bbs2 Motherboard PDF

Intel Desktop Board
D945GCLF2
Technical Product Specification
December 2008
Order Number: E45013-002US
The Intel Desktop Board D945GCLF2 may contain design defects or errors known as errata that may cause the product to deviate from published specifications.
Current characterized errata are documented in the Intel Desktop Board D945GCLF2 Specification Update.
Revision History
Revision Revision History Date
-001 First release of the Intel Desktop Board D945GCLF2 Technical Product September 2008
Specification.
-002 Second release of the Intel Desktop Board D945GCLF2 Technical December 2008
Product Specification. Covers both the D945GCLF2 and D945GCLF2D
desktop boards. Added copyright protection technology notice to
disclaimer. Updated current capability for rear chassis fan.
This product specification applies to only the standard Intel Desktop Board D945GCLF2 with BIOS identifier
LF94510J.86A.
Changes to this specification will be published in the Intel Desktop Board D945GCLF2 Specification Update
before being incorporated into a revision of this document.
This product (D945GCLF2) incorporates copyright protection technology that is protected by U.S. patents
and other intellectual property rights. Use of this copyright protection technology must be authorized by
Macrovision*, and is intended for home and other limited viewing uses only unless otherwise authorized by
Macrovision. Reverse engineering or disassembly is prohibited.
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to deviate from published specifications. Current characterized errata are available on request.
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Copyright 2008, Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board D945GCLF2. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board D945GCLF2 and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
# INTEGRATORS NOTES
Integrators notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board D945GCLF2 Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 System Memory .............................................................................. 15
1.6 Intel 945GC Chipset ....................................................................... 16
1.6.1 Intel 945GC Graphics Subsystem............................................ 16
1.6.2 USB ................................................................................... 18
1.6.3 IDE Support ........................................................................ 18
1.7 Real-Time Clock Subsystem .............................................................. 19
1.8 S-Video Output ............................................................................... 20
1.9 Legacy I/O Controller ....................................................................... 20
1.9.1 Serial Port ........................................................................... 20
1.9.2 Parallel Port......................................................................... 20
1.9.3 Keyboard and Mouse Interface ............................................... 21
1.10 Audio Subsystem............................................................................. 22
1.10.1 Audio Subsystem Software .................................................... 23
1.10.2 Audio Connectors and Headers ............................................... 23
1.11 LAN Subsystem ............................................................................... 24
1.11.1 LAN Subsystem Software....................................................... 24
1.11.2 RJ-45 LAN Connector with Integrated LEDs .............................. 25
1.12 Hardware Management Subsystem .................................................... 26
1.12.1 Hardware Monitoring............................................................. 26
1.12.2 Thermal Monitoring .............................................................. 27
1.13 Power Management ......................................................................... 28
1.13.1 ACPI................................................................................... 28
1.13.2 Hardware Support ................................................................ 31
1.13.3 ENERGY STAR* .................................................................... 35
2 Technical Reference
2.1 Memory Map................................................................................... 37
2.1.1 Addressable Memory............................................................. 37
2.2 Connectors and Headers................................................................... 40
2.2.1 Back Panel Connectors .......................................................... 41
2.2.2 Component-side Connectors and Headers ................................ 42
2.3 Jumper Block .................................................................................. 49
2.4 Mechanical Considerations ................................................................ 50
2.4.1 Form Factor......................................................................... 50
2.5 Electrical Considerations ................................................................... 51
v
2.5.1 Power Supply Considerations ................................................. 51

2.5.2 Fan Header Current Capability................................................ 51
2.5.3 Add-in Board Considerations .................................................. 52
2.6 Thermal Considerations .................................................................... 52
2.7 Reliability ....................................................................................... 54
2.8 Environmental ................................................................................ 54
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 55
3.2 BIOS Flash Memory Organization ....................................................... 56
3.3 Resource Configuration .................................................................... 56
3.3.1 PCI* Autoconfiguration.......................................................... 56
3.4 System Management BIOS (SMBIOS)................................................. 57
3.5 Legacy USB Support ........................................................................ 58
3.6 BIOS Updates ................................................................................. 59
3.6.1 Language Support ................................................................ 59
3.6.2 Custom Splash Screen .......................................................... 59
3.7 BIOS Recovery................................................................................ 60
3.8 Boot Options................................................................................... 61
3.8.1 CD-ROM Boot ...................................................................... 61
3.8.2 Network Boot....................................................................... 61
3.8.3 Booting Without Attached Devices........................................... 61
3.8.4 Changing the Default Boot Device During POST ........................ 61
3.9 Adjusting Boot Speed....................................................................... 62
3.9.1 Peripheral Selection and Configuration..................................... 62
3.9.2 BIOS Boot Optimizations ....................................................... 62
3.10 BIOS Security Features .................................................................... 63
4 Error Messages and Beep Codes
4.1 BIOS Front-panel Power LED Codes.................................................... 65
4.2 BIOS Beep Codes ............................................................................ 66
4.3 BIOS Error Messages ....................................................................... 66
4.4 Port 80h POST Codes ....................................................................... 67
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 73
5.1.1 Safety Standards.................................................................. 73
5.1.2 European Union Declaration of Conformity Statement ................ 74
5.1.3 Product Ecology Statements................................................... 75
5.1.4 EMC Regulations .................................................................. 79
5.1.5 Product Certification Markings (Board Level)............................. 80
5.2 Battery Disposal Information............................................................. 81
vi
Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Back Panel Audio Connectors ............................................................ 23
4. LAN Connector LED Locations ............................................................ 25
5. Thermal Sensors and Fan Headers ..................................................... 27
6. Location of the Standby Power Indicator LED ....................................... 35
7. Detailed System Memory Address Map ............................................... 38
8. Back Panel Connectors ..................................................................... 41
9. Component-side Connectors and Headers ........................................... 42
10. Connection Diagram for Front Panel Header ........................................ 46
11. Connection Diagram for Front Panel USB Headers ................................ 48
12. Location of the Jumper Block............................................................. 49
13. Board Dimensions ........................................................................... 50
14. Localized High Temperature Zones..................................................... 53
Tables
1. Feature Summary.............................................................................. 9
2. Board Components Shown in Figure 1 ................................................ 12
3. Supported Memory Configurations ..................................................... 15
4. Audio Jack Retasking Support ........................................................... 22
5. LAN Connector LED States ................................................................ 25
6. Effects of Pressing the Power Switch .................................................. 28
7. Power States and Targeted System Power........................................... 29
8. Wake-up Devices and Events ............................................................ 30
9. System Memory Map ....................................................................... 39
10. Component-side Connectors and Headers Shown in Figure 9 ................. 43
11. Front Panel Audio Header ................................................................. 44
12. Serial ATA Connectors ...................................................................... 44
13. Rear Chassis (3-Pin) Fan Header........................................................ 44
14. GMCH (3-Pin) Fan Header................................................................. 44
15. S/PDIF Connector ............................................................................ 44
16. Main Power Connector...................................................................... 45
17. ATX12V Power Connector ................................................................. 46
18. Front Panel Header .......................................................................... 46
19. States for a One-Color Power LED ...................................................... 47
20. States for a Two-Color Power LED...................................................... 47
21. BIOS Setup Configuration Jumper Settings.......................................... 49
22. Recommended Power Supply Current Values ....................................... 51
23. Fan Header Current Capability........................................................... 51
24. Thermal Considerations for Components ............................................. 53
25. Intel Desktop Board D945GCLF2 Environmental Specifications ............... 54
26. BIOS Setup Program Menu Bar.......................................................... 56
27. BIOS Setup Program Function Keys.................................................... 56
28. AcceptableDrives/Media Types for BIOS Recovery ................................ 60
vii
29. Boot Device Menu Options ................................................................ 61

30. Supervisor and User Password Functions............................................. 63
31. Front-panel Power LED Blink Codes .................................................... 65
32. Beep Codes .................................................................................... 66
33. BIOS Error Messages ....................................................................... 66
34. Port 80h POST Code Ranges.............................................................. 67
35. Port 80h POST Codes ....................................................................... 68
36. Typical Port 80h POST Sequence........................................................ 71
37. Safety Standards............................................................................. 73
38. Lead-Free Board Markings ................................................................ 78
39. EMC Regulations ............................................................................. 79
40. Product Certification Markings ........................................................... 80
viii
1 Product Description
1.1 Overview
This document covers Intel Desktop Boards D945GCLF2 and D945GCLF2D. For
readability, the document references the board product name as D945GCLF2 in all
instances.
1.1.1 Feature Summary

Table 1 summarizes the major features of the Intel Desktop Board D945GCLF2.
Table 1. Feature Summary

Form Factor Mini-ITX, compatible with microATX (6.75 inches by 6.75 inches
[171.45 millimeters by 171.45 millimeters])
Processor Support for the following:
Soldered-down Dual-Core Intel Atom processor
Memory One 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) socket
Support for DDR2 533 MHz and DDR2 400 MHz DIMMs (DDR2 800 MHz and
DDR 667 MHz validated to run at 533 MHz only)
Support for up to 2 GB of system memory
Chipset Intel 945GC Chipset, consisting of:
Intel 82945GC Graphics Memory Controller Hub (GMCH)
Intel 82801GB I/O Controller Hub (ICH7)
Audio 5.1-channel audio subsystem using the Realtek* ALC662 high definition audio
codec
Video Intel GMA950 onboard graphics subsystem
Legacy I/O Control SMSC LPC47M997 based Legacy I/O controller for hardware management, serial,
parallel, and PS/2* ports
Peripheral Eight USB 2.0 ports
Interfaces Two Serial ATA (SATA) headers
One serial port
One parallel port
One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
PS/2 keyboard and mouse ports
One S-Video output port (not available on the D945GCLF2D desktop board)
LAN Support 10/100/1000 Mbits/sec LAN subsystem using Realtek 8111C GbE LAN adapter
device
BIOS Intel BIOS (resident in the SPI Flash device)
Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued
9
Table 1. Feature Summary (continued)

Instantly Available Support for PCI* Local Bus Specification Revision 2.3
PC Technology Suspend to RAM support
Wake on PCI, RS-232, front panel, USB ports, and LAN
Expansion One PCI Conventional bus connector
Capabilities
Hardware Monitor Hardware monitoring through the SMSC I/O controller
Subsystem Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Two fan headers
Two fan sense inputs used to monitor fan activity
Fan speed control
10
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Table 2. Board Components Shown in Figure 1

Item/callout
from Figure 1 Description
A PCI Conventional bus add-in card connector
B Front panel audio header Front panel USB headers
C Back panel connectors
D +12 V power connector (ATX12V)
E GMCH fan header
F Chassis fan header
G Intel Atom processor
H Intel 82945GC GMCH
I DIMM socket
J Main power connector
K Parallel ATA IDE connector
L SATA connectors [2]
M Front panel I/O header
N Battery
O Intel 82801GB I/O Controller Hub (ICH7)
P BIOS Setup configuration jumper block
Q Front panel USB headers
S S/PDIF connector
12
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas. The S-Video connector is
not available on the D945GCLF2D Desktop Board.
Figure 2. Block Diagram
13
1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
No floppy drive connector
1.3 Online Support

To find information about Visit this World Wide Web site:
Intel Desktop Board D945GCLF2 http://www.intel.com/products/motherboard/D945GCLF2/index.htm
Intel Desktop Board Support http://support.intel.com/support/motherboards/desktop/d945gclf2/
Available configurations for the Intel http://www.intel.com/products/motherboard/D945GCLF2/index.htm
Desktop Board D945GCLF2
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com/Product_Filter.aspx?ProductID=292
6
1.4 Processor
The board is designed to support the Dual-Core Intel Atom processor soldered down.
# INTEGRATORS NOTE
Use only ATX12V-compliant power supplies.
For information about Refer to
Power supply connectors Section 2.2.2.3, page 45
14
Product Description
1.5 System Memory

The board has one 240-pin DIMM socket and supports the following memory features:
1.8 V (only) DDR2 SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
Double-sided DIMMs with x16 organization are not supported.
2 GB maximum total system memory
Minimum total system memory: 128 MB
Non-ECC DIMMs
Serial Presence Detect
DDR2 533 MHz or DDR2 400 MHz SDRAM DIMMs (DDR2 800 MHz and DDR2
667 MHz validated to run at 533 MHz only)
NOTE
To be fully compliant with all applicable DDR2 SDRAM memory specifications, the
board should be populated with DIMMs that support the Serial Presence Detect (SPD)
data structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations

DIMM SDRAM SDRAM Organization Number of SDRAM
Capacity Configuration Density Front-side/Back-side Devices
128 MB SS 256 Mbit 16 M x 16/empty 4
512 MB DS 256 Mbit 32 M x 8/32 M x 8 16
512 MB SS 1 Gbit 64 M x 16/empty 4
1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16
1024 MB SS 1 Gbit 128 M x 8/empty 8
2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16
Note: In the second column, DS refers to double-sided memory modules (containing two rows of SDRAM)
and SS refers to single-sided memory modules (containing one row of SDRAM).
For information about Refer to:

Tested Memory http://support.intel.com/support/motherboards/desktop/sb/
CS-025414.htm
15
1.6 Intel 945GC Chipset

The Intel 945GC chipset consists of the following devices:
Intel 82945GC Graphics Memory Controller Hub (GMCH) with Direct Media
Interface (DMI) interconnect
Intel 82801GB I/O Controller Hub (ICH7) with DMI interconnect
The GMCH component provides interfaces to the CPU, memory, PCI Express, and the
DMI interconnect. The component also provides integrated graphics capabilities
supporting 3D, 2D, and display capabilities. The ICH7 is a centralized controller for
the boards I/O paths.

The Intel 945GC chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6.1 Intel 945GC Graphics Subsystem
1.6.1.1 Intel GMA950 Graphics Controller

The Intel GMA950 graphics controller features the following:
400 MHz core frequency
High performance 3-D setup and render engine
High quality texture engine
DX9* Compliant Hardware Pixel Shader 2.0
Alpha and luminance maps
Texture color-keying/chroma-keying
Cubic environment reflection mapping
Enhanced texture blending functions
3D Graphics Rendering enhancements
1.3 Dual Texture GigaPixel/Sec Fill Rate
16 and 32 bit color
Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz
Vertex cache
Anti-aliased lines
OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions
2D Graphics enhancements
8, 16, and 32 bit color
Optimized 256-bit BLT engine
Color space conversion
Anti-aliased lines
16
Product Description
Video
Hardware motion compensation for MPEG2
Software DVD at 30 fps full screen
Display
Integrated 24-bit 400 MHz RAMDAC
Up to 2048 x 1536 at 75 Hz refresh (QXGA)
Dynamic Video Memory Technology (DVMT) support up to 224 MB
Intel Zoom Utility
Obtaining graphics software and utilities Section 1.2, page 14
1.6.1.2 Dynamic Video Memory Technology (DVMT)

DVMT enables enhanced graphics and memory performance through Direct AGP, and
highly efficient memory utilization. DVMT ensures the most efficient use of available
system memory for maximum 2-D/3-D graphics performance. Up to 224 MB of
system memory can be allocated to DVMT on systems that have 512 MB or more of
total system memory installed. Up to 128 MB can be allocated to DVMT on systems
that have 256 MB but less than 512 MB of total installed system memory. Up to 64
MB can be allocated to DVMT when less than 256 MB of system memory is installed.
DVMT returns system memory back to the operating system when the additional
system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the
BIOS Setup program) for compatibility with legacy applications. An example of this
would be when using VGA graphics under DOS. Once loaded, the operating system
and graphics drivers allocate additional system memory to the graphics buffer as
needed for performing graphics functions.
NOTE
The use of DVMT requires operating system driver support.
1.6.1.3 Configuration Modes

A list of supported modes for the Intel GMA950 graphics controller is available as a
downloadable document.

Supported video modes for the board Section 1.2, page 14
17
1.6.2 USB
The board supports up to eight USB 2.0 ports, supports UHCI and EHCI, and uses
UHCI- and EHCI-compatible drivers.
The ICH7 provides the USB controller for all ports. The port arrangement is as
follows:
Four ports are implemented with dual stacked back panel connectors
Four ports are routed to two separate front panel USB headers
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.

The location of the USB connectors on the back panel Figure 8, page 41
The location of the front panel USB headers Figure 9, page 42
1.6.3 IDE Support

The board provides three IDE interface connectors:
One parallel ATA IDE connector that supports two devices
Two serial ATA connectors that support one device per connector
1.6.3.1 Parallel ATE IDE Interface

The ICH7s Parallel ATA IDE controller has one bus-mastering Parallel ATA IDE
interface. The Parallel ATA IDE interface supports the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up to
16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is
device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The ICH7s
ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer
rates up to 88 MB/sec.
NOTE
ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce
reflections, noise, and inductive coupling.
The Parallel ATA IDE interface also supports ATAPI devices (such as CD-ROM drives)
and ATA devices using the transfer modes.
18
Product Description
The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector
(ECHS) translation modes. The drive reports the transfer rate and translation mode to
the BIOS.

The location of the Parallel ATA IDE connector Figure 9, page 42
1.6.3.2 Serial ATA Interfaces

The ICH7s Serial ATA controller offers two independent Serial ATA ports with a
theoretical maximum transfer rate of 3 Gbits/sec per port. One device can be installed
on each port for a maximum of two Serial ATA devices. A point-to-point interface is
used for host to device connections, unlike Parallel ATA IDE which supports a
master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the
operating system. The Serial ATA controller can operate in both legacy and native
modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14
and 15). In Native mode, standard PCI Conventional bus resource steering is used.
Native mode is the preferred mode for configurations using the Windows* XP and
Windows Vista* operating systems.
NOTE
Many Serial ATA drives use new low-voltage power connectors and require adapters or
power supplies equipped with low-voltage power connectors.
For more information, see: http://www.serialata.org/

The location of the Serial ATA IDE connectors Figure 9, page 42
1.7 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery. The clock is accurate to 13 minutes/year at
25 C with 3.3 VSB applied.
NOTE
If the battery and AC power fail, custom defaults, if previously saved, will be loaded
into CMOS RAM at power-on.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
19
1.8 S-Video Output

The D945GCLF2 desktop board supports S-Video output via a 7-pin S-Video connector
supporting both 4-pin S-Video and Composite signal. S-Video output is not available
on the D945GCLF2D desktop board.
1.9 Legacy I/O Controller

The I/O controller provides the following features:
One serial port
One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port
(EPP) support
Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
PS/2-style mouse and keyboard interfaces
Intelligent power management, including a programmable wake-up event interface
PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1 Serial Port

The serial port A connector is located on the back panel. The serial port supports data
transfers at speeds up to 115.2 kbits/sec with BIOS support.

The location of the serial port A connector Figure 8, page 41
1.9.2 Parallel Port

The 25-pin D-Sub parallel port connector is located on the back panel. Use the BIOS
Setup program to set the parallel port mode.

The location of the parallel port connector Figure 8, page 41
20
Product Description
1.9.3 Keyboard and Mouse Interface

PS/2 keyboard and mouse connectors are located on the back panel.
NOTE
The keyboard is supported in the bottom PS/2 connector and the mouse is supported
in the top PS/2 connector. Power to the computer should be turned off before a
keyboard or mouse is connected or disconnected.

The location of the keyboard and mouse connectors Figure 8, page 41
21
1.10 Audio Subsystem

The audio subsystem consists of the following devices:
Intel 82801GB ICH7
Realtek ALC662 audio codec
The audio subsystem includes these features:
Signal-to-noise ratio 90 dB
Supports wake events (driver dependent)
Mic in pre-amp that supports dynamic, condenser, and electret microphones
The audio subsystem supports the following audio interfaces:
S/PDIF connector
Front panel audio header, including pins for:
Line out
Mic in
Back panel audio connectors:
Line in
Line out
Mic in
NOTE
Systems built with an AC 97 front panel will not be able to obtain the Microsoft
Windows Vista* logo.
Table 4 lists the supported functions of the front panel and back panel audio jacks.
Table 4. Audio Jack Retasking Support

Supports
Supports Line/ Supports Supports Supports Supports
Audio Jack Line In? Front Out? Rear Out? Center/LFE? Mic? HP?
Front panel Green No Yes No No No Yes
Front panel Pink No No No No Yes No
Back panel Blue Yes No Yes No No No
Back panel Green No Yes No No No Yes
Back panel Pink No No No Yes Yes No
22
Product Description
1.10.1 Audio Subsystem Software

Audio software and drivers are available from Intels World Wide Web site.

Obtaining audio software and drivers Section 1.2, page 14
1.10.2 Audio Connectors and Headers

The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 3.
Item Description
A Line in
B Line out
C Mic in
Figure 3. Back Panel Audio Connectors

The location of the front panel audio header Figure 9, page 42
The signal names of the front panel audio header Table 11, page 44
The back panel audio connectors Section 2.2.1, page 41
23
1.11 LAN Subsystem

The LAN subsystem consists of the following:
Intel 82801GB ICH7
Realtek 8111C GbE device for 10/100/1000 Mbits/sec Ethernet LAN connectivity
RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include:
CSMA/CD protocol engine
LAN connect interface that supports the 82562G
PCI Conventional bus power management
Supports ACPI technology
Supports LAN wake capabilities
1.11.1 LAN Subsystem Software

LAN software and drivers are available from Intels World Wide Web site.

Obtaining LAN software and drivers Section 1.2, page 14
24
Product Description
1.11.2 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 4).
Figure 4. LAN Connector LED Locations
Table 5 describes the LED states when the board is powered up and the
10/100/1000 Mbits/sec LAN subsystem is operating.
Table 5. LAN Connector LED States

LED LED Color LED State Condition
A Green Blinking LAN activity is occurring.
Off 10 Mbits/sec data rate is selected.
B Yellow On 100 Mbits/sec data rate is selected.
On 1000 Mbits/sec data rate is selected.
25
1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
Thermal and voltage monitoring
Chassis intrusion detection
1.12.1 Hardware Monitoring

The features of the hardware monitoring and fan control include:
Internal ambient temperature sensor
Remote thermal diode sensors for direct monitoring of processor temperature and
ambient temperature sensing
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and
+VCCP) to detect levels above or below acceptable values
SMBus interface
26
Product Description
1.12.2 Thermal Monitoring

Figure 5 shows the locations of the thermal sensors and fan headers.
Item Description
A Remote thermal sensor
B GMCH fan header
C Chassis fan header
D Thermal diode, located on processor die
Figure 5. Thermal Sensors and Fan Headers
27
1.13 Power Management

Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface (ACPI)
Hardware support:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
Wake from PS/2 devices
Power Management Event signal (PME#) wake-up support
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 8 on page 30)
Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch

If the system is in this and the power switch
state is pressed for the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 Soft off) (ACPI G0 working state)
On Less than four seconds Soft-off/Standby
(ACPI G0 working state) (ACPI G1 sleeping state)
On More than four seconds Fail safe power-off
(ACPI G0 working state) (ACPI G2/G5 Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 sleeping state) (ACPI G0 working state)
Sleep More than four seconds Power-off
(ACPI G1 sleeping state) (ACPI G2/G5 Soft off)
28
Product Description
1.13.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power

Global Processor Targeted System
States Sleeping States States Device States Power (Note 1)
G0 working S0 working C0 working D0 working Full power > 30 W
state state.
G1 sleeping S1 Processor C1 stop D1, D2, D3 5 W < power < 52.5 W
state stopped grant device
specification
specific.
G1 sleeping S3 Suspend to No power D3 no power Power < 5 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 sleeping S4 Suspend to No power D3 no power Power < 5 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 Soft off. No power D3 no power Power < 5 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 No power to the No power D3 no power for No power to the system.
mechanical off. system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
29
1.13.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events

These devices/events can wake up the computer from this state
LAN S1, S3, S4, S5 (Note 1)
PME# signal S1, S3, S4, S5 (Note 1)
Power switch S1, S3, S4, S5
RTC alarm S3, S4, S5
Serial port S3
USB S3
PS/2 devices S1, S3, S4, S5 (Note 2)
Note 1: For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option
to Power On will enable a wake-up event from LAN in the S5 state.
Note 2: For PS/2 devices, if the computer is in an S4 or S5 state, only the key combination alt-PrtScn will
wake the computer.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
30
Product Description
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
PME# signal wake-up support
Wake from PS/2 devices
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB technologies from an ACPI state requires an operating
system that provides full ACPI support.
1.13.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computers response can be set
using the Last Power State feature in the BIOS Setup programs Boot menu.

The location of the main power connector Figure 9, page 42
The signal names of the main power connector Table 16, page 45
31
1.13.2.2 Fan Headers

The function/operation of the fan headers is as follows:
The fans are on when the board is in the S0 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
The chassis fan header supports closed-loop fan control that can adjust the fan
speed and is wired to a fan tachometer input.
All fan headers have a +12 V DC connection.
The locations of the fan headers and thermal sensors Figure 5, page 27
The signal names of the GMCH fan header Table 14, page 44
The signal names of the chassis fan header Table 13, page 44
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
The PCI bus PME# signal for PCI 2.3 compliant LAN designs
By Ping
Magic Packet
The onboard LAN subsystem
32
Product Description
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 30 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
33
1.13.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 and S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the OS.
1.13.2.6 Wake from PS/2 Devices

PS/2 device activity wakes the computer from an ACPI S1, S3, S4, or S5 state.
However, when the computer is in an S4 or S5 state, the only PS/2 activity that will
wake the computer is the alt-PrtScrn key combination on the keyboard.
1.13.2.7 PME# Signal Wake-up Support

When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.8 +5 V Standby Power Indicator LED

The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 6 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
34
Product Description
Figure 6. Location of the Standby Power Indicator LED
1.13.3 ENERGY STAR*

In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. This Intel Desktop Board
meets the Category A requirements.

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
35
36
2 Technical Reference
2.1 Memory Map
2.1.1 Addressable Memory

The board utilizes 2 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 2 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
BIOS/ SPI Flash (4 MB)
Local APIC (19 MB)
Direct Media Interface (40 MB)
Front side bus interrupts (17 MB)
GMCH base address registers, internal graphics ranges
Memory-mapped I/O that is dynamically allocated for PCI Conventional add-in
cards
37
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings. Figure 7 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.
Figure 7. Detailed System Memory Address Map
38
Technical Reference
Table 9 lists the system memory map.
Table 9. System Memory Map

Address Range Address Range
(decimal) (hex) Size Description
1024 K - 2097152 K 100000 - FFFFFFFF 2048 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
39
2.2 Connectors and Headers
CAUTION
Only the following connectors have overcurrent protection: Back panel and front panel
USB and PS/2.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computers chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computers chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
This section describes the boards connectors and headers. The connectors and
headers can be divided into these groups:
Back panel I/O connectors (see page 41)
Component-side connectors and headers (see page 42)
40
Technical Reference
2.2.1 Back Panel Connectors

Figure 8 shows the location of the back panel connectors.
Item Description
A PS/2 mouse port
B PS/2 keyboard port
C Parallel port
D Serial port
E VGA port
F USB ports [2]
G LAN
H USB ports [2]
I S-Video out (not available on the D945GCLF2D
desktop board)
J Audio line in
K Mic in
L Audio line out
Figure 8. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
41
2.2.2 Component-side Connectors and Headers

Figure 9 shows the locations of the component-side connectors and headers.
Figure 9. Component-side Connectors and Headers
42
Technical Reference
Table 10 lists the component-side connectors and headers identified in Figure 9.
Table 10. Component-side Connectors and Headers Shown in Figure 9

Item/callout
from Figure 9 Description
A PCI Conventional bus add-in card connector
B Front panel audio header
C S/PDIF connector
D +12 V power connector (ATX12V)
E GMCH fan header
F Chassis fan header
G Main power connector
H Parallel ATA IDE connector
I SATA connector
J SATA connector
K Front panel I/O header
L Front panel USB header
M Front panel USB header
43
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. Front Panel Audio Header

Pin Signal Name Pin Signal Name
1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 12. Serial ATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 13. Rear Chassis (3-Pin) Fan Header

Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 14. GMCH (3-Pin) Fan Header

Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 15. S/PDIF Connector

Pin Signal Name
1 VCC
2 S/PDIF out
3 Ground
44
Technical Reference
2.2.2.2 Add-in Card Connectors

The board has one PCI Conventional (rev 2.3 compliant) bus add-in card connector.
PCI Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
The PCI Conventional bus connector is bus master capable.
SMBus signals are routed to the PCI Conventional bus connector. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:
Main power a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop Boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and
24 unconnected.
ATX12V power a 2 x 2 connector. This connector provides power directly to
the processor voltage regulator and must always be used. Failure to do so will
prevent the board from booting.
Table 16. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 2 x 12 connector detect (Note) 24 Ground (Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
45
Table 17. ATX12V Power Connector

1 Ground 2 Ground
3 +12 V 4 +12 V

Power supply considerations Section 2.5.1, page 51
2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 18 lists the signal
names of the front panel header. Figure 10 is a connection diagram for the front panel
header.
Table 18. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 HDR_BLNK_GRN Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 HDR_BLNK_YEL Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 10. Connection Diagram for Front Panel Header
46
Technical Reference
2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
A Serial ATA hard drive connected to an onboard Serial ATA connector
A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power/Sleep LED Header

Pins 2 and 4 can be connected to a one- or two-color LED. Table 19 shows the
possible states for a one-color LED. Table 20 shows the possible states for a two-color
LED.
Table 19. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Green Running
Table 20. States for a Two-Color Power LED

LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 19 and Table 20 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.4.4 Power Switch Header

Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
47
2.2.2.5 Front Panel USB Headers

Figure 11 is a connection diagram for the front panel USB headers.
# INTEGRATORS NOTES
The +5 V DC power on the USB headers is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 11. Connection Diagram for Front Panel USB Headers
48
Technical Reference
2.3 Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 12 shows the location of the jumper block. The jumper determines the BIOS
Setup programs mode. Table 21 lists the jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
Figure 12. Location of the Jumper Block
Table 21. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
3 2 1
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
3 2 1
Recovery None The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
3 2 1
49
2.4 Mechanical Considerations
2.4.1 Form Factor

The board is designed to fit into a micro-ATX-form-factor chassis. Figure 13 illustrates
the mechanical form factor for the board. Dimensions are given in inches
[millimeters]. The outer dimensions are 6.75 inches by 6.75 inches [171.45
millimeters by 171.45 millimeters]. Location of the I/O connectors and mounting
holes are in compliance with the micro-ATX specification.
Figure 13. Board Dimensions
50
Technical Reference
2.5 Electrical Considerations

2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5 VSB line
All timing parameters
All voltage tolerances
For example, for a system consisting of a D945GCLF2 board (with integrated Dual-
Core Intel Atom processor at 8 W), 2 GB DDR2 RAM, one hard disk drive, one optical
drive, and all board peripherals enabled, the minimum recommended power supply is
80 W. Table 22 lists the recommended power supply current values.
Table 22. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 0.52 A 7.34 A 1.17 A 0.54 A 0.03 A 0.25 A
2.5.2 Fan Header Current Capability
CAUTION
The GMCH must be connected to the GMCH fan header, not to a chassis fan header.
Connecting the GMCH fan to a chassis fan header may result in onboard component
damage that will halt fan operation.
Table 23 lists the current capability of the fan headers.
Table 23. Fan Header Current Capability

Fan Header Maximum Available Current
GMCH fan 2.0 A
Rear chassis fan 1.0 A
51
2.5.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of +5 V current for the one add-in
board. The total +5 V current draw for the one add-in board must not exceed 2 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the GMCH fan
inlet is a requirement.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel Desktop Boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 14) can reach a temperature of up to 85 oC in
an open chassis.
52
Technical Reference
Figure 14 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel 82945GC GMCH
D Intel 82801GB ICH7
Figure 14. Localized High Temperature Zones
Table 24 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 24. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82945GC GMCH 97 oC (under bias)

Intel 82801GB ICH7 92 oC (under bias)

Processor datasheets and specification updates Section 1.2, page 14
53
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 C. The MTBF for the Intel
Desktop Board D945GCLF2 is 75,716.67728 hours and for the Intel Desktop Board
D945GCLF2D the MTBF is 76,277.65065 hours.
2.8 Environmental
Table 25 lists the environmental specifications for the board.
Table 25. Intel Desktop Board D945GCLF2 Environmental Specifications

Parameter Specification
Temperature
Non-Operating -20 C to +70 C
Operating 0 C to +55 C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change
(inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz
20 Hz to 500 Hz: 0.02 g Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g Hz (flat)
40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz
54
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as LF94510J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 49 shows how to put the board in configure mode.
55
Table 26 lists the BIOS Setup program menu features.
Table 26. BIOS Setup Program Menu Bar

Maintenance Main Advanced Security Power Boot Exit
Clears Displays Configures Sets Configures Selects boot Saves or
passwords and processor advanced passwords power options discards
displays and memory features and security management changes to
processor configuration available features features and Setup
information through the power supply program
chipset controls options
Table 27 lists the function keys available for menu screens.
Table 27. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<> or <> Selects a different menu screen (Moves the cursor left or right)
<> or <> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization

The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 4 Mbit (512 KB)
flash memory device.
3.3 Resource Configuration

3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
56
Overview of BIOS Features
3.4 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
57
3.5 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
systems USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating systems
installation instructions.
58
3.6 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
Intel Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/
CS-022312.htm.
3.6.1 Language Support

The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrators Toolkit utility. Check the Intel website for
details.
3.6.2 Custom Splash Screen

During POST, an Intel splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrators Toolkit that is
available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.

Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
Additional Intel software tools http://developer.intel.com/products/motherboard/dg965wh/tools.htm
and
http://developer.intel.com/design/motherbd/software.htm
59
3.7 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 28 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable.
Table 28. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
CD-ROM drive connected to the Parallel ATA interface Yes
CD-ROM drive connected to the Serial ATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No

BIOS recovery http://support.intel.com/support/motherboards/desktop
60
3.8 Boot Options

In the BIOS Setup program, the user can choose to boot from a diskette drive, hard
drive, USB drive, USB flash drive, CD-ROM, or the network. The default setting is for
the diskette drive to be the first boot device, the hard drive second, and the ATAPI
CD-ROM third. If enabled, the last default boot device is the network.
3.8.1 CD-ROM Boot

Booting from CD-ROM is supported in compliance to the El Torito bootable CD-ROM
format specification. Under the Boot menu in the BIOS Setup program, ATAPI CD-
ROM is listed as a boot device. Boot devices are defined in priority order. Accordingly,
if there is not a bootable CD in the CD-ROM drive, the system will attempt to boot
from the next defined drive.
3.8.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.8.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
Video adapter
Keyboard
Mouse
3.8.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices (as set in the BIOS setup programs
Boot Device Priority Submenu). Table 29 lists the boot device menu options.
Table 29. Boot Device Menu Options

Boot Device Menu Function Keys Description
<> or <> Selects a default boot device
<Enter> Exits the menu, saves changes, and boots from the selected
device
<Esc> Exits the menu without saving changes
61
3.9 Adjusting Boot Speed

These factors affect system boot speed:
Selecting and configuring peripherals properly
Optimized BIOS boot parameters
3.9.1 Peripheral Selection and Configuration

The following techniques help improve system boot speed:
Choose a hard drive with parameters such as power-up to data ready less than
eight seconds, that minimize hard drive startup delays.
Select a CD-ROM drive with a fast initialization rate. This rate can influence POST
execution time.
Eliminate unnecessary add-in adapter features, such as logo displays, screen
repaints, or mode changes in POST. These features may add time to the boot
process.
Try different monitors. Some monitors initialize and communicate with the BIOS
more quickly, which enables the system to boot more quickly.
3.9.2 BIOS Boot Optimizations

Use of the following BIOS Setup program settings reduces the POST execution time.
In the Boot Menu, set the hard disk drive as the first boot device. As a result, the
POST does not first seek a diskette drive, which saves about one second from the
POST execution time.
In the Peripheral Configuration submenu, disable the LAN device if it will not be
used. This can reduce up to four seconds of option ROM boot time.
NOTE
It is possible to optimize the boot process to the point where the system boots so
quickly that the Intel logo screen (or a custom logo splash screen) will not be seen.
Monitors and hard disk drives with minimum initialization times can also contribute to
a boot time that might be so fast that necessary logo screens and POST messages
cannot be seen.
This boot time may be so fast that some drives might be not be initialized at all. If
this condition should occur, it is possible to introduce a programmable delay ranging
from three to 30 seconds (using the Hard Disk Pre-Delay feature of the Advanced
Menu in the Drive Configuration Submenu of the BIOS Setup program).
62
3.10 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
For enhanced security, use different passwords for the supervisor and user
passwords.
Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
Table 30 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 30. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.
63
64
4 Error Messages and Beep Codes
4.1 BIOS Front-panel Power LED Codes

The front-panel power LED blinks off and on to display messages. For example, the
power LED is on when the system is powered on, and blinks off for 0.5 second when
processor initialization is complete. In addition, whenever a recoverable error occurs
during POST, the BIOS causes the front-panel power LED to blink an error message
describing the problem (see Table 32).
Table 31. Front-panel Power LED Blink Codes

Type Pattern
Processor initialization complete On when system powers up, then off for 0.5 second.
POST complete On when system powers up, then off for 0.5 second.
BIOS update in progress Off when update begins, then on for 0.5 second, then off for 0.5
second; pattern repeats until BIOS update is complete.
Video error On-off (0.5 second each) two times, then 3.0 second pause (off)
between on-off blink pattern; repeat entire pattern (two on-off
blinks and pause) until system is powered off.
Memory error On-off (0.5 second each) three times, then 3.0 second pause (off)
between on-off blink pattern; repeat entire pattern (three on-off
blinks and 3-second pause) until system is powered off.
Thermal warning On-off (0.5 second each) four times, then 3.0 second pause (off)
between on-off blink pattern; repeat entire pattern (four on-off
blinks and 3-second pause) until 16th on blink, then end.
65
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the boards
speaker to beep an error message describing the problem (see Table 32).
NOTE
For Intel Desktop Board D945GCLF2, the beep code is only audible through a speaker
connected to the green audio line out connector on the back panel. See Figure 3 on
page 23 for information on the back panel audio connectors.
Table 32. Beep Codes

Type Pattern Frequency
Memory error Three long beeps 1280 Hz
Thermal warning Four alternating beeps: High tone: 2000 Hz
High tone, low tone, high tone, low tone Low tone: 1600 Hz
4.3 BIOS Error Messages

Whenever a recoverable error occurs during POST, the BIOS displays an error
message describing the problem. Table 33 lists the error messages and provides a
brief description of each.
Table 33. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
66
Error Messages and Beep Codes
4.4 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in PCI bus connector 1.
The following tables provide information about the POST codes generated by the
BIOS:
Table 34 lists the Port 80h POST code ranges
Table 35 lists the Port 80h POST codes themselves
Table 36 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 34. Port 80h POST Code Ranges

Range Category/Subsystem
00 0F Debug codes: Can be used by any PEIM/driver for debug.
10 1F Host Processors: 1F is an unrecoverable CPU error.
20 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 3F Recovery: 3F indicated recovery failure.
40 4F Reserved for future use.
50 5F I/O Busses: PCI, USB, ISA, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 6F Reserved for future use (for new busses).
70 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 8F Reserved for future use (new output console codes).
90 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 AF Reserved for future use (new input console codes).
B0 BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 CF Reserved for future use.
D0 DF Boot device selection.
E0 FF E0 EE: Miscellaneous codes. See Table 35.
EF: boot/S3 resume failure.
F0 FF: FF processor exception.
67
Table 35. Port 80h POST Codes

POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
28 Testing memory
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
68
Table 35. Port 80h POST Codes (continued)

Keyboard (PS/2 or USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (PS/2 or USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (IDE hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (IDE, CD-ROM detection, etc.)
BC Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
continued
69
Table 35. Port 80h POST Codes (continued)

DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
70
Table 36. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot
71
72
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board D945GCLF2:
Safety standards
European Union Declaration of Conformity statement
Product Ecology statements
Electromagnetic Compatibility (EMC) standards
Product certification markings
5.1.1 Safety Standards

Intel Desktop Board D945GCLF2 complies with the safety standards stated in Table 37
when correctly installed in a compatible host system.
Table 37. Safety Standards

Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second Information Technology Equipment Safety - Part 1: General
Edition Requirements (European Union)
IEC 60950-1:2005, Second Information Technology Equipment Safety - Part 1: General
Edition Requirements (International)
73
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product
Intel Desktop Board D945GCLF2 is in conformity with all applicable essential
requirements necessary for CE marking, following the provisions of the European
Council Directive 2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage
Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nuetele.
Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC mryksi.
Franais Ce produit est conforme aux exigences de la Directive Europenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie
2004/108/EC & 2006/95/EC.

2004/108/EC 2006/95/EC.
Magyar E termk megfelel a 2004/108/EC s 2006/95/EC Eurpai Irnyelv
elrsainak.
Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvi is produktas atitinka Europos direktyv 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
74
Regulatory Compliance and Battery Disposal Information
Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC

& 2006/95/EC.
Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv
2004/108/EC a 2006/95/EC.
Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Trke Bu rn, Avrupa Birliinin 2004/108/EC ve 2006/95/EC ynergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intels branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.

Intel Product Recycling Program

http://www.intel.com/intel/other/ehs/product_ecology

Deutsch
Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr
ordnungsgemes Recycling zurckzugeben.
Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte,
verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
75
Espaol
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envo, trminos y condiciones, etc.
Franais
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en uvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits uss en les retournant des adresses spcifies.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, savoir les produits concerns, les adresses
disponibles, les instructions d'expdition, les conditions gnrales, etc.

http://www.intel.com/in
tel/other/ehs/product_ecology
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos so reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponveis, as instrues de envio, os termos e condies, etc.
76
Russian
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Web sayfasna gidin.
5.1.3.3 Lead Free Intel Desktop Board

This Intel Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Intel Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Intel Desktop Board is referred to as Lead-free second level
interconnect. The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 38 shows the various forms of the Lead-Free 2nd Level Interconnect mark as it
appears on the board and accompanying collateral.
77
Table 38. Lead-Free Board Markings

Description Mark
nd
Lead-Free 2 Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the board substrate and
the solder connections from the
board to the components (second- or
level interconnect) is not greater
than 0.1% by weight (1000 ppm).
or
78
5.1.4 EMC Regulations

Intel Desktop Board D945GCLF2 complies with the EMC regulations stated in Table 39
when correctly installed in a compatible host system.
Table 39. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
(Class B)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
(Class B) of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment Immunity Characteristics Limits and
(Class B) methods of measurement. (European Union)
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
(Class B) Compatibility. (Australia and New Zealand)
CISPR 22:2005 Limits and methods of measurement of Radio Disturbance Characteristics of
+A1:2005 +A2:2006 Information Technology Equipment. (International)
(Class B)
CISPR 24:1997 Information Technology Equipment Immunity Characteristics Limits and
+A1:2001 +A2:2002 Methods of Measurement. (International)
(Class B)
VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment.
V-4/2007.04, Class B (Japan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
79
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)

Intel Desktop Board D945GCLF2 has the product certification markings shown in
Table 40:
Table 40. Product Certification Markings

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel Desktop Boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes

Intel name and D945GCLF2 model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and

Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum

Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes

adjacent MIC certification number: CPU-D945GCLF2 (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.
Printed wiring board manufacturers recognition mark. Consists of a unique V-0

UL recognized manufacturers logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
80
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les
piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des
piles usages doit respecter les rglementations locales en vigueur en matire de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i
overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on
mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
81
PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias
usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, .
, , .
.
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon,
baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi
pedpisy o ivotnm prosted.

.
.
.
VIGYAZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket
lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi
elrsoknak megfelelen kell kiselejtezni.
82
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu
baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi
przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor.
Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s
respecte reglementrile locale privind protecia mediului.
.
.
, .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu.
Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus
vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo.
e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri
dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, .
, .
, .
83
84

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Intel Desktop Board

Order Number: E45013-002US

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE,

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

* Other names and brands may be claimed as the property of others.

Copyright 2008, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

2.5.1 Power Supply Considerations ................................................. 51

29. Boot Device Menu Options ................................................................ 61

1.1.1 Feature Summary

Table 1. Feature Summary

Table 1. Feature Summary (continued)

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Board Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Legacy Considerations

1.3 Online Support

1.5 System Memory

Table 3. Supported Memory Configurations

For information about Refer to:

1.6 Intel 945GC Chipset

For information about Refer to

1.6.1 Intel 945GC Graphics Subsystem

1.6.1.1 Intel GMA950 Graphics Controller

1.6.1.2 Dynamic Video Memory Technology (DVMT)

1.6.1.3 Configuration Modes

For information about Refer to

For information about Refer to

1.6.3 IDE Support

1.6.3.1 Parallel ATE IDE Interface

For information about Refer to

1.6.3.2 Serial ATA Interfaces

For information about Refer to

1.7 Real-Time Clock Subsystem

1.8 S-Video Output

1.9 Legacy I/O Controller

1.9.1 Serial Port

For information about Refer to

1.9.2 Parallel Port

For information about Refer to

1.9.3 Keyboard and Mouse Interface

For information about Refer to

1.10 Audio Subsystem

Table 4. Audio Jack Retasking Support

1.10.1 Audio Subsystem Software

For information about Refer to

1.10.2 Audio Connectors and Headers

Figure 3. Back Panel Audio Connectors

For information about Refer to

1.11 LAN Subsystem

1.11.1 LAN Subsystem Software

For information about Refer to

1.11.2 RJ-45 LAN Connector with Integrated LEDs

Figure 4. LAN Connector LED Locations