Enclosure Heat Load PDF

HOW TO CALCULATE ENCLOSURE HEAT LOAD AND WHY
YOU NEED TO COOL ELECTRONICS.

HARMFUL
HEAT
Like people, industrial electronics can over-heat,
causing malfunction and even complete failure.
The good news is that electronic components
HOFFMAN®  MCLEAN®  SCHROFF®
can be kept cool to extend their life and prevent
expensive operations downtime.
PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 2

LEARNING OBJECTIVES
• Understanding why temperature variation can be a problem

• Understand the consequences of over-heated electronics
• Learn the benefits of cooling industrial electronics
• Identify the sources of damaging heat
• Learn how to size a cooling unit for your cabinet



WHY CAN TEMPERATURE VARIATION BE A PROBLEM?
Typical devices housed in an enclosure in an
Automation Control System
▶ VARIABLE FREQUENCY DRIVE (VFD)
▶ SERVO DRIVE
▶ PROGRAMMABLE LOGIC CONTROLLER (PLC)
▶ STARTER KIT
▶ POWER SUPPLY
▶ INVERTER
▶ RELAYS
▶ TERMINAL BLOCKS
▶ INDICATOR LIGHTS
▶ TRANSFORMER*
* Typically outside the control panel, but can sometimes be Electrical Enclosure
included inside the enclosure
VFD
PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

TEMPERATURE EXTREMES WILL CAUSE

PROBLEMS
AT HIGH TEMPERATURES:
Drive performance is de-rated
I/C- based devices behave strangely-
funky output- voltage migration
(Properties of silicone materials
change with temp extremes)
AT LOW TEMPERATURES
Cooling below the dew point leads to
condensation - promotes corrosion
Batteries
HOFFMAN® 
die
MCLEAN SCHROFF
® ®
I/C
HOFFMAN® 
-based devices behave strangely
MCLEAN SCHROFF
® ®

All Metal-Oxide-Semiconductor electronic components are sensitive to
temperature changes: Metal Oxide field effect transistors (MOSFET) are no
different
• Electrical characteristics
• Threshold voltage = Applied voltage to the gate
• The higher the temperature , the higher the threshold voltage
trigger point requirements
• May cause the transistor to drift out of design requirements
• The higher the temperature, the longer it takes for the gate to open
• The higher the temperature the greater the internal resistance – the
gate may not open at all
• Result: the gate does not open when it is designed to, which
HOFFMAN MCLEAN SCHROFF
® ®

® ®
®
adversely affects other components on the circuit

• Life Expectancy
• Properties of silicon oxide used in the components changes with
temperature fluxuations

Mechanical properties of materials change with increasing temperatures
In Wiring Insulation
• Elasticity and
strength are
reduced
• Ductility increases
temporarily
• Atomic Mobility
increases

TREND TOWARD MORE HEAT
As information processing becomes more powerful,
the heat generated from electronics continues to increase.
“Semiconductor transistor density and

performance double every 18-24 months.”
Moore’s Law
Named for Intel founder,
Dr Gordon Moore

The need for more electronics cooling continues to grow


Every 10 C / 18 F over room temperature cuts electronics life in half.
52 C / 126 F 12.5%
42 C / 108 F 25%
32 C / 90 F 50%
22 C / 72 F 100%
0 10 20 30 40 50 60 70 80 90 100
Percent of Electronics Life Expectancy
Source: DEC Study
Using cooling can avoid early automation drive replacement

RUNNING HOT
COMPONENTS
IS A GAMBLE
Depending on the equipment, allowing
electronic components to run hot can be a
costly gamble.
Early replacement of industrial drives,
hours of automation system downtime,
and out-of-warranty conditions all become
® ®

® ®
®
risks when cooling is not used.

CONSEQUENCES OF HOT ELECTRONICS
One hour of industrial operation downtime can cost big money
UP TO $500,000 PER HOUR!

Lost production+ direct repair cost + lost opportunity cost= Cost of downtime
A little investment in cooling can save huge costs later

CONSEQUENCES OF HOT ELECTRONICS
Operating electronics over its specified temperature
could void the manufacturer’s warranty.

Using cooling can prevent unpleasant and expensive surprises


SOURCES OF DAMAGING HEAT
Typical efficiency of devices housed in an enclosure
in an Automation Control System
▶ VARIABLE FREQUENCY DRIVE (VFD)
▶ APPROX. 95 TO 98% EFFICIENT
▶ SERVO DRIVE
▶ >85% EFFICIENT
▶ POWER SUPPLY
▶ APPROX. 60 TO 83% EFFICIENT
▶ TRANSFORMER*
▶ APPROX. 95-99% EFFICIENT

* Typically outside the control panel, but can sometimes be

included inside the enclosure

SOURCES OF DAMAGING HEAT
Heat can also come from outside the electrical enclosure and
radiate inside, further adding to the heat stress of the component.
IRON FOUNDRY WELDING PROCESS SOLAR HEAT GAIN DRYING OVEN

MINING INTENSE LIGHTING HOT WEATHER BLAST FURNACE
Heat radiates
HOFFMAN® intoSCHROFF
MCLEAN ® the ® Applies extra heat load Dark-painted enclosures Many factories around
control
HOFFMANcabinet
®
MCLEAN from
®
SCHROFF ®
to the automation collect more heat than the world are hot
outside electronics inside light-colored cabinets environments and use
automation equipment
Most of these conditions require industrial control cooling

TERMS AND ABBREVIATIONS
Heat Load
The heat generated by the equipment or
system and is usually given in Watts
Max System Temperature TMAX
The maximum internal system
equipment temp allowable. TMAX
Ambient Temperature TA
The Outside or Inlet Temperature to the Heat
equipment or system.
Load
Temperature Rise or T
The difference between the Maximum
TA
Internal System Temp. and the Ambient
Temperature.
T = TMAX - TA AMBIENT

Solar load
This is the contribution to the heat load of the
Sun on outdoor systems
Noise
Quoted in dB(A)
The higher the number the louder the fan.
Volumetric Flow Rate
Air flow performance of the fan in free air
(i.e. fan blows in free space without static
pressure) measured in CFM or m3/hr
Static Pressure
HOFFMANThis
®
is the
MCLEAN®
amount of ambient air pressure.
SCHROFF ®

® ® ®
As air pressure increases fan performance

declines.
In general, high static pressure in in an
application is caused by air flow
obstructions and/or inadequate venting

Fan Curve System Flow Resistance
This is the key performance This curve represents the system or
characteristic for Fan Performance
a particular fan vs System
requirements resistance to the flow of air
Characteristic
itself.
Static Pressure (Inches H2O)
1.2
1
Static
0.8
PressureInc
hes (H2O) 0.6
0.4
0.2

0
HOFFMAN®  MCLEAN®  SCHROFF® 0 200 400 600 800
Air Air
FlowFlow - CFM
(SCFM)

CONVERSIONS/ASSUMPTIONS
1 Watt = 3.413 BTU/HR

1 HP = 746 Watts
1 HP = 2546 BTU/HR
If the efficiency of the drive is known, Watts lost to heat can be estimated if
it is not supplied by the manufacturer.
50 HP drive = 37,300 Watts potential power consumption.

If 93% efficient, and operating at full capacity,
HOFFMAN®  MCLEAN 2,611
®
SCHROFF Watts lost to heat = 8,911BTU/HR cooling required.
®
HOFFMAN®  MCLEAN SCHROFF

® ®

HEAT TRANSFER BASICS
• Thermal energy moves from high to low. (second law of Thermodynamics)
• A/C’s and HX’s create air movement over a cool surface which “pulls” heat
out of the enclosure.
• A/C’s cooling source is refrigeration system therefore, capable of temp’s

below ambient.
• Heat exchanger cooling source is ambient air therefore, can never create
® ® ®
temp’s below ambient.
® ® ®
• Forced Convection (open loop)cooling source is ambient air therefore, can

never create temp’s below ambient.

WAYS TO COOL INDUSTRIAL ENCLOSURES
There are 3 basic ways to cool industrial enclosures.
SEALED ENCLOSURE FRESH AIR CONDUCTIVE

COOLING COOLING COOLING
1 2 3

Cooling that maintains the Cooling that circulates fresh Cooling that allows the heat
protective seal of the cabinet, air through the cabinet to to simply radiate through
typically with an air conditioner take damaging heat away the cabinet
or heat exchanger


CUSTOMER NEEDS ANALYSIS
Determine ambient and electronics temperatures
A A AMBIENT TEMPERATURE
The maximum temperature outside the enclosure.
B B ELECTRONICS TEMPERATURE
The rated or desired temperature for the electronics
inside the enclosure.
Electrical Enclosure
HOFFMAN
<
B ®  MCLEAN IF ELECTRONICS TEMPERATURE MUST BE LOWER THAN AMBIENT TEMPERATURE
A ®  SCHROFF®
HOFFMAN MCLEAN®  SCHROFF®
®
Then air conditioners, air-to-water heat exchangers, thermoelectric coolers or

vortex coolers are selected.
B > A IF ELECTRONICS TEMPERATURE CAN BE HIGHER THAN AMBIENT TEMPERATURE
Then filter fans, axial fans, fan trays or air-to-air heat exchangers are chosen.
Temperature differences dictate the type of cooling

WHERE ARE YOU GOING TO DEPLOY YOUR CABINET?
-48/118 -50/105
-70/117 -48/105
-47/106
-54/119 -60/121
-60/118
-60/114 -55/114
-58/120 -52/108 -35/107
-66/115 -51/112
-25/104
-50/125 -47/118 -42/111
-32/106
-47/118 -39/113
-47/118 -34/110
-36/116
-17/110
-69/117 -40/118 -30/110
-61/114
-45/134 -37/114 -37/112 -40/109
-40/121
-40/128
-50/122 -27/120 -34/110
-29/120 -22/113
® ® ®

-19/115 -10/111
-27/112 -17/112
-23/120 -16/114
-80/100
-2/109
12/100

AIR CONDITIONER COOLING CAPACITY
Capacity needs to match or exceed amount of total heat load
generated by the electronic system
Total heat load comes from 2 sources:

Internal Heat Load Heat Transfer Load
Electronics in enclosure Ambient heat outside enclosure

+
VFD
TOTAL HEAT LOAD = INTERNAL HEAT LOAD + HEAT TRANSFER LOAD

STEP 1: DETERMINE INTERNAL HEAT LOAD
Internal heat load =

waste heat generated inside enclosure expressed in Watts (W)
METHODS TO DETERMINE INTERNAL HEAT LOAD

1. Data from Each Electronics Component
2. Component Power – Component Efficiency
3. Incoming – Outgoing Power
4. Automated Equipment Horsepower

VFD
4 methods for determining internal heat load

METHOD 1:
DATA FROM COMPONENTS
Customer may know amount of heat their equipment is generating
GATHER HEAT LOAD DATA OF EACH ELECTRONIC COMPONENT

Ask your customer . . .
“How much heat is being generated from each electronic
component in your enclosure?”

“SUPER COOL SALESMAN”
Gather heat load data for each electronic component

METHOD 2: INTERNAL HEAT LOAD =
COMPONENT POWER – COMPONENT EFFICIENCY COMPONENT POWER (W) - COMPONENT EFFICIENCY
System uses two components that draw 115 VAC at 15 amps. Each has
a rated efficiency of 90% (10% of each device becomes heat).
Estimated internal heat load is:

Device Power = 115 x 15 = 1725 W
Total Power = 2 x 1725 = 3450
HOFFMAN®  MCLEAN®  SCHROFF® Less Efficiency = 3450 x (1 - .90)
Total Heat Load = 345 W
Utilize component efficiency to estimate heat load

METHOD 3: INTERNAL HEAT LOAD =
INCOMING – OUTGOING POWER INCOMING POWER (W) – OUTGOING POWER (W)
An enclosure has three input lines of 230 VAC at 11, 6 and 4 A.

It has one output control line of 115 VAC at 9 A.

Incoming Power = (230 x 11) + (230 x 6) + (230 x 4) = 4830 W
Outgoing Power = 115 x 9 = 1035 W
Total Heat Load = 4830 – 1035 = 3795 W
Utilize power input and output to estimate heat load

METHOD 4: 1 hp = 745.6 W
AUTOMATED EQUIPMENT HORSEPOWER
A cabinet has three 5-hp VFDs with 95% efficiency

VFD Watts = 5 hp x 745.6 x 3 = 11184
Adjusted Watts = 11184 x (1 - .95) = 559
HOFFMAN®  MCLEAN®  SCHROFF®Total Heat Load = 559 x 1.25 = 699 W
1.25 is an assumed “safety” margin for other minor heat producing components.
Utilize horsepower (hp) to estimate heat load

FINDING THE EFFICIENCY OF COMPONENTS






STEP 2: DETERMINE HEAT TRANSFER LOAD
Heat transfer load = ambient heat outside enclosure

conducting itself through enclosure walls
METHODS TO DETERMINE HEAT TRANSFER LOAD

1. Simple Chart Method
2. Equation Method

REMEMBER
▶ The higher the ambient temperature and/or
the presence of solar heat gain on the
enclosure, the more cooling capacity is
required.

METHOD 1:
SIMPLE CHART METHOD
Reasonably accurate for most indoor industrial systems
Step A. Determine ΔT in °F or °C
Step B. Find the heat transfer per ft.2 or m2

on the chart, using ΔT and the proper
enclosure material curve.
Step C. Multiply the heat transfer per ft.2 or

m2 by the total surface area of the enclosure
that will conduct heat. (Remember to
® ® ®
exclude®
surfaces such as a side mounted to a
® ®
wall.)
SURFACE AREA (ft.2) = [2AB (in.) + 2BC (in.) + 2AC (in.)] ÷ 144
SURFACE AREA (m2) = [2AB (mm) + 2BC (mm) + 2AC (mm)] ÷ 1000000
Total Heat Transfer Load = Heat Transfer per ft.2 or m2 x Cabinet Surface Area
Use ΔT and enclosure surface area to estimate heat transfer

METHOD 1:
SIMPLE CHART METHOD
A painted steel enclosure has 80 ft.2 of surface area and will be

located in a maximum ambient temperature of 95 degrees F. The
rated temperature of the electronics is 75 degrees F.
Estimated internal heat transfer load is:
ΔT = 95 – 75 = 20 F
Heat Transfer = 4 W/ft.2 (from chart)
Total Heat Transfer Load = 80 x 4 = 320 W
If system will be deployed outdoors, solar heat gain will need to be added. We recommend
utilizing the online Product Selection Tool in these instances.

METHOD 2:
EQUATION METHOD
The governing equations for heat transfer load are: Definition of Variables—
English System (°F, inches and feet): q = Heat transfer load per unit of surface area
To = Maximum ambient temperature outside
q = (To - Ti) ÷ [(1/ho) + (1/hi) + R]
the enclosure
Metric System (°C, millimeters and meters): Ti = Maximum rated temperature of the
q = (To - Ti) ÷ [(1/ho) + (1/hi) + R] x 5.67 electronics components
ho = Convective heat transfer coefficient
q = (125 - 75) ÷ [(1/6) + (1/2) + 4] outside the cabinet
q = (50) ÷ (.16 + .5 + 4) Still air: h = 1.6
q = 50 ÷ 4.66 Relatively calm day: h = 2.5
Windy day (approx. 15 mph): h = 6.0
q = 10.7 BTU/hr./ft.2
hi = Convective heat transfer coefficient inside
Total Heat Transfer Load the cabinet
10.7 x 72 = 770 BTU/hr. or 770 ÷ 3.413 = 226 W Still air: h = 1.6
Since the cabinet is outdoors, and assuming it is painted Moderate air movement: h = 2.0
® ® ®
ANSI 61 gray
HOFFMAN®
MCLEAN SCHROFF
® ® Blower (approx. 8 ft.3/sec.): h = 3.0
and located in the sun, extra solar load needs to be added R = Value of insulation lining the interior of
to the the enclosure walls
No insulation: R = 0.0
outcome above which is 504 Watts (7 W per ft.2 x 72
1/2 in. or 12 mm: R = 2.0
ft.2). 1 in. or 25 mm: R = 4.0
Total Heat Transfer Load with Extra from Solar Heat Gain 1-1/2 in. or 38 mm: R = 6.0
226 + 504 = 730 WA 2 in. or 51 mm: R = 8.0

STEP 3: DETERMINE TOTAL HEAT LOAD
The internal heat load from one of the earlier examples was 3795
Watts. If the heat transfer load is 730 W.
Total Heat Load =

3795 + 730 = 4525 W
To convert Watts into BTU/hr. multiply by 3.413
4525 W = 15444 BTU/hr.

Total Heat Load = INTERNAL HEAT LOAD + HEAT TRANSFER LOAD

AIR CONDITIONER SPEC EXAMPLE
Estimated internal heat load:
Device Power = 115V x 17Amp = 1955 W
Total Power = 6 x 1955W = 11730W
Less Efficiency = 11730W x (1 - .90)
Total Heat Load = 1173 W
Online Product Selection Tool:

Total heat load = 1733 W
BTU/Hr. = 1733 x 3.413 = 5914


CUSTOMER NEEDS ANALYSIS
Identify the customer’s remaining requirements
UTILITIES AT THE INSTALLATION ENCLOSURE COOLING LOCATION

 Electricity only  Side of the enclosure
 Chilled circulated water  Top of the enclosure
 Compressed air  19” data rack
 Back panel / inside the enclosure
POWER INPUT
 115 VAC 50/60 Hz AGENCY CERTIFICATION
 230 VAC 50/60 Hz  UL / cUL
 230 VAC 50 Hz  UR
HOFFMAN®   460SCHROFF
MCLEAN
®
VAC 50/60 Hz single-phase
®  CSA
HOFFMAN®  MCLEAN SCHROFF
® ®
 460 VAC 50/60 Hz three-phase  CE

 24 VDC  GOST
 48 VDC  Telcordia GR-487 capable
Leads you to the final cooling product and options

SPECIFYING FRESH AIR COOLING PRODUCTS
What is air flow?
• Air flow is the volume of air moved by a Fresh Air Cooling product such as a filter fan,
impeller, 19” fan tray or blower
• It’s like gallons or liters per minute of water
• The more that an electronics system puts out heat, the more air flow is needed to cool it
• Air flow is measured in terms of:
 CFM (English system)
 M3/Hr (Metric system)

Low Air Flow High Air Flow

19” Blower 19” Blower
As you select a Fresh Air Cooling product, you will use Air Flow
What is static pressure?
• Static Pressure is the air flow restriction caused by electronic components.
• Here are three examples:

(187 Pascal) (187 - 436 Pascal) (436 Pascal)
• Static pressure is measured in terms of:

 Inches of H2O (English system)
 Pascal (Metric system)
You will also use Static Pressure to choose Fresh Air Cooling
Use these 5 simple steps to specify an Open Loop Product.
1 Determine Delta-T — The difference in maximum desired temperature for the electronics and
maximum temperature outside the enclosure
Electronics vs. Ambient Temperature Difference (ΔT)
Delta-T = Maximum Temperature Maximum Expected

Maximum -
Ambient Desired for the Electronics Ambient Temperature
Maximum Temperature Example—
Electronics
Temperature Delta-T = 35°C (95°F) Maximum - 25°C (77°F) Maximum
Electronics Temperature Ambient Temperature
Delta-T = 10°C (18°F)
2 Determine Heat Load — The amount of heat to be removed from the enclosure
HOFFMAN®  MCLEAN®  SCHROFF® Electronics Heat Load

Heat Load Definition Example—
10000 Watts Drawn by - 90% System
Heat Load = Total Watts Drawn by - System Heat Load =
the Electronics System Efficiency
the Electronics System Efficiency
Heat Load = 1000 Watts
1000 Watts of heat at a ΔT of 10°C need to be removed

3 Determine Free Air Flow — Using Delta-T (Step 1) and Heat Load (Step 2)
1
Free Air Flow Requirement
2000

180
306
Consult the manufacturers catalog for performance curves

Estimate Air Flow Restriction — Determine approximate system impedance based on the amount
4 of electronics in the cabinet using your judgment
Levels of Air Flow Restriction

(Need to confirm with actual prototype testing)

(187 Pascal) (187 - 436 Pascal) (436 Pascal)
Many Industrial cabinets are lightly packed with electronics

Select Your Open Loop solution– Pick the Power Input and Protection Level. Then overlay a judgmental
5 airflow restriction curve on the performance curves of your fan options, picking the one with the closest
air flow
ST13 303 CFM (515 M3/Hr) Filter Fan
Under-Sized
Below 180 CFM (306 M3/Hr) target
Light Airflow
Restriction
SF13 376 CFM (638 M3/Hr) Filter Fan
Light Airflow
Restriction
SF13 473 CFM (803 M3/Hr) Filter Fan
Light Airflow Right-Sized

® ® ® Restriction
At the 180 CFM (306 M3/Hr) target
Over-Sized
Above 180 CFM (306 M3/Hr) target
Designers should confirm the filter fan model with a system test
Air mover cooling is based on air flow and static pressure.
6
• Fans - High Volume Low
5
Static Pressure (in wg)

680
Pressure 498 MI
• MI’s - High Volume Radial
4
Fan Tray
Medium Pressure 374
Centrifugal
• Centrifugal Blower - High 3
Static Pressure
Static Pressure
Volume High Pressure 2

249
• Radial Blower - Low

(in. of H20)
Volume High Pressure 1 125
(Pa)
® ® ®
0
0
0 200 400 600400 800 1000 1200 1400
Air Flow (CFM) Air Flow (CFM)
Impellers overcome more air restriction than filter fans

The capability of each Fresh Air Cooling option varies considerably.
• General vs. concentrated air flow

• Amount of air volume
• Ability to overcome air flow restrictions caused by electronic
components
• Component price
• Power input (AC or DC volt)
• Ability to protect the electronics from dust and water
You will need to carefully consider your Fresh Air Cooling options
Filter fans often cool Industrial enclosures because the electronics
are “lightly packed”, and the factory is climate controlled.
Industrial Filter Fan Design Options
Push Design
Push Design with Dual Exhaust Pull Design Push / Pull Design Roof Mount Design
A typical application. An extra exhaust grille Pull design is less Push / pull is used Roof mount filter
Pressurizes
HOFFMAN cabinet
MCLEAN to
®
SCHROFF is added to improve
® ® desirable because to increase air flow fans save space
HOFFMAN dust. SCHROFF air flow and cooling.
MCLEAN dust can be sucked through more tightly inside the cabinet.
® ® ®
help keep out
inside the cabinet. packed cabinets.
Filter fans are typically installed using a “Push Design”

SPECIFYING FRESH
Open Loop AIR Principles
Cooling COOLING PRODUCTS
How to Specify an Open Loop Cooling Solution
 Determining Factors
 Maximum ambient temperature  Negative or positive cabinet
 Maximum enclosure pressure
temperature  Air filtration
 Maximum rise in temperature  Maximum sound levels (dB)
(ΔT)  Power source (AC or DC)
 Heat to be dissipated (heat load)  Voltage range (of power source)
 Hot spots in the cabinet  Optional controls & alarms
 Air mover type (fan tray, blower,
HOFFMAN®  MCLEAN®  SCHROFF®  Power consumption
etc.)
 Reliability (estimated life)
 Air flow (CFM or M3/HR)
 Budget
 Enclosure system air resistance
 Static pressure (air flow drive)

TYPES OF ENCLOSURE TEMPERATURE REGULATORS
A variety of sealed enclosure and fresh air cooling products exist.
SEALED ENCLOSURE COOLING FRESH AIR COOLING
AIR CONDITIONER AIR-TO-WATER INDUSTRIAL FILTER FAN

Keeps electronics cooler HEAT EXCHANGER
Pushes cool air through the
than temperatures outside Also keeps electronics enclosure to remove heat
the enclosure by using a cooler than temperatures from the electronics
refrigerant system outside the enclosure, but
with chilled water
AIR-TO-AIR COMPACT AXIAL FAN

THERMOELECTRIC COOLER
HEAT EXCHANGER Circulates cool air through
A refrigerant-free form of air or within the electrical
Quickly radiates heat conditioning that relies on enclosure
away from the enclosure
electrified ceramic chips.
by circulating cool air Also known as Peltier cooling
through a metal core
HOFFMAN®  MCLEAN®  SCHROFF® 19” FAN TRAY AND BLOWER
HOFFMAN®  MCLEAN®  SCHROFF® Fits a standard 19” data rack, blowing fresh
VORTEX COOLER ENCLOSURE HEATER cool air through the electronics
Cools electronics lower Used to warm electronics
than temperatures outside rather than cool them. Also
the enclosure using reduces condensation inside
compressed air the electrical enclosure
McLean makes every one of these products available today

SUMMARY
• Understanding why temperature variation can be a problem

• Understand the consequences of over-heated electronics
• Learn the benefits of cooling industrial electronics
• Identify the sources of damaging heat
• Learn how to size a cooling unit for your cabinet



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HOW TO CALCULATE ENCLOSURE HEAT LOAD AND WHY

YOU NEED TO COOL ELECTRONICS.

expensive operations downtime.

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 2

• Understanding why temperature variation can be a problem

HOFFMAN®  MCLEAN®  SCHROFF®

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 3

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 4

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

TEMPERATURE EXTREMES WILL CAUSE

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 6

HOFFMAN MCLEAN SCHROFF

adversely affects other components on the circuit

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 7

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 8

“Semiconductor transistor density and

HOFFMAN®  MCLEAN®  SCHROFF®

The need for more electronics cooling continues to grow

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

Using cooling can avoid early automation drive replacement

HOFFMAN MCLEAN SCHROFF

risks when cooling is not used.

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 12

UP TO $500,000 PER HOUR!

HOFFMAN®  MCLEAN®  SCHROFF®

A little investment in cooling can save huge costs later

HOFFMAN®  MCLEAN®  SCHROFF®

Using cooling can prevent unpleasant and expensive surprises

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 15

HOFFMAN®  MCLEAN®  SCHROFF®

* Typically outside the control panel, but can sometimes be

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

IRON FOUNDRY WELDING PROCESS SOLAR HEAT GAIN DRYING OVEN

Most of these conditions require industrial control cooling

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

HOFFMAN MCLEAN SCHROFF

As air pressure increases fan performance

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

HOFFMAN®  MCLEAN®  SCHROFF®

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

1 Watt = 3.413 BTU/HR

50 HP drive = 37,300 Watts potential power consumption.

HOFFMAN®  MCLEAN SCHROFF

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

• Thermal energy moves from high to low. (second law of Thermodynamics)

• A/C’s cooling source is refrigeration system therefore, capable of temp’s

• Forced Convection (open loop)cooling source is ambient air therefore, can

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

SEALED ENCLOSURE FRESH AIR CONDUCTIVE

HOFFMAN®  MCLEAN®  SCHROFF®

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 23

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF® 24

Then air conditioners, air-to-water heat exchangers, thermoelectric coolers or

Temperature differences dictate the type of cooling

HOFFMAN®  MCLEAN®  SCHROFF®

PENTAIR HOFFMAN®  MCLEAN®  SCHROFF®

Total heat load comes from 2 sources:

HOFFMAN®  MCLEAN®  SCHROFF®

TOTAL HEAT LOAD = INTERNAL HEAT LOAD + HEAT TRANSFER LOAD