DQ57TM TechProdSpec

Intel® Desktop Board
DQ57TM
Technical Product Specification
January 2010
Order Number: E83547-001US
The Intel® Desktop Board DQ57TM may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DQ57TM Specification Update.
Revision History
Revision Revision History Date
®
-001 First release of the Intel Desktop Board DQ57TM Technical Product January 2010
Specification
This product specification applies to only the standard Intel® Desktop Board DQ57TM with BIOS
identifier TMIBX10H.86A.
Changes to this specification will be published in the Intel Desktop Board DQ57TM Specification
Update before being incorporated into a revision of this document.
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deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your
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Copyright © 2010, Intel Corporation. All rights reserved.

Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel® Desktop Board DQ57TM.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DQ57TM and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains

Chapter Description
1 A description of the hardware used on the Intel Desktop Board DQ57TM
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
iii
Intel Desktop Board DQ57TM Technical Product Specification
Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
iv
Contents
1 Product Description
1.1 Overview.......................................................................................... 9
1.1.1 Feature Summary .................................................................. 9
1.1.2 Board Layout ....................................................................... 11
1.1.3 Block Diagram ..................................................................... 13
1.2 Legacy Considerations...................................................................... 14
1.3 Online Support................................................................................ 14
1.4 Processor ....................................................................................... 14
1.5 Intel® Q57 Express Chipset ............................................................... 15
1.6 System Memory .............................................................................. 15
1.6.1 Memory Configurations ......................................................... 16
1.7 Graphics Subsystem ........................................................................ 18
1.7.1 Integrated Graphics .............................................................. 18
1.7.2 PCI Express x16 Graphics ...................................................... 19
1.8 USB............................................................................................... 19
1.9 SATA Interfaces .............................................................................. 20
1.10 Legacy I/O Controller ....................................................................... 21
1.10.1 Serial Port ........................................................................... 21
1.11 Audio Subsystem............................................................................. 21
1.11.1 Audio Subsystem Software .................................................... 21
1.11.2 Audio Headers and Connectors ............................................... 22
1.12 LAN Subsystem ............................................................................... 23
1.12.1 Intel® 82578DM Gigabit Ethernet Controller ............................. 23
1.12.2 LAN Subsystem Software....................................................... 23
1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 24
1.13 Real-Time Clock Subsystem .............................................................. 25
1.14 Thermal Monitoring.......................................................................... 26
1.15 Platform Management and Security .................................................... 27
1.15.1 Hardware Management Subsystem ......................................... 27
1.15.2 Intel® vPro™ Technology ....................................................... 28
1.16 Power Management ......................................................................... 33
1.16.1 ACPI................................................................................... 34
1.16.2 Hardware Support ................................................................ 37
1.16.3 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 41
2 Technical Reference
2.1 Memory Resources .......................................................................... 43
2.1.1 Addressable Memory............................................................. 43
2.1.2 Memory Map........................................................................ 45
2.2 Connectors and Headers................................................................... 45
2.2.1 Back Panel Connectors .......................................................... 46
2.2.2 Component-side Connectors and Headers ................................ 47
2.3 BIOS Configuration Jumper Block....................................................... 56
v
2.4 Clear CMOS Header ......................................................................... 58

2.5 Mechanical Considerations ................................................................ 59
2.5.1 Form Factor......................................................................... 59
2.6 Electrical Considerations ................................................................... 60
2.6.1 Power Supply Considerations ................................................. 60
2.6.2 Fan Header Current Capability................................................ 61
2.6.3 Add-in Board Considerations .................................................. 61
2.7 Thermal Considerations .................................................................... 62
2.8 Reliability ....................................................................................... 64
2.9 Environmental ................................................................................ 64
3 Overview of BIOS Features
3.1 Introduction ................................................................................... 65
3.2 System Management BIOS (SMBIOS)................................................. 67
3.3 Legacy USB Support ........................................................................ 67
3.4 BIOS Updates ................................................................................. 68
3.4.1 Language Support ................................................................ 68
3.4.2 Custom Splash Screen .......................................................... 69
3.5 BIOS Recovery................................................................................ 69
3.6 Boot Options................................................................................... 70
3.6.1 Optical Drive Boot ................................................................ 70
3.6.2 Network Boot....................................................................... 70
3.6.3 Booting Without Attached Devices........................................... 70
3.6.4 Changing the Default Boot Device During POST ........................ 70
3.7 Hard Disk Drive Password Security Feature ......................................... 71
3.8 BIOS Security Features .................................................................... 72
4 Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 75
4.2 BIOS Beep Codes ............................................................................ 75
4.3 Front-panel Power LED Blink Codes .................................................... 76
4.4 BIOS Error Messages ....................................................................... 76
4.5 Port 80h POST Codes ....................................................................... 77
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 83
5.1.1 Safety Standards.................................................................. 83
5.1.2 European Union Declaration of Conformity Statement ................ 84
5.1.3 Product Ecology Statements................................................... 85
5.1.4 EMC Regulations .................................................................. 89
5.1.5 Product Certification Markings (Board Level)............................. 90
5.2 Battery Disposal Information............................................................. 91
vi
Contents
Figures
1. Major Board Components.................................................................. 11
2. Block Diagram ................................................................................ 13
3. Memory Channel and DIMM Configuration ........................................... 17
4. Back Panel Audio Connector Options .................................................. 22
5. LAN Connector LED Locations ............................................................ 24
6. Thermal Sensors and Fan Headers ..................................................... 26
7. Location of the Intel ME “M” State LED ............................................... 31
8. Location of the Standby Power LED (Green) ........................................ 40
9. Detailed System Memory Address Map ............................................... 44
10. Back Panel Connectors ..................................................................... 46
11. Component-side Connectors and Headers ........................................... 47
12. Connection Diagram for Front Panel Header ........................................ 53
13. Connection Diagram for Front Panel USB Headers ................................ 55
14. Location of the Jumper Block............................................................. 56
15. CMOS Clear Header ......................................................................... 58
16. Board Dimensions ........................................................................... 59
17. Localized High Temperature Zones..................................................... 63
Tables
1. Feature Summary.............................................................................. 9
2. Components Shown in Figure 1 ......................................................... 12
3. Supported Memory Configurations ..................................................... 15
4. LAN Connector LED States ................................................................ 24
5. Intel ME “M” State LED Behavior........................................................ 30
6. Effects of Pressing the Power Switch .................................................. 34
7. Power States and Targeted System Power........................................... 35
8. Wake-up Devices and Events ............................................................ 36
9. System Memory Map ....................................................................... 45
10. Component-side Connectors and Headers Shown in Figure 11................ 48
11. Serial Port Header ........................................................................... 49
12. S/PDIF Header ................................................................................ 49
13. Internal Mono Speaker Header .......................................................... 49
14. Front Panel Audio Header for Intel HD Audio........................................ 49
15. Front Panel Audio Header for AC ’97 Audio .......................................... 50
16. Front Panel USB Header ................................................................... 50
17. SATA Connectors............................................................................. 50
18. Chassis Intrusion Header .................................................................. 50
19. Processor (4-Pin) Fan Header ............................................................ 51
20. Front and Rear Chassis Fan Headers .................................................. 51
21. Intel Remote PC Assist Technology Header .......................................... 51
22. Processor Core Power Connector........................................................ 52
23. Main Power Connector...................................................................... 52
24. Front Panel Header .......................................................................... 53
25. States for a One-Color Power LED ...................................................... 54
26. Alternate Front Panel Power LED Header ............................................. 54
vii
27. BIOS Setup Configuration Jumper Settings.......................................... 57

28. Clear CMOS .................................................................................... 58
29. Recommended Power Supply Current Values ....................................... 60
30. Fan Header Current Capability........................................................... 61
31. Thermal Considerations for Components ............................................. 63
32. Environmental Specifications............................................................. 64
33. BIOS Setup Program Menu Bar.......................................................... 66
34. BIOS Setup Program Function Keys.................................................... 66
35. Acceptable Drives/Media Types for BIOS Recovery ............................... 69
36. Boot Device Menu Options ................................................................ 70
37. Master Key and User Hard Drive Password Functions ............................ 71
38. Supervisor and User Password Functions............................................. 73
39. BIOS Beep Codes ............................................................................ 75
40. Front-panel Power LED Blink Codes .................................................... 76
41. BIOS Error Messages ....................................................................... 76
42. Port 80h POST Code Ranges.............................................................. 77
43. Port 80h POST Codes ....................................................................... 78
44. Typical Port 80h POST Sequence........................................................ 81
45. Safety Standards............................................................................. 83
46. Lead-Free Board Markings ................................................................ 88
47. EMC Regulations ............................................................................. 89
48. Product Certification Markings ........................................................... 90
viii
1 Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary

Form Factor MicroATX (9.60 inches by 9.60 inches [243.84 millimeters by
243.84 millimeters])
Processor • Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3, Intel® Pentium® processors,
and Intel® Xeon® processor 3400 series in an LGA1156 socket:
― Integrated graphics processing (processors with Intel® Graphics
Technology)
― External graphics interface controller
― Integrated memory controller
Chipset Intel® Q57 Express Chipset consisting of the Intel® Q57 Platform Controller
Hub (PCH)
Memory • Four 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
• Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
• Support for 1 Gb and 2 Gb memory technology
• Support for up to 16 GB of system memory with four DIMMs using 2 Gb
memory technology
• Support for non-ECC memory
• Support for unbuffered ECC memory with Intel Xeon processor 3400 series
Graphics • Integrated graphics support for processors with Intel® Graphics Technology:
― DVI-I
― DVI-D
― DisplayPort*
• Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio • Intel® High Definition Audio:
― Realtek* ALC662 audio codec
― S/PDIF audio header
― DisplayPort Digital Audio
Peripheral • Fourteen USB 2.0 ports:
Interfaces ― Six ports are implemented with stacked back panel connectors
― Eight front panel ports are implemented through four dual-port internal
headers
• Six SATA interfaces through the Intel Q57 Express Chipset with Intel® Rapid
Storage Technology RAID support:
― Four internal SATA 3.0 Gb/s ports
― One internal eSATA 3.0 Gb/s port
― One backpanel eSATA 3.0 Gb/s port
• One serial port header
Legacy I/O Control • Nuvoton* W83677 Super I/O controller for hardware management and serial
port support
continued
9
Table 1. Feature Summary (continued)

BIOS • Intel® BIOS resident in the SPI Flash device
• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available • Support for PCI* Local Bus Specification Revision 2.2
PC Technology • Support for PCI Express*
• Suspend to RAM support
• Wake on PCI, PCI Express, LAN, front panel, serial, and USB ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel® 82578DM Gigabit
Ethernet Controller
Expansion • One PCI Express 2.0 x16 add-in card connector
Capabilities • Two PCI Express 2.0 x1 add-in card connectors
• One Conventional PCI bus connector
Hardware Monitor • Intel® Quiet System Technology (Intel® QST) implemented through Intel®
Subsystem Management Engine (Intel® ME) in the Intel Q57 PCH
• Voltage sense to detect out of range power supply voltages
• Thermal sense to detect out of range thermal values
• Three fan headers using PWM control
• 4-pin headers for processor, front, and rear fans
• 4-wire and 3-wire (linear) fan speed control support for front and rear fans
• Support for Platform Environmental Control Interface (PECI)
®
Intel vPro™ • Intel® Advanced Management Technology (Intel® AMT) 6.0
Technology • Intel® Trusted Execution Technology (Intel® TXT)
• Intel® Remote PC Assist (Intel® RPAT)
• Intel® Fast Call for Help
• Intel® Virtualization Technology (Intel® VT)
• Intel® Virtualization for Directed I/O (Intel® VT-d)
10
Product Description
1.1.2 Board Layout

Figure 1 shows the location of the major components on Intel Desktop Board DQ57TM.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
11
Table 2. Components Shown in Figure 1

Item/callout
from Figure 1 Description
A Conventional PCI bus add-in card connector
B PCI Express x1 add-in card connector
C Battery
D Piezoelectric speaker
E PCI Express x1 add-in card connector
F PCI Express x16 add-in card connector
G Back panel connectors
H 12 V internal power connector (ATX12V)
I Rear chassis fan header
J LGA1156 processor socket
K Processor fan header
L DIMM Channel A sockets (2)
M DIMM Channel B sockets (2)
N Front chassis fan header
O Chassis intrusion header
P Main power connector (2 x 12)
Q SATA connectors
R Alternate front panel power LED header
S Front panel header
T Standby power LED
U Intel ME “M” state LED
V Front panel USB headers (4)
W Intel Q57 Express Chipset
X BIOS setup configuration jumper block
Y Clear CMOS header
Z Intel Remote PC Assist header
AA Serial port header
BB S/PDIF header
CC Front panel audio header
DD Internal mono speaker header
12
Product Description
1.1.3 Block Diagram

Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
13
1.2 Legacy Considerations

This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
• No floppy drive connector
• No PS/2 connector
• No Parallel ATA (PATA) IDE drive connector
1.3 Online Support

To find information about… Visit this World Wide Web site:
Intel Desktop Board DQ57TM http://www.intel.com/products/motherboard/DQ57TM/index.htm
Desktop Board Support http://www.intel.com/support/motherboards/desktop
Available configurations for the Intel http://www.intel.com/products/motherboard/DQ57TM/index.htm
Desktop Board DQ57TM
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, Intel
Pentium processors, and Intel Xeon processor 3400 series in an LGA1156 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:

Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 60 for information on power supply requirements for this board.
14
Product Description
1.5 Intel® Q57 Express Chipset

The Intel Q57 Express Chipset consisting of the Intel Q57 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, Conventional PCI, and PCI Express x1 interfaces. The PCH is a centralized
controller for the board’s I/O paths.
For information about Refer to

The Intel Q57 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory

The board has four DIMM sockets and supports the following memory features:
• Two independent memory channels with interleaved mode support
• Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
• Support for unbuffered ECC memory when used with an Intel Xeon processor 3400
series
• 16 GB maximum total system memory (with 2 Gb memory technology). Refer to
Section 2.1.1 on page 43 for information on the total amount of addressable
memory.
• Minimum total system memory: 1 GB using 1 Gb x8 module
• Serial Presence Detect
• DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations

DIMM Configuration SDRAM SDRAM Organization Number of SDRAM
(Note)
Capacity Density Front-side/Back-side Devices
1024 MB SS 1 Gbit 1 Gb x8/empty 8
2048 MB DS 1 Gbit 1 Gb x8/1 Gb x8 16
2048 MB SS 2 Gbit 2 Gb x8/empty 8
4096 MB DS 2 Gbit 2 Gb x8/2 Gb x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
15

Tested Memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.6.1 Memory Configurations

The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series support the following types of memory organization:
• Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
• Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.

Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm
16
Product Description
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
NOTE
When using a processor without Intel Graphics Technology, there must always be
memory installed into any or both of the DIMM 0 (blue) memory sockets for the
system to boot.
17
1.7 Graphics Subsystem

The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics

The board supports integrated graphics through the Intel® Flexible Display Interface
(Intel® FDI) for processors with Intel Graphics Technology.
NOTE
If using a processor with integrated graphics, the board will support only two of the
integrated graphics interfaces simultaneously: DisplayPort, DVI-I, DVI-D. Also, during
the Power On Self Test (POST), the board will not output to the DisplayPort if DVI-I or
DVI-D is used concurrently with DisplayPort.
1.7.1.1 DisplayPort*
DisplayPort is a digital communication interface that utilizes differential signaling to
achieve a high bandwidth bus interface designed to support connections between PCs
and monitors, projectors, and TV displays. DisplayPort is suitable for display
connections between consumer electronics devices such as high definition optical disc
players, set top boxes, and TV displays. DisplayPort output can also be converted to
High-Definition Multimedia Interface* (HDMI*) using a DisplayPort-HDMI converter.
DisplayPort’s maximum supported display resolution is 2560 x 1600 at 60 Hz refresh
with a 16:10 aspect ratio (WQXGA). DisplayPort 1.1 adds support for High Bandwidth
Digital Content Protection (HDCP) version 1.3. HDCP support enables viewing of
protected content from Blu-ray Disc* and HD-DVD optical media over DisplayPort 1.1
connections.

DisplayPort technology http://www.displayport.org
1.7.1.2 Digital Visual Interface (DVI)

The DVI-I port supports both digital and analog DVI displays. The maximum
supported resolution is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI port is
compliant with the DVI 1.0 specification. DVI analog output can also be converted to
VGA using a DVI-VGA converter.
The DVI-D port supports only digital DVI displays. The maximum supported resolution
is 2048 x 1536 at 75 Hz refresh (QXGA). The DVI-D port is compliant with the
DVI 1.0 specification.
18
Product Description
1.7.2 PCI Express x16 Graphics

The Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium processors, and Intel Xeon
processors 3400 series in an LGA1156 socket support discrete add in graphics cards
through the PCI Express 2.0 x16 graphics connector:
• Supports PCI Express GEN2 frequency of 2.5 GHz resulting in 5.0 Gb/s each
direction (500 MB/s) per lane. Maximum theoretical bandwidth on interface is
8 GB/s in each direction, simultaneously, when operating in x16 mode.
• Supports PCI Express GEN1 frequency of 1.25 GHz resulting in 2.5 Gb/s each
direction (250 MB/s) per lane. Maximum theoretical bandwidth on interface is
4 GB/s in each direction, simultaneously, when operating in x16 mode.

PCI Express technology http://www.pcisig.com
1.8 USB
The board supports up to fourteen USB 2.0 ports through two EHCI host controllers on
the PCH that allow the use of EHCI-compatible drivers.
The port arrangement is as follows:
• Six ports are implemented with stacked back panel connectors
• Eight front panel ports are implemented through four dual-port internal headers

The location of the USB connectors on the back panel Figure 10, page 46
The location of the front panel USB headers Figure 11, page 47
19
1.9 SATA Interfaces

The board provides six SATA connectors through the PCH, which support one device
per connector:
• Four internal SATA connectors (black)
• One internal eSATA connector (red) for internal or external connectivity
• One eSATA connector (red) on the back panel for external connectivity
The PCH provides independent SATA ports with a theoretical maximum transfer rate of
3 Gb/s per port. A point-to-point interface is used for host to device connections.
The underlying SATA functionality is transparent to the operating system. The SATA
controller can operate in both legacy and native modes. In legacy mode, standard IDE
I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI
Conventional bus resource steering is used. Native mode is the preferred mode for
configurations using the Windows* XP, Windows Vista*, and Windows 7* operating
systems.
For more information, see: http://www.serialata.org/.

The location of the SATA connectors Figure 11, page 47
1.9.1.1 Serial ATA RAID

The board supports the Intel Rapid Storage Technology (Intel RST) which provides the
following RAID (Redundant Array of Independent Drives) levels:
• RAID 0 - data striping
• RAID 1 - data mirroring
• RAID 0+1 (or RAID 10) - data striping and mirroring
• RAID 5 - distributed parity
1.9.1.2 Intel® Rapid Recover Technology

The board incorporates the Intel® Rapid Recover Technology (Intel® RRT). Intel Rapid
Recover Technology is a feature of Intel Rapid Storage Technology. It uses RAID 1
(mirroring) functionality to copy data from a designated master drive to a designated
recovery drive. The master drive data can be copied to the recovery drive either
continuously or on request.
When using the continuous update policy, changes made to the data on the master
drive while the recovery drive is disconnected or offline are automatically copied to the
recovery drive when it is reconnected. When using the on request update policy, the
master drive data can be restored to a previous state by copying the data on the
recovery drive back to the master drive.

Intel Rapid Recovery Technology http://www.intel.com/support/chipsets/
imsm/sb/CS-026142.htm
20
Product Description
1.10 Legacy I/O Controller

The Legacy I/O Controller provides the following features:
• One serial port
• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional
bus systems
• Intelligent power management, including a programmable wake-up event interface
• PCI Conventional bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1 Serial Port

The serial port is implemented as a 10-pin header on the board. The serial port
supports data transfers at speeds up to 115.2 kbits/s with BIOS support.

The location of the serial port header Figure 11, page 47
1.11 Audio Subsystem

The board supports Intel High Definition Audio through the Realtek ALC662-VC audio
codec as well as the DisplayPort interface.
The Realtek ALC662-VC-based audio subsystem supports the following features:
• 6-channel audio with independent multi-streaming stereo.
• Advanced jack sense for the back panel audio jacks that enables the audio codec to
recognize the device that is connected to an audio port. The back panel audio
jacks are capable of retasking according to the user’s definition, or can be
automatically switched depending on the recognized device type.
• Stereo input and output through back panel jacks
• Headphone and Mic in functions for front panel audio jacks
• S/PDIF audio header
• A signal-to-noise (S/N) ratio of 90 dB
1.11.1 Audio Subsystem Software

Audio software and drivers are available from Intel’s World Wide Web site.

Obtaining audio software and drivers Section 1.3, page 14
21
1.11.2 Audio Headers and Connectors

The board contains audio connectors and headers on both the back panel and the
component side of the board. The component-side audio headers include the
following:
• Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals
for front panel audio connectors) (yellow)
• S/PDIF audio header (1 x 4-pin header) (yellow)
• Internal mono speaker header (1 x 2-pin header) (yellow)

The locations of the front panel audio header, S/PDIF header, and Figure 11, page 47
internal mono speaker header
The signal names of the front panel audio header Table 14 and Table 15, page 49
The signal names of the S/PDIF header Table 12, page 49
The signal names of the internal mono speaker header Table 13, page 49
The back panel audio connectors Section 2.2.1, page 46
1.11.2.1 Analog Audio Connectors

The available configurable back panel audio connectors are shown in Figure 4.
Item Description
A Audio line in
B Audio line out
C Mic in
Figure 4. Back Panel Audio Connector Options
The back panel audio connectors are configurable through the audio device drivers.

The back panel audio connectors Section 2.2.1, page 46
The front panel headphone output is supported using a separate audio channel pair
allowing multi-streaming audio configurations such as simultaneous 5.1 surround
playback and stereo audio conferencing (through back panel speakers and a front
panel headset, respectively).
22
Product Description
1.11.2.2 S/PDIF Header

The S/PDIF header allows connections to coaxial or optical dongles for digital audio
output.
1.11.2.3 Internal Mono Speaker Header

The internal mono speaker header allows connection to an internal, low-power speaker
for basic system sound capability. The subsystem is capable of driving a speaker load
of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
1.12 LAN Subsystem

The LAN subsystem consists of the following:
• Intel 82578DM Gigabit Ethernet Controller (10/100/1000 Mbits/s)
• RJ-45 LAN connector with integrated status LEDs

LAN software and drivers http://downloadcenter.intel.com
1.12.1 Intel® 82578DM Gigabit Ethernet Controller

The Intel 82578DM Gigabit Ethernet Controller supports the following features:
• 10/100/1000 BASE-T IEEE 802.3 compliant
• PCI Express link
• Compliant to IEEE 802.3x flow control support
• 802.1p and 802.1q
• TCP, IP, and UDP checksum offload (for IPv4 and IPv6)
• Transmit TCP segmentation
• Full device driver compatibility
• PCI Express power management support
• Intel AMT 6.0
1.12.2 LAN Subsystem Software

LAN software and drivers are available from Intel’s World Wide Web site.

Obtaining LAN software and drivers http://downloadcenter.intel.com
23
1.12.3 RJ-45 LAN Connector with Integrated LEDs

Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item Description
A Link/Activity LED (green)
B Link Speed LED (green/yellow)
Figure 5. LAN Connector LED Locations
Table 4 describes the LED states when the board is powered up and the LAN
subsystem is operating.
Table 4. LAN Connector LED States

LED LED Color LED State Condition
Off LAN link is not established.
Link/Activity Green On LAN link is established.
Blinking LAN activity is occurring.
Off 10 Mbits/s data rate is selected or negotiated.
Link Speed Green/Yellow Green 100 Mbits/s data rate is selected or negotiated.
Yellow 1000 Mbits/s data rate is selected or negotiated.
24
Product Description
1.13 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When
the computer is not plugged into a wall socket, the battery has an estimated life of
three years. When the computer is plugged in, the standby current from the power
supply extends the life of the battery.
The clock is accurate to ± 13 minutes/year at 25 ºC with power applied through the
power supply 5V STBY rail.
NOTE
If the battery and AC power fail date and time values will be reset and the user will be
notified during POST.
When the voltage drops below a certain level, the BIOS Setup program settings stored
in CMOS RAM (for example, the date and time) might not be accurate. Replace the
battery with an equivalent one. Figure 1 on page 11 shows the location of the battery.
25
1.14 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item Description
A Rear chassis fan header
B Thermal diode, located on processor die
C Processor fan header
D Front chassis fan header
Figure 6. Thermal Sensors and Fan Headers
26
Product Description
1.15 Platform Management and Security

In addition to Intel AMT the Intel DQ57TM Desktop Board integrates several functions
designed to manage the system and lower the total cost of ownership (TCO) of the
system. These system management functions are designed to report errors, diagnose
the system, and recover from system lockups without the aid of an external
microcontroller.
1.15.1 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired
for Management (WfM) specification. The board has several hardware management
features, including the following:
• Fan monitoring and control
• Thermal and voltage monitoring
• Chassis intrusion detection
1.15.1.1 Hardware Monitoring and Fan Control

The features of the hardware monitoring and fan control include:
• Intel Quiet System Technology, delivering acoustically-optimized thermal
management
• Thermal sensors in the processor and PCH, as well as near the CPU voltage
regulators and system memory
• Monitoring of five system voltages (+5 V, +12 V, +3.3 V, Memory V-SM and
+VCCP) to detect levels above or below acceptable values
• Thermally monitored closed-loop fan control for all three fans that can adjust fan
speed as needed
1.15.1.2 Fan Monitoring

Fan monitoring can be observed through the BIOS setup user interface, Intel® Desktop
Utilities or third-party software.

The functions of the fan headers Section 1.16.2.2, page 38
1.15.1.3 Chassis Intrusion and Detection

The board supports a chassis security feature that detects if the chassis cover is
removed. The security feature uses a mechanical switch on the chassis that attaches
to the chassis intrusion header. When the chassis cover is removed, the mechanical
switch is in the closed position.

The location of the chassis intrusion header Figure 11, page 47
27
1.15.2 Intel® vPro™ Technology

Intel® vPro™ Technology is a set of processor and platform capabilities designed to
enable greater proactive security, enhanced maintenance, and improved remote
management both inside and outside the corporate firewall. These include:
• Intel Active Management Technology (Intel AMT)
• Intel Virtualization Technology (Intel VT)
• Intel Trusted Execution Technology (Intel TXT)
• Intel Virtualization Technology for Directed I/O (Intel VT-d)
• Intel Remote PC Assist (Intel RPAT) / Intel Fast Call for Help
• Trusted Platform Module (TPM)
1.15.2.1 Intel® Active Management Technology

(Intel® AMT)
Intel Active Management Technology (Intel AMT) offers IT organizations tamper-
resistant and persistent management capabilities. Specifically, Intel AMT is a
hardware-based solution that uses out of band communication to manage access to
client systems in addition to offering encrypted and persistent asset management and
remote diagnostics and/or recovery capabilities for networked platforms. With Intel
AMT, IT organizations can easily get accurate platform information, and can perform
remote updating, diagnostics, debugging and repair of a system, regardless of the
state of the operating system or the power state of the system.
The Intel Active Management Technology subsystem consists of:

• Intel ME microcontroller embedded in the Intel Q57 PCH
• Intel 82578DM Gigabit (10/100/1000 Mbits/s) Ethernet LAN controller
• BIOS/SPI Flash (64 Mbits)
• On-board Intel ME “M” state status LED
NOTE
Software with AMT capability is required to take advantage of Intel AMT platform
management capabilities.
1.15.2.1.1 Intel AMT Features

The key features of Intel AMT include:
• Secure Out of Band (OOB) system management that allows remote management
of PCs regardless of system power or operating system state.
⎯ SSL 3.1/TLS encryption
⎯ HTTP authentication
⎯ TCP/IP
⎯ HTTP web GUI
⎯ XML/SOAP API
⎯ Web Services for Management (WS-MAN) protocol support
28
Product Description
• Remote troubleshooting and recovery that can significantly reduce desk-side visits
and potentially increasing efficiency of IT technical staff.
⎯ System event log
⎯ IDE Redirection (IDE-R) or PXE boot: remote CD or network drive boot
⎯ Serial over LAN
⎯ OOB diagnostics
⎯ Remote control
⎯ Operating system repair
• Proactive alerting that decreases downtime and minimizes time to repair.
⎯ Programmable policies
⎯ Operating system lock-up alert
⎯ Boot failure alert
⎯ Hardware failure alerts
• Third party non-volatile storage that prevents users from removing critical
inventory, remote control, or virus protection agents.
⎯ Nonvolatile storage for agents
⎯ Tamper-resistant
• Remote hardware and software asset tracking that eliminates time-consuming
manual inventory tracking, which also reduces asset accounting costs.
⎯ E-Asset Tag
⎯ HW/SW inventory
• System Defense 2. In addition to the in-bound and out-bound packet filtering of
the previous generation, System Defense 2 is an Intel AMT feature that uses
advanced heuristics to help protect against the propagation of worms through the
use of preset packet filters. The number of new connections made to a specific
port or IP address are counted over a specific time window. If a preset threshold is
exceeded, it will alert the Management Console and suspend the client’s network
activity until the system can be remediated.
• Remote Configuration (RCFG) minimizes the cost to deploy Intel AMT by
eliminating the need for IT personnel to touch each client system prior to
configuration. Remote Configuration consists of a single OEM BIOS/Firmware
image that provides the Intel AMT client with information to authenticate
connections and allows it to remotely perform a secure setup procedure. IT
departments must acquire an appropriate Intel AMT-trusted certificate as well as
use a remote management application that supports Remote Configuration.
Remote Configuration also requires the use of automatic IP addressing (DHCP).
29
• KVM (Keyboard-Video-Mouse) Redirection allows an IT administrator to remotely

control a user’s keyboard without having to rely on third-party software
applications. The user retains the ability to allow or discontinue the remote access
through on-screen pop-up windows.
NOTE
KVM Redirection requires the use of an Intel® processor with integrated graphics.
• PC Alarm Clock can wake the PC at scheduled times to run resource-intensive tasks
during off hours, improving security and performance of the platform.

Intel Active Management Technology (Intel AMT) http://www.intel.com/technology/platform-
technology/intel-amt/index.htm
1.15.2.1.2 Intel AMT Software and Drivers
Intel AMT software and drivers are available from Intel’s World Wide Web site. The
package usually consists of the following components:
• Intel® Management Engine Interface (Intel® ME Interface)
• Serial Over LAN (SOL) driver
• Local Manageability Service (LMS)
• User Notification Service (UNS)
• Intel® ME WMI provider
• Intel® Active Management Technology NAC Posture Plug-in
• Intel® Control Center
• Intel® Management and Security Status Application
• Intel® Remote PC Assist Technology Client Agent

Obtaining Intel AMT software and drivers Section 1.3, page 14
1.15.2.1.3 Intel ME “M” State LED
The board has a red-colored Intel ME “M” state LED (see Figure 7). The “M” state is
based on Intel ME status, as follows:
• M0 = Intel ME is in full control in S0
• M3 = Intel ME is in full control in S3-S5 for “out of bound” Intel manageability
• Moff = Intel ME is in sleep state after Intel ME timeout has occurred
Table 5 shows expected behavior of the “M” state LED.
Table 5. Intel ME “M” State LED Behavior
Sx/M3 Sx/Moff S0/M0
LED blinks Off On
30
Product Description
Figure 7. Location of the Intel ME “M” State LED
1.15.2.2 Intel® Virtualization Technology (Intel® VT)

Intel Virtualization Technology (Intel VT) is a processor technology that enables a
platform to run multiple operating systems and applications as independent machines,
allowing one computer system to function as multiple "virtual" systems. It also
provides the “assisted hardware virtualization” required by some operating systems for
backward compatibility, such as Windows XP Mode for Windows 7.
NOTE
Requires an Intel processor that supports Intel VT.
1.15.2.3 Intel® Trusted Execution Technology (Intel® TXT)

Intel Trusted Execution Technology (Intel TXT) helps protect the platform against
software-based attacks and preserves the confidentiality and integrity of the data
created and stored on the system. It accomplishes this by using a measured launch
and leveraging Intel VT to produce a protected environment for the execution of
sensitive applications.
NOTE
Requires an Intel processor that supports Intel TXT.
31
1.15.2.4 Intel® Virtualization Technology for Directed I/O

(Intel® VT-d)
Intel Virtualization Technology for Directed I/O (Intel VT-d) compliments Intel VT by
providing the ability to isolate and restrict device accesses to the resources owned by
the virtual partition managing the device.
NOTE
Requires an Intel processor that supports Intel VT.
1.15.2.5 Intel® Remote PC Assist (Intel® RPAT) and Intel® Fast Call
for Help
Intel Remote PC Assist (Intel RPAT) provides a means for on-demand, reactive
maintenance for small and medium businesses. Out of band, it is activated by
pressing function key <F9> during the system’s Power On Self Test (POST).
Optionally, an integrator may chose to supply an external button connected to the
RPAT header that will serve the same function. To utilize Intel RPAT technology from
the desktop requires the installation of the Intel RPAT Client Agent, available for
download from Intel’s World Wide Web site.
Intel Fast Call for Help supplies remote maintenance connectivity for the Enterprise
user inside or outside the corporate firewall. Coupled with your enterprise’s
Management Presence Server, it provides both reactive and proactive maintenance.
Inside the firewall, this feature adapts Client Initiated Local Access (CILA); outside the
firewall it uses Client Initiated Remote Access (CIRA). This service is triggered in the
same manner as Intel RPAT.
Many of the features of Intel AMT are available with Intel RPAT and Intel Fast Call for
Help. These include Serial-over-LAN, IDE Redirection, KVM Redirection and PC Alarm
Clock.
NOTE
Intel Remote PC Assist Technology requires a vPro technology-enabled computer that
has an Intel Remote PC Assist Technology-enabled BIOS, a connection with a power
source and the Internet. This service operates via a wired LAN connection only and
requires a direct Internet connection (no proxy server) with the ability to connect to
external Internet locations (locations outside the local network). A remote service
provider supporting the Intel Remote PC Assist Technology must be used to perform
remote management. The Intel® Remote PC Assist Wizard application and third party
remote management software tools supporting Intel Remote PC Assist Technology
must be deployed on the target computer running one of the supported operating
systems in order to perform remote management operations. Use of the technology
may require configuration by the purchaser. Intel Remote PC Assist Technology is not
available in all geographies or on all computer systems.

The location of the Intel RPAT header Figure 11, page 47
Intel Remote PC Assist Technology http://www.intel.com/technology/product/remotepcassist.htm
32
Product Description
1.15.2.6 Trusted Platform Module (TPM)

The Nuvoton WPCT210 TPM version 1.2 revision 103 component is specifically
designed to enhance platform security above-and-beyond the capabilities of today’s
software by providing a protected space for key operations and other security critical
tasks. Using both hardware and software, the TPM protects encryption and signature
keys at their most vulnerable stages—operations when the keys are being used
unencrypted in plain-text form. The TPM is specifically designed to shield unencrypted
keys and platform authentication information from software-based attacks.

Nuvoton TPM version 1.2 http://www.nuvoton-usa.com/
1.16 Power Management

Power management is implemented at several levels, including:
• Software support through Advanced Configuration and Power Interface (ACPI)
• Hardware support:
⎯ Power connector
⎯ Fan headers
⎯ LAN wake capabilities
⎯ Instantly Available PC technology
⎯ Wake from USB
⎯ Power Management Event signal (PME#) wake-up support
⎯ PCI Express WAKE# signal support
⎯ Wake from serial port
33
1.16.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with this board requires an
operating system that provides full ACPI support. ACPI features include:
• Plug and Play (including bus and device enumeration)
• Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
• Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
• A Soft-off feature that enables the operating system to power-off the computer
• Support for multiple wake-up events (see Table 8 on page 36)
• Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch

If the system is in this …and the power switch is
state… pressed for …the system enters this state
Off Less than four seconds Power-on
(ACPI G2/G5 – Soft off) (ACPI G0 – working state)
On Less than four seconds Soft-off/Standby (note)
(ACPI G0 – working state) (ACPI G1 – sleeping state)
On More than six seconds Fail safe power-off
(ACPI G0 – working state) (ACPI G2/G5 – Soft off)
Sleep Less than four seconds Wake-up
(ACPI G1 – sleeping state) (ACPI G0 – working state)
Sleep More than six seconds Power-off
(ACPI G1 – sleeping state) (ACPI G2/G5 – Soft off)
Note: System can only enter Standby state if power switch action is properly configured by the
operating system.
1.16.1.1 System States and Power States

Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
34
Product Description
Table 7. Power States and Targeted System Power

Processor Targeted System
Global States Sleeping States States Device States Power (Note 1)
G0 – working S0 – working C0 – working D0 – working Full power > 30 W
state state.
G1 – sleeping S1 – Processor C1 – stop D1, D2, D3 – 5 W < power < 52.5 W
state stopped grant device
specification
specific.
G1 – sleeping S3 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state RAM. Context except for
saved to RAM. wake-up logic.
G1 – sleeping S4 – Suspend to No power D3 – no power Power < 5 W (Note 2)
state disk. Context except for
saved to disk. wake-up logic.
G2/S5 S5 – Soft off. No power D3 – no power Power < 5 W (Note 2)
Context not saved. except for
Cold boot is wake-up logic.
required.
G3 – No power to the No power D3 – no power for No power to the system.
mechanical off system. wake-up logic, Service can be performed
AC power is except when safely.
disconnected provided by
from the battery or
computer. external source.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis’ power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
35
1.16.1.2 Wake-up Devices and Events

Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events

These devices/events can wake up the computer… …from this state
Power switch S1, S3, S4, S5
RTC alarm S1, S3, S4, S5
LAN S1, S3, S4, S5
USB S1, S3
PME# signal S1, S3, S4, S5
WAKE# signal S1, S3, S4, S5
Serial port S1, S3
Notes:
• S4 implies operating system support only.
• USB ports are turned off during S4/S5 states.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
36
Product Description
1.16.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
• Power connector
• Fan headers
• LAN wake capabilities
• Instantly Available PC technology
• Wake from USB
• PME# signal wake-up support
• WAKE# signal wake-up support
• Wake from serial port
• +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.16.2.1 Power Connector

ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computer’s response can be set
using the Last Power State feature in the BIOS Setup program’s Boot menu.

The location of the main power connector Figure 11, page 47
The signal names of the main power connector Table 23, page 52
37
1.16.2.2 Fan Headers

The function/operation of the fan headers is as follows:
• The fans are on when the board is in the S0 or S1 state
• The fans are off when the board is in the S3, S4, or S5 state
• Each fan header is wired to a fan tachometer input of the hardware monitoring and
fan control ASIC
• All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed
• All fan headers have a +12 V DC connection
• 4-pin fan headers are controlled by Pulse Width Modulation
• The front fan and rear fan headers also support linear fan control on 3-wire fans

The location of the fan headers Figure 11, page 47
The location of the fan headers and sensors for thermal monitoring Figure 6, page 26
1.16.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable
of providing adequate +5 V standby current. Failure to provide adequate standby
current when implementing LAN wake capabilities can damage the power supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem monitors network traffic at the Media Independent Interface.
Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal
that powers up the computer.
38
Product Description
1.16.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off and the front panel power LED will behave as configured by the
BIOS “S3 State Indicator” option). When signaled by a wake-up device or event, the
system quickly returns to its last known wake state. Table 8 on page 36 lists the
devices and events that can wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.2 compliant add-in cards, PCI Express add-in cards, and drivers.
1.16.2.5 Wake from USB

USB bus activity wakes the computer from ACPI S1 or S3 states.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and is supported by the operating system.
1.16.2.6 PME# Signal Wake-up Support

When the PME# signal on the Conventional PCI bus is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state.
1.16.2.7 WAKE# Signal Wake-up Support

When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes
from an ACPI S1, S3, S4, or S5 state.
1.16.2.8 Wake from Serial Port

Serial port activity wakes the computer from an ACPI S1 or S3 state.
1.16.2.9 +5 V Standby Power LED

The green +5 V standby power indicator LED shows that power is still present even
when the computer appears to be off. Figure 8 shows the location of the Standby
Power indicator LED on the board.
39
CAUTION
If AC power has been switched off and the standby power indicators are still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 8. Location of the Standby Power LED (Green)
40
Product Description
1.16.3 ENERGY STAR* 5.0, e-Standby, and ErP

Compliance
The US Department of Energy and the US Environmental Protection Agency have
continually revised the ENERGY STAR requirements. Intel has worked directly with
these two governmental agencies in the definition of new requirements.
Intel Desktop Board DQ57TM meets the following program requirements in an
adequate system configuration, including appropriate selection of an efficient power
supply:
• Energy Star v5.0, category A
• EPEAT*
• Korea e-Standby
• European Union Energy-related Products Directive 2009 (ErP)

ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
Electronic Product Environmental Assessment Tool (EPEAT) http://www.epeat.net/
Korea e-Standby Program http://www.kemco.or.kr/new_eng/pg02/
pg02100300.asp
European Union Energy-related Products Directive 2009 (ErP) http://ec.europa.eu/enterprise/policies/s
ustainable-business/sustainable-product-
policy/ecodesign/index_en.htm
41
42
2 Technical Reference
2.1 Memory Resources
2.1.1 Addressable Memory

The board utilizes 16 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM
(total system memory). On a system that has 16 GB of system memory installed, it is
not possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
• BIOS/SPI Flash device (64 Mbit)
• Local APIC (19 MB)
• Direct Media Interface (40 MB)
• Front side bus interrupts (17 MB)
• PCI Express configuration space (256 MB)
• PCH base address registers PCI Express ports (up to 256 MB)
• Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the
memory mapped I/O logical address space. The board remaps physical memory from
the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical
address range located just above the 4 GB boundary. Figure 9 shows a schematic of
the system memory map. All installed system memory can be used when there is no
overlap of system addresses.
43
Figure 9. Detailed System Memory Address Map
44
Technical Reference
2.1.2 Memory Map

Table 9 lists the system memory map.
Table 9. System Memory Map

Address Range (decimal) Address Range (hex) Size Description
1024 K - 16777216 K 100000 - 3FFFFFFFF 16382 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI
Conventional bus). Dependent on
video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel
and front panel USB.
The other internal connectors and headers are not overcurrent protected and should
connect only to devices inside the computer’s chassis, such as fans and internal
peripherals. Do not use these connectors or headers to power devices external to the
computer’s chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
Furthermore, improper connection of USB header single wire connectors may
eventually overload the overcurrent protection and cause damage to the board.
This section describes the board’s connectors. The connectors can be divided into
these groups:
• Back panel I/O connectors
• Component-side I/O connectors and headers (see page 47)
45
2.2.1 Back Panel Connectors

Figure 10 shows the location of the back panel connectors for the board.
Item Description
A LAN
B USB ports
C DVI-I connector
D DVI-D connector
E DisplayPort connector
F USB ports
G eSATA port
H USB ports
I Audio line in
J Audio line out
K Mic in
Figure 10. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
46
Technical Reference
2.2.2 Component-side Connectors and Headers

Figure 11 shows the locations of the component-side connectors and headers.
Figure 11. Component-side Connectors and Headers
Table 10 lists the component-side connectors and headers identified in Figure 11.
47
Table 10. Component-side Connectors and Headers Shown in Figure 11

Item/callout
from Figure 11 Description
A PCI Conventional bus add-in card connector
B PCI Express x1 bus add-in card connector
C PCI Express x1 bus add-in card connector
D PCI Express x16 bus add-in card connector
E 12 V internal power connector
F Rear chassis fan header
G Processor fan header
H Front chassis fan header
I Chassis intrusion header
J Main power connector (2 x 12)
K SATA connectors
L Alternate front panel LED header
M Front panel header
N Front panel USB headers (4)
O Intel Remote PC Assist header
P Serial port header
Q S/PDIF header
R Front panel audio header
S Internal mono speaker header
48
Technical Reference
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. Serial Port Header

Pin Signal Name Pin Signal Name
1 DCD (Data Carrier Detect) 2 RXD# (Receive Data)
3 TXD# (Transmit Data) 4 DTR (Data Terminal Ready)
5 Ground 6 DSR (Data Set Ready)
7 RTS (Request To Send) 8 CTS (Clear To Send)
9 RI (Ring Indicator) 10 Key (no pin)
Table 12. S/PDIF Header

Pin Signal Name
1 Ground
2 S/PDIF out
3 Key (no pin)
3 +5V_DC
Table 13. Internal Mono Speaker Header

Pin Signal Name
1 −
2 +
Table 14. Front Panel Audio Header for Intel HD Audio

1 [Port 1] Left channel 2 Ground
3 [Port 1] Right channel 4 PRESENCE# (Dongle present)
5 [Port 2] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
49
Table 15. Front Panel Audio Header for AC ’97 Audio

1 MIC 2 AUD_GND
3 MIC_BIAS 4 AUD_GND
5 FP_OUT_R 6 FP_RETURN_R
7 AUD_5V 8 KEY (no pin)
9 FP_OUT_L 10 FP_RETURN_L
NOTE
Not all AC ’97 signals are supported; specifically, pins 4, 6, 7, and 10 are not
supported.
Table 16. Front Panel USB Header

1 +5 VDC 2 +5 VDC
3 D- 4 D-
5 D+ 6 D+
7 Ground 8 Ground
9 KEY (no pin) 10 No Connect
Table 17. SATA Connectors

Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 18. Chassis Intrusion Header

Pin Signal Name
1 Intruder#
2 Ground
50
Technical Reference
Table 19. Processor (4-Pin) Fan Header

Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Table 20. Front and Rear Chassis Fan Headers

Pin 4-Wire Support Pin 3-Wire Support
1 Ground 3 Ground
2 +12 V 2 FAN_POWER
3 FAN_TACH 1 FAN_TACH
4 FAN_CONTROL N/A N/A
Table 21. Intel Remote PC Assist Technology Header

Pin Signal Name
1 RPAT#
2 Ground
2.2.2.2 Add-in Card Connectors

The board has the following add-in card connectors:
• One PCI Express 2.0 x16: this connector supports simultaneous transfer speeds of
up to 8 GB/s of peak bandwidth per direction.
• Two PCI Express 2.0 x1: each of these connectors support simultaneous transfer
speeds of up to 500 MB/s of peak bandwidth per direction.
• One Conventional PCI (rev 2.3 compliant) connector.
Note the following considerations for the Conventional PCI bus connector:
• The Conventional PCI bus connector is bus master capable.
• SMBus signals are routed to the Conventional PCI bus connector. This enables
Conventional PCI bus add-in boards with SMBus support to access sensor data on
the desktop board. The specific SMBus signals are as follows:
⎯ The SMBus clock line is connected to pin A40.
⎯ The SMBus data line is connected to pin A41.
51
2.2.2.3 Power Supply Connectors

The board has the following power supply connectors:
• Main power – a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and
24 must remain unconnected.
• Processor core power – a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
CAUTION
If a high power (75 W or greater) add-in card is installed in the PCI Express x16
connector, that card must also be connected directly to the power supply. Failure to
do so may cause damage to the board and the add-in card.
Table 22. Processor Core Power Connector

1 Ground 2 Ground
3 +12 V 4 +12 V
Table 23. Main Power Connector

1 +3.3 V 13 +3.3 V
2 +3.3 V 14 −12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 −5 V (obsolete)
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V (Note) 23 +5 V (Note)
12 +3.3 V 2 x 12 connector detect 24 Ground (Note)
(Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations Section 2.6.1 on page 60
52
Technical Reference
2.2.2.4 Front Panel Header

This section describes the functions of the front panel header. Table 24 lists the signal
names of the front panel header. Figure 12 is a connection diagram for the front panel
header.
Table 24. Front Panel Header

In/ In/
Pin Signal Out Description Pin Signal Out Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED 2 FP_LED+ Out Front panel green
pull-up to +5 V LED
3 HDA# Out Hard disk active 4 FP_LED− Out Front panel yellow
LED LED
Reset Switch On/Off Switch
5 Ground Ground 6 PWR# In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 12. Connection Diagram for Front Panel Header
2.2.2.4.1 Hard Drive Activity LED Header

Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to an internal storage device. Proper LED function requires
a SATA hard drive or optical drive connected to an onboard SATA connector.
53
2.2.2.4.2 Reset Switch Header

Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.4.3 Power LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 25 shows the default
states for this LED. More options are available through BIOS setup.
Table 25. States for a One-Color Power LED

LED State Description
Off Power off/sleeping
Steady Lit Running
Blink Standby
2.2.2.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
2.2.2.5 Alternate Front Panel Power LED Header

Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 26. Alternate Front Panel Power LED Header

Pin Signal Name In/Out Description
1 FP_LED+ Out FP_LED+
2 Not connected
3 FP_LED− Out FP_LED−
54
Technical Reference
2.2.2.6 Front Panel USB Headers

Figure 13 is a connection diagram for the front panel USB headers.
NOTE
• The +5 V DC power on the USB headers is fused.
• Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 13. Connection Diagram for Front Panel USB Headers
55
2.3 BIOS Configuration Jumper Block

CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the jumper block. The 3-pin jumper block determines
the BIOS Setup program’s mode. Table 27 describes the jumper settings for the three
modes: normal, configure, and recovery.
Figure 14. Location of the Jumper Block
56
Technical Reference
Table 27. BIOS Setup Configuration Jumper Settings

Function/Mode Jumper Setting Configuration
Normal 1-2 The BIOS uses current configuration information and
passwords for booting.
Configure 2-3 After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Note that this Configure mode is the only way to clear the
BIOS/CMOS settings. Press F9 (restore defaults) while in
Configure mode to restore the BIOS/CMOS settings to their
default values.
Recovery None The BIOS attempts to recover the BIOS configuration. A

recovery CD or USB flash drive is required.
57
2.4 Clear CMOS Header

Figure 15 shows the location of the Clear CMOS header. In order to initiate a CMOS
clear, a jumper (not included) must be connected to the jumper block pins for at least
two seconds (see Table 28).
CAUTION
Initiating a CMOS clear when the board is powered on (S0 mode) or in standby (S1 or
S3 mode) may damage the board.
Figure 15. CMOS Clear Header
Table 28. Clear CMOS

Pin Function
1-2 Clear CMOS
2-3 N/A
No Jumper Normal
58
Technical Reference
2.5 Mechanical Considerations
2.5.1 Form Factor

The board is designed to fit into a microATX form-factor chassis. Figure 16 illustrates
the mechanical form factor for the board. Dimensions are given in inches
[millimeters]. The outer dimensions are 9.60 inches by 9.60 inches
[243.84 millimeters by 243.84 millimeters]. Location of the I/O connectors and
mounting holes are in compliance with the ATX specification.
Figure 16. Board Dimensions
59
2.6 Electrical Considerations

2.6.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
• The potential relation between 3.3 VDC and +5 VDC power rails
• The current capability of the +5 VSB line
• All timing parameters
• All voltage tolerances
For example, for a system consisting of a supported 95 W processor (see Section 1.4
on page 14 for information on supported processors), 2 GB DDR3 RAM, one high end
video card, one hard disk drive, one optical drive, and all board peripherals enabled,
the minimum recommended power supply is 460 W. Table 29 lists the recommended
power supply current values.
Table 29. Recommended Power Supply Current Values

Output Voltage 3.3 V 5V 12 V1 12 V2 -12 V 5 VSB
Current 22 A 20 A 16 A 16 A 0.3 A 1.5 A

Selecting an appropriate power supply http://www.intel.com/support/motherboards/desktop/sb/C
S-026472.htm
60
Technical Reference
2.6.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 30 lists the current capability of the fan headers.
Table 30. Fan Header Current Capability

Fan Header Maximum Available Current
Processor fan 2.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
2.6.3 Add-in Board Considerations

The board is designed to provide 2 A (average) of current for each add-in board from
the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board
(all expansion slots filled) must not exceed the system’s power supply +5 V maximum
current.
61
2.7 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan
inlet is required. Use of a processor heat sink that provides omni-directional airflow to
maintain required airflow across the processor voltage regulator area is highly
recommended. For a list of chassis that have been tested with Intel desktop boards
please refer to the following website:
http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
The ambient temperature must not exceed the board’s maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.9.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit.
62
Technical Reference
Figure 17 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel Q57 Express Chipset
Figure 17. Localized High Temperature Zones
Table 31 provides maximum case temperatures for the components that are sensitive
to thermal changes. The operating temperature, current load, or operating frequency
could affect case temperatures. Maximum case temperatures are important when
considering proper airflow to cool the board.
Table 31. Thermal Considerations for Components

Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel Q57 Express Chipset 111 oC (under bias)

Processor datasheets and specification updates Section 1.3, page 14
63
2.8 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Telcordia
"Reliability Prediction Procedure for Electronic Equipment" SR-332 Issue 1, an update
of Bellcore TR-332, Issue 6. The MTBF prediction is used to estimate repair rates and
spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is
107,515 hours.
2.9 Environmental
Table 32 lists the environmental specifications for the board.
Table 32. Environmental Specifications

Parameter Specification
Temperature
Non-Operating -40 °C to +60 °C
Operating 0 °C to +40 °C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second²
Packaged Half sine 2 millisecond
Product Weight (pounds) Free Fall (inches) Velocity Change (inches/sec²)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g² Hz sloping up to 0.02 g² Hz
20 Hz to 500 Hz: 0.02 g² Hz (flat)
Packaged 5 Hz to 40 Hz: 0.015 g² Hz (flat)
40 Hz to 500 Hz: 0.015 g² Hz sloping down to 0.00015 g² Hz
64
3 Overview of BIOS Features
3.1 Introduction
The board uses an Intel BIOS that is stored in a 64 Mbit (8,192 KB) Serial Peripheral
Interface Flash Memory (SPI Flash) device which can be updated using a set of
utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM
information, Plug and Play support, and other firmware.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as TMIBX10H.86A.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Intel ME Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 56 shows how to put the board in configure mode.
65
Table 33 lists the BIOS Setup program menu features.
Table 33. BIOS Setup Program Menu Bar

Configura-
Maintenance Main tion Performance Security Power Boot Intel ME Exit
Clears Displays Configures Configures Sets Configures Selects Configure Saves or
passwords processor and advanced Memory and passwords power boot Intel ME discards
and displays memory features Processor and manage- options and Intel changes to
processor configuration available overrides security ment AMT Setup
information through the features features settings program
chipset options
Table 34 lists the function keys available for menu screens.
Table 34. BIOS Setup Program Function Keys

BIOS Setup Program
Function Key Description
<←> or <→> Selects a different menu screen (Moves the cursor left or right)
<↑> or <↓> Selects an item (Moves the cursor up or down)
<Tab> Selects sub-items within a field (i.e., date/time)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
66
Overview of BIOS Features
3.2 System Management BIOS (SMBIOS)

SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
• BIOS data, such as the BIOS revision level
• Fixed-system data, such as peripherals, serial numbers, and asset tags
• Resource data, such as memory size, cache size, and processor speed
• Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
3.3 Legacy USB Support

Legacy USB support enables USB devices to be used even when the operating
system’s USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:

1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
67
3.4 BIOS Updates

The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
• Intel® Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB drive), or an optical drive.
• Intel® Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB drive), or an optical drive.
• Intel® F7 switch allows a user to select where the BIOS .bio file is located and
perform the update from that location/device. Similar to performing a BIOS
Recovery without removing the BIOS configuration jumper.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.

BIOS update utilities http://www.intel.com/support/motherboards/desktop/sb/CS-
022312.htm.
3.4.1 Language Support

The BIOS Setup program and help messages are supported in US English.
68
3.4.2 Custom Splash Screen

During POST, an Intel® splash screen is displayed by default. This splash screen can
be augmented with a custom splash screen. The Intel Integrator’s Toolkit that is
available from Intel can be used to create a custom splash screen.

®
Intel Integrator Toolkit http://developer.intel.com/design/motherbd/software/itk/
®
Additional Intel software tools http://developer.intel.com/products/motherboard/DQ57TM/
tools.htm
and
http://developer.intel.com/design/motherbd/software.htm
3.5 BIOS Recovery

It is unlikely that anything will interrupt a BIOS update; however, if an interruption
occurs, the BIOS could be damaged. Table 35 lists the drives and media types that
can and cannot be used for BIOS recovery. The BIOS recovery media does not need
to be made bootable however, it must contain the motherboard .bio file at the root
level.
Table 35. Acceptable Drives/Media Types for BIOS Recovery

Media Type Can be used for BIOS recovery?
Optical drive connected to the SATA interface Yes
USB removable drive (a USB Flash Drive, for example) Yes
USB diskette drive (with a 1.44 MB diskette) No
USB hard disk drive No
Legacy diskette drive (with a 1.44 MB diskette) connected to the No
legacy diskette drive interface

BIOS recovery http://www.intel.com/support/motherboards/desktop/sb/
cs-023360.htm
69
3.6 Boot Options

In the BIOS Setup program, the user can choose to boot from a hard drive, optical
drive, removable drive, or the network. The default setting is for the optical drive to
be the first boot device, the hard drive second, removable drive third, and the network
fourth.
3.6.1 Optical Drive Boot

Booting from the optical drive is supported in compliance to the El Torito bootable
CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the
optical drive is listed as a boot device. Boot devices are defined in priority order.
Accordingly, if there is not a bootable CD in the optical drive, the system will attempt
to boot from the next defined drive.
3.6.2 Network Boot

The network can be selected as a boot device. This selection allows booting from the
onboard LAN or a network add-in card with a remote boot ROM installed.
Pressing the <F12> key during POST automatically forces booting from the LAN. To
use this key during POST, the User Access Level in the BIOS Setup program's Security
menu must be set to Full.
3.6.3 Booting Without Attached Devices

For use in embedded applications, the BIOS has been designed so that after passing
the POST, the operating system loader is invoked even if the following devices are not
present:
• Video adapter
• Keyboard
• Mouse
3.6.4 Changing the Default Boot Device During POST

Pressing the <F10> key during POST causes a boot device menu to be displayed. This
menu displays the list of available boot devices. Table 36 lists the boot device menu
options.
Table 36. Boot Device Menu Options

Boot Device Menu Function Keys Description
<↑> or <↓> Selects a default boot device
<Enter> Exits the menu, and boots from the selected device
<Esc> Exits the menu and boots according to the boot priority
defined through BIOS setup
70
3.7 Hard Disk Drive Password Security Feature

The Hard Disk Drive Password Security feature blocks read and write accesses to the
hard disk drive until the correct password is given. Hard Disk Drive Passwords are set
in BIOS SETUP and are prompted for during BIOS POST. For convenient support of S3
resume, the system BIOS will automatically unlock drives on resume from S3.
The User hard disk drive password, when installed, will be required upon each power-
cycle until the Master Key or User hard disk drive password is submitted.
The Master Key hard disk drive password, when installed, will not lock the drive. The
Master Key hard disk drive password exists as an unlock override in the event that the
User hard disk drive password is forgotten. Only the installation of the User hard disk
drive password will cause a hard disk to be locked upon a system power-cycle.
Table 37 shows the effects of setting the Hard Disk Drive Passwords.
Table 37. Master Key and User Hard Drive Password Functions
Password Set Password During Boot
Neither None
Master only None
User only User only
Master and User Set Master or User
During every POST, if a User hard disk drive password is set, POST execution will
pause with the following prompt to force the user to enter the Master Key or User hard
disk drive password:
Enter Hard Disk Drive Password:
Upon successful entry of the Master Key or User hard disk drive password, the system
will continue with normal POST.
If the hard disk drive password is not correctly entered, the system will go back to the
above prompt. The user will have three attempts to correctly enter the hard disk drive
password. After the third unsuccessful hard disk drive password attempt, the system
will halt with the message:
Hard Disk Drive Password Entry Error
A manual power cycle will be required to resume system operation.
NOTE
As implemented on DQ57TM, Hard Disk Drive Password Security is only supported on
SATA port 0. The passwords are stored on the hard disk drive so if the drive is
relocated to another SATA port or computer that does not support Hard Disk Drive
Password Security feature, the drive will not be accessible.
71
NOTE
Hard Disk Drive Password Security is not supported in PCH RAID mode. Secured hard
disk drives attached to the system when the system is in PCH RAID mode will not be
accessible due to the disabling of BIOS Hard Disk Drive Password support.
3.8 BIOS Security Features

The BIOS includes security features that restrict access to the BIOS Setup program
and who can boot the computer. A supervisor password and a user password can be
set for the BIOS Setup program and for booting the computer, with the following
restrictions:
• The supervisor password gives unrestricted access to view and change all the
Setup options in the BIOS Setup program. This is the supervisor mode.
• The user password gives restricted access to view and change Setup options in the
BIOS Setup program. This is the user mode.
• If only the supervisor password is set, pressing the <Enter> key at the password
prompt of the BIOS Setup program allows the user restricted access to Setup.
• If both the supervisor and user passwords are set, users can enter either the
supervisor password or the user password to access Setup. Users have access to
Setup respective to which password is entered.
• Setting the user password restricts who can boot the computer. The password
prompt will be displayed before the computer is booted. If only the supervisor
password is set, the computer boots without asking for a password. If both
passwords are set, the user can enter either password to boot the computer.
• For enhanced security, use different passwords for the supervisor and user
passwords.
• Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to
16 characters in length.
72
Table 38 shows the effects of setting the supervisor password and user password.
This table is for reference only and is not displayed on the screen.
Table 38. Supervisor and User Password Functions

Password Password
Password Supervisor to Enter During
Set Mode User Mode Setup Options Setup Boot
Neither Can change all Can change all None None None
options (Note) options (Note)
Supervisor Can change all Can change a Supervisor Password Supervisor None
only options limited number
of options
User only N/A Can change all Enter Password User User
options Clear User Password
Supervisor Can change all Can change a Supervisor Password Supervisor or Supervisor or
and user set options limited number Enter Password user user
of options
Note: If no password is set, any user can change all Setup options.
73
74
4 Error Messages and Beep Codes
4.1 Speaker
The board-mounted piezoelectric speaker provides audible error code (beep code)
information during POST.

The location of the onboard speaker Figure 1, page 11
4.2 BIOS Beep Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s
piezoelectric speaker to beep an error message describing the problem (see Table 39).
Table 39. BIOS Beep Codes

Type Pattern Frequency/Comments
F2 Setup/F10 Boot Menu One 0.5 second beep when BIOS is ready to 932 Hz
Prompt accept keyboard input
BIOS update in progress None
Video error (no add-in On-off (1.0 second each) two times, then 932 Hz
graphics card installed) 2.5-second pause (off), entire pattern repeats For processors requiring an
(beeps and pause) once and the BIOS will add-in graphics card
continue to boot.
Memory error On-off (1.0 second each) three times, then 932 Hz
2.5-second pause (off), entire pattern repeats
(beeps and pause) until the system is powered
off.
Thermal trip warning Alternate high and low beeps (1.0 second each) High beep 2000 Hz
for eight beeps, followed by system shut down. Low beep 1500 Hz
75
4.3 Front-panel Power LED Blink Codes

Whenever a recoverable error occurs during POST, the BIOS causes the board’s front
panel power LED to blink an error message describing the problem (see Table 40).
Table 40. Front-panel Power LED Blink Codes

Type Pattern Note
F2 Setup/F10 Boot Menu None
Prompt
BIOS update in progress Off when the update begins, then on for
0.5 seconds, then off for 0.5 seconds. The
pattern repeats until the BIOS update is
complete.
Video error (no add-in On-off (1.0 second each) two times, then For processors requiring an
graphics card installed) 2.5-second pause (off), entire pattern repeats add-in graphics card
(blink and pause) until the system is powered
off.
Memory error On-off (1.0 second each) three times, then
2.5-second pause (off), entire pattern repeats
(blinks and pause) until the system is powered
off.
Thermal trip warning Each beep will be accompanied by the following
blink pattern: .25 seconds On, .25 seconds Off,
.25 seconds On, .25 seconds Off. This will result
in a total of 16 blinks.
4.4 BIOS Error Messages

Table 41 lists the error messages and provides a brief description of each.
Table 41. BIOS Error Messages

Error Message Explanation
CMOS Battery Low The battery may be losing power. Replace the battery soon.
CMOS Checksum Bad The CMOS checksum is incorrect. CMOS memory may have been
corrupted. Run Setup to reset values.
Memory Size Decreased Memory size has decreased since the last boot. If no memory
was removed, then memory may be bad.
No Boot Device Available System did not find a device to boot.
76
Error Messages and Beep Codes
4.5 Port 80h POST Codes

During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O
port 80h. If the POST fails, execution stops and the last POST code generated is left
at port 80h. This code is useful for determining the point where an error occurred.
Displaying the POST codes requires a PCI bus add-in card, often called a POST card.
The POST card can decode the port and display the contents on a medium such as a
seven-segment display.
NOTE
The POST card must be installed in the PCI bus connector.
The following tables provide information about the POST codes generated by the
BIOS:
• Table 42 lists the Port 80h POST code ranges
• Table 43 lists the Port 80h POST codes themselves
• Table 44 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal.
Table 42. Port 80h POST Code Ranges

Range Category/Subsystem
00 – 0F Debug codes: Can be used by any PEIM/driver for debug.
10 – 1F Host Processors: 1F is an unrecoverable CPU error.
20 – 2F Memory/Chipset: 2F is no memory detected or no useful memory detected.
30 – 3F Recovery: 3F indicated recovery failure.
40 – 4F Reserved for future use.
50 – 5F I/O Busses: PCI, USB, ATA, etc. 5F is an unrecoverable error. Start with PCI.
60 – 6F Reserved for future use (for new busses).
70 – 7F Output Devices: All output consoles. 7F is an unrecoverable error.
80 – 8F Reserved for future use (new output console codes).
90 – 9F Input devices: Keyboard/Mouse. 9F is an unrecoverable error.
A0 – AF Reserved for future use (new input console codes).
B0 – BF Boot Devices: Includes fixed media and removable media. BF is an unrecoverable error.
C0 – CF Reserved for future use.
D0 – DF Boot device selection.
E0 – FF E0 – EE: Miscellaneous codes. See Table 43.
EF: boot/S3 resume failure.
F0 – FF: FF processor exception.
77
Table 43. Port 80h POST Codes

POST Code Description of POST Operation
Host Processor
10 Power-on initialization of the host processor (Boot Strap Processor)
11 Host processor cache initialization (including APs)
12 Starting Application processor initialization
13 SMM initialization
Chipset
21 Initializing a chipset component
Memory
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
24 Programming timing parameters in the memory controller and the DIMMs
25 Configuring memory
26 Optimizing memory settings
27 Initializing memory, such as ECC init
29 Memory testing completed
PCI Bus
50 Enumerating PCI busses
51 Allocating resources to PCI bus
52 Hot Plug PCI controller initialization
53 – 57 Reserved for PCI Bus
USB
58 Resetting USB bus
59 Reserved for USB
ATA/ATAPI/SATA
5A Resetting PATA/SATA bus and all devices
5B Reserved for ATA
SMBus
5C Resetting SMBus
5D Reserved for SMBus
Local Console
70 Resetting the VGA controller
71 Disabling the VGA controller
72 Enabling the VGA controller
Remote Console
78 Resetting the console controller
79 Disabling the console controller
7A Enabling the console controller
continued
78
Table 43. Port 80h POST Codes (continued)

Keyboard (USB)
90 Resetting keyboard
91 Disabling keyboard
92 Detecting presence of keyboard
93 Enabling the keyboard
94 Clearing keyboard input buffer
95 Instructing keyboard controller to run Self Test (PS/2 only)
Mouse (USB)
98 Resetting mouse
99 Disabling mouse
9A Detecting presence of mouse
9B Enabling mouse
Fixed Media
B0 Resetting fixed media
B1 Disabling fixed media
B2 Detecting presence of a fixed media (hard drive detection etc.)
B3 Enabling/configuring a fixed media
Removable Media
B8 Resetting removable media
B9 Disabling removable media
BA Detecting presence of a removable media (CD-ROM detection, etc.)
BC Enabling/configuring a removable media
BDS
Dy Trying boot selection y (y=0 to 15)
PEI Core
E0 Started dispatching PEIMs (emitted on first report of EFI_SW_PC_INIT_BEGIN
EFI_SW_PEI_PC_HANDOFF_TO_NEXT)
E2 Permanent memory found
E1, E3 Reserved for PEI/PEIMs
DXE Core
E4 Entered DXE phase
E5 Started dispatching drivers
E6 Started connecting drivers
continued
79
Table 43. Port 80h POST Codes (continued)

DXE Drivers
E7 Waiting for user input
E8 Checking password
E9 Entering BIOS setup
EB Calling Legacy Option ROMs
Runtime Phase/EFI OS Boot
F4 Entering Sleep state
F5 Exiting Sleep state
F8 EFI boot service ExitBootServices ( ) has been called
F9 EFI runtime service SetVirtualAddressMap ( ) has been called
FA EFI runtime service ResetSystem ( ) has been called
PEIMs/Recovery
30 Crisis Recovery has initiated per user request
31 Crisis Recovery has initiated by software (corrupt flash)
34 Loading recovery capsule
35 Handing off control to the recovery capsule
3F Unable to recover
80
Table 44. Typical Port 80h POST Sequence

POST Code Description
21 Initializing a chipset component
22 Reading SPD from memory DIMMs
23 Detecting presence of memory DIMMs
25 Configuring memory
28 Testing memory
34 Loading recovery capsule
E4 Entered DXE phase
12 Starting application processor initialization
13 SMM initialization
50 Enumerating PCI busses
51 Allocating resourced to PCI bus
92 Detecting the presence of the keyboard
95 Keyboard Self Test
EB Calling Video BIOS
58 Resetting USB bus
92 Detecting the presence of the keyboard
28 Testing memory
E7 Waiting for user input
01 INT 19
00 Ready to boot
81
82
5 Regulatory Compliance and Battery
Disposal Information
5.1 Regulatory Compliance

This section contains the following regulatory compliance information for Intel Desktop
Board DQ57TM:
• Safety standards
• European Union Declaration of Conformity statement
• Product Ecology statements
• Electromagnetic Compatibility (EMC) standards
• Product certification markings
5.1.1 Safety Standards

Intel Desktop Board DQ57TM complies with the safety standards stated in Table 45
when correctly installed in a compatible host system.
Table 45. Safety Standards

Standard Title
CSA/UL 60950-1, First Edition Information Technology Equipment – Safety - Part 1: General
Requirements (USA and Canada)
EN 60950-1:2006, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (European Union)
IEC 60950-1:2005, Second Information Technology Equipment – Safety - Part 1: General
Edition Requirements (International)
83
5.1.2 European Union Declaration of Conformity

Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel®
Desktop Board DQ57TM is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nõuetele.
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.
Français Ce produit est conforme aux exigences de la Directive Européenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie
2004/108/EC & 2006/95/EC.
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών
2004/108/EC και 2006/95/EC.
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv
előírásainak.
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC
& 2006/95/EC.
84
Regulatory Compliance and Battery Disposal Information
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív
2004/108/EC a 2006/95/EC.
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.
5.1.3 Product Ecology Statements

The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations

This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations

As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intel’s branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
中文
作为其对环境责任之承诺的部分，英特尔已实施 Intel Product Recycling Program
（英特尔产品回收计划），以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作
恰当的重复使用处理。
请参考http://www.intel.com/intel/other/ehs/product_ecology
了解此计划的详情，包括涉及产品之范围、回收地点、运送指导、条款和条件等。
Deutsch
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für
ordnungsgemäßes Recycling zurückzugeben.
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
85
Español
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envío, términos y condiciones, etc.
Français
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en œuvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits usés en les retournant à des adresses spécifiées.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, à savoir les produits concernés, les adresses
disponibles, les instructions d'expédition, les conditions générales, etc.
日本語
インテルでは、環境保護活動の一環として、使い終えたインテル
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル
プログラムを発足させました。
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in
tel/other/ehs/product_ecology （英語）をご覧ください。
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponíveis, as instruções de envio, os termos e condições, etc.
86
Russian
В качестве части своих обязательств к окружающей среде, в Intel создана
программа утилизации продукции Intel (Product Recycling Program) для
предоставления конечным пользователям марок продукции Intel возможности
возврата используемой продукции в специализированные пункты для должной
утилизации.
Пожалуйста, обратитесь на веб-сайт
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой
программе, принимаемых продуктах, местах приема, инструкциях об отправке,
положениях и условиях и т.д.
Türkçe
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya
koymuştur.
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen
http://www.intel.com/intel/other/ehs/product_ecology
Web sayfasına gidin.
5.1.3.3 Lead Free Desktop Board

This Intel Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Intel Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Intel Desktop Board is referred to as “Lead-free second level
interconnect.” The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Table 46 shows the various forms of the “Lead-Free 2nd Level Interconnect” mark as it
appears on the board and accompanying collateral.
87
Table 46. Lead-Free Board Markings

Description Mark
nd
Lead-Free 2 Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the or
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
88
5.1.4 EMC Regulations

Intel Desktop Board DQ57TM complies with the EMC regulations stated in Table 47
when correctly installed in a compatible host system.
Table 47. EMC Regulations

Regulation Title
FCC 47 CFR Part 15, Title 47 of the Code of Federal Regulations, Part15, Subpart B, Radio
Subpart B Frequency Devices. (USA)
ICES-003 Issue 4 Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022:2006 Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment – Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006 Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 22:2005 Limits and methods of measurement of Radio Disturbance Characteristics of
+A1:2005 +A2:2006 Information Technology Equipment. (International)
CISPR 24:1997 Information Technology Equipment – Immunity Characteristics – Limits and
+A1:2001 +A2:2002 Methods of Measurement. (International)
VCCI V-3/2007.04, Voluntary Control for Interference by Information Technology Equipment.
V-4/2007.04 (Japan)
KN-22, KN-24 Korean Communications Commission – Framework Act on
Telecommunications and Radio Waves Act (South Korea)
CNS 13438:2006 Bureau of Standards, Metrology and Inspection (Taiwan)
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
89
Korean Class B statement translation: this is household equipment that is certified to

comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
5.1.5 Product Certification Markings (Board Level)

Intel Desktop Board DQ57TM has the product certification markings shown in
Table 48:
Table 48. Product Certification Markings

Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes

Intel name and DQ57TM model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and

Low Voltage directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum

Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code
number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea KCC (Korean Communications Commission) mark. Includes

adjacent KCC certification number: CPU-DQ57TM (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.

Includes adjacent Intel company number, D33025.
Printed wiring board manufacturer’s recognition mark. Consists of a unique V-0

UL recognized manufacturer’s logo, along with a flammability rating (solder
side).
China RoHS/Environmentally Friendly Use Period Logo: This is an example of
the symbol used on Intel Desktop Boards and associated collateral. The color
of the mark may vary depending upon the application. The Environmental
Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined
to be 10 years.
90
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des
piles usagées doit respecter les réglementations locales en vigueur en matière de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i
overensstemmelse med gældende miljølovgivning.
OBS!
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
bør kastes i henhold til gjeldende miljølovgivning.
VIKTIGT!
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljövårdsbestämmelserna.
VARO
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
91
PRECAUCIÓN
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENÇÃO
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias
usadas deve ser feita de acordo com as regulamentações ambientais da região.
AŚCIAROŽZNAŚĆ
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.
UPOZORNÌNÍ
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními
předpisy o životním prostředí.
Προσοχή
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με
τους κατά τόπο περιβαλλοντικούς κανονισμούς.
VIGYAZAT
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi
előírásoknak megfelelően kell kiselejtezni.
92
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEŻENIE
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi
przepisami ochrony środowiska.
PRECAUŢIE
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să
respecte reglementările locale privind protecţia mediului.
ВНИМАНИЕ
При использовании батареи несоответствующего типа существует риск ее взрыва.
Батареи должны быть утилизированы по возможности. Утилизация батарей
должна проводится по правилам, соответствующим местным требованиям.
UPOZORNENIE
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu.
Batérie by sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí
vykonávať v súlade s miestnymi predpismi na ochranu životného prostredia.
POZOR
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
UYARI
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.
OСТОРОГА
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.
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Intel® Desktop Board

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

* Other names and brands may be claimed as the property of others.

Copyright © 2010, Intel Corporation. All rights reserved.

What This Document Contains

Notes, Cautions, and Warnings

Other Common Notation

2.4 Clear CMOS Header ......................................................................... 58

27. BIOS Setup Configuration Jumper Settings.......................................... 57

Table 1. Feature Summary

Table 1. Feature Summary (continued)

1.1.2 Board Layout

Figure 1. Major Board Components

Table 2 lists the components identified in Figure 1.

Table 2. Components Shown in Figure 1

1.1.3 Block Diagram

Figure 2. Block Diagram

1.2 Legacy Considerations

1.3 Online Support

For information about… Refer to:

1.5 Intel® Q57 Express Chipset

For information about Refer to

1.6 System Memory

Table 3. Supported Memory Configurations

For information about… Refer to:

1.6.1 Memory Configurations

For information about… Refer to:

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

1.7 Graphics Subsystem

1.7.1 Integrated Graphics

For information about Refer to

1.7.1.2 Digital Visual Interface (DVI)

1.7.2 PCI Express x16 Graphics

For information about Refer to

For information about Refer to

1.9 SATA Interfaces

For more information, see: http://www.serialata.org/.

For information about Refer to

1.9.1.1 Serial ATA RAID

1.9.1.2 Intel® Rapid Recover Technology

For information about Refer to

1.10 Legacy I/O Controller

1.10.1 Serial Port

For information about Refer to

1.11 Audio Subsystem

1.11.1 Audio Subsystem Software

For information about Refer to

1.11.2 Audio Headers and Connectors

For information about Refer to

1.11.2.1 Analog Audio Connectors

Figure 4. Back Panel Audio Connector Options

For information about Refer to

1.11.2.2 S/PDIF Header

1.11.2.3 Internal Mono Speaker Header

1.12 LAN Subsystem

For information about Refer to

1.12.1 Intel® 82578DM Gigabit Ethernet Controller

1.12.2 LAN Subsystem Software