2 Electrical Characteristics (Extended
12.1 Related Links ........................................................ 28
Temperature Range).................................................. 9
12.2 Community Resources.......................................... 28
6.8 LM4041-N-xx ADJ (Adjustable) Electrical
Characteristics (Industrial Temperature Range) ...... 11 12.3 Trademarks ........................................................... 28
6.9 LM4041-N-xx ADJ (Adjustable) Electrical 12.4 Electrostatic Discharge Caution ............................ 28
Characteristics (Extended Temperature Range) ..... 13 12.5 Glossary ................................................................ 28
6.10 Typical Characteristics .......................................... 14 13 Mechanical, Packaging, and Orderable
Information ........................................................... 28
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
DBZ Package
3-Pin SOT-23 DCK Package
Top View 5-Pin SC70
Top View
1
1 5
+ 3* t N/C
2
2 N/C*
– 4
3
+ N/C
1.2 V
LP Package
3-Pin TO-92
Top View
Pin Functions
PIN
I/O DESCRIPTION
NAME SOT-23 SC70 TO-92
Anode 2 1 1 O Anode pin, normally grounded
Cathode 1 3 2 I/O Shunt current and output voltage
FB — — — I Feedback pin for adjustable output voltage
NC** 3 2 — — **Must float or connect to anode
NC — 4, 5 3 — No connect
DBZ Package
3-Pin SOT-23 DCK Package
Top View 5-Pin SC70
1 Top View
1 5
FB
3 N/C FB
–
2 2
+ t
ADJ 3 4
+ N/C
ADJ
LP Pakage
3-Pin TO-92
Bottom View
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
Reverse current 20 mA
Forward current 10 mA
Maximum output voltage (LM4041-N ADJ, LM4041-N-Q1 ADJ) 15 V
DBZ package 306 mW
Power dissipation (TA = 25°C) (3) LP package 550 mW
DCK package 241 mW
Vapor phase (60 seconds) 215 °C
DBZ packages
Lead temperature Infrared (15 seconds) 220 °C
LP package Soldering (10 seconds) 260 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4041-N,
TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, 415°C/W for the
SC70 package and 180°C/W with 0.4-in lead length and 170°C/W with 0.125-in lead length for the TO-92 package.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human-body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF
capacitor discharged directly into each pin. All pins are rated at 2 kV for human-body model, but the feedback pin which is rated at
1 kV.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Recommended Operating Conditions indicate
conditions for which the device is functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(1) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
(2) Typicals are at TJ = 25°C and represent most likely parametric norm.
(3) The overtemperature limit for Reverse Breakdown Voltage Tolerance is defined as the room temperature Reverse Breakdown Voltage
Tolerance ±[(ΔVR↱ΔT)(max ΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in
temperature from the reference point of 25 °C to T MAX or TMIN, and VR is the reverse breakdown voltage. The total over-temperature
tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.75% = ±0.1% ±100 ppm/°C × 65°C
B-grade: ±0.85% = ±0.2% ±100 ppm/°C × 65°C
C-grade: ±1.15% = ±0.5% ±100 ppm/°C × 65°C
D-grade: ±1.98% = ±1.0% ±150 ppm/°C × 65°C
E-grade: ±2.98% = ±2.0% ±150 ppm/°C × 65°C
The total over-temperature tolerance for the different grades in the extended temperature range where max ΔT = 100 °C is shown
below:
B-grade: ±1.2% = ±0.2% ±100 ppm/°C × 100°C
C-grade: ±1.5% = ±0.5% ±100 ppm/°C × 100°C
D-grade: ±2.5% = ±1.0% ±150 ppm/°C × 100°C
E-grade: ±4.5% = ±2.0% ±150 ppm/°C × 100°C
Therefore, as an example, the A-grade LM4041-N 1.2 has an over-temperature Reverse Breakdown Voltage tolerance of ±1.2 V ×
0.75% = ±9.2 mV.
(4) Load regulation is measured on pulse basis from no load to the specified load current. Output changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature –40°C and the +25°C
measurement after cycling to temperature +125°C.
(1) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
(2) Typicals are at TJ = 25°C and represent most likely parametric norm.
(3) The overtemperature limit for reverse breakdown voltage tolerance is defined as the room temperature reverse breakdown voltage
tolerance ±[(ΔVR↱ΔT)(max ΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in
temperature from the reference point of 25 °C to T MAX or TMIN, and VR is the reverse breakdown voltage. The total over-temperature
tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.75% = ±0.1% ±100 ppm/°C × 65°C
B-grade: ±0.85% = ±0.2% ±100 ppm/°C × 65°C
C-grade: ±1.15% = ±0.5% ±100 ppm/°C × 65°C
D-grade: ±1.98% = ±1.0% ±150 ppm/°C × 65°C
E-grade: ±2.98% = ±2.0% ±150 ppm/°C × 65°C
The total over-temperature tolerance for the different grades in the extended temperature range where max ΔT = 100 °C is shown
below:
B-grade: ±1.2% = ±0.2% ±100 ppm/°C × 100°C
C-grade: ±1.5% = ±0.5% ±100 ppm/°C × 100°C
D-grade: ±2.5% = ±1.0% ±150 ppm/°C × 100°C
E-grade: ±4.5% = ±2.0% ±150 ppm/°C × 100°C
Therefore, as an example, the A-grade LM4041-N 1.2 has an over-temperature reverse breakdown voltage tolerance of ±1.2 V × 0.75%
= ±9.2 mV.
Copyright © 1999–2016, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM4041-N LM4041-N-Q1
LM4041-N, LM4041-N-Q1
SNOS641G – OCTOBER 1999 – REVISED JANUARY 2016 www.ti.com
(4) Load regulation is measured on pulse basis from no load to the specified load current. Ouput changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature –40°C and the +25°C
measurement after cycling to temperature +125°C.
TA = TJ = 25°C LM4041DEM3,
LM4041QDEM3
65
LM4041EEM3,
Minimum LM4041QEEM3
IRMIN operating μA
current LM4041CEM3,
68
LM4041QCEM3
LM4041EEM3, LM4041DEM3,
LM4041QEEM3 LM4041QDEM3
73
LM4041EEM3,
LM4041QEEM3
LM4041EEM3,
±20
LM4041QEEM3
TA = TJ = 25°C ±15
LM4041CEM3,
±100
VR LM4041QCEM3
ΔVR/ΔT temperature IR = 1 mA ppm/°C
TA = TJ = TMIN to TMAX LM4041DEM3,
coefficient (3)
LM4041QDEM3
±150
LM4041EEM3,
LM4041QEEM3
LM4041EEM3,
±15
LM4041QEEM3
(1) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
(2) Typicals are at TJ = 25°C and represent most likely parametric norm.
(3) The overtemperature limit for reverse breakdown voltage tolerance is defined as the room temperature reverse breakdown voltage
tolerance ±[(ΔVR↱ΔT)(max ΔT)(VR)]. Where, ΔVR/ΔT is the VR temperature coefficient, maxΔT is the maximum difference in
temperature from the reference point of 25 °C to T MAX or TMIN, and VR is the reverse breakdown voltage. The total over-temperature
tolerance for the different grades in the industrial temperature range where maxΔT = 65°C is shown below:
A-grade: ±0.75% = ±0.1% ±100 ppm/°C × 65°C
B-grade: ±0.85% = ±0.2% ±100 ppm/°C × 65°C
C-grade: ±1.15% = ±0.5% ±100 ppm/°C × 65°C
D-grade: ±1.98% = ±1.0% ±150 ppm/°C × 65°C
E-grade: ±2.98% = ±2.0% ±150 ppm/°C × 65°C
The total over-temperature tolerance for the different grades in the extended temperature range where max ΔT = 100 °C is shown
below:
B-grade: ±1.2% = ±0.2% ±100 ppm/°C × 100°C
C-grade: ±1.5% = ±0.5% ±100 ppm/°C × 100°C
D-grade: ±2.5% = ±1.0% ±150 ppm/°C × 100°C
E-grade: ±4.5% = ±2.0% ±150 ppm/°C × 100°C
Therefore, as an example, the A-grade LM4041-N 1.2 has an over-temperature reverse breakdown voltage tolerance of ±1.2 V × 0.75%
= ±9.2 mV.
Copyright © 1999–2016, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: LM4041-N LM4041-N-Q1
LM4041-N, LM4041-N-Q1
SNOS641G – OCTOBER 1999 – REVISED JANUARY 2016 www.ti.com
TA = TJ = 25°C LM4041DEM3,
LM4041QDEM3
2
LM4041EEM3,
LM4041QEEM3
IRMIN ≤ IR ≤ 1.0 mA mV
LM4041CEM3,
2
LM4041QCEM3
LM4041EEM3, LM4041DEM3,
LM4041QEEM3 LM4041QDEM3
2.5
Reverse M4041EEM3,
breakdown LM4041QEEM3
ΔVR/ΔIR
change with LM4041CEM3,
current (4) 2.5 6
LM4041QCEM3
LM4041EEM3, LM4041DEM3,
LM4041QEEM3 LM4041QDEM3
8
LM4041EEM3,
LM4041QEEM3
1 mA ≤ IR ≤ 12 mA mV
LM4041CEM3,
8
LM4041QCEM3
LM4041EEM3, LM4041DEM3,
LM4041QEEM3 LM4041QDEM3
10
LM4041EEM3,
LM4041QEEM3
TA = TJ = 25°C 0.5
LM4041CEM3,
1.5
Reverse LM4041QCEM3
IR = 1 mA, f = 120 Hz,
ZR dynamic Ω
IAC= 0.1 IR TA = TJ = TMIN to TMAX LM4041DEM3,
impedance
LM4041QDEM3
2
LM4041EEM3,
LM4041QEEM3
IR = 100 μA
eN Noise voltage 20 μVrms
10 Hz ≤ f ≤ 10 kHz
Long-term
t = 1000 hrs
stability
ΔVR T = 25°C ±0.1°C 120 ppm
(non-
IR = 100 μA
cumulative)
Thermal
VHYST ΔT = −40°C to +125°C 0.08%
hysteresis (5)
(4) Load regulation is measured on pulse basis from no load to the specified load current. Ouput changes due to die temperature change
must be taken into account separately.
(5) Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature –40°C and the +25°C
measurement after cycling to temperature +125°C.
(1) When VOUT ≤ 1.6 V, the LM4041-N ADJ in the SOT-23 package must operate at reduced IR. This is caused by the series resistance of
the die attach between the die (–) output and the package (–) output pin. See the Output Saturation (SOT-23 only) curve in the Typical
Characteristics section.
(2) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
(3) Typicals are at TJ = 25°C and represent most likely parametric norm.
(4) Reference voltage and temperature coefficient will change with output voltage. See Typical Characteristics curves.
(5) Load regulation is measured on pulse basis from no load to the specified load current. Ouput changes due to die temperature change
must be taken into account separately.
Copyright © 1999–2016, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: LM4041-N LM4041-N-Q1
LM4041-N, LM4041-N-Q1
SNOS641G – OCTOBER 1999 – REVISED JANUARY 2016 www.ti.com
Wideband
eN VOUT = VREF IR = 100 μA 10 Hz ≤ f ≤ 10 kHz 20 μVrms
noise
Reference
voltage t = 1000 hrs, IR = 100 μA,
ΔVREF 120 ppm
long-term T = 25°C ±0.1°C
stability
Thermal
VHYST ΔT = −40°C to +125°C 0.08%
hysteresis (6)
(6) Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature –40°C and the +25°C
measurement after cycling to temperature +125°C.
(1) When VOUT ≤ 1.6 V, the LM4041-N ADJ in the SOT-23 package must operate at reduced IR. This is caused by the series resistance of
the die attach between the die (–) output and the package (–) output pin. See the Output Saturation (SOT-23 only) curve in the Typical
Characteristics section.
(2) Limits are 100% production tested at 25°C. Limits over temperature are ensured through correlation using Statistical Quality Control
(SQC) methods. The limits are used to calculate AOQL.
(3) Typicals are at TJ = 25°C and represent most likely parametric norm.
(4) Reference voltage and temperature coefficient will change with output voltage. See Typical Characteristics curves.
(5) Load regulation is measured on pulse basis from no load to the specified load current. Ouput changes due to die temperature change
must be taken into account separately.
(6) Thermal hysteresis is defined as the difference in voltage measured at +25°C after cycling to temperature –40°C and the +25°C
measurement after cycling to temperature +125°C.
Figure 9. Output Saturation (SOT-23 Only) Figure 10. Output Impedance vs Frequency
Figure 14. Adjustable Output Test Circuit Figure 15. Line Transient Test Circuit
8 Detailed Description
8.1 Overview
The LM4041 is a precision micro-power shunt voltage reference available in both a fixed and output voltage and
adjustable output voltage options. The part has three different packages available to meet small footprint
requirements. It is also available in five different tolerance grades.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
(1)
The output voltage of the LM4041-N SDJ can be adjusted to any value in the range of 1.24 V through 10 V. It is
a function of the internal reference voltage (VREF) and the ratio of the external feedback resistors as shown in
Figure 19 . The output voltage is found using Equation 2.
VO = VREF[(R2/R1) + 1]
where
• VO is the output voltage. (2)
The actual value of the internal VREF is a function of VO. The corrected VREF is determined by Equation 3.
VREF = ΔVO (ΔVREF/ΔVO) + VY
where
• VY = 1.240 V
• and ΔVO = (VO − VY) (3)
NOTE
The actual output voltage can deviate from that predicted using the typical value of
ΔVREF / ΔVO in Equation 3. For C-grade parts, the worst-case ΔVREF / ΔVO is −2.5 mV/V.
For D-grade parts, the worst-case ΔVREF / ΔVO is −3.0 mV/V.
VO = VREF[(R2/R1) + 1]
Bounded amplifier reduces saturation-induced delays and can prevent succeeding stage damage. Nominal clamping
voltage is ±VO (the reverse breakdown voltage of the LM4041-N) +2 diode VF.
Figure 22. Voltage Level Detector Figure 23. Voltage Level Detector
Figure 24. Precision 1-μA to 1-mA Current Sink Figure 25. Precision 1-μA to 1-mA Current
Sources
*D1 can be any LED, VF = 1.5 V to 2.2 V at 3 mA. D1 may act as an indicator. D1 will be on if ITHRESHOLD falls below
the threshold current, except with I = 0.
Figure 27. Fast Positive Clamp 2.4 V + VD1 Figure 28. Bidirectional Clamp ±2.4 V
Figure 29. Bidirectional Adjustable Clamp ±18 V to Figure 30. Bidirectional Adjustable Clamp ±2.4 V to
±2.4 V ±6 V
9.2.7.1 Design Requirements
Create adjustable clamping circuits using the LM4041.
11 Layout
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 14-Oct-2017
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM4041AIM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 R1A
LM4041AIM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1A
& no Sb/Br)
LM4041AIM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1A
& no Sb/Br)
LM4041AIZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041A
& no Sb/Br) IZ1.2
LM4041BIM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 R1B
LM4041BIM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1B
& no Sb/Br)
LM4041BIM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1B
& no Sb/Br)
LM4041BIM7-1.2 NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 R1B
LM4041BIM7-1.2/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1B
& no Sb/Br)
LM4041BIM7X-1.2/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1B
& no Sb/Br)
LM4041BIZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041B
& no Sb/Br) IZ1.2
LM4041CEM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 R1C
LM4041CEM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1C
& no Sb/Br)
LM4041CEM3-ADJ NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 RAC
LM4041CEM3-ADJ/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RAC
& no Sb/Br)
LM4041CEM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1C
& no Sb/Br)
LM4041CEM3X-ADJ NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 RAC
LM4041CEM3X-ADJ/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RAC
& no Sb/Br)
LM4041CIM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 R1C
LM4041CIM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1C
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM4041CIM3-ADJ NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 RAC
LM4041CIM3-ADJ/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAC
& no Sb/Br)
LM4041CIM3X-1.2 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 R1C
LM4041CIM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1C
& no Sb/Br)
LM4041CIM3X-ADJ/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAC
& no Sb/Br)
LM4041CIM7-1.2/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1C
& no Sb/Br)
LM4041CIM7-ADJ NRND SC70 DCK 5 1000 TBD Call TI Call TI -40 to 85 RAC
LM4041CIM7-ADJ/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAC
& no Sb/Br)
LM4041CIM7X-1.2/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1C
& no Sb/Br)
LM4041CIM7X-ADJ/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAC
& no Sb/Br)
LM4041CIZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041C
& no Sb/Br) IZ1.2
LM4041CIZ-ADJ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041C
& no Sb/Br) IZADJ
LM4041DEM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1D
& no Sb/Br)
LM4041DEM3-ADJ NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 RAD
LM4041DEM3-ADJ/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RAD
& no Sb/Br)
LM4041DEM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1D
& no Sb/Br)
LM4041DEM3X-ADJ/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RAD
& no Sb/Br)
LM4041DIM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 R1D
LM4041DIM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1D
& no Sb/Br)
LM4041DIM3-ADJ NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 RAD
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM4041DIM3-ADJ/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAD
& no Sb/Br)
LM4041DIM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1D
& no Sb/Br)
LM4041DIM3X-ADJ NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 85 RAD
LM4041DIM3X-ADJ/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAD
& no Sb/Br)
LM4041DIM7-1.2/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1D
& no Sb/Br)
LM4041DIM7-ADJ/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAD
& no Sb/Br)
LM4041DIM7X-1.2/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1D
& no Sb/Br)
LM4041DIM7X-ADJ/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RAD
& no Sb/Br)
LM4041DIZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041D
& no Sb/Br) IZ1.2
LM4041DIZ-ADJ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS CU SN N / A for Pkg Type 4041D
& no Sb/Br) IZADJ
LM4041DIZ-ADJ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS CU SN N / A for Pkg Type -40 to 85 4041D
& no Sb/Br) IZADJ
LM4041EEM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 R1E
LM4041EEM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1E
& no Sb/Br)
LM4041EEM3X-1.2 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 R1E
LM4041EEM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 R1E
& no Sb/Br)
LM4041EIM3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 85 R1E
LM4041EIM3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1E
& no Sb/Br)
LM4041EIM3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1E
& no Sb/Br)
LM4041EIM7-1.2/NOPB ACTIVE SC70 DCK 5 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1E
& no Sb/Br)
LM4041EIM7X-1.2/NOPB ACTIVE SC70 DCK 5 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 R1E
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM4041QAIM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RQA
& no Sb/Br)
LM4041QAIM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RQA
& no Sb/Br)
LM4041QBIM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RQB
& no Sb/Br)
LM4041QBIM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 85 RQB
& no Sb/Br)
LM4041QCEM3-1.2NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQC
& no Sb/Br)
LM4041QCEM3-ADJ/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RZC
& no Sb/Br)
LM4041QCEM3X-1.2NO ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQC
& no Sb/Br)
LM4041QCEM3X-ADJNO PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125
LM4041QCIM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQC
& no Sb/Br)
LM4041QCIM3-ADJ/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RZC
& no Sb/Br)
LM4041QCIM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQC
& no Sb/Br)
LM4041QCIM3X-ADJNO PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125
LM4041QDEM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQD
& no Sb/Br)
LM4041QDEM3-ADJ/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RZD
& no Sb/Br)
LM4041QDEM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQD
& no Sb/Br)
LM4041QDEM3X-ADJNO PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125
LM4041QDIM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQD
& no Sb/Br)
LM4041QDIM3-ADJ/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RZD
& no Sb/Br)
LM4041QDIM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQD
& no Sb/Br)
LM4041QDIM3X-ADJNO PREVIEW SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM4041QEEM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQE
& no Sb/Br)
LM4041QEEM3X-1.2NO ACTIVE SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQE
& no Sb/Br)
LM4041QEIM3-1.2/NO ACTIVE SOT-23 DBZ 3 1000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQE
& no Sb/Br)
LM4041QEIM3X-1.2NO PREVIEW SOT-23 DBZ 3 3000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 RQE
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2017
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Catalog: LM4041-N
• Automotive: LM4041-N-Q1
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2017
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2017
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2017
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2017
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4041BIM7-1.2 SC70 DCK 5 1000 210.0 185.0 35.0
LM4041BIM7-1.2/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041BIM7X-1.2/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041CEM3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CEM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CEM3-ADJ SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CEM3-ADJ/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CEM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041CEM3X-ADJ SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041CEM3X-ADJ/NOP SOT-23 DBZ 3 3000 210.0 185.0 35.0
B
LM4041CIM3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CIM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CIM3-ADJ SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CIM3-ADJ/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041CIM3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041CIM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041CIM3X-ADJ/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041CIM7-1.2/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041CIM7-ADJ SC70 DCK 5 1000 210.0 185.0 35.0
LM4041CIM7-ADJ/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041CIM7X-1.2/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041CIM7X-ADJ/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041DEM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DEM3-ADJ SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DEM3-ADJ/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DEM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041DEM3X-ADJ/NOP SOT-23 DBZ 3 3000 210.0 185.0 35.0
B
LM4041DIM3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DIM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DIM3-ADJ SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DIM3-ADJ/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041DIM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041DIM3X-ADJ SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041DIM3X-ADJ/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041DIM7-1.2/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041DIM7-ADJ/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041DIM7X-1.2/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041DIM7X-ADJ/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041EEM3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041EEM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041EEM3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041EEM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Sep-2017
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4041EIM3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041EIM3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041EIM3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041EIM7-1.2/NOPB SC70 DCK 5 1000 210.0 185.0 35.0
LM4041EIM7X-1.2/NOPB SC70 DCK 5 3000 210.0 185.0 35.0
LM4041QAIM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QBIM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QCEM3-1.2NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QCEM3-ADJ/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QCEM3X-1.2NO SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041QCIM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QCIM3-ADJ/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QDEM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QDEM3-ADJ/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QDIM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QDIM3-ADJ/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QEEM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM4041QEEM3X-1.2NO SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM4041QEIM3-1.2/NO SOT-23 DBZ 3 1000 210.0 185.0 35.0
Pack Materials-Page 5
PACKAGE OUTLINE
LP0003A SCALE 1.200 SCALE 1.200
TO-92 - 5.34 mm max height
TO-92
5.21
4.44
EJECTOR PIN
OPTIONAL
5.34
4.32
(1.5) TYP
(2.54) SEATING
2X NOTE 3 PLANE
4 MAX
(0.51) TYP
6X
0.076 MAX
SEATING
PLANE
3X
12.7 MIN
0.43
2X 0.55 3X
3X 0.35
2.6 0.2 0.38
2X 1.27 0.13
FORMED LEAD OPTION
OTHER DIMENSIONS IDENTICAL STRAIGHT LEAD OPTION
TO STRAIGHT LEAD OPTION
2.67
3X
2.03 4.19
3.17
3 2 1
3.43 MIN
4215214/B 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Lead dimensions are not controlled within this area.
4. Reference JEDEC TO-226, variation AA.
5. Shipping method:
a. Straight lead option available in bulk pack only.
b. Formed lead option available in tape and reel or ammo pack.
c. Specific products can be offered in limited combinations of shipping medium and lead options.
d. Consult product folder for more information on available options.
www.ti.com
EXAMPLE BOARD LAYOUT
LP0003A TO-92 - 5.34 mm max height
TO-92
FULL R
0.05 MAX (1.07) TYP
ALL AROUND METAL 3X ( 0.85) HOLE
TYP TYP
2X
METAL
(1.5) 2X (1.5)
2X
SOLDER MASK
OPENING
1 2 3
(R0.05) TYP 2X (1.07)
(1.27)
SOLDER MASK
(2.54)
OPENING
METAL
2X
1 2 3 SOLDER MASK
(R0.05) TYP
(2.6) OPENING
SOLDER MASK
OPENING (5.2)
4215214/B 04/2017
www.ti.com
TAPE SPECIFICATIONS
LP0003A TO-92 - 5.34 mm max height
TO-92
13.7
11.7
32
23
16.5
15.5
11.0 9.75
8.5 8.50
19.0
17.5
4215214/B 04/2017
www.ti.com
4203227/C
PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA
0.95
3.04
1.9 2.80
3
2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01
0.25
GAGE PLANE 0.20
TYP
0.08
0.6
TYP SEATING PLANE
0 -8 TYP 0.2
4214838/C 04/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
(R0.05) TYP
(2.1)
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214838/C 04/2017
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
(R0.05) TYP
(2.1)
4214838/C 04/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
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ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in
life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use.
Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life
support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all
medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S.
TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product).
Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications
and that proper product selection is at Designers’ own risk. Designers are solely responsible for compliance with all legal and regulatory
requirements in connection with such selection.
Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer’s non-
compliance with the terms and provisions of this Notice.
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