ST72321

8-BIT MCU WITH NESTED INTERRUPTS, FLASH, 10-BIT ADC, FIVE TIMERS, SPI, SCI, I2C INTERFACE
I

Memories 32K to 60K dual voltage High Density Flash (HDFlash) or ROM with read-out protection capability. In-Application Programming and In-Circuit Programming for HDFlash devices 1K to 2K RAM HDFlash endurance: 100 cycles, data retention: 20 years at 55C Clock, Reset And Supply Management Enhanced low voltage supervisor (LVD) for main supply and auxiliary voltage detector (AVD) with interrupt capability Clock sources: crystal/ceramic resonator oscillators, internal RC oscillator, clock security system and bypass for external clock PLL for 2x frequency multiplication Four Power Saving Modes: Halt, Active-Halt, Wait and Slow Interrupt Management Nested interrupt controller 14 interrupt vectors plus TRAP and RESET Top Level Interrupt (TLI) pin on 64-pin devices 15 external interrupt lines (on 4 vectors) Up to 48 I/O Ports 48/32 multifunctional bidirectional I/O lines 34/22 alternate function lines 16/12 high sink outputs 5 Timers Main Clock Controller with: Real time base, Beep and Clock-out capabilities Configurable watchdog timer Two 16-bit timers with: 2 input captures, 2 output compares, external clock input on one timer, PWM and pulse generator modes 8-bit PWM Auto-reload timer with: 2 input captures, 4 PWM outputs, output compare and
Features ST72321(R/AR/J)9
60K 2048 (256)

TQFP64 14 x 14

TQFP64 10 x 10

time base interrupt, external clock with event detector 3 Communications Interfaces SPI synchronous serial interface SCI asynchronous serial interface (LIN compatible) I2C multimaster interface 1 Analog peripheral 10-bit ADC with up to 16 input pins Instruction Set 8-bit Data Manipulation 63 Basic Instructions 17 main Addressing Modes 8 x 8 Unsigned Multiply Instruction Development Tools Full hardware/software development package In-Circuit Testing capability
ST72321(R/AR)6

Device Summary
ST72321(R/AR/J)7
Program memory - bytes RAM (stack) - bytes Operating Voltage Temp. Range Package 48K 32K 1536 (256) 1024 (256) 3.8V to 5.5V up to -40C to +125C TQFP64 14x14 (R), TQFP64 10x10 (AR), TQFP44 10x10 (J)

Rev. 1.9 August 2003 1/185

Table of Contents
1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2 PIN DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 REGISTER & MEMORY MAP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 4 FLASH PROGRAM MEMORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.2 4.3 4.4 4.5 4.6 4.7 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 7 STRUCTURE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.3.1 Read-out Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 ICC INTERFACE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 ICP (IN-CIRCUIT PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 IAP (IN-APPLICATION PROGRAMMING) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 RELATED DOCUMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4.7.1 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5 CENTRAL PROCESSING UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2 5.3 MAIN FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 0 CPU REGISTERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

6 SUPPLY, RESET AND CLOCK MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.1 PHASE LOCKED LOOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 6.2 6.3 MULTI-OSCILLATOR (MO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 RESET SEQUENCE MANAGER (RSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 25 25 26 26 26 27 27 28 30 30 31 32 32

6.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.2 Asynchronous External RESET pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.3 External Power-On RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.4 Internal Low Voltage Detector (LVD) RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.5 Internal Watchdog RESET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4 SYSTEM INTEGRITY MANAGEMENT (SI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.1 Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.2 Auxiliary Voltage Detector (AVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.3 Clock Security System (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.4.5 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.2 7.3 7.4 7.5 7.6 7.7

MASKING AND PROCESSING FLOW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 INTERRUPTS AND LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 CONCURRENT & NESTED MANAGEMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 INTERRUPT REGISTER DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 EXTERNAL INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 7.6.1 I/O Port Interrupt Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 EXTERNAL INTERRUPT CONTROL REGISTER (EICR) . . . . . . . . . . . . . . . . . . . . . . . 39

8 POWER SAVING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 185 8.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 8.2 SLOW MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

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8.3 8.4 WAIT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 ACTIVE-HALT AND HALT MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 43 44 46 46 46 46 46 49

8.4.1 ACTIVE-HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8.4.2 HALT MODE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 I/O PORTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.2 9.2.1 Input Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.2.2 Output Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.2.3 Alternate Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.3 I/O PORT IMPLEMENTATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.4 9.5

FUNCTIONAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

LOW POWER MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 INTERRUPTS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

9.5.1 I/O Port Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 10 ON-CHIP PERIPHERALS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 10.1 WATCHDOG TIMER (WDG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 10.1.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.4 How to Program the Watchdog Timeout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.6 Hardware Watchdog Option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.7 Using Halt Mode with the WDG (WDGHALT option) . . . . . . . . . . . . . . . . . . . . . . . 10.1.8 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.1.9 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) . 10.2.1 Programmable CPU Clock Prescaler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.2 Clock-out Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.3 Real Time Clock Timer (RTC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.4 Beeper . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.2.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.3 PWM AUTO-RELOAD TIMER (ART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.3.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.3.3 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4 16-BIT TIMER . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.6 Summary of Timer modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.4.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5 SERIAL PERIPHERAL INTERFACE (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 52 52 53 55 55 55 55 55 57 57 57 57 57 58 58 58 60 60 61 65 69 69 69 69 81 81 81 82 88

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10.5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.4 Clock Phase and Clock Polarity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.5 Error Flags . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.6 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.7 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.5.8 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.6 SERIAL COMMUNICATIONS INTERFACE (SCI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 88 88 92 93 95 95 96 99

10.6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 10.6.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 10.6.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 10.6.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 10.6.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 10.6.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106 10.6.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107 10.7 I2C BUS INTERFACE (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 10.7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.3 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.5 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.6 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.7.7 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8 10-BIT A/D CONVERTER (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.2 Main Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.3 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.4 Low Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.5 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10.8.6 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 INSTRUCTION SET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1 CPU ADDRESSING MODES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.2 Immediate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.4 Indexed (No Offset, Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.5 Indirect (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.6 Indirect Indexed (Short, Long) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.1.7 Relative mode (Direct, Indirect) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.2 INSTRUCTION GROUPS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 113 113 115 119 119 120 126 126 126 127 127 127 128 130 130 131 131 131 131 131 132 132 133

12 ELECTRICAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 12.1 PARAMETER CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 12.1.1 12.1.2 12.1.3 12.1.4 12.1.5 Minimum and Maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 185 ... Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136 136 136 136 136

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12.2 ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 12.2.1 Voltage Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.2 Current Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.2.3 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.3 OPERATING CONDITIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.3.1 General Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.3.2 Operating Conditions with Low Voltage Detector (LVD) . . . . . . . . . . . . . . . . . . . . 12.3.3 Auxiliary Voltage Detector (AVD) Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.3.4 External Voltage Detector (EVD) Thresholds . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4 SUPPLY CURRENT CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.1 RUN and SLOW Modes (Flash devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.2 WAIT and SLOW WAIT Modes (Flash devices) . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.3 RUN and SLOW Modes (ROM devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.4 WAIT and SLOW WAIT Modes (ROM devices) . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.5 HALT and ACTIVE-HALT Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.6 Supply and Clock Managers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.7 On-Chip Peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5 CLOCK AND TIMING CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.1 General Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.2 External Clock Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.3 Crystal and Ceramic Resonator Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.4 RC Oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.5 Clock Security System (CSS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.5.6 PLL Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 MEMORY CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137 137 138 138 138 139 140 140 141 141 142 143 143 144 144 145 146 146 146 147 149 150 150 151

12.6.1 RAM and Hardware Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 12.6.2 FLASH Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151 12.7 EMC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 12.7.1 Functional EMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.7.2 Electro Magnetic Interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.7.3 Absolute Electrical Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.7.4 ESD Pin Protection Strategy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.8 I/O PORT PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152 152 153 155 157

12.8.1 General Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 12.8.2 Output Driving Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 158 12.9 CONTROL PIN CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 12.9.1 Asynchronous RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 12.9.2 ICCSEL/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 12.10 TIMER PERIPHERAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 12.10.18-Bit PWM-ART Auto-Reload Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 12.10.216-Bit Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 161 12.11 COMMUNICATION INTERFACE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . 162 12.11.1SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 12.11.2I2C - Inter IC Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 164 12.12 10-BIT ADC CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 12.12.1Analog Power Supply and Reference Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166 12.12.2General PCB Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 166

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12.12.3ADC Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 167 13 PACKAGE CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 13.1 PACKAGE MECHANICAL DATA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 168 13.2 THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 13.3 SOLDERING AND GLUEABILITY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171 14 ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION . . . . . . . . . . . . . . . 172 14.1 FLASH OPTION BYTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172 14.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE . . . . 174 14.2.1 Version-Specific Sales Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 14.3 DEVELOPMENT TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 14.3.1 Socket and Emulator Adapter Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177 14.4 ST7 APPLICATION NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 178 15 IMPORTANT NOTES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 15.1 SILICON IDENTIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 15.2 ALL FLASH AND ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 15.2.1 External RC option . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.2 CSS Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.3 Safe Connection of OSC1/OSC2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.4 Unexpected Reset Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.5 Internal RC Oscillator with LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.6 Read-out protection with LVD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.2.7 16-bit Timer PWM Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15.3 FLASH REV S AND ALL ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180 180 180 180 180 180 180 181

15.3.1 External clock source with PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 15.3.2 LVD Startup behaviour . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181 15.4 FLASH REV S AND ROM REV Y DEVICES ONLY . . . . . . . . . . . . . . . . . . . . . . . . . 182 15.4.1 I/O Port D Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 15.5 ALL ROM DEVICES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 15.5.1 LVD Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 15.5.2 AVD not supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 15.5.3 Internal RC oscillator operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182 16 SUMMARY OF CHANGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 184

To obtain the most recent version of this datasheet, please check at www.st.com>products>technical literature>datasheet. Please also pay special attention to the Section IMPORTANT NOTES on page 180

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ST72321

1 INTRODUCTION
The ST72321R, ST72321AR and ST72321J devices are members of the ST7 microcontroller family designed for mid-range applications All devices are based on a common industrystandard 8-bit core, featuring an enhanced instruction set and are available with FLASH or ROM program memory. Under software control, all devices can be placed in WAIT, SLOW, ACTIVE-HALT or HALT mode, Figure 1. Device Block Diagram
8-BIT CORE ALU RESET VPP TLI VSS VDD EVD OSC1 OSC2 CONTROL

reducing power consumption when the application is in idle or stand-by state. The enhanced instruction set and addressing modes of the ST7 offer both power and flexibility to software developers, enabling the design of highly efficient and compact application code. In addition to standard 8-bit data management, all ST7 microcontrollers feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes.

PROGRAM MEMORY (16K - 60K Bytes) RAM (512 - 2048 Bytes)

LVD AVD WATCHDOG OSC I2C PORT A PORT B PB7:0 (8-bits) PWM ART PORT C TIMER B SCI SPI PORT D PC7:0 (8-bits) ADDRESS AND DATA BUS MCC/RTC/BEEP PA7:0 (8-bits)

PORT F PF7:0 (8-bits) TIMER A BEEP PORT E PE7:0 (8-bits)

PD7:0 (8-bits) 10-BIT ADC VAREF VSSA

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2 PIN DESCRIPTION
Figure 2. 64-Pin TQFP 14x14 and 10x10 Package Pinout

(HS) PE4 (HS) PE5 (HS) PE6 (HS) PE7 PWM3 / PB0 PWM2 / PB1 PWM1 / PB2 PWM0 /PB3 ARTCLK /(HS) PB4 ARTIC1 / PB5 ARTIC2 / PB6 PB7 AIN0 / PD0 AIN1 / PD1 AIN2 / PD2 AIN3 / PD3

64 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

PE3 PE2 PE1 / RDI PE0 / TDO VDD_2 OSC1 OSC2 VSS_2 TLI EVD RESET VPP / ICCSEL PA7 (HS) / SCLI PA6 (HS) / SDAI PA5 (HS) PA4 (HS) 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 ei0 44 43 ei2 42 41 40 39 ei3 38 37 36 35 ei1 34 33 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

VSS_1 VDD_1 PA3 (HS) PA2 PA1 PA0 PC7 / SS / AIN15 PC6 / SCK / ICCCLK PC5 / MOSI / AIN14 PC4 / MISO / ICCDATA PC3 (HS) / ICAP1_B PC2 (HS) / ICAP2_B PC1 / OCMP1_B / AIN13 PC0 / OCMP2_B / AIN12 VSS_0 VDD_0

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AIN4 / PD4 AIN5 / PD5 AIN6 / PD6 AIN7 / PD7 VAREF VSSA VDD_3 VSS_3 MCO / AIN8 / PF0 BEEP / (HS) PF1 (HS) PF2 OCMP2_A / AIN9 / PF3 OCMP1_A / AIN10 / PF4 ICAP2_A / AIN11 / PF5 ICAP1_A / (HS) PF6 EXTCLK_A / (HS) PF7 (HS) 20mA high sink capability eix associated external interrupt vector

ST72321

Figure 3. 44-Pin Device Pinout

PE1 / RDI PWM3 /PB0 PWM2 / PB1 PWM1 / PB2 PWM0 / PB3 ARTCLK / (HS) PB4 AIN0 / PD0 AIN1 / PD1 AIN2 / PD2 AIN3 / PD3 AIN4 / PD4

44 43 42 41 40 39 38 37 36 35 34 1 33 2 32 3 31 ei0 ei2 4 30 5 29 ei3 6 28 7 27 8 26 9 25 ei1 10 24 11 23 12 13 14 15 16 17 18 19 20 21 22 AIN5 / PD5 VAREF VSSA MCO / AIN8 / PF0 BEEP / (HS) PF1 (HS) PF2 OCMP1_A / AIN10 / PF4 ICAP1_A / (HS) PF6 EXTCLK_A / (HS) PF7 VDD_0 VSS_0

PE0 / TDO VDD_2 OSC1 OSC2 VSS_2 RESET VPP / ICCSEL PA7 (HS) / SCLI PA6 (HS) / SDAI PA5 (HS) PA4 (HS)

VSS_1 VDD_1 PA3 (HS) PC7 / SS / AIN15 PC6 / SCK / ICCCLK PC5 / MOSI / AIN14 PC4 / MISO / ICCDATA PC3 (HS) / ICAP1_B PC2 (HS) / ICAP2_B PC1 / OCMP1_B / AIN13 PC0 / OCMP2_B / AIN12

(HS) 20mA high sink capability eix associated external interrupt vector

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PIN DESCRIPTION (Contd) For external pin connection guidelines, refer to See ELECTRICAL CHARACTERISTICS on page 136. Legend / Abbreviations for Table 1: Type: I = input, O = output, S = supply Input level: A = Dedicated analog input In/Output level: C = CMOS 0.3VDD/0.7VDD CT= CMOS 0.3VDD/0.7VDD with input trigger TT= TTL 0.8V / 2V with Schmitt trigger Output level: HS = 20mA high sink (on N-buffer only) Port and control configuration: Input: float = floating, wpu = weak pull-up, int = interrupt 1), ana = analog Output: OD = open drain 2), PP = push-pull Refer to I/O PORTS on page 46 for more details on the software configuration of the I/O ports. The RESET configuration of each pin is shown in bold. This configuration is valid as long as the device is in reset state. Table 1. Device Pin Description
Pin n TQFP64 TQFP44 Type Pin Name Level Output Input Input float wpu ana int Port Main Output function (after reset) OD X X X X
ei2 ei2 ei2

Alternate function

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23

2 3 4 5 6 7 8 9 10 11 12 13 14 -

PE4 (HS) PE5 (HS) PE6 (HS) PE7 (HS) PB0/PWM3 PB1/PWM2 PB2/PWM1 PB3/PWM0 PB4 (HS)/ARTCLK PB5 / ARTIC1 PB6 / ARTIC2 PB7 PD0/AIN0 PD1/AIN1 PD2/AIN2 PD3/AIN3 PD4/AIN4 PD5/AIN5 PD6/AIN6 PD7/AIN7 VAREF VSSA VDD_3

I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I S S

HS HS HS HS

X X X X X X X X

X X X X

PP X X X X X X X X X X X X X X X X X X X X

Port E4 Port E5 Port E6 Port E7 Port B0 Port B1 Port B2 Port B3 Port B4 Port B5 Port B6 Port B7 Port D0 Port D1 Port D2 Port D3 Port D4 Port D5 Port D6 Port D7 ADC Analog Input 0 ADC Analog Input 1 ADC Analog Input 2 ADC Analog Input 3 ADC Analog Input 4 ADC Analog Input 5 ADC Analog Input 6 ADC Analog Input 7 PWM Output 3 PWM Output 2 PWM Output 1 PWM Output 0 PWM-ART External Clock PWM-ART Input Capture 1 PWM-ART Input Capture 2

X X X X X X X X X X X X X X X X X X X X X X X X

ei2 ei3 ei3 ei3 ei3 X X X X X X X X

HS

X X X X X X X X X X X X

Analog Reference Voltage for ADC Analog Ground Voltage Digital Main Supply Voltage

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Pin n TQFP64 TQFP44 Type Pin Name

Level Output Input Input float wpu

Port

ana

OD

24 25 26 27 28

15 16 17 -

VSS_3 PF0/MCO/AIN8 PF1 (HS)/BEEP PF2 (HS) PF3/OCMP2_A/AIN9

S I/O CT I/O CT I/O CT I/O CT HS HS X X X X X ei1 ei1 ei1 X X X X X X X X X X

PP

int

Main function Output (after reset)

Alternate function

Digital Ground Voltage Port F0 Port F1 Port F2 Port F3 Timer A OutADC Analog put Compare Input 9 2 Timer A OutADC Analog put Compare Input 10 1 Timer A Input ADC Analog Capture 2 Input 11 Timer A Input Capture 1 Timer A External Clock Source Main clock out (fOSC/2) ADC Analog Input 8

Beep signal output

29 30 31 32 33 34 35

18 19 20 21 22 23

PF4/OCMP1_A/AIN10 PF5/ICAP2_A/AIN11 PF6 (HS)/ICAP1_A PF7 (HS)/EXTCLK_A VDD_0 VSS_0 PC0/OCMP2_B/AIN12

I/O CT I/O CT I/O CT I/O CT S S I/O CT HS HS

X X X X

X X X X

X X

X X X X

X X X X

Port F4 Port F5 Port F6 Port F7

Digital Main Supply Voltage Digital Ground Voltage X X X X X Port C0 Timer B OutADC Analog put Compare Input 12 2 Timer B OutADC Analog put Compare Input 13 1 Timer B Input Capture 2 Timer B Input Capture 1 SPI Master In ICC Data In/ Slave Out put Data SPI Master ADC Analog Out / Slave In Input 14 Data SPI Serial Clock SPI Slave Select (active low) ICC Clock Output ADC Analog Input 15

36 37 38 39

24 25 26 27

PC1/OCMP1_B/AIN13 PC2 (HS)/ICAP2_B PC3 (HS)/ICAP1_B PC4/MISO/ICCDATA

I/O CT I/O CT I/O CT I/O CT HS HS

X X X X

X X X X

X X X X

X X X X

Port C1 Port C2 Port C3 Port C4

40

28 29 30 31 32 33 34 35

PC5/MOSI/AIN14

I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT I/O CT S S I/O CT HS HS

Port C5

41

PC6/SCK/ICCCLK

Port C6

42 43 44 45 46 47 48 49

PC7/SS/AIN15 PA0 PA1 PA2 PA3 (HS) VDD_1 VSS_1 PA4 (HS)

X X X X X

X ei0 ei0 ei0 ei0

X X X X X

X X X X X

Port C7 Port A0 Port A1 Port A2 Port A3

Digital Main Supply Voltage Digital Ground Voltage X X X X Port A4

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Pin n TQFP64 TQFP44 Type Pin Name

Level Output Input Input float wpu

Port

ana

OD

50 51 52

36 37 38

PA5 (HS) PA6 (HS)/SDAI PA7 (HS)/SCLI

I/O CT I/O CT I/O CT

HS HS HS

X X X

X T T

PP

int

Main function Output (after reset) X Port A5 Port A6 Port A7

Alternate function

I2C Data 1) I2C Clock 1)

53

39

VPP/ ICCSEL

Must be tied low. In flash programming mode, this pin acts as the programming voltage input VPP. See Section 12.9.2 for more details. High voltage must not be applied to ROM devices Top priority non maskable interrupt. External voltage detector X Top level interrupt input pin Digital Ground Voltage Resonator oscillator inverter output External clock input or Resonator oscillator inverter input Digital Main Supply Voltage X X X X X X X X X X X X X Port E0 Port E1 Port E2 Port E3 SCI Transmit Data Out SCI Receive Data In

54 55 56 57 58 59 60 61 62 63 64

40 41 42 43 44 1 -

RESET EVD TLI VSS_2 OSC23) OSC13) VDD_2 PE0/TDO PE1/RDI PE2 PE3

I/O CT I S I/O I S I/O CT I/O CT I/O CT I/O CT CT

Notes: 1. In the interrupt input column, eiX defines the associated external interrupt vector. If the weak pull-up column (wpu) is merged with the interrupt column (int), then the I/O configuration is pull-up interrupt input, else the configuration is floating interrupt input. 2. In the open drain output column, T defines a true open drain I/O (P-Buffer and protection diode to VDD are not implemented). See See I/O PORTS on page 46. and Section 12.8 I/O PORT PIN CHARACTERISTICS for more details. 3. OSC1 and OSC2 pins connect a crystal/ceramic resonator, or an external source to the on-chip oscillator; see Section 1 INTRODUCTION and Section 12.5 CLOCK AND TIMING CHARACTERISTICS for more details. 4. On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up configuration after reset. The configuration of these pads must be kept at reset state to avoid added current consumption.

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3 REGISTER & MEMORY MAP

As shown in Figure 4, the MCU is capable of addressing 64K bytes of memories and I/O registers. The available memory locations consist of 128 bytes of register locations, up to 2Kbytes of RAM and up to 60Kbytes of user program memory. The RAM space includes up to 256 bytes for the stack from 0100h to 01FFh. Figure 4. Memory Map
0000h 007Fh 0080h

The highest address bytes contain the user reset and interrupt vectors. IMPORTANT: Memory locations marked as Reserved must never be accessed. Accessing a reseved area can have unpredictable effects on the device.

HW Registers (see Table 2)

0080h

Short Addressing RAM (zero page)

00FFh 0100h

RAM (2048, 1536 or 1024 Bytes)

087Fh 0880h

256 Bytes Stack

01FFh 0200h or 047Fh or 067Fh or 087Fh 1000h

Reserved
0FFFh 1000h

16-bit Addressing RAM

60 KBytes 48 KBytes 32 KBytes

4000h 8000h

Program Memory (60K, 48K or 32K)

FFDFh FFE0h FFFFh

Interrupt & Reset Vectors (see Table 7)

FFFFh

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Table 2. Hardware Register Map

Address 0000h 0001h 0002h 0003h 0004h 0005h 0006h 0007h 0008h 0009h 000Ah 000Bh 000Ch 000Dh 000Eh 000Fh 0010h 0011h 0012h to 0017h 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh 001Fh 0020h 0021h 0022h 0023h 0024h 0025h 0026h 0027h 0028h 0029h FLASH SPIDR SPICR SPICSR ISPR0 ISPR1 ISPR2 ISPR3 EICR FCSR I2CCR I2CSR1 I2CSR2 I2CCCR I2COAR1 I2COAR2 I2CDR I2C I2C I2C I2C I2C I2C I2C Block Register Label PADR PADDR PAOR PBDR PBDDR PBOR PCDR PCDDR PCOR PDDR PDDDR PDOR PEDR PEDDR PEOR PFDR PFDDR PFOR Register Name Port A Data Register Port A Data Direction Register Port A Option Register Port B Data Register Port B Data Direction Register Port B Option Register Port C Data Register Port C Data Direction Register Port C Option Register Port D Data Register Port D Data Direction Register Port D Option Register Port E Data Register Port E Data Direction Register Port E Option Register Port F Data Register Port F Data Direction Register Port F Option Register Reset Status 00h1) 00h 00h 00h1) 00h 00h 00h1) 00h 00h 00h1) 00h 00h 00h1) 00h 00h 00h1) 00h 00h Remarks R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W R/W2) R/W2) R/W R/W R/W

Port A

Port B

Port C

Port D

Port E

Port F

Reserved Area (6 Bytes)

I2C

Control Register Status Register 1 Status Register 2 Clock Control Register Own Address Register 1 Own Address Register2 Data Register Reserved Area (2 Bytes)

00h 00h 00h 00h 00h 00h 00h

R/W Read Only Read Only R/W R/W R/W R/W

SPI

SPI Data I/O Register SPI Control Register SPI Control/Status Register Interrupt Interrupt Interrupt Interrupt Software Priority Software Priority Software Priority Software Priority Register 0 Register 1 Register 2 Register 3

xxh 0xh 00h FFh FFh FFh FFh 00h 00h

R/W R/W R/W R/W R/W R/W R/W R/W R/W

ITC

External Interrupt Control Register Flash Control/Status Register

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Address 002Ah 002Bh 002Ch 002Dh 002Eh to 0030h 0031h 0032h 0033h 0034h 0035h 0036h 0037h 0038h 0039h 003Ah 003Bh 003Ch 003Dh 003Eh 003Fh 0040h 0041h 0042h 0043h 0044h 0045h 0046h 0047h 0048h 0049h 004Ah 004Bh 004Ch 004Dh 004Eh 004Fh 0050h 0051h 0052h 0053h 0054h 0055h 0056h 0057h

Block WATCHDOG

Register Label WDGCR SICSR

Register Name Watchdog Control Register System Integrity Control/Status Register Main Clock Control / Status Register Main Clock Controller: Beep Control Register

Reset Status 7Fh

Remarks R/W

000x 000x b R/W 00h 00h R/W R/W

MCC

MCCSR MCCBCR

Reserved Area (3 Bytes)

TIMER A

TACR2 TACR1 TACSR TAIC1HR TAIC1LR TAOC1HR TAOC1LR TACHR TACLR TAACHR TAACLR TAIC2HR TAIC2LR TAOC2HR TAOC2LR

Timer A Control Register 2 Timer A Control Register 1 Timer A Control/Status Register Timer A Input Capture 1 High Register Timer A Input Capture 1 Low Register Timer A Output Compare 1 High Register Timer A Output Compare 1 Low Register Timer A Counter High Register Timer A Counter Low Register Timer A Alternate Counter High Register Timer A Alternate Counter Low Register Timer A Input Capture 2 High Register Timer A Input Capture 2 Low Register Timer A Output Compare 2 High Register Timer A Output Compare 2 Low Register Reserved Area (1 Byte)

00h 00h xxxx x0xx b xxh xxh 80h 00h FFh FCh FFh FCh xxh xxh 80h 00h

R/W R/W R/W Read Only Read Only R/W R/W Read Only Read Only Read Only Read Only Read Only Read Only R/W R/W

TIMER B

TBCR2 TBCR1 TBCSR TBIC1HR TBIC1LR TBOC1HR TBOC1LR TBCHR TBCLR TBACHR TBACLR TBIC2HR TBIC2LR TBOC2HR TBOC2LR SCISR SCIDR SCIBRR SCICR1 SCICR2 SCIERPR SCIETPR

Timer B Control Register 2 Timer B Control Register 1 Timer B Control/Status Register Timer B Input Capture 1 High Register Timer B Input Capture 1 Low Register Timer B Output Compare 1 High Register Timer B Output Compare 1 Low Register Timer B Counter High Register Timer B Counter Low Register Timer B Alternate Counter High Register Timer B Alternate Counter Low Register Timer B Input Capture 2 High Register Timer B Input Capture 2 Low Register Timer B Output Compare 2 High Register Timer B Output Compare 2 Low Register SCI Status Register SCI Data Register SCI Baud Rate Register SCI Control Register 1 SCI Control Register 2 SCI Extended Receive Prescaler Register Reserved area SCI Extended Transmit Prescaler Register

00h 00h xxxx x0xx b xxh xxh 80h 00h FFh FCh FFh FCh xxh xxh 80h 00h C0h xxh 00h x000 0000b 00h 00h --00h

R/W R/W R/W Read Only Read Only R/W R/W Read Only Read Only Read Only Read Only Read Only Read Only R/W R/W Read Only R/W R/W R/W R/W R/W R/W

SCI

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Address 0058h to 006Fh 0070h 0071h 0072h 0073h 0074h 0075h 0076h 0077h 0078h 0079h 007Ah 007Bh 007Ch 007Dh 007Eh 007Fh

Block

Register Label

Register Name

Reset Status

Remarks

Reserved Area (24 Bytes)

ADC

ADCCSR ADCDRH ADCDRL PWMDCR3 PWMDCR2 PWMDCR1 PWMDCR0 PWMCR ARTCSR ARTCAR ARTARR ARTICCSR ARTICR1 ARTICR2

Control/Status Register Data High Register Data Low Register PWM AR Timer Duty Cycle Register 3 PWM AR Timer Duty Cycle Register 2 PWM AR Timer Duty Cycle Register 1 PWM AR Timer Duty Cycle Register 0 PWM AR Timer Control Register Auto-Reload Timer Control/Status Register Auto-Reload Timer Counter Access Register Auto-Reload Timer Auto-Reload Register AR Timer Input Capture Control/Status Reg. AR Timer Input Capture Register 1 AR Timer Input Capture Register 1 Reserved Area (2 Bytes)

00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h 00h

R/W Read Only Read Only R/W R/W R/W R/W R/W R/W R/W R/W R/W Read Only Read Only

PWM ART

Legend: x=undefined, R/W=read/write Notes: 1. The contents of the I/O port DR registers are readable only in output configuration. In input configuration, the values of the I/O pins are returned instead of the DR register contents. 2. The bits associated with unavailable pins must always keep their reset value.

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4 FLASH PROGRAM MEMORY

4.1 Introduction The ST7 dual voltage High Density Flash (HDFlash) is a non-volatile memory that can be electrically erased as a single block or by individual sectors and programmed on a Byte-by-Byte basis using an external VPP supply. The HDFlash devices can be programmed and erased off-board (plugged in a programming tool) or on-board using ICP (In-Circuit Programming) or IAP (In-Application Programming). The array matrix organisation allows each sector to be erased and reprogrammed without affecting other sectors. 4.2 Main Features
I

Depending on the overall Flash memory size in the microcontroller device, there are up to three user sectors (see Table 3). Each of these sectors can be erased independently to avoid unnecessary erasing of the whole Flash memory when only a partial erasing is required. The first two sectors have a fixed size of 4 Kbytes (see Figure 5). They are mapped in the upper part of the ST7 addressing space so the reset and interrupt vectors are located in Sector 0 (F000hFFFFh). Table 3. Sectors available in Flash devices
Flash Size (bytes) 4K 8K > 8K Available Sectors Sector 0 Sectors 0,1 Sectors 0,1, 2

I I

Three Flash programming modes: Insertion in a programming tool. In this mode, all sectors including option bytes can be programmed or erased. ICP (In-Circuit Programming). In this mode, all sectors including option bytes can be programmed or erased without removing the device from the application board. IAP (In-Application Programming) In this mode, all sectors except Sector 0, can be programmed or erased without removing the device from the application board and while the application is running. ICT (In-Circuit Testing) for downloading and executing user application test patterns in RAM Read-out protection against piracy Register Access Security System (RASS) to prevent accidental programming or erasing

4.3 Structure The Flash memory is organised in sectors and can be used for both code and data storage. Figure 5. Memory Map and Sector Address
4K
1000h 3FFFh 7FFFh 9FFFh BFFFh D7FFh DFFFh EFFFh FFFFh

4.3.1 Read-out Protection Read-out protection, when selected, makes it impossible to extract the memory content from the microcontroller, thus preventing piracy. Even ST cannot access the user code. In flash devices, this protection is removed by reprogramming the option. In this case, the entire program memory is first automatically erased and the device can be reprogrammed. Read-out protection selection depends on the device type: In Flash devices it is enabled and removed through the FMP_R bit in the option byte. In ROM devices it is enabled by mask option specified in the Option List. Note: The LVD is not supported if read-out protection is enabled

8K

10K

16K

24K

32K

48K

60K

FLASH MEMORY SIZE

SECTOR 2 2 Kbytes 8 Kbytes 16 Kbytes 24 Kbytes 40 Kbytes 52 Kbytes 4 Kbytes 4 Kbytes SECTOR 1 SECTOR 0

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FLASH PROGRAM MEMORY (Contd) 4.4 ICC Interface ICC needs a minimum of 4 and up to 6 pins to be connected to the programming tool (see Figure 6). These pins are: RESET: device reset VSS: device power supply ground Figure 6. Typical ICC Interface
PROGRAMMING TOOL ICC CONNECTOR ICC Cable APPLICATION BOARD OPTIONAL (See Note 3) OPTIONAL (See Note 4) ICC CONNECTOR HE10 CONNECTOR TYPE 9 10 7 8 5 6 3 4 1 2 APPLICATION RESET SOURCE See Note 2 10k APPLICATION POWER SUPPLY CL2 CL1 See Note 1 APPLICATION I/O

ICCCLK: ICC output serial clock pin ICCDATA: ICC input/output serial data pin ICCSEL/VPP: programming voltage OSC1(or OSCIN): main clock input for external source (optional) VDD: application board power supply (optional, see Figure 6, Note 3)

RESET

ST7

Notes: 1. If the ICCCLK or ICCDATA pins are only used as outputs in the application, no signal isolation is necessary. As soon as the Programming Tool is plugged to the board, even if an ICC session is not in progress, the ICCCLK and ICCDATA pins are not available for the application. If they are used as inputs by the application, isolation such as a serial resistor has to implemented in case another device forces the signal. Refer to the Programming Tool documentation for recommended resistor values. 2. During the ICC session, the programming tool must control the RESET pin. This can lead to conflicts between the programming tool and the application reset circuit if it drives more than 5mA at high level (push pull output or pull-up resistor<1K). A schottky diode can be used to isolate the application RESET circuit in this case. When using a classical RC network with R>1K or a reset man-

agement IC with open drain output and pull-up resistor>1K, no additional components are needed. In all cases the user must ensure that no external reset is generated by the application during the ICC session. 3. The use of Pin 7 of the ICC connector depends on the Programming Tool architecture. This pin must be connected when using most ST Programming Tools (it is used to monitor the application power supply). Please refer to the Programming Tool manual. 4. Pin 9 has to be connected to the OSC1 or OSCIN pin of the ST7 when the clock is not available in the application or if the selected clock option is not programmed in the option byte. ST7 devices with multi-oscillator capability need to have OSC2 grounded in this case.

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ICCSEL/VPP

ICCDATA

ICCCLK

OSC2

OSC1

VDD

VSS

ST72321

FLASH PROGRAM MEMORY (Contd) 4.5 ICP (In-Circuit Programming) To perform ICP the microcontroller must be switched to ICC (In-Circuit Communication) mode by an external controller or programming tool. Depending on the ICP code downloaded in RAM, Flash memory programming can be fully customized (number of bytes to program, program locations, or selection serial communication interface for downloading). When using an STMicroelectronics or third-party programming tool that supports ICP and the specific microcontroller device, the user needs only to implement the ICP hardware interface on the application board (see Figure 6). For more details on the pin locations, refer to the device pinout description. 4.6 IAP (In-Application Programming) This mode uses a BootLoader program previously stored in Sector 0 by the user (in ICP mode or by plugging the device in a programming tool). This mode is fully controlled by user software. This allows it to be adapted to the user application, (user-defined strategy for entering programming mode, choice of communications protocol used to fetch the data to be stored, etc.). For example, it is possible to download code from the SPI, SCI, USB
Address (Hex.) 0029h Register Label FCSR Reset Value 7 6 5

or CAN interface and program it in the Flash. IAP mode can be used to program any of the Flash sectors except Sector 0, which is write/erase protected to allow recovery in case errors occur during the programming operation. 4.7 Related Documentation For details on Flash programming and ICC protocol, refer to the ST7 Flash Programming Reference Manual and to the ST7 ICC Protocol Reference Manual. 4.7.1 Register Description FLASH CONTROL/STATUS REGISTER (FCSR) Read /Write Reset Value: 0000 0000 (00h)
7 0 0 0 0 0 0 0 0 0

This register is reserved for use by Programming Tool software. It controls the Flash programming and erasing operations. Flash Control/Status Register Address and Reset Value

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5 CENTRAL PROCESSING UNIT

5.1 INTRODUCTION This CPU has a full 8-bit architecture and contains six internal registers allowing efficient 8-bit data manipulation. 5.2 MAIN FEATURES
I I I

5.3 CPU REGISTERS The 6 CPU registers shown in Figure 7 are not present in the memory mapping and are accessed by specific instructions. Accumulator (A) The Accumulator is an 8-bit general purpose register used to hold operands and the results of the arithmetic and logic calculations and to manipulate data. Index Registers (X and Y) These 8-bit registers are used to create effective addresses or as temporary storage areas for data manipulation. (The Cross-Assembler generates a precede instruction (PRE) to indicate that the following instruction refers to the Y register.) The Y register is not affected by the interrupt automatic procedures. Program Counter (PC) The program counter is a 16-bit register containing the address of the next instruction to be executed by the CPU. It is made of two 8-bit registers PCL (Program Counter Low which is the LSB) and PCH (Program Counter High which is the MSB).

I I I I I

Enable executing 63 basic instructions Fast 8-bit by 8-bit multiply 17 main addressing modes (with indirect addressing mode) Two 8-bit index registers 16-bit stack pointer Low power HALT and WAIT modes Priority maskable hardware interrupts Non-maskable software/hardware interrupts

Figure 7. CPU Registers

7 RESET VALUE = XXh 7 RESET VALUE = XXh 7 RESET VALUE = XXh 15 PCH 8 7 PCL 0 PROGRAM COUNTER RESET VALUE = RESET VECTOR @ FFFEh-FFFFh 7 0 CONDITION CODE REGISTER 1 1 I1 H I0 N Z C RESET VALUE = 1 1 1 X 1 X X X 15 8 7 0 STACK POINTER RESET VALUE = STACK HIGHER ADDRESS X = Undefined Value 0 Y INDEX REGISTER 0 X INDEX REGISTER 0 ACCUMULATOR

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CENTRAL PROCESSING UNIT (Contd) Condition Code Register (CC) Read/Write Reset Value: 111x1xxx
7
1 1 I1 H I0 N Z

Bit 1 = Z Zero. This bit is set and cleared by hardware. This bit indicates that the result of the last arithmetic, logical or data manipulation is zero. 0: The result of the last operation is different from zero. 1: The result of the last operation is zero. This bit is accessed by the JREQ and JRNE test instructions. Bit 0 = C Carry/borrow. This bit is set and cleared by hardware and software. It indicates an overflow or an underflow has occurred during the last arithmetic operation. 0: No overflow or underflow has occurred. 1: An overflow or underflow has occurred. This bit is driven by the SCF and RCF instructions and tested by the JRC and JRNC instructions. It is also affected by the bit test and branch, shift and rotate instructions. Interrupt Management Bits Bit 5,3 = I1, I0 Interrupt The combination of the I1 and I0 bits gives the current interrupt software priority.
Interrupt Software Priority Level 0 (main) Level 1 Level 2 Level 3 (= interrupt disable) I1 1 0 0 1 I0 0 1 0 1

0 C

The 8-bit Condition Code register contains the interrupt masks and four flags representative of the result of the instruction just executed. This register can also be handled by the PUSH and POP instructions. These bits can be individually tested and/or controlled by specific instructions. Arithmetic Management Bits Bit 4 = H Half carry. This bit is set by hardware when a carry occurs between bits 3 and 4 of the ALU during an ADD or ADC instructions. It is reset by hardware during the same instructions. 0: No half carry has occurred. 1: A half carry has occurred. This bit is tested using the JRH or JRNH instruction. The H bit is useful in BCD arithmetic subroutines. Bit 2 = N Negative . This bit is set and cleared by hardware. It is representative of the result sign of the last arithmetic, logical or data manipulation. Its a copy of the result 7th bit. 0: The result of the last operation is positive or null. 1: The result of the last operation is negative (i.e. the most significant bit is a logic 1). This bit is accessed by the JRMI and JRPL instructions.

These two bits are set/cleared by hardware when entering in interrupt. The loaded value is given by the corresponding bits in the interrupt software priority registers (IxSPR). They can be also set/ cleared by software with the RIM, SIM, IRET, HALT, WFI and PUSH/POP instructions. See the interrupt management chapter for more details.

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CENTRAL PROCESSING UNIT (Contd) Stack Pointer (SP) Read/Write Reset Value: 01 FFh
15 0 7
SP7 SP6 SP5 SP4 SP3 SP2 SP1

8 0 0 0 0 0 0 1 0 SP0

The Stack Pointer is a 16-bit register which is always pointing to the next free location in the stack. It is then decremented after data has been pushed onto the stack and incremented before data is popped from the stack (see Figure 8). Since the stack is 256 bytes deep, the 8 most significant bits are forced by hardware. Following an MCU Reset, or after a Reset Stack Pointer instruction (RSP), the Stack Pointer contains its reset value (the SP7 to SP0 bits are set) which is the stack higher address. Figure 8. Stack Manipulation Example
CALL Subroutine @ 0100h Interrupt Event PUSH Y

The least significant byte of the Stack Pointer (called S) can be directly accessed by a LD instruction. Note: When the lower limit is exceeded, the Stack Pointer wraps around to the stack upper limit, without indicating the stack overflow. The previously stored information is then overwritten and therefore lost. The stack also wraps in case of an underflow. The stack is used to save the return address during a subroutine call and the CPU context during an interrupt. The user may also directly manipulate the stack by means of the PUSH and POP instructions. In the case of an interrupt, the PCL is stored at the first location pointed to by the SP. Then the other registers are stored in the next locations as shown in Figure 8. When an interrupt is received, the SP is decremented and the context is pushed on the stack. On return from interrupt, the SP is incremented and the context is popped from the stack. A subroutine call occupies two locations and an interrupt five locations in the stack area.

POP Y

IRET

RET or RSP

SP SP CC A X PCH SP PCH @ 01FFh PCL PCL PCH PCL Y CC A X PCH PCL PCH PCL SP CC A X PCH PCL PCH PCL SP PCH PCL SP

Stack Higher Address = 01FFh Stack Lower Address = 0100h

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6 SUPPLY, RESET AND CLOCK MANAGEMENT

The device includes a range of utility features for securing the application in critical situations (for example in case of a power brown-out), and reducing the number of external components. An overview is shown in Figure 10. For more details, refer to dedicated parametric section. Main features I Optional PLL for multiplying the frequency by 2 (not to be used with internal RC oscillator) I Reset Sequence Manager (RSM) I Multi-Oscillator Clock Management (MO) 5 Crystal/Ceramic resonator oscillators 1 Internal RC oscillator I System Integrity Management (SI) Main supply Low voltage detection (LVD) Auxiliary Voltage detector (AVD) with interrupt capability for monitoring the main supply or the EVD pin Clock Security System (CSS) with Clock Filter and Backup Safe Oscillator (enabled by opFigure 10. Clock, Reset and Supply Block Diagram
SYSTEM INTEGRITY MANAGEMENT CLOCK SECURITY SYSTEM (CSS) OSC2 OSC1 MULTIOSCILLATOR (MO) fOSC PLL (option) fOSC2 CLOCK FILTER SAFE OSC fOSC2 MAIN CLOCK fCPU CONTROLLER WITH REALTIME CLOCK (MCC/RTC)

tion byte) 6.1 PHASE LOCKED LOOP If the clock frequency input to the PLL is in the range 2 to 4 MHz, the PLL can be used to multiply the frequency by two to obtain an fOSC2 of 4 to 8 MHz. The PLL is enabled by option byte. If the PLL is disabled, then fOSC2 = fOSC/2. Caution: The PLL is not recommended for applications where timing accuracy is required. See PLL Characteristics on page 150. Figure 9. PLL Block Diagram
PLL x 2
fOSC 0 fOSC2 1

/2

PLL OPTION BIT

RESET SEQUENCE RESET MANAGER (RSM)

AVD Interrupt Request SICSR AVD AVD AVD LVD S IE F RF CSS CSS WDG IE D RF

WATCHDOG TIMER (WDG)

CSS Interrupt Request LOW VOLTAGE VSS VDD 0 EVD 1 DETECTOR (LVD)

AUXILIARY VOLTAGE DETECTOR (AVD)

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6.2 MULTI-OSCILLATOR (MO) The main clock of the ST7 can be generated by three different source types coming from the multioscillator block: I an external source I 4 crystal or ceramic resonator oscillators I an internal high frequency RC oscillator Each oscillator is optimized for a given frequency range in terms of consumption and is selectable through the option byte. The associated hardware configurations are shown in Table 4. Refer to the electrical characteristics section for more details. Caution: The OSC1 and/or OSC2 pins must not be left unconnected. For the purposes of Failure Mode and Effect Analysis, it should be noted that if the OSC1 and/or OSC2 pins are left unconnected, the ST7 main oscillator may start and, in this configuration, could generate an fOSC clock frequency in excess of the allowed maximum (>16MHz.), putting the ST7 in an unsafe/undefined state. The product behaviour must therefore be considered undefined when the OSC pins are left unconnected. External Clock Source In this external clock mode, a clock signal (square, sinus or triangle) with ~50% duty cycle has to drive the OSC1 pin while the OSC2 pin is tied to ground. Note: External clock source is not supported with the PLL enabled. Crystal/Ceramic Oscillators This family of oscillators has the advantage of producing a very accurate rate on the main clock of the ST7. The selection within a list of 4 oscillators with different frequency ranges has to be done by option byte in order to reduce consumption (refer to Section 14.1 on page 172 for more details on the frequency ranges). In this mode of the multioscillator, the resonator and the load capacitors have to be placed as close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. The loading capacitance values must be adjusted according to the selected oscillator. These oscillators are not stopped during the RESET phase to avoid losing time in the oscillator start-up phase. Internal RC Oscillator This oscillator allows a low cost solution for the main clock of the ST7 using only an internal resistor and capacitor. Internal RC oscillator mode has the drawback of a lower frequency accuracy and should not be used in applications that require accurate timing. In this mode, the two oscillator pins have to be tied to ground. Table 4. ST7 Clock Sources
Hardware Configuration

External Clock

ST7 OSC1 OSC2

EXTERNAL SOURCE

Crystal/Ceramic Resonators

ST7 OSC1 OSC2

CL1

LOAD CAPACITORS

CL2

Internal RC Oscillator

ST7 OSC1 OSC2

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6.3 RESET SEQUENCE MANAGER (RSM) 6.3.1 Introduction The reset sequence manager includes three RESET sources as shown in Figure 12: I External RESET source pulse I Internal LVD RESET (Low Voltage Detection) I Internal WATCHDOG RESET These sources act on the RESET pin and it is always kept low during the delay phase. The RESET service routine vector is fixed at addresses FFFEh-FFFFh in the ST7 memory map. The basic RESET sequence consists of 3 phases as shown in Figure 11: I Active Phase depending on the RESET source I 256 or 4096 CPU clock cycle delay (selected by option byte) I RESET vector fetch The 256 or 4096 CPU clock cycle delay allows the oscillator to stabilise and ensures that recovery has taken place from the Reset state. The shorter or longer clock cycle delay should be selected by option byte to correspond to the stabilization time of the external oscillator used in the application (see Section 14.1 on page 172). Figure 12. Reset Block Diagram The RESET vector fetch phase duration is 2 clock cycles. Figure 11. RESET Sequence Phases

RESET
Active Phase INTERNAL RESET 256 or 4096 CLOCK CYCLES FETCH VECTOR

6.3.2 Asynchronous External RESET pin The RESET pin is both an input and an open-drain output with integrated RON weak pull-up resistor. This pull-up has no fixed value but varies in accordance with the input voltage. It can be pulled low by external circuitry to reset the device. See CONTROL PIN CHARACTERISTICS on page 160 for more details. A RESET signal originating from an external source must have a duration of at least th(RSTL)in in order to be recognized (see Figure 13). This detection is asynchronous and therefore the MCU can enter reset state even in HALT mode.

VDD

RON
RESET
Filter INTERNAL RESET

PULSE GENERATOR

WATCHDOG RESET LVD RESET

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RESET SEQUENCE MANAGER (Contd) The RESET pin is an asynchronous signal which plays a major role in EMS performance. In a noisy environment, it is recommended to follow the guidelines mentioned in the electrical characteristics section. If the external RESET pulse is shorter than tw(RSTL)out (see short ext. Reset in Figure 13), the signal on the RESET pin may be stretched. Otherwise the delay will not be applied (see long ext. Reset in Figure 13). Starting from the external RESET pulse recognition, the device RESET pin acts as an output that is pulled low during at least tw(RSTL)out. 6.3.3 External Power-On RESET If the LVD is disabled by option byte, to start up the microcontroller correctly, the user must ensure by means of an external reset circuit that the reset signal is held low until VDD is over the minimum level specified for the selected fOSC frequency. (see OPERATING CONDITIONS on page 138) A proper reset signal for a slow rising VDD supply can generally be provided by an external RC network connected to the RESET pin. 6.3.4 Internal Low Voltage Detector (LVD) RESET Two different RESET sequences caused by the internal LVD circuitry can be distinguished: I Power-On RESET I Voltage Drop RESET The device RESET pin acts as an output that is pulled low when VDD<VIT+ (rising edge) or VDD<VIT- (falling edge) as shown in Figure 13. The LVD filters spikes on VDD larger than tg(VDD) to avoid parasitic resets. 6.3.5 Internal Watchdog RESET The RESET sequence generated by a internal Watchdog counter overflow is shown in Figure 13. Starting from the Watchdog counter underflow, the device RESET pin acts as an output that is pulled low during at least tw(RSTL)out.

Figure 13. RESET Sequences VDD

VIT+(LVD) VIT-(LVD)

LVD RESET

SHORT EXT. RESET

LONG EXT. RESET

WATCHDOG RESET

RUN
ACTIVE PHASE

RUN

ACTIVE PHASE

RUN

ACTIVE PHASE

RUN

ACTIVE PHASE

RUN

tw(RSTL)out th(RSTL)in
EXTERNAL RESET SOURCE

tw(RSTL)out th(RSTL)in
DELAY

tw(RSTL)out

RESET PIN

WATCHDOG RESET WATCHDOG UNDERFLOW INTERNAL RESET (256 or 4096 TCPU ) VECTOR FETCH

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6.4 SYSTEM INTEGRITY MANAGEMENT (SI) The System Integrity Management block contains the Low Voltage Detector (LVD), Auxiliary Voltage Detector (AVD) functions and Clock Security System (CSS). It is managed by the SICSR register. 6.4.1 Low Voltage Detector (LVD) The Low Voltage Detector function (LVD) generates a static reset when the VDD supply voltage is below a VIT- reference value. This means that it secures the power-up as well as the power-down keeping the ST7 in reset. The VIT- reference value for a voltage drop is lower than the VIT+ reference value for power-on in order to avoid a parasitic reset when the MCU starts running and sinks current on the supply (hysteresis). The LVD Reset circuitry generates a reset when VDD is below: VIT+ when VDD is rising VIT- when VDD is falling The LVD function is illustrated in Figure 14. Provided the minimum VDD value (guaranteed for the oscillator frequency) is above VIT-, the MCU can only be in two modes: under full software control in static safe reset In these conditions, secure operation is always ensured for the application without the need for external reset hardware. During a Low Voltage Detector Reset, the RESET pin is held low, thus permitting the MCU to reset other devices. Notes: The LVD allows the device to be used without any external RESET circuitry. If the medium or low thresholds are selected, the detection may occur outside the specified operating voltage range. Below 3.8V, device operation is not guaranteed. The LVD is an optional function which can be selected by option byte.

Figure 14. Low Voltage Detector vs Reset

VDD

Vhys VIT+ VIT-

RESET

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SYSTEM INTEGRITY MANAGEMENT (Contd) 6.4.2 Auxiliary Voltage Detector (AVD) The Voltage Detector function (AVD) is based on an analog comparison between a VIT-(AVD) and VIT+(AVD) reference value and the VDD main supply or the external EVD pin voltage level (VEVD). The VIT- reference value for falling voltage is lower than the VIT+ reference value for rising voltage in order to avoid parasitic detection (hysteresis). The output of the AVD comparator is directly readable by the application software through a real time status bit (AVDF) in the SICSR register. This bit is read only. Caution: The AVD function is active only if the LVD is enabled through the option byte. 6.4.2.1 Monitoring the VDD Main Supply This mode is selected by clearing the AVDS bit in the SICSR register. The AVD voltage threshold value is relative to the selected LVD threshold configured by option byte (see Section 14.1 on page 172). If the AVD interrupt is enabled, an interrupt is generated when the voltage crosses the VIT+(AVD) or VIT-(AVD) threshold (AVDF bit toggles). In the case of a drop in voltage, the AVD interrupt acts as an early warning, allowing software to shut down safely before the LVD resets the microcontroller. See Figure 15. The interrupt on the rising edge is used to inform the application that the VDD warning state is over. If the voltage rise time trv is less than 256 or 4096 CPU cycles (depending on the reset delay selected by option byte), no AVD interrupt will be generated when VIT+(AVD) is reached. If trv is greater than 256 or 4096 cycles then: If the AVD interrupt is enabled before the VIT+(AVD) threshold is reached, then 2 AVD interrupts will be received: the first when the AVDIE bit is set, and the second when the threshold is reached. If the AVD interrupt is enabled after the VIT+(AVD) threshold is reached then only one AVD interrupt will occur.

Figure 15. Using the AVD to Monitor VDD (AVDS bit=0) VDD Early Warning Interrupt (Power has dropped, MCU not not yet in reset)
Vhyst

VIT+(AVD) VIT-(AVD) VIT+(LVD) VIT-(LVD)

trv VOLTAGE RISE TIME

AVDF bit AVD INTERRUPT REQUEST IF AVDIE bit = 1

RESET VALUE

INTERRUPT PROCESS

INTERRUPT PROCESS

LVD RESET

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SYSTEM INTEGRITY MANAGEMENT (Contd) 6.4.2.2 Monitoring a Voltage on the EVD pin This mode is selected by setting the AVDS bit in the SICSR register. The AVD circuitry can generate an interrupt when the AVDIE bit of the SICSR register is set. This interrupt is generated on the rising and falling edges of the comparator output. This means it is generated when either one of these two events occur: VEVD rises up to VIT+(EVD) VEVD falls down to VIT-(EVD) The EVD function is illustrated in Figure 16. For more details, refer to the Electrical Characteristics section.

Figure 16. Using the Voltage Detector to Monitor the EVD pin (AVDS bit=1) VEVD

VIT+(EVD) VIT-(EVD)

Vhyst

AVDF AVD INTERRUPT REQUEST IF AVDIE = 1

INTERRUPT PROCESS

INTERRUPT PROCESS

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SYSTEM INTEGRITY MANAGEMENT (Contd) 6.4.3 Clock Security System (CSS) The Clock Security System (CSS) protects the ST7 against breakdowns, spikes and overfrequencies occurring on the main clock source (fOSC). It is based on a clock filter and a clock detection control with an internal safe oscillator (fSFOSC). Caution: The CSS function is not guaranteed. Refer to Section 15 6.4.3.1 Clock Filter Control The PLL has an integrated glitch filtering capability making it possible to protect the internal clock from overfrequencies created by individual spikes. This feature is available only when the PLL is enabled. If glitches occur on fOSC (for example, due to loose connection or noise), the CSS filters these automatically, so the internal CPU frequency (fCPU) continues deliver a glitch-free signal (see Figure 17). 6.4.3.2 Clock detection Control If the clock signal disappears (due to a broken or disconnected resonator...), the safe oscillator delivers a low frequency clock signal (fSFOSC) which allows the ST7 to perform some rescue operations. Automatically, the ST7 clock source switches back from the safe oscillator (fSFOSC) if the main clock source (fOSC) recovers. When the internal clock (fCPU) is driven by the safe oscillator (fSFOSC), the application software is notified by hardware setting the CSSD bit in the SICFigure 17. Clock Filter Function
Clock Filter Function
fOSC2 fCPU

SR register. An interrupt can be generated if the CSSIE bit has been previously set. These two bits are described in the SICSR register description. 6.4.4 Low Power Modes
Mode WAIT Description No effect on SI. CSS and AVD interrupts cause the device to exit from Wait mode. The CRSR register is frozen. The CSS (including the safe oscillator) is disabled until HALT mode is exited. The previous CSS configuration resumes when the MCU is woken up by an interrupt with exit from HALT mode capability or from the counter reset value when the MCU is woken up by a RESET.

HALT

6.4.4.1 Interrupts The CSS or AVD interrupt events generate an interrupt if the corresponding Enable Control Bit (CSSIE or AVDIE) is set and the interrupt mask in the CC register is reset (RIM instruction).
Interrupt Event Enable Event Control Flag Bit CSSIE AVDIE Exit from Wait Yes Yes Exit from Halt No No

CSS event detection (safe oscillator acti- CSSD vated as main clock) AVD event AVDF

Clock Detection Function

fOSC2 fSFOSC fCPU

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SYSTEM INTEGRITY MANAGEMENT (Contd) 6.4.5 Register Description SYSTEM INTEGRITY (SI) CONTROL/STATUS REGISTER (SICSR) Read /Write is detected by the Clock Security System (CSSD bit set). It is set and cleared by software. Reset Value: 000x 000x (00h) 0: Clock security system interrupt disabled 1: Clock security system interrupt enabled 7 0 When the CSS is disabled by OPTION BYTE, the CSSIE bit has no effect. AVD AVD AVD LVD CSS CSS WDG
S IE F RF 0 IE D RF

Bit 7 = AVDS Voltage Detection selection This bit is set and cleared by software. Voltage Detection is available only if the LVD is enabled by option byte. 0: Voltage detection on VDD supply 1: Voltage detection on EVD pin Bit 6 = AVDIE Voltage Detector interrupt enable This bit is set and cleared by software. It enables an interrupt to be generated when the AVDF flag changes (toggles). The pending interrupt information is automatically cleared when software enters the AVD interrupt routine. 0: AVD interrupt disabled 1: AVD interrupt enabled Bit 5 = AVDF Voltage Detector flag This read-only bit is set and cleared by hardware. If the AVDIE bit is set, an interrupt request is generated when the AVDF bit changes value. Refer to Figure 15 and to Section 6.4.2.1 for additional details. 0: VDD or VEVD over VIT+(AVD) threshold 1: VDD or VEVD under VIT-(AVD) threshold Bit 4 = LVDRF LVD reset flag This bit indicates that the last Reset was generated by the LVD block. It is set by hardware (LVD reset) and cleared by software (writing zero). See WDGRF flag description for more details. When the LVD is disabled by OPTION BYTE, the LVDRF bit value is undefined. Bits 3 = Reserved, must be kept cleared. Bit 2 = CSSIE Clock security syst interrupt enable This bit enables the interrupt when a disturbance
.

Bit 1 = CSSD Clock security system detection This bit indicates that the safe oscillator of the Clock Security System block has been selected by hardware due to a disturbance on the main clock signal (fOSC). It is set by hardware and cleared by reading the SICSR register when the original oscillator recovers. 0: Safe oscillator is not active 1: Safe oscillator has been activated When the CSS is disabled by OPTION BYTE, the CSSD bit value is forced to 0. Bit 0 = WDGRF Watchdog reset flag This bit indicates that the last Reset was generated by the Watchdog peripheral. It is set by hardware (watchdog reset) and cleared by software (writing zero) or an LVD Reset (to ensure a stable cleared state of the WDGRF flag when CPU starts). Combined with the LVDRF flag information, the flag description is given by the following table.
RESET Sources External RESET pin Watchdog LVD LVDRF 0 0 1 WDGRF 0 1 X

Application notes The LVDRF flag is not cleared when another RESET type occurs (external or watchdog), the LVDRF flag remains set to keep trace of the original failure. In this case, a watchdog reset can be detected by software while an external reset can not. CAUTION: When the LVD is not activated with the associated option byte, the WDGRF flag can not be used in the application.

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7 INTERRUPTS
7.1 INTRODUCTION The ST7 enhanced interrupt management provides the following features: I Hardware interrupts I Software interrupt (TRAP) I Nested or concurrent interrupt management with flexible interrupt priority and level management: Up to 4 software programmable nesting levels Up to 16 interrupt vectors fixed by hardware 2 non maskable events: RESET, TRAP 1 maskable Top Level event: TLI This interrupt management is based on: Bit 5 and bit 3 of the CPU CC register (I1:0), Interrupt software priority registers (ISPRx), Fixed interrupt vector addresses located at the high addresses of the memory map (FFE0h to FFFFh) sorted by hardware priority order. This enhanced interrupt controller guarantees full upward compatibility with the standard (not nested) ST7 interrupt controller. 7.2 MASKING AND PROCESSING FLOW The interrupt masking is managed by the I1 and I0 bits of the CC register and the ISPRx registers which give the interrupt software priority level of Figure 18. Interrupt Processing Flowchart
RESET PENDING INTERRUPT N Y TRAP Interrupt has the same or a lower software priority than current one N I1:0 Interrupt has a higher software priority than current one Y

each interrupt vector (see Table 5). The processing flow is shown in Figure 18 When an interrupt request has to be serviced: Normal processing is suspended at the end of the current instruction execution. The PC, X, A and CC registers are saved onto the stack. I1 and I0 bits of CC register are set according to the corresponding values in the ISPRx registers of the serviced interrupt vector. The PC is then loaded with the interrupt vector of the interrupt to service and the first instruction of the interrupt service routine is fetched (refer to Interrupt Mapping table for vector addresses). The interrupt service routine should end with the IRET instruction which causes the contents of the saved registers to be recovered from the stack. Note: As a consequence of the IRET instruction, the I1 and I0 bits will be restored from the stack and the program in the previous level will resume. Table 5. Interrupt Software Priority Levels
Interrupt software priority Level 0 (main) Level 1 Level 2 Level 3 (= interrupt disable) Level Low I1 1 0 0 1 I0 0 1 0 1

High

FETCH NEXT INSTRUCTION

THE INTERRUPT STAYS PENDING

IRET N

RESTORE PC, X, A, CC FROM STACK

EXECUTE INSTRUCTION

STACK PC, X, A, CC LOAD I1:0 FROM INTERRUPT SW REG. LOAD PC FROM INTERRUPT VECTOR

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INTERRUPTS (Contd) Servicing Pending Interrupts As several interrupts can be pending at the same time, the interrupt to be taken into account is determined by the following two-step process: the highest software priority interrupt is serviced, if several interrupts have the same software priority then the interrupt with the highest hardware priority is serviced first. Figure 19 describes this decision process. Figure 19. Priority Decision Process
PENDING INTERRUPTS

TRAP (Non Maskable Software Interrupt) This software interrupt is serviced when the TRAP instruction is executed. It will be serviced according to the flowchart in Figure 18. Caution: TRAP can be interrupted by a TLI. I RESET The RESET source has the highest priority in the ST7. This means that the first current routine has the highest software priority (level 3) and the highest hardware priority. See the RESET chapter for more details.
I

Same

SOFTWARE PRIORITY

Different

HIGHEST SOFTWARE PRIORITY SERVICED HIGHEST HARDWARE PRIORITY SERVICED

When an interrupt request is not serviced immediately, it is latched and then processed when its software priority combined with the hardware priority becomes the highest one. Note 1: The hardware priority is exclusive while the software one is not. This allows the previous process to succeed with only one interrupt. Note 2: TLI, RESET and TRAP can be considered as having the highest software priority in the decision process. Different Interrupt Vector Sources Two interrupt source types are managed by the ST7 interrupt controller: the non-maskable type (RESET, TRAP) and the maskable type (external or from internal peripherals). Non-Maskable Sources These sources are processed regardless of the state of the I1 and I0 bits of the CC register (see Figure 18). After stacking the PC, X, A and CC registers (except for RESET), the corresponding vector is loaded in the PC register and the I1 and I0 bits of the CC are set to disable interrupts (level 3). These sources allow the processor to exit HALT mode.

Maskable Sources Maskable interrupt vector sources can be serviced if the corresponding interrupt is enabled and if its own interrupt software priority (in ISPRx registers) is higher than the one currently being serviced (I1 and I0 in CC register). If any of these two conditions is false, the interrupt is latched and thus remains pending. I TLI (Top Level Hardware Interrupt) This hardware interrupt occurs when a specific edge is detected on the dedicated TLI pin. It will be serviced according to the flowchart in Figure 18 as a trap. Caution: A TRAP instruction must not be used in a TLI service routine. I External Interrupts External interrupts allow the processor to exit from HALT low power mode. External interrupt sensitivity is software selectable through the External Interrupt Control register (EICR). External interrupt triggered on edge will be latched and the interrupt request automatically cleared upon entering the interrupt service routine. If several input pins of a group connected to the same interrupt line are selected simultaneously, these will be logically ORed. I Peripheral Interrupts Usually the peripheral interrupts cause the MCU to exit from HALT mode except those mentioned in the Interrupt Mapping table. A peripheral interrupt occurs when a specific flag is set in the peripheral status registers and if the corresponding enable bit is set in the peripheral control register. The general sequence for clearing an interrupt is based on an access to the status register followed by a read or write to an associated register. Note: The clearing sequence resets the internal latch. A pending interrupt (i.e. waiting for being serviced) will therefore be lost if the clear sequence is executed.

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INTERRUPTS (Contd) 7.3 INTERRUPTS AND LOW POWER MODES All interrupts allow the processor to exit the WAIT low power mode. On the contrary, only external and other specified interrupts allow the processor to exit from the HALT modes (see column Exit from HALT in Interrupt Mapping table). When several pending interrupts are present while exiting HALT mode, the first one serviced can only be an interrupt with exit from HALT mode capability and it is selected through the same decision process shown in Figure 19. Note: If an interrupt, that is not able to Exit from HALT mode, is pending with the highest priority when exiting HALT mode, this interrupt is serviced after the first one serviced. Figure 20. Concurrent Interrupt Management
TRAP SOFTWARE PRIORITY LEVEL IT2 IT1 IT4 IT3 IT0 I1 I0

7.4 CONCURRENT & NESTED MANAGEMENT The following Figure 20 and Figure 21 show two different interrupt management modes. The first is called concurrent mode and does not allow an interrupt to be interrupted, unlike the nested mode in Figure 21. The interrupt hardware priority is given in this order from the lowest to the highest: MAIN, IT4, IT3, IT2, IT1, IT0, TLI. The software priority is given for each interrupt. Warning: A stack overflow may occur without notifying the software of the failure.

HARDWARE PRIORITY

TRAP IT0 IT1 IT2 IT3 RIM IT4 MAIN MAIN IT1

3 3 3 3 3 3 3/0 10

1 1 1 1 1 1 1 1 1 1 1 1

11 / 10 Figure 21. Nested Interrupt Management

TRAP

SOFTWARE PRIORITY LEVEL

IT0

IT2

IT1

IT4

IT3

I1

I0

HARDWARE PRIORITY

TRAP IT0 IT1 IT2 IT3 RIM IT4 MAIN IT4 MAIN IT1 IT2

3 3 2 1 3 3 3/0 10

1 1 1 1 0 0 0 1 1 1 1 1

11 / 10

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USED STACK = 10 BYTES

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INTERRUPTS (Contd) 7.5 INTERRUPT REGISTER DESCRIPTION CPU CC REGISTER INTERRUPT BITS Read /Write Reset Value: 111x 1010 (xAh)
7 1 1 I1 H I0 N Z 0 C ISPR1 I1_7 I0_7 I1_6 I0_6 I1_5 I0_5 I0_9 I1_4 I1_8 I0_4 I0_8

INTERRUPT SOFTWARE PRIORITY REGISTERS (ISPRX) Read/Write (bit 7:4 of ISPR3 are read only) Reset Value: 1111 1111 (FFh)
7 ISPR0 I1_3 I0_3 I1_2 I0_2 I1_1 I0_1 I1_0 0 I0_0

Bit 5, 3 = I1, I0 Software Interrupt Priority These two bits indicate the current interrupt software priority.
Interrupt Software Priority Level 0 (main) Level 1 Level 2 Level 3 (= interrupt disable*) Level Low I1 1 0 0 1 I0 0 1 0 1

ISPR2 ISPR3

I1_11 I0_11 I1_10 I0_10 I1_9 1 1 1 1

I1_13 I0_13 I1_12 I0_12

High

These two bits are set/cleared by hardware when entering in interrupt. The loaded value is given by the corresponding bits in the interrupt software priority registers (ISPRx). They can be also set/cleared by software with the RIM, SIM, HALT, WFI, IRET and PUSH/POP instructions (see Interrupt Dedicated Instruction Set table). *Note: TLI, TRAP and RESET events can interrupt a level 3 program.

These four registers contain the interrupt software priority of each interrupt vector. Each interrupt vector (except RESET and TRAP) has corresponding bits in these registers where its own software priority is stored. This correspondance is shown in the following table.
Vector address FFFBh-FFFAh FFF9h-FFF8h ... FFE1h-FFE0h ISPRx bits I1_0 and I0_0 bits* I1_1 and I0_1 bits ... I1_13 and I0_13 bits

Each I1_x and I0_x bit value in the ISPRx registers has the same meaning as the I1 and I0 bits in the CC register. Level 0 can not be written (I1_x=1, I0_x=0). In this case, the previously stored value is kept. (example: previous=CFh, write=64h, result=44h) The TLI, RESET, and TRAP vectors have no software priorities. When one is serviced, the I1 and I0 bits of the CC register are both set. *Note: Bits in the ISPRx registers which correspond to the TLI can be read and written but they are not significant in the interrupt process management. Caution: If the I1_x and I0_x bits are modified while the interrupt x is executed the following behaviour has to be considered: If the interrupt x is still pending (new interrupt or flag not cleared) and the new software priority is higher than the previous one, the interrupt x is re-entered. Otherwise, the software priority stays unchanged up to the next interrupt request (after the IRET of the interrupt x).

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INTERRUPTS (Contd)

Table 6. Dedicated Interrupt Instruction Set

Instruction HALT IRET JRM JRNM POP CC RIM SIM TRAP WFI New Description Entering Halt mode Interrupt routine return Jump if I1:0=11 (level 3) Jump if I1:0<>11 Pop CC from the Stack Enable interrupt (level 0 set) Disable interrupt (level 3 set) Software trap Wait for interrupt Pop CC, A, X, PC I1:0=11 ? I1:0<>11 ? Mem => CC Load 10 in I1:0 of CC Load 11 in I1:0 of CC Software NMI I1 1 1 1 1 H I0 0 1 1 0 N Z C Function/Example I1 1 I1 H H I0 0 I0 N Z C N Z C

Note: During the execution of an interrupt routine, the HALT, POPCC, RIM, SIM and WFI instructions change the current software priority up to the next IRET instruction or one of the previously mentioned instructions.

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INTERRUPTS (Contd) Table 7. Interrupt Mapping

N Source Block RESET TRAP 0 1 2 3 4 5 6 7 8 9 10 11 12 13 SPI TIMER A TIMER B SCI AVD I2C PWM ART TLI MCC/RTC CSS ei0 ei1 ei2 ei3 Reset Software interrupt External top level interrupt Main clock controller time base interrupt Safe oscillator activation interrupt External interrupt port A3..0 External interrupt port F2..0 External interrupt port B3..0 External interrupt port B7..4 Not used SPI peripheral interrupts TIMER A peripheral interrupts TIMER B peripheral interrupts SCI Peripheral interrupts Auxiliary Voltage detector interrupt I2C Peripheral interrupts PWM ART interrupt SPICSR TASR TBSR SCISR SICSR (see periph) ARTCSR Lower Priority yes2 no no no no no yes3 N/A Description Register Label N/A EICR MCCSR SICSR Higher Priority Priority Order Exit from HALT1) yes no yes yes yes yes yes yes Address Vector FFFEh-FFFFh FFFCh-FFFDh FFFAh-FFFBh FFF8h-FFF9h FFF6h-FFF7h FFF4h-FFF5h FFF2h-FFF3h FFF0h-FFF1h FFEEh-FFEFh FFECh-FFEDh FFEAh-FFEBh FFE8h-FFE9h FFE6h-FFE7h FFE4h-FFE5h FFE2h-FFE3h FFE0h-FFE1h

Notes: 1. Valid for HALT mode except for the MCC/RTC or CSS interrupt source which exits from ACTIVE-HALT mode. 2. Exit from HALT possible when SPI is in slave mode. 3. Exit from HALT possible when PWM ART is in external clock mode.

7.6 EXTERNAL INTERRUPTS 7.6.1 I/O Port Interrupt Sensitivity The external interrupt sensitivity is controlled by the IPA, IPB and ISxx bits of the EICR register (Figure 22). This control allows to have up to 4 fully independent external interrupt source sensitivities. Each external interrupt source can be generated on four (or five) different events on the pin: I Falling edge I Rising edge I Falling and rising edge Falling edge and low level I Rising edge and high level (only for ei0 and ei2) To guarantee correct functionality, the sensitivity bits in the EICR register can be modified only when the I1 and I0 bits of the CC register are both set to 1 (level 3). This means that interrupts must be disabled before changing sensitivity. The pending interrupts are cleared by writing a different value in the ISx[1:0], IPA or IPB bits of the EICR.
I

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INTERRUPTS (Contd) Figure 22. External Interrupt Control bits

PORT A [3:0] INTERRUPTS PAOR.3 PADDR.3 PA3

EICR IS20 IS21 PA3 PA2 PA1 PA0

SENSITIVITY CONTROL

ei0 INTERRUPT SOURCE

IPA BIT

PORT F [2:0] INTERRUPTS PFOR.2 PFDDR.2 PF2

EICR IS20 IS21 PF2 PF1 PF0

SENSITIVITY CONTROL

ei1 INTERRUPT SOURCE

PORT B [3:0] INTERRUPTS PBOR.3 PBDDR.3 PB3

EICR IS10 IS11 PB3 PB2 PB1 PB0

SENSITIVITY CONTROL

ei2 INTERRUPT SOURCE

IPB BIT

PORT B [7:4] INTERRUPTS PBOR.7 PBDDR.7 PB7

EICR IS10 IS11 PB7 PB6 PB5 PB4

SENSITIVITY CONTROL

ei3 INTERRUPT SOURCE

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7.7 EXTERNAL INTERRUPT CONTROL REGISTER (EICR) Read /Write Reset Value: 0000 0000 (00h)
7 IS11 IS10 IPB IS21 IS20 IPA TLIS 0 TLIE 0 0 1 0 1

- ei0 (port A3..0)

External Interrupt Sensitivity IS21 IS20 IPA bit =0 Falling edge & low level Rising edge only Falling edge only IPA bit =1 Rising edge & high level Falling edge only Rising edge only

Bit 7:6 = IS1[1:0] ei2 and ei3 sensitivity The interrupt sensitivity, defined using the IS1[1:0] bits, is applied to the following external interrupts: - ei2 (port B3..0)
External Interrupt Sensitivity IS11 IS10 IPB bit =0 0 0 1 1 0 1 0 1 Falling edge & low level Rising edge only Falling edge only IPB bit =1 Rising edge & high level Falling edge only Rising edge only

0 1 1

Rising and falling edge

- ei1 (port F2..0)

IS21 IS20 0 0 1 1 0 1 0 1 External Interrupt Sensitivity Falling edge & low level Rising edge only Falling edge only Rising and falling edge

Rising and falling edge

- ei3 (port B7..4)

IS11 IS10 0 0 1 1 0 1 0 1 External Interrupt Sensitivity Falling edge & low level Rising edge only Falling edge only Rising and falling edge

These 2 bits can be written only when I1 and I0 of the CC register are both set to 1 (level 3). Bit 2 = IPA Interrupt polarity for port A This bit is used to invert the sensitivity of the port A [3:0] external interrupts. It can be set and cleared by software only when I1 and I0 of the CC register are both set to 1 (level 3). 0: No sensitivity inversion 1: Sensitivity inversion Bit 1 = TLIS TLI sensitivity This bit allows to toggle the TLI edge sensitivity. It can be set and cleared by software only when TLIE bit is cleared. 0: Falling edge 1: Rising edge Bit 0 = TLIE TLI enable This bit allows to enable or disable the TLI capability on the dedicated pin. It is set and cleared by software. 0: TLI disabled 1: TLI enabled Note: a parasitic interrupt can be generated when

These 2 bits can be written only when I1 and I0 of the CC register are both set to 1 (level 3). Bit 5 = IPB Interrupt polarity for port B This bit is used to invert the sensitivity of the port B [3:0] external interrupts. It can be set and cleared by software only when I1 and I0 of the CC register are both set to 1 (level 3). 0: No sensitivity inversion 1: Sensitivity inversion Bit 4:3 = IS2[1:0] ei0 and ei1 sensitivity The interrupt sensitivity, defined using the IS2[1:0] bits, is applied to the following external interrupts:

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INTERRUPTS (Contd) Table 8. Nested Interrupts Register Map and Reset Values
Address (Hex.) 0024h Register Label ISPR0 Reset Value ISPR1 Reset Value ISPR2 Reset Value ISPR3 Reset Value EICR Reset Value 7 ei1 I1_3 1 SPI 0025h I1_7 1 AVD 0026h I1_11 1 I0_11 1 I1_10 1 I0_7 1 I1_6 1 SCI I0_10 1 I0_6 1 I1_5 1 I0_3 1 I1_2 1 6 5 ei0 I0_2 1 4 3 MCC + SI I1_1 1 ei3 I0_5 1 I1_4 1 I0_1 1 1 ei2 I0_4 1 2 1 TLI 1 0

TIMER B I1_9 I0_9 1 1 PWMART I1_13 1 IS20 0 I0_13 1 IPA 0

TIMER A I1_8 I0_8 1 1 I2C I1_12 1 TLIS 0 I0_12 1 TLIE 0

0027h 0028h

1 IS11 0

1 IS10 0

1 IPB 0

1 IS21 0

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8 POWER SAVING MODES

8.1 INTRODUCTION To give a large measure of flexibility to the application in terms of power consumption, four main power saving modes are implemented in the ST7 (see Figure 23): SLOW, WAIT (SLOW WAIT), ACTIVE HALT and HALT. After a RESET the normal operating mode is selected by default (RUN mode). This mode drives the device (CPU and embedded peripherals) by means of a master clock which is based on the main oscillator frequency divided or multiplied by 2 (fOSC2). From RUN mode, the different power saving modes may be selected by setting the relevant register bits or by calling the specific ST7 software instruction whose action depends on the oscillator status. Figure 23. Power Saving Mode Transitions Figure 24. SLOW Mode Clock Transitions
High
fOSC2/2 fOSC2/4 fOSC2

8.2 SLOW MODE This mode has two targets: To reduce power consumption by decreasing the internal clock in the device, To adapt the internal clock frequency (fCPU) to the available supply voltage. SLOW mode is controlled by three bits in the MCCSR register: the SMS bit which enables or disables Slow mode and two CPx bits which select the internal slow frequency (fCPU). In this mode, the master clock frequency (fOSC2) can be divided by 2, 4, 8 or 16. The CPU and peripherals are clocked at this lower frequency (fCPU). Note: SLOW-WAIT mode is activated when entering the WAIT mode while the device is already in SLOW mode.

RUN SLOW MCCSR WAIT SLOW WAIT ACTIVE HALT HALT Low POWER CONSUMPTION

fCPU

fOSC2 CP1:0 SMS 00 01

NEW SLOW FREQUENCY REQUEST

NORMAL RUN MODE REQUEST

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POWER SAVING MODES (Contd) 8.3 WAIT MODE WAIT mode places the MCU in a low power consumption mode by stopping the CPU. This power saving mode is selected by calling the WFI instruction. All peripherals remain active. During WAIT mode, the I[1:0] bits of the CC register are forced to 10, to enable all interrupts. All other registers and memory remain unchanged. The MCU remains in WAIT mode until an interrupt or RESET occurs, whereupon the Program Counter branches to the starting address of the interrupt or Reset service routine. The MCU will remain in WAIT mode until a Reset or an Interrupt occurs, causing it to wake up. Refer to Figure 25. Figure 25. WAIT Mode Flow-chart
OSCILLATOR PERIPHERALS CPU I[1:0] BITS ON ON OFF 10

WFI INSTRUCTION

N RESET N INTERRUPT Y OSCILLATOR PERIPHERALS CPU I[1:0] BITS ON OFF ON 10 Y

256 OR 4096 CPU CLOCK CYCLE DELAY

OSCILLATOR PERIPHERALS CPU I[1:0] BITS

ON ON ON XX 1)

FETCH RESET VECTOR OR SERVICE INTERRUPT

Note: 1. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are set to the current software priority level of the interrupt routine and recovered when the CC register is popped.

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POWER SAVING MODES (Contd) 8.4 ACTIVE-HALT AND HALT MODES ACTIVE-HALT and HALT modes are the two lowest power consumption modes of the MCU. They are both entered by executing the HALT instruction. The decision to enter either in ACTIVE-HALT or HALT mode is given by the MCC/RTC interrupt enable flag (OIE bit in MCCSR register).
MCCSR OIE bit 0 1 Power Saving Mode entered when HALT instruction is executed HALT mode ACTIVE-HALT mode

the interrupt occurs (tDELAY = 256 or 4096 tCPU delay depending on option byte). Otherwise, the ST7 enters HALT mode for the remaining tDELAY period. Figure 26. ACTIVE-HALT Timing Overview
RUN ACTIVE 256 OR 4096 CPU HALT CYCLE DELAY 1) RESET OR INTERRUPT RUN

HALT INSTRUCTION [MCCSR.OIE=1]

FETCH VECTOR

8.4.1 ACTIVE-HALT MODE ACTIVE-HALT mode is the lowest power consumption mode of the MCU with a real time clock available. It is entered by executing the HALT instruction when the OIE bit of the Main Clock Controller Status register (MCCSR) is set (see Section 10.2 on page 57 for more details on the MCCSR register). The MCU can exit ACTIVE-HALT mode on reception of an MCC/RTC interrupt or a RESET. When exiting ACTIVE-HALT mode by means of an MCC/ RTC interrupt, no 256 or 4096 CPU cycle delay occurs. The CPU resumes operation by servicing the interrupt or by fetching the reset vector which woke it up (see Figure 27). When entering ACTIVE-HALT mode, the I[1:0] bits in the CC register are forced to 10b to enable interrupts. Therefore, if an interrupt is pending, the MCU wakes up immediately. In ACTIVE-HALT mode, only the main oscillator and its associated counter (MCC/RTC) are running to keep a wake-up time base. All other peripherals are not clocked except those which get their clock supply from another clock generator (such as external or auxiliary oscillator). The safeguard against staying locked in ACTIVEHALT mode is provided by the oscillator interrupt. Note: As soon as the interrupt capability of one of the oscillators is selected (MCCSR.OIE bit set), entering ACTIVE-HALT mode while the Watchdog is active does not generate a RESET. This means that the device cannot spend more than a defined delay in this power saving mode. CAUTION: When exiting ACTIVE-HALT mode following an MCC/RTC interrupt, OIE bit of MCCSR register must not be cleared before tDELAY after

Figure 27. ACTIVE-HALT Mode Flow-chart

HALT INSTRUCTION (MCCSR.OIE=1) OSCILLATOR PERIPHERALS 2) CPU I[1:0] BITS N N ON OFF OFF 10

RESET Y

INTERRUPT 3) Y

OSCILLATOR PERIPHERALS CPU I[1:0] BITS

ON OFF ON XX 4)

256 OR 4096 CPU CLOCK CYCLE DELAY OSCILLATOR PERIPHERALS CPU I[1:0] BITS ON ON ON XX 4)

FETCH RESET VECTOR OR SERVICE INTERRUPT

Notes: 1. This delay occurs only if the MCU exits ACTIVEHALT mode by means of a RESET. 2. Peripheral clocked with an external clock source can still be active. 3. Only the MCC/RTC interrupt can exit the MCU from ACTIVE-HALT mode. 4. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are set to the current software priority level of the interrupt routine and restored when the CC register is popped.

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POWER SAVING MODES (Contd) 8.4.2 HALT MODE The HALT mode is the lowest power consumption mode of the MCU. It is entered by executing the HALT instruction when the OIE bit of the Main Clock Controller Status register (MCCSR) is cleared (see Section 10.2 on page 57 for more details on the MCCSR register). The MCU can exit HALT mode on reception of either a specific interrupt (see Table 7, Interrupt Mapping, on page 37) or a RESET. When exiting HALT mode by means of a RESET or an interrupt, the oscillator is immediately turned on and the 256 or 4096 CPU cycle delay is used to stabilize the oscillator. After the start up delay, the CPU resumes operation by servicing the interrupt or by fetching the reset vector which woke it up (see Figure 29). When entering HALT mode, the I[1:0] bits in the CC register are forced to 10bto enable interrupts. Therefore, if an interrupt is pending, the MCU wakes up immediately. In HALT mode, the main oscillator is turned off causing all internal processing to be stopped, including the operation of the on-chip peripherals. All peripherals are not clocked except the ones which get their clock supply from another clock generator (such as an external or auxiliary oscillator). The compatibility of Watchdog operation with HALT mode is configured by the WDGHALT option bit of the option byte. The HALT instruction when executed while the Watchdog system is enabled, can generate a Watchdog RESET (see Section 14.1 on page 172 for more details). Figure 28. HALT Timing Overview
RUN HALT 256 OR 4096 CPU CYCLE DELAY RESET OR INTERRUPT FETCH VECTOR FETCH RESET VECTOR OR SERVICE INTERRUPT RUN

Figure 29. HALT Mode Flow-chart

HALT INSTRUCTION (MCCSR.OIE=0) ENABLE WDGHALT 1) 1 WATCHDOG RESET OSCILLATOR OFF PERIPHERALS 2) OFF CPU OFF I[1:0] BITS 10 0 WATCHDOG DISABLE

N RESET N Y INTERRUPT 3) Y OSCILLATOR PERIPHERALS CPU I[1:0] BITS ON OFF ON XX 4)

256 OR 4096 CPU CLOCK CYCLE DELAY OSCILLATOR PERIPHERALS CPU I[1:0] BITS ON ON ON XX 4)

HALT INSTRUCTION [MCCSR.OIE=0]

Notes: 1. WDGHALT is an option bit. See option byte section for more details. 2. Peripheral clocked with an external clock source can still be active. 3. Only some specific interrupts can exit the MCU from HALT mode (such as external interrupt). Refer to Table 7, Interrupt Mapping, on page 37 for more details. 4. Before servicing an interrupt, the CC register is pushed on the stack. The I[1:0] bits of the CC register are set to the current software priority level of the interrupt routine and recovered when the CC register is popped.

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POWER SAVING MODES (Contd) 8.4.2.1 Halt Mode Recommendations Make sure that an external event is available to wake up the microcontroller from Halt mode. When using an external interrupt to wake up the microcontroller, reinitialize the corresponding I/O as Input Pull-up with Interrupt before executing the HALT instruction. The main reason for this is that the I/O may be wrongly configured due to external interference or by an unforeseen logical condition. For the same reason, reinitialize the level sensitiveness of each external interrupt as a precautionary measure. The opcode for the HALT instruction is 0x8E. To avoid an unexpected HALT instruction due to a program counter failure, it is advised to clear all occurrences of the data value 0x8E from memory. For example, avoid defining a constant in ROM with the value 0x8E. As the HALT instruction clears the interrupt mask in the CC register to allow interrupts, the user may choose to clear all pending interrupt bits before executing the HALT instruction. This avoids entering other peripheral interrupt routines after executing the external interrupt routine corresponding to the wake-up event (reset or external interrupt).

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9 I/O PORTS
9.1 INTRODUCTION The I/O ports offer different functional modes: transfer of data through digital inputs and outputs and for specific pins: external interrupt generation alternate signal input/output for the on-chip peripherals. An I/O port contains up to 8 pins. Each pin can be programmed independently as digital input (with or without interrupt generation) or digital output. 9.2 FUNCTIONAL DESCRIPTION Each port has 2 main registers: Data Register (DR) Data Direction Register (DDR) and one optional register: Option Register (OR) Each I/O pin may be programmed using the corresponding register bits in the DDR and OR registers: bit X corresponding to pin X of the port. The same correspondence is used for the DR register. The following description takes into account the OR register, (for specific ports which do not provide this register refer to the I/O Port Implementation section). The generic I/O block diagram is shown in Figure 30 9.2.1 Input Modes The input configuration is selected by clearing the corresponding DDR register bit. In this case, reading the DR register returns the digital value applied to the external I/O pin. Different input modes can be selected by software through the OR register. Notes: 1. Writing the DR register modifies the latch value but does not affect the pin status. 2. When switching from input to output mode, the DR register has to be written first to drive the correct level on the pin as soon as the port is configured as an output. 3. Do not use read/modify/write instructions (BSET or BRES) to modify the DR register External interrupt function When an I/O is configured as Input with Interrupt, an event on this I/O can generate an external interrupt request to the CPU. Each pin can independently generate an interrupt request. The interrupt sensitivity is independently programmable using the sensitivity bits in the EICR register. Each external interrupt vector is linked to a dedicated group of I/O port pins (see pinout description and interrupt section). If several input pins are selected simultaneously as interrupt sources, these are first detected according to the sensitivity bits in the EICR register and then logically ORed. The external interrupts are hardware interrupts, which means that the request latch (not accessible directly by the application) is automatically cleared when the corresponding interrupt vector is fetched. To clear an unwanted pending interrupt by software, the sensitivity bits in the EICR register must be modified. 9.2.2 Output Modes The output configuration is selected by setting the corresponding DDR register bit. In this case, writing the DR register applies this digital value to the I/O pin through the latch. Then reading the DR register returns the previously stored value. Two different output modes can be selected by software through the OR register: Output push-pull and open-drain. DR register value and output pin status:
DR 0 1 Push-pull VSS VDD Open-drain Vss Floating

9.2.3 Alternate Functions When an on-chip peripheral is configured to use a pin, the alternate function is automatically selected. This alternate function takes priority over the standard I/O programming. When the signal is coming from an on-chip peripheral, the I/O pin is automatically configured in output mode (push-pull or open drain according to the peripheral). When the signal is going to an on-chip peripheral, the I/O pin must be configured in input mode. In this case, the pin state is also digitally readable by addressing the DR register. Note: Input pull-up configuration can cause unexpected value at the input of the alternate peripheral input. When an on-chip peripheral use a pin as input and output, this pin has to be configured in input floating mode.

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I/O PORTS (Contd) Figure 30. I/O Port General Block Diagram
REGISTER ACCESS ALTERNATE OUTPUT 1 0 ALTERNATE ENABLE DR

VDD

P-BUFFER (see table below) PULL-UP (see table below) VDD

DDR PULL-UP CONDITION If implemented OR SEL N-BUFFER DDR SEL CMOS SCHMITT TRIGGER ANALOG INPUT DIODES (see table below) PAD

OR

EXTERNAL INTERRUPT SOURCE (eix)

Table 9. I/O Port Mode Options

Configuration Mode Input Floating with/without Interrupt Pull-up with/without Interrupt Push-pull Open Drain (logic level) True Open Drain Pull-Up Off On Off NI P-Buffer Off On Off NI On On Diodes to VDD to VSS

Output

Legend: NI - not implemented Off - implemented not activated On - implemented and activated

DATA BUS

DR SEL

1 0

ALTERNATE INPUT

NI (see note)

Note: The diode to VDD is not implemented in the true open drain pads. A local protection between the pad and VSS is implemented to protect the device against positive stress.

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I/O PORTS (Contd) Table 10. I/O Port Configurations

Hardware Configuration
NOT IMPLEMENTED IN TRUE OPEN DRAIN I/O PORTS VDD RPU PAD PULL-UP CONDITION DR REGISTER ACCESS

DR REGISTER

W DATA BUS R

INPUT 1)

ALTERNATE INPUT EXTERNAL INTERRUPT SOURCE (ei x) INTERRUPT CONDITION ANALOG INPUT NOT IMPLEMENTED IN TRUE OPEN DRAIN I/O PORTS

OPEN-DRAIN OUTPUT 2)

VDD RPU

DR REGISTER ACCESS

PAD

DR REGISTER

R/W

DATA BUS

ALTERNATE ENABLE

ALTERNATE OUTPUT

PUSH-PULL OUTPUT 2)

NOT IMPLEMENTED IN TRUE OPEN DRAIN I/O PORTS

VDD RPU

DR REGISTER ACCESS

PAD

DR REGISTER

R/W

DATA BUS

ALTERNATE ENABLE

ALTERNATE OUTPUT

Notes: 1. When the I/O port is in input configuration and the associated alternate function is enabled as an output, reading the DR register will read the alternate function output status. 2. When the I/O port is in output configuration and the associated alternate function is enabled as an input, the alternate function reads the pin status given by the DR register content.

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I/O PORTS (Contd) CAUTION: The alternate function must not be activated as long as the pin is configured as input with interrupt, in order to avoid generating spurious interrupts. Analog alternate function When the pin is used as an ADC input, the I/O must be configured as floating input. The analog multiplexer (controlled by the ADC registers) switches the analog voltage present on the selected pin to the common analog rail which is connected to the ADC input. It is recommended not to change the voltage level or loading on any port pin while conversion is in progress. Furthermore it is recommended not to have clocking pins located close to a selected analog pin. WARNING: The analog input voltage level must be within the limits stated in the absolute maximum ratings. 9.3 I/O PORT IMPLEMENTATION The hardware implementation on each I/O port depends on the settings in the DDR and OR registers and specific feature of the I/O port such as ADC Input or true open drain. Switching these I/O ports from one state to another should be done in a sequence that prevents unwanted side effects. Recommended safe transitions are illustrated in Figure 31 Other transitions are potentially risky and should be avoided, since they are likely to present unwanted side-effects such as spurious interrupt generation.

Figure 31. Interrupt I/O Port State Transitions

01
INPUT floating/pull-up interrupt

00
INPUT floating (reset state)

10
OUTPUT open-drain

11
OUTPUT push-pull

XX

= DDR, OR

9.4 LOW POWER MODES

Mode WAIT HALT Description No effect on I/O ports. External interrupts cause the device to exit from WAIT mode. No effect on I/O ports. External interrupts cause the device to exit from HALT mode.

9.5 INTERRUPTS The external interrupt event generates an interrupt if the corresponding configuration is selected with DDR and OR registers and the interrupt mask in the CC register is not active (RIM instruction).
Interrupt Event External interrupt on selected external event Enable Event Control Flag Bit DDRx ORx Exit from Wait Yes Exit from Halt Yes

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I/O PORTS (Contd) 9.5.1 I/O Port Implementation The I/O port register configurations are summarised as follows. Standard Ports PA5:4, PC7:0, PD7:0, PE7:34, PE1:0, PF7:3,
MODE floating input pull-up input open drain output push-pull output DDR 0 0 1 1 OR 0 1 0 1

PA3, PB7, PB3, PF2 (without pull-up)

MODE floating input floating interrupt input open drain output push-pull output DDR 0 0 1 1 OR 0 1 0 1

True Open Drain Ports PA7:6

MODE floating input open drain (high sink ports) DDR 0 1

Interrupt Ports PA2:0, PB6:5, PB4, PB2:0, PF1:0 (with pull-up)

MODE floating input pull-up interrupt input open drain output push-pull output DDR 0 0 1 1 OR 0 1 0 1

Pull-up Input Port PE2

MODE pull-up input

Table 11. Port Configuration

Port Pin name
PA7:6 PA5:4 PA3 PA2:0 PB7, PB3 Port B Port C Port D Port E PB6:5, PB4, PB2:0 PC7:0 PD7:0 PE7:3, PE1:0 PE2 PF7:3 PF2 PF1:0

Input OR = 0
floating floating floating floating floating floating floating floating floating floating floating floating pull-up floating interrupt pull-up interrupt floating interrupt pull-up interrupt pull-up pull-up pull-up

Output OR = 1 OR = 0 OR = 1
true open-drain open drain push-pull open drain push-pull open drain open drain open drain open drain open drain open drain push-pull push-pull push-pull push-pull push-pull push-pull push-pull push-pull push-pull

Port A

pull-up input only pull-up open drain floating interrupt pull-up interrupt open drain open drain

Port F

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I/O PORTS (Contd) Table 12. I/O Port Register Map and Reset Values
Address (Hex.) Register Label 7 0 6 0 5 0 4 0 3 0 2 0 1 0 0 0

Reset Value of all I/O port registers 0000h PADR 0001h PADDR 0002h PAOR 0003h PBDR 0004h PBDDR 0005h PBOR 0006h PCDR 0007h PCDDR 0008h PCOR 0009h PDDR 000Ah PDDDR 000Bh PDOR 000Ch PEDR 000Dh PEDDR 000Eh PEOR 000Fh PFDR 0010h PFDDR 0011h PFOR

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

MSB

LSB

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10 ON-CHIP PERIPHERALS
10.1 WATCHDOG TIMER (WDG) 10.1.1 Introduction The Watchdog timer is used to detect the occurrence of a software fault, usually generated by external interference or by unforeseen logical conditions, which causes the application program to abandon its normal sequence. The Watchdog circuit generates an MCU reset on expiry of a programmed time period, unless the program refreshes the counters contents before the T6 bit becomes cleared. 10.1.2 Main Features I Programmable free-running downcounter I Programmable reset I Reset (if watchdog activated) when the T6 bit reaches zero I Optional reset on HALT instruction (configurable by option byte) I Hardware Watchdog selectable by option byte 10.1.3 Functional Description The counter value stored in the Watchdog Control register (WDGCR bits T[6:0]), is decremented every 16384 fOSC2 cycles (approx.), and the length of the timeout period can be programmed by the user in 64 increments. If the watchdog is activated (the WDGA bit is set) and when the 7-bit timer (bits T[6:0]) rolls over from 40h to 3Fh (T6 becomes cleared), it initiates a reset cycle pulling low the reset pin for typically 500ns. The application program must write in the WDGCR register at regular intervals during normal operation to prevent an MCU reset. This downcounter is free-running: it counts down even if the watchdog is disabled. The value to be stored in the WDGCR register must be between FFh and C0h: The WDGA bit is set (watchdog enabled) The T6 bit is set to prevent generating an immediate reset The T[5:0] bits contain the number of increments which represents the time delay before the watchdog produces a reset (see Figure 33. Approximate Timeout Duration). The timing varies between a minimum and a maximum value due to the unknown status of the prescaler when writing to the WDGCR register (see Figure 34). Following a reset, the watchdog is disabled. Once activated it cannot be disabled, except by a reset. The T6 bit can be used to generate a software reset (the WDGA bit is set and the T6 bit is cleared). If the watchdog is activated, the HALT instruction will generate a Reset.

Figure 32. Watchdog Block Diagram

RESET

fOSC2 MCC/RTC
WATCHDOG CONTROL REGISTER (WDGCR) DIV 64 WDGA T6 T5 T4 T3 T2 T1 T0

6-BIT DOWNCOUNTER (CNT)

12-BIT MCC RTC COUNTER MSB

11 6 5

LSB
0

TB[1:0] bits (MCCSR Register)

WDG PRESCALER DIV 4

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WATCHDOG TIMER (Contd) 10.1.4 How to Program the Watchdog Timeout Figure 33 shows the linear relationship between the 6-bit value to be loaded in the Watchdog Counter (CNT) and the resulting timeout duration in milliseconds. This can be used for a quick calculation without taking the timing variations into account. If Figure 33. Approximate Timeout Duration 3F 38

more precision is needed, use the formulae in Figure 34. Caution: When writing to the WDGCR register, always write 1 in the T6 bit to avoid generating an immediate reset.

30

CNT Value (hex.)

28

20 18

10

08 00 1.5 18 34 50 65 82 98 114 128 Watchdog timeout (ms) @ 8 MHz. fOSC2

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WATCHDOG TIMER (Contd) Figure 34. Exact Timeout Duration (tmin and tmax) WHERE: tmin0 = (LSB + 128) x 64 x tOSC2 tmax0 = 16384 x tOSC2 tOSC2 = 125ns if fOSC2=8 MHz CNT = Value of T[5:0] bits in the WDGCR register (6 bits) MSB and LSB are values from the table below depending on the timebase selected by the TB[1:0] bits in the MCCSR register
TB1 Bit TB0 Bit (MCCSR Reg.) (MCCSR Reg.) 0 0 0 1 1 0 1 1 Selected MCCSR Timebase 2ms 4ms 10ms 25ms MSB 4 8 20 49 LSB 59 53 35 54

To calculate the minimum Watchdog Timeout (tmin): IF CNT < MSB ------------4

THEN

tm in = tmin0 + 16384 CNT t osc2

4 CNT ELSE t min = tmin0 + 16384 CN T --------------- MSB

+ ( 192 + LS B) 64 ----------------

4CNT MSB

t osc2

To calculate the maximum Watchdog Timeout (tmax): IF CNT MSB ------------4

THEN

t ma x = tmax0 + 16384 C NT tosc2

ELSE t max = tmax0 + 16384 C NT 4CNT --------------- MSB

4CNT + ( 192 + LSB ) 64 ---------------MSB

t osc2

Note: In the above formulae, division results must be rounded down to the next integer value. Example: With 2ms timeout selected in MCCSR register
Value of T[5:0] Bits in WDGCR Register (Hex.) 00 3F Min. Watchdog Timeout (ms) tmin 1.496 128 Max. Watchdog Timeout (ms) tmax 2.048 128.552

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WATCHDOG TIMER (Contd) 10.1.5 Low Power Modes Mode SLOW WAIT Description No effect on Watchdog. No effect on Watchdog.
OIE bit in MCCSR register WDGHALT bit in Option Byte No Watchdog reset is generated. The MCU enters Halt mode. The Watchdog counter is decremented once and then stops counting and is no longer able to generate a watchdog reset until the MCU receives an external interrupt or a reset. If an external interrupt is received, the Watchdog restarts counting after 256 or 4096 CPU clocks. If a reset is generated, the Watchdog is disabled (reset state) unless Hardware Watchdog is selected by option byte. For application recommendations see Section 10.1.7 below. A reset is generated. No reset is generated. The MCU enters Active Halt mode. The Watchdog counter is not decremented. It stop counting. When the MCU receives an oscillator interrupt or external interrupt, the Watchdog restarts counting immediately. When the MCU receives a reset the Watchdog restarts counting after 256 or 4096 CPU clocks.

HALT

10.1.6 Hardware Watchdog Option If Hardware Watchdog is selected by option byte, the watchdog is always active and the WDGA bit in the WDGCR is not used. Refer to the Option Byte description. 10.1.7 Using Halt Mode with the WDG (WDGHALT option) The following recommendation applies if Halt mode is used when the watchdog is enabled. Before executing the HALT instruction, refresh the WDG counter, to avoid an unexpected WDG reset immediately after waking up the microcontroller. 10.1.8 Interrupts None.

10.1.9 Register Description CONTROL REGISTER (WDGCR) Read /Write Reset Value: 0111 1111 (7Fh)
7 WDGA T6 T5 T4 T3 T2 T1 0 T0

Bit 7 = WDGA Activation bit. This bit is set by software and only cleared by hardware after a reset. When WDGA = 1, the watchdog can generate a reset. 0: Watchdog disabled 1: Watchdog enabled Note: This bit is not used if the hardware watchdog option is enabled by option byte. Bit 6:0 = T[6:0] 7-bit counter (MSB to LSB). These bits contain the value of the watchdog counter. It is decremented every 16384 fOSC2 cycles (approx.). A reset is produced when it rolls over from 40h to 3Fh (T6 becomes cleared).

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Table 13. Watchdog Timer Register Map and Reset Values

Address (Hex.) 002Ah Register Label WDGCR Reset Value 7 WDGA 0 6 T6 1 5 T5 1 4 T4 1 3 T3 1 2 T2 1 1 T1 1 0 T0 1

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10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) The Main Clock Controller consists of three different functions: I a programmable CPU clock prescaler I a clock-out signal to supply external devices I a real time clock timer with interrupt capability Each function can be used independently and simultaneously. 10.2.1 Programmable CPU Clock Prescaler The programmable CPU clock prescaler supplies the clock for the ST7 CPU and its internal peripherals. It manages SLOW power saving mode (See Section 8.2 SLOW MODE for more details). The prescaler selects the fCPU main clock frequency and is controlled by three bits in the MCCSR register: CP[1:0] and SMS. 10.2.2 Clock-out Capability The clock-out capability is an alternate function of an I/O port pin that outputs a f OSC2 clock to drive external devices. It is controlled by the MCO bit in the MCCSR register. CAUTION: When selected, the clock out pin suspends the clock during ACTIVE-HALT mode. 10.2.3 Real Time Clock Timer (RTC) The counter of the real time clock timer allows an interrupt to be generated based on an accurate real time clock. Four different time bases depending directly on fOSC2 are available. The whole functionality is controlled by four bits of the MCCSR register: TB[1:0], OIE and OIF. When the RTC interrupt is enabled (OIE bit set), the ST7 enters ACTIVE-HALT mode when the HALT instruction is executed. See Section 8.4 ACTIVE-HALT AND HALT MODES for more details. 10.2.4 Beeper The beep function is controlled by the MCCBCR register. It can output three selectable frequencies on the BEEP pin (I/O port alternate function).

Figure 35. Main Clock Controller (MCC/RTC) Block Diagram

BC1 BC0 MCCBCR BEEP BEEP SIGNAL SELECTION MCO

DIV 64

12-BIT MCC RTC COUNTER

TO WATCHDOG TIMER

MCO CP1 CP0 SMS TB1 TB0 MCCSR fOSC2 DIV 2, 4, 8, 16

OIE

OIF MCC/RTC INTERRUPT

1 0

fCPU

CPU CLOCK TO CPU AND PERIPHERALS

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MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Contd) 10.2.5 Low Power Modes
Mode WAIT Description No effect on MCC/RTC peripheral. MCC/RTC interrupt cause the device to exit from WAIT mode. No effect on MCC/RTC counter (OIE bit is set), the registers are frozen. MCC/RTC interrupt cause the device to exit from ACTIVE-HALT mode. MCC/RTC counter and registers are frozen. MCC/RTC operation resumes when the MCU is woken up by an interrupt with exit from HALT capability.

Bit 6:5 = CP[1:0] CPU clock prescaler These bits select the CPU clock prescaler which is applied in the different slow modes. Their action is conditioned by the setting of the SMS bit. These two bits are set and cleared by software
fCPU in SLOW mode fOSC2 / 2 fOSC2 / 4 fOSC2 / 8 fOSC2 / 16 CP1 0 0 1 1 CP0 0 1 0 1

ACTIVEHALT

HALT

10.2.6 Interrupts The MCC/RTC interrupt event generates an interrupt if the OIE bit of the MCCSR register is set and the interrupt mask in the CC register is not active (RIM instruction).
Interrupt Event Time base overflow event Enable Event Control Flag Bit OIF OIE Exit from Wait Yes Exit from Halt No 1)

Bit 4 = SMS Slow mode select This bit is set and cleared by software. 0: Normal mode. fCPU = fOSC2 1: Slow mode. fCPU is given by CP1, CP0 See Section 8.2 SLOW MODE and Section 10.2 MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK AND BEEPER (MCC/RTC) for more details. Bit 3:2 = TB[1:0] Time base control These bits select the programmable divider time base. They are set and cleared by software.
Time Base Counter Prescaler f OSC2 =4MHz fOSC2=8MHz 16000 4ms 8ms 20ms 50ms 2ms 4ms 10ms 25ms 32000 80000 200000 TB1 0 0 1 1 TB0 0 1 0 1

Note: The MCC/RTC interrupt wakes up the MCU from ACTIVE-HALT mode, not from HALT mode.

10.2.7 Register Description MCC CONTROL/STATUS REGISTER (MCCSR) Read /Write Reset Value: 0000 0000 (00h )
7 MCO CP1 CP0 SMS TB1 TB0 OIE 0 OIF

A modification of the time base is taken into account at the end of the current period (previously set) to avoid an unwanted time shift. This allows to use this time base as a real time clock. Bit 1 = OIE Oscillator interrupt enable This bit set and cleared by software. 0: Oscillator interrupt disabled 1: Oscillator interrupt enabled This interrupt can be used to exit from ACTIVEHALT mode. When this bit is set, calling the ST7 software HALT instruction enters the ACTIVE-HALT power saving mode.

Bit 7 = MCO Main clock out selection This bit enables the MCO alternate function on the PF0 I/O port. It is set and cleared by software. 0: MCO alternate function disabled (I/O pin free for general-purpose I/O) 1: MCO alternate function enabled (fCPU on I/O port) Note: To reduce power consumption, the MCO function is not active in ACTIVE-HALT mode.

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MAIN CLOCK CONTROLLER WITH REAL TIME CLOCK (Contd) Bit 0 = OIF Oscillator interrupt flag This bit is set by hardware and cleared by software reading the MCCSR register. It indicates when set that the main oscillator has reached the selected elapsed time (TB1:0). 0: Timeout not reached 1: Timeout reached CAUTION: The BRES and BSET instructions must not be used on the MCCSR register to avoid unintentionally clearing the OIF bit. MCC BEEP CONTROL REGISTER (MCCBCR) Read /Write Reset Value: 0000 0000 (00h)
7 0 0 0 0 0 0 BC1 0 BC0

Bit 7:2 = Reserved, must be kept cleared. Bit 1:0 = BC[1:0] Beep control These 2 bits select the PF1 pin beep capability.
BC1 0 0 1 1 BC0 0 1 0 1 ~2-KHz ~1-KHz ~500-Hz Beep mode with fOSC2=8MHz Off Output Beep signal ~50% duty cycle

The beep output signal is available in ACTIVEHALT mode but has to be disabled to reduce the consumption. Table 14. Main Clock Controller Register Map and Reset Values
Address (Hex.) 002Bh 002Ch 002Dh Register Label SICSR Reset Value MCCSR Reset Value MCCBCR Reset Value 7 AVDS 0 MCO 0 0 6 AVDIE 0 CP1 0 0 5 AVDF 0 CP0 0 0 4 LVDRF x SMS 0 0 3 2 CSSIE 0 TB0 0 0 1 CSSD 0 OIE 0 BC1 0 0 WDGRF x OIF 0 BC0 0

0 TB1 0 0

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10.3 PWM AUTO-RELOAD TIMER (ART) 10.3.1 Introduction The Pulse Width Modulated Auto-Reload Timer on-chip peripheral consists of an 8-bit auto reload counter with compare/capture capabilities and of a 7-bit prescaler clock source. These resources allow five possible operating modes: Generation of up to 4 independent PWM signals Output compare and Time base interrupt Figure 36. PWM Auto-Reload Timer Block Diagram
PWMCR OEx OPx OCRx REGISTER LOAD PWMx PORT ALTERNATE FUNCTION POLARITY CONTROL COMPARE DCRx REGISTER

Up to two input capture functions External event detector Up to two external interrupt sources The three first modes can be used together with a single counter frequency. The timer can be used to wake up the MCU from WAIT and HALT modes.

ARR REGISTER

8-BIT COUNTER (CAR REGISTER)

LOAD

ARTICx

INPUT CAPTURE CONTROL

LOAD

ICRx REGISTER

ICSx

ICIEx

ICFx

ICCSR

ARTCLK

fEXT fCPU fCOUNTER

ICx INTERRUPT

MUX fINPUT

PROGRAMMABLE PRESCALER

EXCL

CC2

CC1

CC0

TCE

FCRL

OIE

OVF

ARTCSR

OVF INTERRUPT

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PWM AUTO-RELOAD TIMER (Contd) 10.3.2 Functional Description Counter The free running 8-bit counter is fed by the output of the prescaler, and is incremented on every rising edge of the clock signal. It is possible to read or write the contents of the counter on the fly by reading or writing the Counter Access register (ARTCAR). When a counter overflow occurs, the counter is automatically reloaded with the contents of the ARTARR register (the prescaler is not affected). Counter clock and prescaler The counter clock frequency is given by: fCOUNTER = fINPUT / 2CC[2:0] The timer counters input clock (fINPUT) feeds the 7-bit programmable prescaler, which selects one of the 8 available taps of the prescaler, as defined by CC[2:0] bits in the Control/Status Register (ARTCSR). Thus the division factor of the prescaler can be set to 2 n (where n = 0, 1,..7). This fINPUT frequency source is selected through the EXCL bit of the ARTCSR register and can be either the fCPU or an external input frequency fEXT. The clock input to the counter is enabled by the TCE (Timer Counter Enable) bit in the ARTCSR register. When TCE is reset, the counter is stopped and the prescaler and counter contents are frozen. When TCE is set, the counter runs at the rate of the selected clock source. Figure 37. Output compare control Counter and Prescaler Initialization After RESET, the counter and the prescaler are cleared and fINPUT = fCPU. The counter can be initialized by: Writing to the ARTARR register and then setting the FCRL (Force Counter Re-Load) and the TCE (Timer Counter Enable) bits in the ARTCSR register. Writing to the ARTCAR counter access register, In both cases the 7-bit prescaler is also cleared, whereupon counting will start from a known value. Direct access to the prescaler is not possible. Output compare control The timer compare function is based on four different comparisons with the counter (one for each PWMx output). Each comparison is made between the counter value and an output compare register (OCRx) value. This OCRx register can not be accessed directly, it is loaded from the duty cycle register (PWMDCRx) at each overflow of the counter. This double buffering method avoids glitch generation when changing the duty cycle on the fly.

fCOUNTER ARTARR=FDh COUNTER FDh FEh FFh FDh FEh FFh FDh FEh FFh

OCRx

FDh

FEh

PWMDCRx

FDh

FEh

PWMx

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PWM AUTO-RELOAD TIMER (Contd) Independent PWM signal generation This mode allows up to four Pulse Width Modulated signals to be generated on the PWMx output pins with minimum core processing overhead. This function is stopped during HALT mode. Each PWMx output signal can be selected independently using the corresponding OEx bit in the PWM Control register (PWMCR). When this bit is set, the corresponding I/O pin is configured as output push-pull alternate function. The PWM signals all have the same frequency which is controlled by the counter period and the ARTARR register value. fPWM = fCOUNTER / (256 - ARTARR) When a counter overflow occurs, the PWMx pin level is changed depending on the corresponding OPx (output polarity) bit in the PWMCR register. Figure 38. PWM Auto-reload Timer Function
255 DUTY CYCLE REGISTER (PWMDCRx)

When the counter reaches the value contained in one of the output compare register (OCRx) the corresponding PWMx pin level is restored. It should be noted that the reload values will also affect the value and the resolution of the duty cycle of the PWM output signal. To obtain a signal on a PWMx pin, the contents of the OCRx register must be greater than the contents of the ARTARR register. The maximum available resolution for the PWMx duty cycle is: Resolution = 1 / (256 - ARTARR) Note: To get the maximum resolution (1/256), the ARTARR register must be 0. With this maximum resolution, 0% and 100% can be obtained by changing the polarity.

COUNTER

AUTO-RELOAD REGISTER (ARTARR) 000

PWMx OUTPUT

WITH OEx=1 AND OPx=0 WITH OEx=1 AND OPx=1

Figure 39. PWM Signal from 0% to 100% Duty Cycle

fCOUNTER ARTARR=FDh COUNTER FDh FEh FFh FDh FEh FFh FDh FEh

OCRx=FCh PWMx OUTPUT WITH OEx=1 AND OPx=0 OCRx=FDh OCRx=FEh OCRx=FFh

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PWM AUTO-RELOAD TIMER (Contd) Output compare and Time base interrupt On overflow, the OVF flag of the ARTCSR register is set and an overflow interrupt request is generated if the overflow interrupt enable bit, OIE, in the ARTCSR register, is set. The OVF flag must be reset by the user software. This interrupt can be used as a time base in the application. External clock and event detector mode Using the fEXT external prescaler input clock, the auto-reload timer can be used as an external clock event detector. In this mode, the ARTARR register is used to select the nEVENT number of events to be counted before setting the OVF flag. nEVENT = 256 - ARTARR When entering HALT mode while fEXT is selected, all the timer control registers are frozen but the counter continues to increment. If the OIE bit is set, the next overflow of the counter will generate an interrupt which wakes up the MCU.

Figure 40. External Event Detector Example (3 counts)

f EXT=fCOUNTER ARTARR=FDh

COUNTER

FDh

FEh

FFh

FDh

FEh

FFh

FDh

OVF

ARTCSR READ INTERRUPT IF OIE=1 INTERRUPT IF OIE=1

ARTCSR READ

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PWM AUTO-RELOAD TIMER (Contd) Input capture function This mode allows the measurement of external signal pulse widths through ARTICRx registers. Each input capture can generate an interrupt independently on a selected input signal transition. This event is flagged by a set of the corresponding CFx bits of the Input Capture Control/Status register (ARTICCSR). These input capture interrupts are enabled through the CIEx bits of the ARTICCSR register. The active transition (falling or rising edge) is software programmable through the CSx bits of the ARTICCSR register. The read only input capture registers (ARTICRx) are used to latch the auto-reload counter value when a transition is detected on the ARTICx pin (CFx bit set in ARTICCSR register). After fetching the interrupt vector, the CFx flags can be read to identify the interrupt source. Note: After a capture detection, data transfer in the ARTICRx register is inhibited until it is read (clearing the CFx bit). The timer interrupt remains pending while the CFx flag is set when the interrupt is enabled (CIEx bit set). This means, the ARTICRx register has to be read at each capture event to clear the CFx flag. The timing resolution is given by auto-reload counter cycle time (1/fCOUNTER). Note: During HALT mode, if both input capture and external clock are enabled, the ARTICRx register value is not guaranteed if the input capture pin and the external clock change simultaneously. Figure 41. Input Capture Timing Diagram
fCOUNTER

External interrupt capability This mode allows the Input capture capabilities to be used as external interrupt sources. The interrupts are generated on the edge of the ARTICx signal. The edge sensitivity of the external interrupts is programmable (CSx bit of ARTICCSR register) and they are independently enabled through CIEx bits of the ARTICCSR register. After fetching the interrupt vector, the CFx flags can be read to identify the interrupt source. During HALT mode, the external interrupts can be used to wake up the micro (if the CIEx bit is set).

COUNTER

01h

02h

03h

04h

05h

06h

07h

ARTICx PIN CFx FLAG xxh ICRx REGISTER

INTERRUPT

04h

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PWM AUTO-RELOAD TIMER (Contd) 10.3.3 Register Description CONTROL / STATUS REGISTER (ARTCSR) Read /Write Reset Value: 0000 0000 (00h)
7 EXCL CC2 CC1 CC0 TCE FCRL OIE 0 OVF 7 0 CA6 CA5 CA4 CA3 CA2 CA1 CA0

0: New transition not yet reached 1: Transition reached COUNTER ACCESS REGISTER (ARTCAR) Read /Write Reset Value: 0000 0000 (00h)

Bit 7 = EXCL External Clock This bit is set and cleared by software. It selects the input clock for the 7-bit prescaler. 0: CPU clock. 1: External clock. Bit 6:4 = CC[2:0] Counter Clock Control These bits are set and cleared by software. They determine the prescaler division ratio from fINPUT.
fCOUNTER fINPUT fINPUT / 2 fINPUT / 4 fINPUT / 8 fINPUT / 16 fINPUT / 32 fINPUT / 64 fINPUT / 128 With fINPUT=8 MHz CC2 CC1 CC0 8 MHz 4 MHz 2 MHz 1 MHz 500 KHz 250 KHz 125 KHz 62.5 KHz 0 0 0 0 1 1 1 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1

CA7

Bit 7:0 = CA[7:0] Counter Access Data These bits can be set and cleared either by hardware or by software. The ARTCAR register is used to read or write the auto-reload counter on the fly (while it is counting).

AUTO-RELOAD REGISTER (ARTARR) Read /Write Reset Value: 0000 0000 (00h)
7 AR7 AR6 AR5 AR4 AR3 AR2 AR1 0 AR0

Bit 3 = TCE Timer Counter Enable This bit is set and cleared by software. It puts the timer in the lowest power consumption mode. 0: Counter stopped (prescaler and counter frozen). 1: Counter running. Bit 2 = FCRL Force Counter Re-Load This bit is write-only and any attempt to read it will yield a logical zero. When set, it causes the contents of ARTARR register to be loaded into the counter, and the content of the prescaler register to be cleared in order to initialize the timer before starting to count. Bit 1 = OIE Overflow Interrupt Enable This bit is set and cleared by software. It allows to enable/disable the interrupt which is generated when the OVF bit is set. 0: Overflow Interrupt disable. 1: Overflow Interrupt enable. Bit 0 = OVF Overflow Flag This bit is set by hardware and cleared by software reading the ARTCSR register. It indicates the transition of the counter from FFh to the ARTARR value.

Bit 7:0 = AR[7:0] Counter Auto-Reload Data These bits are set and cleared by software. They are used to hold the auto-reload value which is automatically loaded in the counter when an overflow occurs. At the same time, the PWM output levels are changed according to the corresponding OPx bit in the PWMCR register. This register has two PWM management functions: Adjusting the PWM frequency Setting the PWM duty cycle resolution PWM Frequency vs. Resolution:
ARTARR value 0 [ 0..127 ] [ 128..191 ] [ 192..223 ] [ 224..239 ] Resolution Min 8-bit > 7-bit > 6-bit > 5-bit > 4-bit ~0.244-KHz ~0.244-KHz ~0.488-KHz ~0.977-KHz ~1.953-KHz fPWM Max 31.25-KHz 62.5-KHz 125-KHz 250-KHz 500-KHz

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PWM AUTO-RELOAD TIMER (Contd) PWM CONTROL REGISTER (PWMCR) Read /Write Reset Value: 0000 0000 (00h)
7 OE3 OE2 OE1 OE0 OP3 OP2 OP1 0 OP0

DUTY CYCLE REGISTERS (PWMDCRx) Read /Write Reset Value: 0000 0000 (00h)
7 DC7 DC6 DC5 DC4 DC3 DC2 DC1 0 DC0

Bit 7:4 = OE[3:0] PWM Output Enable These bits are set and cleared by software. They enable or disable the PWM output channels independently acting on the corresponding I/O pin. 0: PWM output disabled. 1: PWM output enabled. Bit 3:0 = OP[3:0] PWM Output Polarity These bits are set and cleared by software. They independently select the polarity of the four PWM output signals.
PWMx output level OPx Counter <= OCRx 1 0 Counter > OCRx 0 1 0 1

Bit 7:0 = DC[7:0] Duty Cycle Data These bits are set and cleared by software. A PWMDCRx register is associated with the OCRx register of each PWM channel to determine the second edge location of the PWM signal (the first edge location is common to all channels and given by the ARTARR register). These PWMDCR registers allow the duty cycle to be set independently for each PWM channel.

Note: When an OPx bit is modified, the PWMx output signal polarity is immediately reversed.

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PWM AUTO-RELOAD TIMER (Contd) INPUT CAPTURE CONTROL / STATUS REGISTER (ARTICCSR) Read /Write Reset Value: 0000 0000 (00h)
7 0 0 CS2 CS1 CIE2 CIE1 CF2 0 IC7 CF1 IC6 IC5 IC4 IC3 IC2 IC1 IC0

INPUT CAPTURE REGISTERS (ARTICRx) Read only Reset Value: 0000 0000 (00h)
7 0

Bit 7:6 = Reserved, always read as 0. Bit 5:4 = CS[2:1] Capture Sensitivity These bits are set and cleared by software. They determine the trigger event polarity on the corresponding input capture channel. 0: Falling edge triggers capture on channel x. 1: Rising edge triggers capture on channel x. Bit 3:2 = CIE[2:1] Capture Interrupt Enable These bits are set and cleared by software. They enable or disable the Input capture channel interrupts independently. 0: Input capture channel x interrupt disabled. 1: Input capture channel x interrupt enabled. Bit 1:0 = CF[2:1] Capture Flag These bits are set by hardware and cleared by software reading the corresponding ARTICRx register. Each CFx bit indicates that an input capture x has occurred. 0: No input capture on channel x. 1: An input capture has occured on channel x.

Bit 7:0 = IC[7:0] Input Capture Data These read only bits are set and cleared by hardware. An ARTICRx register contains the 8-bit auto-reload counter value transferred by the input capture channel x event.

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PWM AUTO-RELOAD TIMER (Contd) Table 15. PWM Auto-Reload Timer Register Map and Reset Values
Address (Hex.) 0073h Register Label PWMDCR3 Reset Value PWMDCR2 Reset Value PWMDCR1 Reset Value PWMDCR0 Reset Value PWMCR Reset Value ARTCSR Reset Value ARTCAR Reset Value ARTARR Reset Value ARTICCSR Reset Value ARTICR1 Reset Value ARTICR2 Reset Value 0 IC7 0 IC7 0 0 IC6 0 IC6 0 7 DC7 0 DC7 0 DC7 0 DC7 0 OE3 0 EXCL 0 CA7 0 AR7 0 6 DC6 0 DC6 0 DC6 0 DC6 0 OE2 0 CC2 0 CA6 0 AR6 0 5 DC5 0 DC5 0 DC5 0 DC5 0 OE1 0 CC1 0 CA5 0 AR5 0 CS2 0 IC5 0 IC5 0 4 DC4 0 DC4 0 DC4 0 DC4 0 OE0 0 CC0 0 CA4 0 AR4 0 CS1 0 IC4 0 IC4 0 3 DC3 0 DC3 0 DC3 0 DC3 0 OP3 0 TCE 0 CA3 0 AR3 0 CIE2 0 IC3 0 IC3 0 2 DC2 0 DC2 0 DC2 0 DC2 0 OP2 0 FCRL 0 CA2 0 AR2 0 CIE1 0 IC2 0 IC2 0 1 DC1 0 DC1 0 DC1 0 DC1 0 OP1 0 RIE 0 CA1 0 AR1 0 CF2 0 IC1 0 IC1 0 0 DC0 0 DC0 0 DC0 0 DC0 0 OP0 0 OVF 0 CA0 0 AR0 0 CF1 0 IC0 0 IC0 0

0074h

0075h

0076h

0077h

0078h

0079h

007Ah

007Bh

007Ch

007Dh

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10.4 16-BIT TIMER 10.4.1 Introduction The timer consists of a 16-bit free-running counter driven by a programmable prescaler. It may be used for a variety of purposes, including pulse length measurement of up to two input signals (input capture) or generation of up to two output waveforms (output compare and PWM). Pulse lengths and waveform periods can be modulated from a few microseconds to several milliseconds using the timer prescaler and the CPU clock prescaler. Some ST7 devices have two on-chip 16-bit timers. They are completely independent, and do not share any resources. They are synchronized after a MCU reset as long as the timer clock frequencies are not modified. This description covers one or two 16-bit timers. In ST7 devices with two timers, register names are prefixed with TA (Timer A) or TB (Timer B). 10.4.2 Main Features I Programmable prescaler: fCPU divided by 2, 4 or 8. I Overflow status flag and maskable interrupt I External clock input (must be at least 4 times slower than the CPU clock speed) with the choice of active edge I 1 or 2 Output Compare functions each with: 2 dedicated 16-bit registers 2 dedicated programmable signals 2 dedicated status flags 1 dedicated maskable interrupt I 1 or 2 Input Capture functions each with: 2 dedicated 16-bit registers 2 dedicated active edge selection signals 2 dedicated status flags 1 dedicated maskable interrupt I Pulse width modulation mode (PWM) I One pulse mode I Reduced Power Mode I 5 alternate functions on I/O ports (ICAP1, ICAP2, OCMP1, OCMP2, EXTCLK)* The Block Diagram is shown in Figure 42. *Note: Some timer pins may not available (not bonded) in some ST7 devices. Refer to the device pin out description. When reading an input signal on a non-bonded pin, the value will always be 1. 10.4.3 Functional Description 10.4.3.1 Counter The main block of the Programmable Timer is a 16-bit free running upcounter and its associated 16-bit registers. The 16-bit registers are made up of two 8-bit registers called high & low. Counter Register (CR): Counter High Register (CHR) is the most significant byte (MS Byte). Counter Low Register (CLR) is the least significant byte (LS Byte). Alternate Counter Register (ACR) Alternate Counter High Register (ACHR) is the most significant byte (MS Byte). Alternate Counter Low Register (ACLR) is the least significant byte (LS Byte). These two read-only 16-bit registers contain the same value but with the difference that reading the ACLR register does not clear the TOF bit (Timer overflow flag), located in the Status register, (SR), (see note at the end of paragraph titled 16-bit read sequence). Writing in the CLR register or ACLR register resets the free running counter to the FFFCh value. Both counters have a reset value of FFFCh (this is the only value which is reloaded in the 16-bit timer). The reset value of both counters is also FFFCh in One Pulse mode and PWM mode. The timer clock depends on the clock control bits of the CR2 register, as illustrated in Table 16 Clock Control Bits. The value in the counter register repeats every 131072, 262144 or 524288 CPU clock cycles depending on the CC[1:0] bits. The timer frequency can be fCPU/2, fCPU/4, fCPU/8 or an external frequency.

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16-BIT TIMER (Contd) Figure 42. Timer Block Diagram

ST7 INTERNAL BUS fCPU MCU-PERIPHERAL INTERFACE

8 high

8 low
8-bit buffer

8 high low

8 high

8 low

8 high

8 low

8 high

8 low

EXEDG

16
1/2 1/4 1/8 EXTCLK pin COUNTER REGISTER ALTERNATE COUNTER REGISTER OUTPUT COMPARE REGISTER 1 OUTPUT COMPARE REGISTER 2 INPUT CAPTURE REGISTER 1 INPUT CAPTURE REGISTER 2

16

16

16
CC[1:0] TIMER INTERNAL BUS 16 16 OVERFLOW DETECT CIRCUIT

OUTPUT COMPARE CIRCUIT

EDGE DETECT CIRCUIT1

ICAP1 pin

EDGE DETECT CIRCUIT2

ICAP2 pin

LATCH1
ICF1 OCF1 TOF ICF2 OCF2 TIMD

OCMP1 pin OCMP2 pin

0 LATCH2

(Control/Status Register) CSR

ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1

OC1E OC2E OPM PWM

CC1

CC0 IEDG2 EXEDG

(Control Register 1) CR1

(Control Register 2) CR2

(See note) TIMER INTERRUPT

Note: If IC, OC and TO interrupt requests have separate vectors then the last OR is not present (See device Interrupt Vector Table)

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16-BIT TIMER (Contd) 16-bit read sequence: (from either the Counter Register or the Alternate Counter Register).

Beginning of the sequence

At t0 Read MS Byte Other instructions Read At t0 +t LS Byte
Returns the buffered

LS Byte is buffered

LS Byte value at t0

Sequence completed
The user must read the MS Byte first, then the LS Byte value is buffered automatically. This buffered value remains unchanged until the 16-bit read sequence is completed, even if the user reads the MS Byte several times. After a complete reading sequence, if only the CLR register or ACLR register are read, they return the LS Byte of the count value at the time of the read. Whatever the timer mode used (input capture, output compare, one pulse mode or PWM mode) an overflow occurs when the counter rolls over from FFFFh to 0000h then: The TOF bit of the SR register is set. A timer interrupt is generated if: TOIE bit of the CR1 register is set and I bit of the CC register is cleared. If one of these conditions is false, the interrupt remains pending to be issued as soon as they are both true.

Clearing the overflow interrupt request is done in two steps: 1. Reading the SR register while the TOF bit is set. 2. An access (read or write) to the CLR register. Notes: The TOF bit is not cleared by accesses to ACLR register. The advantage of accessing the ACLR register rather than the CLR register is that it allows simultaneous use of the overflow function and reading the free running counter at random times (for example, to measure elapsed time) without the risk of clearing the TOF bit erroneously. The timer is not affected by WAIT mode. In HALT mode, the counter stops counting until the mode is exited. Counting then resumes from the previous count (MCU awakened by an interrupt) or from the reset count (MCU awakened by a Reset). 10.4.3.2 External Clock The external clock (where available) is selected if CC0=1 and CC1=1 in the CR2 register. The status of the EXEDG bit in the CR2 register determines the type of level transition on the external clock pin EXTCLK that will trigger the free running counter. The counter is synchronized with the falling edge of the internal CPU clock. A minimum of four falling edges of the CPU clock must occur between two consecutive active edges of the external clock; thus the external clock frequency must be less than a quarter of the CPU clock frequency.

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16-BIT TIMER (Contd) Figure 43. Counter Timing Diagram, internal clock divided by 2
CPU CLOCK INTERNAL RESET TIMER CLOCK COUNTER REGISTER TIMER OVERFLOW FLAG (TOF) FFFD FFFE FFFF 0000 0001 0002 0003

Figure 44. Counter Timing Diagram, internal clock divided by 4

CPU CLOCK INTERNAL RESET TIMER CLOCK COUNTER REGISTER TIMER OVERFLOW FLAG (TOF) FFFC FFFD 0000 0001

Figure 45. Counter Timing Diagram, internal clock divided by 8

CPU CLOCK INTERNAL RESET TIMER CLOCK COUNTER REGISTER FFFC FFFD 0000

TIMER OVERFLOW FLAG (TOF)

Note: The MCU is in reset state when the internal reset signal is high, when it is low the MCU is running.

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16-BIT TIMER (Contd) 10.4.3.3 Input Capture In this section, the index, i, may be 1 or 2 because there are 2 input capture functions in the 16-bit timer. The two 16-bit input capture registers (IC1R and IC2R) are used to latch the value of the free running counter after a transition is detected on the ICAPi pin (see figure 5).
ICiR MS Byte ICiHR LS Byte ICiLR

ICiR register is a read-only register. The active transition is software programmable through the IEDGi bit of Control Registers (CRi). Timing resolution is one count of the free running counter: (fCPU/CC[1:0]). Procedure: To use the input capture function select the following in the CR2 register: Select the timer clock (CC[1:0]) (see Table 16 Clock Control Bits). Select the edge of the active transition on the ICAP2 pin with the IEDG2 bit (the ICAP2 pin must be configured as floating input or input with pull-up without interrupt if this configuration is available). And select the following in the CR1 register: Set the ICIE bit to generate an interrupt after an input capture coming from either the ICAP1 pin or the ICAP2 pin Select the edge of the active transition on the ICAP1 pin with the IEDG1 bit (the ICAP1pin must be configured as floating input or input with pullup without interrupt if this configuration is available).

When an input capture occurs: ICFi bit is set. The IC iR register contains the value of the free running counter on the active transition on the ICAPi pin (see Figure 47). A timer interrupt is generated if the ICIE bit is set and the I bit is cleared in the CC register. Otherwise, the interrupt remains pending until both conditions become true. Clearing the Input Capture interrupt request (i.e. clearing the ICFi bit) is done in two steps: 1. Reading the SR register while the ICFi bit is set. 2. An access (read or write) to the ICiLR register. Notes: 1. After reading the ICiHR register, transfer of input capture data is inhibited and ICFi will never be set until the ICiLR register is also read. 2. The ICiR register contains the free running counter value which corresponds to the most recent input capture. 3. The 2 input capture functions can be used together even if the timer also uses the 2 output compare functions. 4. In One pulse Mode and PWM mode only Input Capture 2 can be used. 5. The alternate inputs (ICAP1 & ICAP2) are always directly connected to the timer. So any transitions on these pins activates the input capture function. Moreover if one of the ICAPi pins is configured as an input and the second one as an output, an interrupt can be generated if the user toggles the output pin and if the ICIE bit is set. This can be avoided if the input capture function i is disabled by reading the IC iHR (see note 1). 6. The TOF bit can be used with interrupt generation in order to measure events that go beyond the timer range (FFFFh).

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16-BIT TIMER (Contd) Figure 46. Input Capture Block Diagram

ICAP1 pin ICAP2 pin EDGE DETECT CIRCUIT2 EDGE DETECT CIRCUIT1
ICIE

(Control Register 1) CR1

IEDG1

(Status Register) SR IC2R Register IC1R Register

ICF1 ICF2 0 0 0

16-BIT 16-BIT FREE RUNNING COUNTER

(Control Register 2) CR2

CC1 CC0 IEDG2

Figure 47. Input Capture Timing Diagram

TIMER CLOCK COUNTER REGISTER ICAPi PIN ICAPi FLAG ICAPi REGISTER Note: The rising edge is the active edge. FF03 FF01 FF02 FF03

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16-BIT TIMER (Contd) 10.4.3.4 Output Compare In this section, the index, i, may be 1 or 2 because there are 2 output compare functions in the 16-bit timer. This function can be used to control an output waveform or indicate when a period of time has elapsed. When a match is found between the Output Compare register and the free running counter, the output compare function: Assigns pins with a programmable value if the OCiE bit is set Sets a flag in the status register Generates an interrupt if enabled Two 16-bit registers Output Compare Register 1 (OC1R) and Output Compare Register 2 (OC2R) contain the value to be compared to the counter register each timer clock cycle.
OCiR MS Byte OCiHR LS Byte OCiLR

The OCMPi pin takes OLVLi bit value (OCMPi pin latch is forced low during reset). A timer interrupt is generated if the OCIE bit is set in the CR1 register and the I bit is cleared in the CC register (CC). The OCiR register value required for a specific timing application can be calculated using the following formula:

OCiR =

t * fCPU
PRESC

Where: t = Output compare period (in seconds) = CPU clock frequency (in hertz) fCPU PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits, see Table 16 Clock Control Bits) If the timer clock is an external clock, the formula is:

These registers are readable and writable and are not affected by the timer hardware. A reset event changes the OCiR value to 8000h. Timing resolution is one count of the free running counter: (fCPU/CC[1:0]). Procedure: To use the output compare function, select the following in the CR2 register: Set the OCiE bit if an output is needed then the OCMPi pin is dedicated to the output compare i signal. Select the timer clock (CC[1:0]) (see Table 16 Clock Control Bits). And select the following in the CR1 register: Select the OLVLi bit to applied to the OCMP i pins after the match occurs. Set the OCIE bit to generate an interrupt if it is needed. When a match is found between OCRi register and CR register: OCFi bit is set.

OCiR = t * fEXT
Where: t = Output compare period (in seconds) = External timer clock frequency (in hertz) fEXT Clearing the output compare interrupt request (i.e. clearing the OCFi bit) is done by: 1. Reading the SR register while the OCFi bit is set. 2. An access (read or write) to the OCiLR register. The following procedure is recommended to prevent the OCFi bit from being set between the time it is read and the write to the OCiR register: Write to the OCiHR register (further compares are inhibited). Read the SR register (first step of the clearance of the OCFi bit, which may be already set). Write to the OCiLR register (enables the output compare function and clears the OCFi bit).

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16-BIT TIMER (Contd) Notes: 1. After a processor write cycle to the OCiHR register, the output compare function is inhibited until the OCiLR register is also written. 2. If the OCiE bit is not set, the OCMPi pin is a general I/O port and the OLVLi bit will not appear when a match is found but an interrupt could be generated if the OCIE bit is set. 3. When the timer clock is fCPU/2, OCFi and OCMPi are set while the counter value equals the OCiR register value (see Figure 49 on page 77). This behaviour is the same in OPM or PWM mode. When the timer clock is fCPU/4, fCPU/8 or in external clock mode, OCFi and OCMPi are set while the counter value equals the OC iR register value plus 1 (see Figure 50 on page 77). 4. The output compare functions can be used both for generating external events on the OCMPi pins even if the input capture mode is also used. 5. The value in the 16-bit OCiR register and the OLVi bit should be changed after each successful comparison in order to control an output waveform or establish a new elapsed timeout. Figure 48. Output Compare Block Diagram

Forced Compare Output capability When the FOLVi bit is set by software, the OLVLi bit is copied to the OCMPi pin. The OLVi bit has to be toggled in order to toggle the OCMPi pin when it is enabled (OCiE bit=1). The OCFi bit is then not set by hardware, and thus no interrupt request is generated. The FOLVLi bits have no effect in both one pulse mode and PWM mode.

16 BIT FREE RUNNING COUNTER

OC1E OC2E

CC1

CC0

16-bit
OUTPUT COMPARE CIRCUIT

(Control Register 2) CR2 (Control Register 1) CR1

OCIE FOLV2 FOLV1 OLVL2 OLVL1 Latch 1

OCMP1 Pin OCMP2 Pin

16-bit

16-bit

OC1R Register
OCF1 OCF2 0 0 0

Latch 2

OC2R Register (Status Register) SR

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16-BIT TIMER (Contd) Figure 49. Output Compare Timing Diagram, fTIMER =fCPU/2

INTERNAL CPU CLOCK TIMER CLOCK COUNTER REGISTER OUTPUT COMPARE REGISTER i (OCRi) OUTPUT COMPARE FLAG i (OCFi) OCMPi PIN (OLVLi=1) 2ECF 2ED0 2ED1 2ED2 2ED3 2ED4 2ED3

Figure 50. Output Compare Timing Diagram, fTIMER =fCPU/4

INTERNAL CPU CLOCK TIMER CLOCK COUNTER REGISTER OUTPUT COMPARE REGISTER i (OCRi) COMPARE REGISTER i LATCH OUTPUT COMPARE FLAG i (OCFi) OCMPi PIN (OLVLi=1) 2ECF 2ED0 2ED1 2ED2 2ED3 2ED4 2ED3

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16-BIT TIMER (Contd) 10.4.3.5 One Pulse Mode One Pulse mode enables the generation of a pulse when an external event occurs. This mode is selected via the OPM bit in the CR2 register. The one pulse mode uses the Input Capture1 function and the Output Compare1 function. Procedure: To use one pulse mode: 1. Load the OC1R register with the value corresponding to the length of the pulse (see the formula in the opposite column). 2. Select the following in the CR1 register: Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after the pulse. Using the OLVL2 bit, select the level to be applied to the OCMP1 pin during the pulse. Select the edge of the active transition on the ICAP1 pin with the IEDG1 bit (the ICAP1 pin must be configured as floating input). 3. Select the following in the CR2 register: Set the OC1E bit, the OCMP1 pin is then dedicated to the Output Compare 1 function. Set the OPM bit. Select the timer clock CC[1:0] (see Table 16 Clock Control Bits).

Clearing the Input Capture interrupt request (i.e. clearing the ICFi bit) is done in two steps: 1. Reading the SR register while the ICFi bit is set. 2. An access (read or write) to the ICiLR register. The OC1R register value required for a specific timing application can be calculated using the following formula: t * fCPU -5 OCiR Value =
PRESC

Where: t = Pulse period (in seconds) fCPU = CPU clock frequency (in hertz) PRESC = Timer prescaler factor (2, 4 or 8 depending on the CC[1:0] bits, see Table 16 Clock Control Bits) If the timer clock is an external clock the formula is: OCiR = t * fEXT -5 Where: t = Pulse period (in seconds) fEXT = External timer clock frequency (in hertz) When the value of the counter is equal to the value of the contents of the OC1R register, the OLVL1 bit is output on the OCMP1 pin, (See Figure 51). Notes: 1. The OCF1 bit cannot be set by hardware in one pulse mode but the OCF2 bit can generate an Output Compare interrupt. 2. When the Pulse Width Modulation (PWM) and One Pulse Mode (OPM) bits are both set, the PWM mode is the only active one. 3. If OLVL1=OLVL2 a continuous signal will be seen on the OCMP1 pin. 4. The ICAP1 pin can not be used to perform input capture. The ICAP2 pin can be used to perform input capture (ICF2 can be set and IC2R can be loaded) but the user must take care that the counter is reset each time a valid edge occurs on the ICAP1 pin and ICF1 can also generates interrupt if ICIE is set. 5. When one pulse mode is used OC1R is dedicated to this mode. Nevertheless OC2R and OCF2 can be used to indicate a period of time has been elapsed but cannot generate an output waveform because the level OLVL2 is dedicated to the one pulse mode.

One pulse mode cycle

When event occurs on ICAP1 ICR1 = Counter OCMP1 = OLVL2 Counter is reset to FFFCh ICF1 bit is set When Counter = OC1R

OCMP1 = OLVL1

Then, on a valid event on the ICAP1 pin, the counter is initialized to FFFCh and OLVL2 bit is loaded on the OCMP1 pin, the ICF1 bit is set and the value FFFDh is loaded in the IC1R register. Because the ICF1 bit is set when an active edge occurs, an interrupt can be generated if the ICIE bit is set.

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16-BIT TIMER (Contd) Figure 51. One Pulse Mode Timing Example
IC1R COUNTER ICAP1 OCMP1 OLVL2 OLVL1 OLVL2 01F8 FFFC FFFD FFFE 01F8 2ED0 2ED1 2ED2 2ED3 2ED3 FFFC FFFD

compare1 Note: IEDG1=1, OC1R=2ED0h, OLVL1=0, OLVL2=1

Figure 52. Pulse Width Modulation Mode Timing Example with 2 Output Compare Functions

COUNTER 34E2 FFFC FFFD FFFE OCMP1

2ED0 2ED1 2ED2

34E2

FFFC

OLVL2

OLVL1

OLVL2

compare2

compare1

compare2

Note: OC1R=2ED0h, OC2R=34E2, OLVL1=0, OLVL2= 1

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16-BIT TIMER (Contd) 10.4.3.6 Pulse Width Modulation Mode Pulse Width Modulation (PWM) mode enables the generation of a signal with a frequency and pulse length determined by the value of the OC1R and OC2R registers. Pulse Width Modulation mode uses the complete Output Compare 1 function plus the OC2R register, and so this functionality can not be used when PWM mode is activated. In PWM mode, double buffering is implemented on the output compare registers. Any new values written in the OC1R and OC2R registers are taken into account only at the end of the PWM period (OC2) to avoid spikes on the PWM output pin (OCMP1). Procedure To use pulse width modulation mode: 1. Load the OC2R register with the value corresponding to the period of the signal using the formula in the opposite column. 2. Load the OC1R register with the value corresponding to the period of the pulse if (OLVL1=0 and OLVL2=1) using the formula in the opposite column. 3. Select the following in the CR1 register: Using the OLVL1 bit, select the level to be applied to the OCMP1 pin after a successful comparison with the OC1R register. Using the OLVL2 bit, select the level to be applied to the OCMP1 pin after a successful comparison with the OC2R register. 4. Select the following in the CR2 register: Set OC1E bit: the OCMP1 pin is then dedicated to the output compare 1 function. Set the PWM bit. Select the timer clock (CC[1:0]) (see Table 16 Clock Control Bits).

If OLVL1=1 and OLVL2=0 the length of the positive pulse is the difference between the OC2R and OC1R registers. If OLVL1=OLVL2 a continuous signal will be seen on the OCMP1 pin. The OCiR register value required for a specific timing application can be calculated using the following formula: t * fCPU - 5 OCiR Value =
PRESC

Where: t = Signal or pulse period (in seconds) fCPU = CPU clock frequency (in hertz) PRESC = Timer prescaler factor (2, 4 or 8 depending on CC[1:0] bits, see Table 16) If the timer clock is an external clock the formula is: OCiR = t * fEXT -5 Where: t = Signal or pulse period (in seconds) = External timer clock frequency (in hertz) fEXT The Output Compare 2 event causes the counter to be initialized to FFFCh (See Figure 52) Notes: 1. After a write instruction to the OC iHR register, the output compare function is inhibited until the OCiLR register is also written. 2. The OCF1 and OCF2 bits cannot be set by hardware in PWM mode therefore the Output Compare interrupt is inhibited. 3. The ICF1 bit is set by hardware when the counter reaches the OC2R value and can produce a timer interrupt if the ICIE bit is set and the I bit is cleared. 4. In PWM mode the ICAP1 pin can not be used to perform input capture because it is disconnected to the timer. The ICAP2 pin can be used to perform input capture (ICF2 can be set and IC2R can be loaded) but the user must take care that the counter is reset each period and ICF1 can also generates interrupt if ICIE is set. 5. When the Pulse Width Modulation (PWM) and One Pulse Mode (OPM) bits are both set, the PWM mode is the only active one.

Pulse Width Modulation cycle

When Counter = OC1R

OCMP1 = OLVL1

When Counter = OC2R

OCMP1 = OLVL2 Counter is reset to FFFCh ICF1 bit is set

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16-BIT TIMER (Contd) 10.4.4 Low Power Modes

Mode WAIT Description No effect on 16-bit Timer. Timer interrupts cause the device to exit from WAIT mode. 16-bit Timer registers are frozen. In HALT mode, the counter stops counting until Halt mode is exited. Counting resumes from the previous count when the MCU is woken up by an interrupt with exit from HALT mode capability or from the counter reset value when the MCU is woken up by a RESET. If an input capture event occurs on the ICAPi pin, the input capture detection circuitry is armed. Consequently, when the MCU is woken up by an interrupt with exit from HALT mode capability, the ICFi bit is set, and the counter value present when exiting from HALT mode is captured into the ICiR register.

HALT

10.4.5 Interrupts
Interrupt Event Input Capture 1 event/Counter reset in PWM mode Input Capture 2 event Output Compare 1 event (not available in PWM mode) Output Compare 2 event (not available in PWM mode) Timer Overflow event Event Flag ICF1 ICF2 OCF1 OCF2 TOF Enable Control Bit ICIE OCIE TOIE Exit from Wait Yes Yes Yes Yes Yes Exit from Halt No No No No No

Note: The 16-bit Timer interrupt events are connected to the same interrupt vector (see Interrupts chapter). These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction). 10.4.6 Summary of Timer modes
MODES Input Capture (1 and/or 2) Output Compare (1 and/or 2) One Pulse Mode PWM Mode Input Capture 1 Yes Yes No No TIMER RESOURCES Input Capture 2 Output Compare 1 Output Compare 2 Yes2)5) Yes Yes4) Yes5) Yes Yes4) Not No Partially 2) Recommended1)5) Not No No Recommended3)5)

1) See note 4 in Section 10.4.3.5 One Pulse Mode 2) See note 5 and 6 in Section 10.4.3.5 One Pulse Mode 3) See note 4 in Section 10.4.3.6 Pulse Width Modulation Mode

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16-BIT TIMER (Contd) 10.4.7 Register Description Each Timer is associated with three control and status registers, and with six pairs of data registers (16-bit values) relating to the two input captures, the two output compares, the counter and the alternate counter. CONTROL REGISTER 1 (CR1) Read/Write Reset Value: 0000 0000 (00h)
7 0

Bit 4 = FOLV2 Forced Output Compare 2. This bit is set and cleared by software. 0: No effect on the OCMP2 pin. 1: Forces the OLVL2 bit to be copied to the OCMP2 pin, if the OC2E bit is set and even if there is no successful comparison. Bit 3 = FOLV1 Forced Output Compare 1. This bit is set and cleared by software. 0: No effect on the OCMP1 pin. 1: Forces OLVL1 to be copied to the OCMP1 pin, if the OC1E bit is set and even if there is no successful comparison. Bit 2 = OLVL2 Output Level 2. This bit is copied to the OCMP2 pin whenever a successful comparison occurs with the OC2R register and OCxE is set in the CR2 register. This value is copied to the OCMP1 pin in One Pulse Mode and Pulse Width Modulation mode. Bit 1 = IEDG1 Input Edge 1. This bit determines which type of level transition on the ICAP1 pin will trigger the capture. 0: A falling edge triggers the capture. 1: A rising edge triggers the capture. Bit 0 = OLVL1 Output Level 1. The OLVL1 bit is copied to the OCMP1 pin whenever a successful comparison occurs with the OC1R register and the OC1E bit is set in the CR2 register.

ICIE OCIE TOIE FOLV2 FOLV1 OLVL2 IEDG1 OLVL1

Bit 7 = ICIE Input Capture Interrupt Enable. 0: Interrupt is inhibited. 1: A timer interrupt is generated whenever the ICF1 or ICF2 bit of the SR register is set. Bit 6 = OCIE Output Compare Interrupt Enable. 0: Interrupt is inhibited. 1: A timer interrupt is generated whenever the OCF1 or OCF2 bit of the SR register is set. Bit 5 = TOIE Timer Overflow Interrupt Enable. 0: Interrupt is inhibited. 1: A timer interrupt is enabled whenever the TOF bit of the SR register is set.

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16-BIT TIMER (Contd) CONTROL REGISTER 2 (CR2) Read/Write Reset Value: 0000 0000 (00h)
7 0

OC1E OC2E OPM PWM CC1 CC0 IEDG2 EXEDG

Bit 4 = PWM Pulse Width Modulation. 0: PWM mode is not active. 1: PWM mode is active, the OCMP1 pin outputs a programmable cyclic signal; the length of the pulse depends on the value of OC1R register; the period depends on the value of OC2R register. Bit 3, 2 = CC[1:0] Clock Control. The timer clock mode depends on these bits: Table 16. Clock Control Bits
Timer Clock fCPU / 4 fCPU / 2 fCPU / 8 External Clock (where available) CC1 0 0 1 1 CC0 0 1 0 1

Bit 7 = OC1E Output Compare 1 Pin Enable. This bit is used only to output the signal from the timer on the OCMP1 pin (OLV1 in Output Compare mode, both OLV1 and OLV2 in PWM and one-pulse mode). Whatever the value of the OC1E bit, the Output Compare 1 function of the timer remains active. 0: OCMP1 pin alternate function disabled (I/O pin free for general-purpose I/O). 1: OCMP1 pin alternate function enabled. Bit 6 = OC2E Output Compare 2 Pin Enable. This bit is used only to output the signal from the timer on the OCMP2 pin (OLV2 in Output Compare mode). Whatever the value of the OC2E bit, the Output Compare 2 function of the timer remains active. 0: OCMP2 pin alternate function disabled (I/O pin free for general-purpose I/O). 1: OCMP2 pin alternate function enabled. Bit 5 = OPM One Pulse Mode. 0: One Pulse Mode is not active. 1: One Pulse Mode is active, the ICAP1 pin can be used to trigger one pulse on the OCMP1 pin; the active transition is given by the IEDG1 bit. The length of the generated pulse depends on the contents of the OC1R register.

Note: If the external clock pin is not available, programming the external clock configuration stops the counter. Bit 1 = IEDG2 Input Edge 2. This bit determines which type of level transition on the ICAP2 pin will trigger the capture. 0: A falling edge triggers the capture. 1: A rising edge triggers the capture. Bit 0 = EXEDG External Clock Edge. This bit determines which type of level transition on the external clock pin EXTCLK will trigger the counter register. 0: A falling edge triggers the counter register. 1: A rising edge triggers the counter register.

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16-BIT TIMER (Contd) CONTROL/STATUS REGISTER (CSR) Read Only (except bit 2 R/W) Reset Value: xxxx x0xx (xxh)
7 ICF1 OCF1 TOF ICF2 OCF2 TIMD 0 0 0

Note: Reading or writing the ACLR register does not clear TOF. Bit 4 = ICF2 Input Capture Flag 2. 0: No input capture (reset value). 1: An input capture has occurred on the ICAP2 pin. To clear this bit, first read the SR register, then read or write the low byte of the IC2R (IC2LR) register. Bit 3 = OCF2 Output Compare Flag 2. 0: No match (reset value). 1: The content of the free running counter has matched the content of the OC2R register. To clear this bit, first read the SR register, then read or write the low byte of the OC2R (OC2LR) register. Bit 2 = TIMD Timer disable. This bit is set and cleared by software. When set, it freezes the timer prescaler and counter and disabled the output functions (OCMP1 and OCMP2 pins) to reduce power consumption. Access to the timer registers is still available, allowing the timer configuration to be changed, or the counter reset, while it is disabled. 0: Timer enabled 1: Timer prescaler, counter and outputs disabled Bits 1:0 = Reserved, must be kept cleared.

Bit 7 = ICF1 Input Capture Flag 1. 0: No input capture (reset value). 1: An input capture has occurred on the ICAP1 pin or the counter has reached the OC2R value in PWM mode. To clear this bit, first read the SR register, then read or write the low byte of the IC1R (IC1LR) register. Bit 6 = OCF1 Output Compare Flag 1. 0: No match (reset value). 1: The content of the free running counter has matched the content of the OC1R register. To clear this bit, first read the SR register, then read or write the low byte of the OC1R (OC1LR) register. Bit 5 = TOF Timer Overflow Flag. 0: No timer overflow (reset value). 1: The free running counter rolled over from FFFFh to 0000h. To clear this bit, first read the SR register, then read or write the low byte of the CR (CLR) register.

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16-BIT TIMER (Contd) INPUT CAPTURE 1 HIGH REGISTER (IC1HR) Read Only Reset Value: Undefined This is an 8-bit read only register that contains the high part of the counter value (transferred by the input capture 1 event).
7 MSB 0 LSB

OUTPUT COMPARE 1 HIGH REGISTER (OC1HR) Read/Write Reset Value: 1000 0000 (80h) This is an 8-bit register that contains the high part of the value to be compared to the CHR register.
7 MSB 0 LSB

INPUT CAPTURE 1 LOW REGISTER (IC1LR) Read Only Reset Value: Undefined This is an 8-bit read only register that contains the low part of the counter value (transferred by the input capture 1 event).
7 MSB 0 LSB

OUTPUT COMPARE 1 LOW REGISTER (OC1LR) Read/Write Reset Value: 0000 0000 (00h) This is an 8-bit register that contains the low part of the value to be compared to the CLR register.
7 MSB 0 LSB

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16-BIT TIMER (Contd) OUTPUT COMPARE 2 HIGH REGISTER (OC2HR) Read/Write Reset Value: 1000 0000 (80h) This is an 8-bit register that contains the high part of the value to be compared to the CHR register.
7 MSB 0 LSB

ALTERNATE COUNTER HIGH REGISTER (ACHR) Read Only Reset Value: 1111 1111 (FFh) This is an 8-bit register that contains the high part of the counter value.
7 MSB 0 LSB

OUTPUT COMPARE 2 LOW REGISTER (OC2LR) Read/Write Reset Value: 0000 0000 (00h) This is an 8-bit register that contains the low part of the value to be compared to the CLR register.
7 MSB 0 LSB

ALTERNATE COUNTER LOW REGISTER (ACLR) Read Only Reset Value: 1111 1100 (FCh) This is an 8-bit register that contains the low part of the counter value. A write to this register resets the counter. An access to this register after an access to CSR register does not clear the TOF bit in the CSR register.
7 MSB 0 LSB

COUNTER HIGH REGISTER (CHR) Read Only Reset Value: 1111 1111 (FFh) This is an 8-bit register that contains the high part of the counter value.
7 MSB 0 LSB

INPUT CAPTURE 2 HIGH REGISTER (IC2HR) Read Only Reset Value: Undefined This is an 8-bit read only register that contains the high part of the counter value (transferred by the Input Capture 2 event).
7 MSB 0 LSB

COUNTER LOW REGISTER (CLR) Read Only Reset Value: 1111 1100 (FCh) This is an 8-bit register that contains the low part of the counter value. A write to this register resets the counter. An access to this register after accessing the CSR register clears the TOF bit.
7 MSB 0 LSB

INPUT CAPTURE 2 LOW REGISTER (IC2LR) Read Only Reset Value: Undefined This is an 8-bit read only register that contains the low part of the counter value (transferred by the Input Capture 2 event).
7 MSB 0 LSB

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16-BIT TIMER (Contd) Table 17. 16-Bit Timer Register Map and Reset Values
Address (Hex.) Timer A: 32 Timer B: 42 Timer A: 31 Timer B: 41 Timer A: 33 Timer B: 43 Timer A: 34 Timer B: 44 Timer A: 35 Timer B: 45 Timer A: 36 Timer B: 46 Timer A: 37 Timer B: 47 Timer A: 3E Timer B: 4E Timer A: 3F Timer B: 4F Timer A: 38 Timer B: 48 Timer A: 39 Timer B: 49 Timer A: 3A Timer B: 4A Timer A: 3B Timer B: 4B Timer A: 3C Timer B: 4C Timer A: 3D Timer B: 4D Register Label CR1 Reset Value CR2 Reset Value CSR Reset Value IC1HR Reset Value IC1LR Reset Value OC1HR Reset Value OC1LR Reset Value OC2HR Reset Value OC2LR Reset Value CHR Reset Value CLR Reset Value ACHR Reset Value ACLR Reset Value IC2HR Reset Value IC2LR Reset Value 7 ICIE 0 OC1E 0 ICF1 x MSB x MSB x MSB 1 MSB 0 MSB 1 MSB 0 MSB 1 MSB 1 MSB 1 MSB 1 MSB x MSB x 6 OCIE 0 OC2E 0 OCF1 x x x 0 0 0 0 1 1 1 1 x x 5 TOIE 0 OPM 0 TOF x x x 0 0 0 0 1 1 1 1 x x 4 FOLV2 0 PWM 0 ICF2 x x x 0 0 0 0 1 1 1 1 x x 3 FOLV1 0 CC1 0 OCF2 x x x 0 0 0 0 1 1 1 1 x x 2 OLVL2 0 CC0 0 TIMD 0 x x 0 0 0 0 1 1 1 1 x x 1 IEDG1 0 IEDG2 0 x x x 0 0 0 0 1 0 1 0 x x 0 OLVL1 0 EXEDG 0 x LSB x LSB x LSB 0 LSB 0 LSB 0 LSB 0 LSB 1 LSB 0 LSB 1 LSB 0 LSB x LSB x

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10.5 SERIAL PERIPHERAL INTERFACE (SPI) 10.5.1 Introduction The Serial Peripheral Interface (SPI) allows fullduplex, synchronous, serial communication with external devices. An SPI system may consist of a master and one or more slaves however the SPI interface can not be a master in a multi-master system. 10.5.2 Main Features I Full duplex synchronous transfers (on 3 lines) I Simplex synchronous transfers (on 2 lines) I Master or slave operation I Six master mode frequencies (fCPU/4 max.) I fCPU/2 max. slave mode frequency I SS Management by software or hardware I Programmable clock polarity and phase I End of transfer interrupt flag I Write collision, Master Mode Fault and Overrun flags 10.5.3 General Description Figure 53 shows the serial peripheral interface (SPI) block diagram. There are 3 registers: SPI Control Register (SPICR) SPI Control/Status Register (SPICSR) SPI Data Register (SPIDR) The SPI is connected to external devices through 3 pins: MISO: Master In / Slave Out data MOSI: Master Out / Slave In data SCK: Serial Clock out by SPI masters and input by SPI slaves SS: Slave select: This input signal acts as a chip select to let the SPI master communicate with slaves individually and to avoid contention on the data lines. Slave SS inputs can be driven by standard I/O ports on the master MCU.

Figure 53. Serial Peripheral Interface Block Diagram

Data/Address Bus SPIDR Read Read Buffer Interrupt request

MOSI MISO
8-Bit Shift Register
7 SPIF WCOL OVR MODF 0

SPICSR
SOD SSM

0 SSI

SOD bit

Write

SS
SPI STATE CONTROL
7 SPIE

1 0

SCK

SPICR

SPE SPR2 MSTR CPOL CPHA SPR1 SPR0

MASTER CONTROL SERIAL CLOCK GENERATOR

SS

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.3.1 Functional Description A basic example of interconnections between a single master and a single slave is illustrated in Figure 54. The MOSI pins are connected together and the MISO pins are connected together. In this way data is transferred serially between master and slave (most significant bit first). The communication is always initiated by the master. When the master device transmits data to a slave device via MOSI pin, the slave device reFigure 54. Single Master/ Single Slave Application

sponds by sending data to the master device via the MISO pin. This implies full duplex communication with both data out and data in synchronized with the same clock signal (which is provided by the master device via the SCK pin). To use a single data line, the MISO and MOSI pins must be connected at each node ( in this case only simplex communication is possible). Four possible data/clock timing relationships may be chosen (see Figure 57) but master and slave must be programmed with the same timing mode.

MASTER MSBit LSBit MISO MISO MSBit

SLAVE LSBit

8-BIT SHIFT REGISTER

8-BIT SHIFT REGISTER

MOSI

MOSI

SPI CLOCK GENERATOR

SCK SS +5V

SCK SS

Not used if SS is managed by software

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.3.2 Slave Select Management As an alternative to using the SS pin to control the Slave Select signal, the application can choose to manage the Slave Select signal by software. This is configured by the SSM bit in the SPICSR register (see Figure 56) In software management, the external SS pin is free for other application uses and the internal SS signal level is driven by writing to the SSI bit in the SPICSR register. In Master mode: SS internal must be held high continuously

In Slave Mode: There are two cases depending on the data/clock timing relationship (see Figure 55): If CPHA=1 (data latched on 2nd clock edge): SS internal must be held low during the entire transmission. This implies that in single slave applications the SS pin either can be tied to VSS, or made free for standard I/O by managing the SS function by software (SSM= 1 and SSI=0 in the in the SPICSR register) If CPHA=0 (data latched on 1st clock edge): SS internal must be held low during byte transmission and pulled high between each byte to allow the slave to write to the shift register. If SS is not pulled high, a Write Collision error will occur when the slave writes to the shift register (see Section 10.5.5.3).

Figure 55. Generic SS Timing Diagram

MOSI/MISO Master SS Slave SS (if CPHA=0) Slave SS (if CPHA=1)

Byte 1

Byte 2

Byte 3

Figure 56. Hardware/Software Slave Select Management SSM bit

SSI bit SS external pin

1 0

SS internal

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.3.3 Master Mode Operation In master mode, the serial clock is output on the SCK pin. The clock frequency, polarity and phase are configured by software (refer to the description of the SPICSR register). Note: The idle state of SCK must correspond to the polarity selected in the SPICSR register (by pulling up SCK if CPOL=1 or pulling down SCK if CPOL=0). To operate the SPI in master mode, perform the following two steps in order (if the SPICSR register is not written first, the SPICR register setting may be not taken into account): 1. Write to the SPICSR register: Select the clock frequency by configuring the SPR[2:0] bits. Select the clock polarity and clock phase by configuring the CPOL and CPHA bits. Figure 57 shows the four possible configurations. Note: The slave must have the same CPOL and CPHA settings as the master. Either set the SSM bit and set the SSI bit or clear the SSM bit and tie the SS pin high for the complete byte transmit sequence. 2. Write to the SPICR register: Set the MSTR and SPE bits Note: MSTR and SPE bits remain set only if SS is high). The transmit sequence begins when software writes a byte in the SPIDR register. 10.5.3.4 Master Mode Transmit Sequence When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the MOSI pin most significant bit first. When data transfer is complete: The SPIF bit is set by hardware An interrupt request is generated if the SPIE bit is set and the interrupt mask in the CCR register is cleared. Clearing the SPIF bit is performed by the following software sequence: 1. An access to the SPICSR register while the SPIF bit is set 2. A read to the SPIDR register. Note: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read.

10.5.3.5 Slave Mode Operation In slave mode, the serial clock is received on the SCK pin from the master device. To operate the SPI in slave mode: 1. Write to the SPICSR register to perform the following actions: Select the clock polarity and clock phase by configuring the CPOL and CPHA bits (see Figure 57). Note: The slave must have the same CPOL and CPHA settings as the master. Manage the SS pin as described in Section 10.5.3.2 and Figure 55. If CPHA=1 SS must be held low continuously. If CPHA=0 SS must be held low during byte transmission and pulled up between each byte to let the slave write in the shift register. 2. Write to the SPICR register to clear the MSTR bit and set the SPE bit to enable the SPI I/O functions. 10.5.3.6 Slave Mode Transmit Sequence When software writes to the SPIDR register, the data byte is loaded into the 8-bit shift register and then shifted out serially to the MISO pin most significant bit first. The transmit sequence begins when the slave device receives the clock signal and the most significant bit of the data on its MOSI pin. When data transfer is complete: The SPIF bit is set by hardware An interrupt request is generated if SPIE bit is set and interrupt mask in the CCR register is cleared. Clearing the SPIF bit is performed by the following software sequence: 1. An access to the SPICSR register while the SPIF bit is set. 2. A write or a read to the SPIDR register. Notes: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. The SPIF bit can be cleared during a second transmission; however, it must be cleared before the second SPIF bit in order to prevent an Overrun condition (see Section 10.5.5.2).

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.4 Clock Phase and Clock Polarity Four possible timing relationships may be chosen by software, using the CPOL and CPHA bits (See Figure 57). Note: The idle state of SCK must correspond to the polarity selected in the SPICSR register (by pulling up SCK if CPOL=1 or pulling down SCK if CPOL=0). The combination of the CPOL clock polarity and CPHA (clock phase) bits selects the data capture clock edge Figure 57. Data Clock Timing Diagram

Figure 57, shows an SPI transfer with the four combinations of the CPHA and CPOL bits. The diagram may be interpreted as a master or slave timing diagram where the SCK pin, the MISO pin, the MOSI pin are directly connected between the master and the slave device. Note: If CPOL is changed at the communication byte boundaries, the SPI must be disabled by resetting the SPE bit.

CPHA =1
SCK (CPOL = 1) SCK (CPOL = 0)

MISO (from master) MOSI (from slave) SS (to slave)

CAPTURE STROBE

MSBit

Bit 6

Bit 5

Bit 4

Bit3

Bit 2

Bit 1

LSBit

MSBit

Bit 6

Bit 5

Bit 4

Bit3

Bit 2

Bit 1

LSBit

CPHA =0
SCK (CPOL = 1) SCK (CPOL = 0)

MISO (from master) MOSI (from slave) SS (to slave)

CAPTURE STROBE

MSBit

Bit 6

Bit 5

Bit 4

Bit3

Bit 2

Bit 1

LSBit

MSBit

Bit 6

Bit 5

Bit 4

Bit3

Bit 2

Bit 1

LSBit

Note: This figure should not be used as a replacement for parametric information. Refer to the Electrical Characteristics chapter.

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.5 Error Flags 10.5.5.1 Master Mode Fault (MODF) Master mode fault occurs when the master device has its SS pin pulled low. When a Master mode fault occurs: The MODF bit is set and an SPI interrupt request is generated if the SPIE bit is set. The SPE bit is reset. This blocks all output from the device and disables the SPI peripheral. The MSTR bit is reset, thus forcing the device into slave mode. Clearing the MODF bit is done through a software sequence: 1. A read access to the SPICSR register while the MODF bit is set. 2. A write to the SPICR register. Notes: To avoid any conflicts in an application with multiple slaves, the SS pin must be pulled high during the MODF bit clearing sequence. The SPE and MSTR bits may be restored to their original state during or after this clearing sequence. Hardware does not allow the user to set the SPE and MSTR bits while the MODF bit is set except in the MODF bit clearing sequence. 10.5.5.2 Overrun Condition (OVR) An overrun condition occurs, when the master device has sent a data byte and the slave device has

not cleared the SPIF bit issued from the previously transmitted byte. When an Overrun occurs: The OVR bit is set and an interrupt request is generated if the SPIE bit is set. In this case, the receiver buffer contains the byte sent after the SPIF bit was last cleared. A read to the SPIDR register returns this byte. All other bytes are lost. The OVR bit is cleared by reading the SPICSR register. 10.5.5.3 Write Collision Error (WCOL) A write collision occurs when the software tries to write to the SPIDR register while a data transfer is taking place with an external device. When this happens, the transfer continues uninterrupted; and the software write will be unsuccessful. Write collisions can occur both in master and slave mode. See also Section 10.5.3.2 Slave Select Management. Note: a "read collision" will never occur since the received data byte is placed in a buffer in which access is always synchronous with the MCU operation. The WCOL bit in the SPICSR register is set if a write collision occurs. No SPI interrupt is generated when the WCOL bit is set (the WCOL bit is a status flag only). Clearing the WCOL bit is done through a software sequence (see Figure 58).

Figure 58. Clearing the WCOL bit (Write Collision Flag) Software Sequence Clearing sequence after SPIF = 1 (end of a data byte transfer) 1st Step Read SPICSR
RESULT

2nd Step

Read SPIDR

SPIF =0 WCOL=0

Clearing sequence before SPIF = 1 (during a data byte transfer) 1st Step 2nd Step Read SPICSR
RESULT

Read SPIDR

WCOL=0

Note: Writing to the SPIDR register instead of reading it does not reset the WCOL bit

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.5.4 Single Master Systems A typical single master system may be configured, using an MCU as the master and four MCUs as slaves (see Figure 59). The master device selects the individual slave devices by using four pins of a parallel port to control the four SS pins of the slave devices. The SS pins are pulled high during reset since the master device ports will be forced to be inputs at that time, thus disabling the slave devices.

Note: To prevent a bus conflict on the MISO line the master allows only one active slave device during a transmission. For more security, the slave device may respond to the master with the received data byte. Then the master will receive the previous byte back from the slave device if all MISO and MOSI pins are connected and the slave has not written to its SPIDR register. Other transmission security methods can use ports for handshake lines or data bytes with command fields.

Figure 59. Single Master / Multiple Slave Configuration

SS SCK Slave MCU MOSI MISO SCK Slave MCU

SS SCK Slave MCU

SS SCK Slave MCU

SS

MOSI MISO

MOSI MISO

MOSI MISO

MOSI MISO SCK Master MCU 5V SS Ports

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.6 Low Power Modes

Mode WAIT Description No effect on SPI. SPI interrupt events cause the device to exit from WAIT mode. SPI registers are frozen. In HALT mode, the SPI is inactive. SPI operation resumes when the MCU is woken up by an interrupt with exit from HALT mode capability. The data received is subsequently read from the SPIDR register when the software is running (interrupt vector fetching). If several data are received before the wakeup event, then an overrun error is generated. This error can be detected after the fetch of the interrupt routine that woke up the device.

SPI exits from Slave mode, it returns to normal state immediately. Caution: The SPI can wake up the ST7 from Halt mode only if the Slave Select signal (external SS pin or the SSI bit in the SPICSR register) is low when the ST7 enters Halt mode. So if Slave selection is configured as external (see Section 10.5.3.2), make sure the master drives a low level on the SS pin when the slave enters Halt mode. 10.5.7 Interrupts
Interrupt Event SPI End of Transfer Event Master Mode Fault Event Overrun Error Event Flag SPIF MODF OVR SPIE Enable Control Bit Exit from Wait Yes Yes Yes Exit from Halt Yes No No

HALT

10.5.6.1 Using the SPI to wakeup the MCU from Halt mode In slave configuration, the SPI is able to wakeup the ST7 device from HALT mode through a SPIF interrupt. The data received is subsequently read from the SPIDR register when the software is running (interrupt vector fetch). If multiple data transfers have been performed before software clears the SPIF bit, then the OVR bit is set by hardware. Note: When waking up from Halt mode, if the SPI remains in Slave mode, it is recommended to perform an extra communications cycle to bring the SPI from Halt mode state to normal state. If the

Note: The SPI interrupt events are connected to the same interrupt vector (see Interrupts chapter). They generate an interrupt if the corresponding Enable Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction).

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SERIAL PERIPHERAL INTERFACE (Contd) 10.5.8 Register Description CONTROL REGISTER (SPICR) Read/Write Reset Value: 0000 xxxx (0xh)
7 SPIE SPE SPR2 MSTR CPOL CPHA SPR1 0 SPR0

Bit 7 = SPIE Serial Peripheral Interrupt Enable. This bit is set and cleared by software. 0: Interrupt is inhibited 1: An SPI interrupt is generated whenever SPIF=1, MODF=1 or OVR=1 in the SPICSR register Bit 6 = SPE Serial Peripheral Output Enable. This bit is set and cleared by software. It is also cleared by hardware when, in master mode, SS=0 (see Section 10.5.5.1 Master Mode Fault (MODF)). The SPE bit is cleared by reset, so the SPI peripheral is not initially connected to the external pins. 0: I/O pins free for general purpose I/O 1: SPI I/O pin alternate functions enabled Bit 5 = SPR2 Divider Enable. This bit is set and cleared by software and is cleared by reset. It is used with the SPR[1:0] bits to set the baud rate. Refer to Table 18 SPI Master mode SCK Frequency. 0: Divider by 2 enabled 1: Divider by 2 disabled Note: This bit has no effect in slave mode. Bit 4 = MSTR Master Mode. This bit is set and cleared by software. It is also cleared by hardware when, in master mode, SS=0 (see Section 10.5.5.1 Master Mode Fault (MODF)). 0: Slave mode 1: Master mode. The function of the SCK pin changes from an input to an output and the functions of the MISO and MOSI pins are reversed.

Bit 3 = CPOL Clock Polarity. This bit is set and cleared by software. This bit determines the idle state of the serial Clock. The CPOL bit affects both the master and slave modes. 0: SCK pin has a low level idle state 1: SCK pin has a high level idle state Note: If CPOL is changed at the communication byte boundaries, the SPI must be disabled by resetting the SPE bit. Bit 2 = CPHA Clock Phase. This bit is set and cleared by software. 0: The first clock transition is the first data capture edge. 1: The second clock transition is the first capture edge. Note: The slave must have the same CPOL and CPHA settings as the master. Bits 1:0 = SPR[1:0] Serial Clock Frequency. These bits are set and cleared by software. Used with the SPR2 bit, they select the baud rate of the SPI serial clock SCK output by the SPI in master mode. Note: These 2 bits have no effect in slave mode. Table 18. SPI Master mode SCK Frequency Serial Clock fCPU/4 fCPU/8 fCPU/16 fCPU/32 fCPU/64 fCPU/128 SPR2 1 0 0 1 0 0 SPR1 0 0 0 1 1 1 SPR0 0 0 1 0 0 1

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SERIAL PERIPHERAL INTERFACE (Contd) CONTROL/STATUS REGISTER (SPICSR) Read/Write (some bits Read Only) Reset Value: 0000 0000 (00h)
7 SPIF WCOL OVR MODF SOD SSM 0 SSI

Bit 3 = Reserved, must be kept cleared. Bit 2 = SOD SPI Output Disable. This bit is set and cleared by software. When set, it disables the alternate function of the SPI output (MOSI in master mode / MISO in slave mode) 0: SPI output enabled (if SPE=1) 1: SPI output disabled Bit 1 = SSM SS Management. This bit is set and cleared by software. When set, it disables the alternate function of the SPI SS pin and uses the SSI bit value instead. See Section 10.5.3.2 Slave Select Management. 0: Hardware management (SS managed by external pin) 1: Software management (internal SS signal controlled by SSI bit. External SS pin free for general-purpose I/O) Bit 0 = SSI SS Internal Mode. This bit is set and cleared by software. It acts as a chip select by controlling the level of the SS slave select signal when the SSM bit is set. 0 : Slave selected 1 : Slave deselected DATA I/O REGISTER (SPIDR) Read/Write Reset Value: Undefined
7 0 D6 D5 D4 D3 D2 D1 D0

Bit 7 = SPIF Serial Peripheral Data Transfer Flag (Read only). This bit is set by hardware when a transfer has been completed. An interrupt is generated if SPIE=1 in the SPICR register. It is cleared by a software sequence (an access to the SPICSR register followed by a write or a read to the SPIDR register). 0: Data transfer is in progress or the flag has been cleared. 1: Data transfer between the device and an external device has been completed. Note: While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. Bit 6 = WCOL Write Collision status (Read only). This bit is set by hardware when a write to the SPIDR register is done during a transmit sequence. It is cleared by a software sequence (see Figure 58). 0: No write collision occurred 1: A write collision has been detected Bit 5 = OVR SPI Overrun error (Read only). This bit is set by hardware when the byte currently being received in the shift register is ready to be transferred into the SPIDR register while SPIF = 1 (See Section 10.5.5.2). An interrupt is generated if SPIE = 1 in SPICSR register. The OVR bit is cleared by software reading the SPICSR register. 0: No overrun error 1: Overrun error detected Bit 4 = MODF Mode Fault flag (Read only). This bit is set by hardware when the SS pin is pulled low in master mode (see Section 10.5.5.1 Master Mode Fault (MODF)). An SPI interrupt can be generated if SPIE=1 in the SPICSR register. This bit is cleared by a software sequence (An access to the SPICSR register while MODF=1 followed by a write to the SPICR register). 0: No master mode fault detected 1: A fault in master mode has been detected

D7

The SPIDR register is used to transmit and receive data on the serial bus. In a master device, a write to this register will initiate transmission/reception of another byte. Notes: During the last clock cycle the SPIF bit is set, a copy of the received data byte in the shift register is moved to a buffer. When the user reads the serial peripheral data I/O register, the buffer is actually being read. While the SPIF bit is set, all writes to the SPIDR register are inhibited until the SPICSR register is read. Warning: A write to the SPIDR register places data directly into the shift register for transmission. A read to the SPIDR register returns the value located in the buffer and not the content of the shift register (see Figure 53).

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SERIAL PERIPHERAL INTERFACE (Contd) Table 19. SPI Register Map and Reset Values
Address (Hex.) 0021h 0022h 0023h Register Label SPIDR Reset Value SPICR Reset Value SPICSR Reset Value 7 MSB x SPIE 0 SPIF 0 6 5 4 3 2 1 0 LSB x SPR0 x SSI 0

x SPE 0 WCOL 0

x SPR2 0 OR 0

x MSTR 0 MODF 0

x CPOL x 0

x CPHA x SOD 0

x SPR1 x SSM 0

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10.6 SERIAL COMMUNICATIONS INTERFACE (SCI) 10.6.1 Introduction The Serial Communications Interface (SCI) offers a flexible means of full-duplex data exchange with external equipment requiring an industry standard NRZ asynchronous serial data format. The SCI offers a very wide range of baud rates using two baud rate generator systems. 10.6.2 Main Features I Full duplex, asynchronous communications I NRZ standard format (Mark/Space) I Dual baud rate generator systems I Independently programmable transmit and receive baud rates up to 500K baud. I Programmable data word length (8 or 9 bits) I Receive buffer full, Transmit buffer empty and End of Transmission flags I Two receiver wake-up modes: Address bit (MSB) Idle line I Muting function for multiprocessor configurations I Separate enable bits for Transmitter and Receiver I Four error detection flags: Overrun error Noise error Frame error Parity error I Five interrupt sources with flags: Transmit data register empty Transmission complete Receive data register full Idle line received Overrun error detected I Parity control: Transmits parity bit Checks parity of received data byte I Reduced power consumption mode 10.6.3 General Description The interface is externally connected to another device by two pins (see Figure 61): TDO: Transmit Data Output. When the transmitter and the receiver are disabled, the output pin returns to its I/O port configuration. When the transmitter and/or the receiver are enabled and nothing is to be transmitted, the TDO pin is at high level. RDI: Receive Data Input is the serial data input. Oversampling techniques are used for data recovery by discriminating between valid incoming data and noise. Through these pins, serial data is transmitted and received as frames comprising: An Idle Line prior to transmission or reception A start bit A data word (8 or 9 bits) least significant bit first A Stop bit indicating that the frame is complete. This interface uses two types of baud rate generator: A conventional type for commonly-used baud rates, An extended type with a prescaler offering a very wide range of baud rates even with non-standard oscillator frequencies.

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SERIAL COMMUNICATIONS INTERFACE (Contd) Figure 60. SCI Block Diagram

Write

Read

(DATA REGISTER) DR

Transmit Data Register (TDR) TDO Transmit Shift Register RDI

Received Data Register (RDR)

Received Shift Register

CR1
R8 T8 SCID M WAKE PCE PS PIE

TRANSMIT CONTROL

WAKE UP UNIT

RECEIVER CONTROL

RECEIVER CLOCK

CR2
TIE TCIE RIE ILIE TE RE RWU SBK TDRE TC RDRF IDLE OR NF FE PE

SR

SCI INTERRUPT CONTROL TRANSMITTER CLOCK TRANSMITTER RATE

fCPU

CONTROL

/16

/PR BRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0

RECEIVER RATE CONTROL CONVENTIONAL BAUD RATE GENERATOR

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.4 Functional Description The block diagram of the Serial Control Interface, is shown in Figure 60. It contains 6 dedicated registers: Two control registers (SCICR1 & SCICR2) A status register (SCISR) A baud rate register (SCIBRR) An extended prescaler receiver register (SCIERPR) An extended prescaler transmitter register (SCIETPR) Refer to the register descriptions in Section 10.6.7for the definitions of each bit.

10.6.4.1 Serial Data Format Word length may be selected as being either 8 or 9 bits by programming the M bit in the SCICR1 register (see Figure 60). The TDO pin is in low state during the start bit. The TDO pin is in high state during the stop bit. An Idle character is interpreted as an entire frame of 1s followed by the start bit of the next frame which contains data. A Break character is interpreted on receiving 0s for some multiple of the frame period. At the end of the last break frame the transmitter inserts an extra 1 bit to acknowledge the start bit. Transmission and reception are driven by their own baud rate generator.

Figure 61. Word Length Programming

9-bit Word length (M bit is set) Data Frame

Start Bit Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6 Bit7 Possible Parity Bit Bit8

Next Data Frame

Next Stop Start Bit Bit Start Bit

Idle Frame

Break Frame

Extra 1

Start Bit

8-bit Word length (M bit is reset) Data Frame

Start Bit Bit0 Bit1 Bit2 Bit3 Bit4 Bit5 Bit6

Possible Parity Bit Bit7 Stop Bit

Next Data Frame

Next Start Bit Start Bit Extra Start Bit 1

Idle Frame Break Frame

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.4.2 Transmitter The transmitter can send data words of either 8 or 9 bits depending on the M bit status. When the M bit is set, word length is 9 bits and the 9th bit (the MSB) has to be stored in the T8 bit in the SCICR1 register. Character Transmission During an SCI transmission, data shifts out least significant bit first on the TDO pin. In this mode, the SCIDR register consists of a buffer (TDR) between the internal bus and the transmit shift register (see Figure 60). Procedure Select the M bit to define the word length. Select the desired baud rate using the SCIBRR and the SCIETPR registers. Set the TE bit to assign the TDO pin to the alternate function and to send a idle frame as first transmission. Access the SCISR register and write the data to send in the SCIDR register (this sequence clears the TDRE bit). Repeat this sequence for each data to be transmitted. Clearing the TDRE bit is always performed by the following software sequence: 1. An access to the SCISR register 2. A write to the SCIDR register The TDRE bit is set by hardware and it indicates: The TDR register is empty. The data transfer is beginning. The next data can be written in the SCIDR register without overwriting the previous data. This flag generates an interrupt if the TIE bit is set and the I bit is cleared in the CCR register. When a transmission is taking place, a write instruction to the SCIDR register stores the data in the TDR register and which is copied in the shift register at the end of the current transmission. When no transmission is taking place, a write instruction to the SCIDR register places the data directly in the shift register, the data transmission starts, and the TDRE bit is immediately set.

When a frame transmission is complete (after the stop bit or after the break frame) the TC bit is set and an interrupt is generated if the TCIE is set and the I bit is cleared in the CCR register. Clearing the TC bit is performed by the following software sequence: 1. An access to the SCISR register 2. A write to the SCIDR register Note: The TDRE and TC bits are cleared by the same software sequence. Break Characters Setting the SBK bit loads the shift register with a break character. The break frame length depends on the M bit (see Figure 61). As long as the SBK bit is set, the SCI send break frames to the TDO pin. After clearing this bit by software the SCI insert a logic 1 bit at the end of the last break frame to guarantee the recognition of the start bit of the next frame. Idle Characters Setting the TE bit drives the SCI to send an idle frame before the first data frame. Clearing and then setting the TE bit during a transmission sends an idle frame after the current word. Note: Resetting and setting the TE bit causes the data in the TDR register to be lost. Therefore the best time to toggle the TE bit is when the TDRE bit is set i.e. before writing the next byte in the SCIDR.

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.4.3 Receiver The SCI can receive data words of either 8 or 9 bits. When the M bit is set, word length is 9 bits and the MSB is stored in the R8 bit in the SCICR1 register. Character reception During a SCI reception, data shifts in least significant bit first through the RDI pin. In this mode, the SCIDR register consists or a buffer (RDR) between the internal bus and the received shift register (see Figure 60). Procedure Select the M bit to define the word length. Select the desired baud rate using the SCIBRR and the SCIERPR registers. Set the RE bit, this enables the receiver which begins searching for a start bit. When a character is received: The RDRF bit is set. It indicates that the content of the shift register is transferred to the RDR. An interrupt is generated if the RIE bit is set and the I bit is cleared in the CCR register. The error flags can be set if a frame error, noise or an overrun error has been detected during reception. Clearing the RDRF bit is performed by the following software sequence done by: 1. An access to the SCISR register 2. A read to the SCIDR register. The RDRF bit must be cleared before the end of the reception of the next character to avoid an overrun error. Break Character When a break character is received, the SPI handles it as a framing error. Idle Character When a idle frame is detected, there is the same procedure as a data received character plus an interrupt if the ILIE bit is set and the I bit is cleared in the CCR register.

Overrun Error An overrun error occurs when a character is received when RDRF has not been reset. Data can not be transferred from the shift register to the RDR register as long as the RDRF bit is not cleared. When a overrun error occurs: The OR bit is set. The RDR content will not be lost. The shift register will be overwritten. An interrupt is generated if the RIE bit is set and the I bit is cleared in the CCR register. The OR bit is reset by an access to the SCISR register followed by a SCIDR register read operation. Noise Error Oversampling techniques are used for data recovery by discriminating between valid incoming data and noise. When noise is detected in a frame: The NF is set at the rising edge of the RDRF bit. Data is transferred from the Shift register to the SCIDR register. No interrupt is generated. However this bit rises at the same time as the RDRF bit which itself generates an interrupt. The NF bit is reset by a SCISR register read operation followed by a SCIDR register read operation. Framing Error A framing error is detected when: The stop bit is not recognized on reception at the expected time, following either a de-synchronization or excessive noise. A break is received. When the framing error is detected: the FE bit is set by hardware Data is transferred from the Shift register to the SCIDR register. No interrupt is generated. However this bit rises at the same time as the RDRF bit which itself generates an interrupt. The FE bit is reset by a SCISR register read operation followed by a SCIDR register read operation.

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SERIAL COMMUNICATIONS INTERFACE (Contd) Figure 62. SCI Baud Rate and Extended Prescaler Block Diagram
TRANSMITTER CLOCK EXTENDED PRESCALER TRANSMITTER RATE CONTROL

SCIETPR
EXTENDED TRANSMITTER PRESCALER REGISTER

SCIERPR
EXTENDED RECEIVER PRESCALER REGISTER RECEIVER CLOCK EXTENDED PRESCALER RECEIVER RATE CONTROL EXTENDED PRESCALER

fCPU
TRANSMITTER RATE CONTROL

/16

/PR SCIBRR
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2 SCR1SCR0

RECEIVER RATE CONTROL CONVENTIONAL BAUD RATE GENERATOR

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.4.4 Conventional Baud Rate Generation with: The baud rate for the receiver and transmitter (Rx ETPR = 1,..,255 (see SCIETPR register) and Tx) are set independently and calculated as ERPR = 1,.. 255 (see SCIERPR register) follows: 10.6.4.6 Receiver Muting and Wake-up Feature fCPU fCPU In multiprocessor configurations it is often desiraRx = Tx = ble that only the intended message recipient (16*PR)*RR (16*PR)*TR should actively receive the full message contents, with: thus reducing redundant SCI service overhead for all non addressed receivers. PR = 1, 3, 4 or 13 (see SCP[1:0] bits) The non addressed devices may be placed in TR = 1, 2, 4, 8, 16, 32, 64,128 sleep mode by means of the muting function. (see SCT[2:0] bits) Setting the RWU bit by software puts the SCI in RR = 1, 2, 4, 8, 16, 32, 64,128 sleep mode: (see SCR[2:0] bits) All the reception status bits can not be set. All these bits are in the SCIBRR register. All the receive interrupts are inhibited. Example: If fCPU is 8 MHz (normal mode) and if A muted receiver may be awakened by one of the PR=13 and TR=RR=1, the transmit and receive following two ways: baud rates are 38400 baud. by Idle Line detection if the WAKE bit is reset, Note: the baud rate registers MUST NOT be by Address Mark detection if the WAKE bit is set. changed while the transmitter or the receiver is enabled. Receiver wakes-up by Idle Line detection when the Receive line has recognised an Idle Frame. 10.6.4.5 Extended Baud Rate Generation Then the RWU bit is reset by hardware but the The extended prescaler option gives a very fine IDLE bit is not set. tuning on the baud rate, using a 255 value prescalReceiver wakes-up by Address Mark detection er, whereas the conventional Baud Rate Generawhen it received a 1 as the most significant bit of tor retains industry standard software compatibilia word, thus indicating that the message is an adty. dress. The reception of this particular word wakes The extended baud rate generator block diagram up the receiver, resets the RWU bit and sets the is described in the Figure 62. RDRF bit, which allows the receiver to receive this word normally and to use it as an address word. The output clock rate sent to the transmitter or to the receiver will be the output from the 16 divider Caution: In Mute mode, do not write to the divided by a factor ranging from 1 to 255 set in the SCICR2 register. If the SCI is in Mute mode during SCIERPR or the SCIETPR register. the read operation (RWU=1) and a address mark wake up event occurs (RWU is reset) before the Note: the extended prescaler is activated by setwrite operation, the RWU bit will be set again by ting the SCIETPR or SCIERPR register to a value this write operation. Consequently the address other than zero. The baud rates are calculated as byte is lost and the SCI is not woken up from Mute follows: mode. fCPU fCPU Rx = Tx = 16*ERPR*(PR*RR) 16*ETPR*(PR*TR)

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.4.7 Parity Control Parity control (generation of parity bit in trasmission and and parity chencking in reception) can be enabled by setting the PCE bit in the SCICR1 register. Depending on the frame length defined by the M bit, the possible SCI frame formats are as listed in Table 20. Table 20. Frame Formats
M bit 0 0 1 1 PCE bit 0 1 0 1 SCI frame | SB | 8 bit data | STB | | SB | 7-bit data | PB | STB | | SB | 9-bit data | STB | | SB | 8-bit data PB | STB |

(PS=0) or an odd number of 1s if odd parity is selected (PS=1). If the parity check fails, the PE flag is set in the SCISR register and an interrupt is generated if PIE is set in the SCICR1 register. 10.6.5 Low Power Modes Mode WAIT Description No effect on SCI. SCI interrupts cause the device to exit from Wait mode. SCI registers are frozen. In Halt mode, the SCI stops transmitting/receiving until Halt mode is exited.

HALT

Legend: SB = Start Bit, STB = Stop Bit, PB = Parity Bit Note: In case of wake up by an address mark, the MSB bit of the data is taken into account and not the parity bit Even parity: the parity bit is calculated to obtain an even number of 1s inside the frame made of the 7 or 8 LSB bits (depending on whether M is equal to 0 or 1) and the parity bit. Ex: data=00110101; 4 bits set => parity bit will be 0 if even parity is selected (PS bit = 0). Odd parity: the parity bit is calculated to obtain an odd number of 1s inside the frame made of the 7 or 8 LSB bits (depending on whether M is equal to 0 or 1) and the parity bit. Ex: data=00110101; 4 bits set => parity bit will be 1 if odd parity is selected (PS bit = 1). Transmission mode: If the PCE bit is set then the MSB bit of the data written in the data register is not transmitted but is changed by the parity bit. Reception mode: If the PCE bit is set then the interface checks if the received data byte has an even number of 1s if even parity is selected

10.6.6 Interrupts
Interrupt Event Enable Exit Event Control from Flag Bit Wait TIE TCIE RIE ILIE PIE Yes Yes Yes Yes Yes Yes Exit from Halt No No No No No No

Transmit Data Register TDRE Empty Transmission ComTC plete Received Data Ready RDRF to be Read Overrun Error Detected OR Idle Line Detected IDLE Parity Error PE

The SCI interrupt events are connected to the same interrupt vector. These events generate an interrupt if the corresponding Enable Control Bit is set and the interrupt mask in the CC register is reset (RIM instruction).

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SERIAL COMMUNICATIONS INTERFACE (Contd) 10.6.7 Register Description Note: The IDLE bit will not be set again until the RDRF bit has been set itself (i.e. a new idle line ocSTATUS REGISTER (SCISR) curs). Read Only Reset Value: 1100 0000 (C0h) Bit 3 = OR Overrun error. 7 0 This bit is set by hardware when the word currently being received in the shift register is ready to be TDRE TC RDRF IDLE OR NF FE PE transferred into the RDR register while RDRF=1. An interrupt is generated if RIE=1 in the SCICR2 register. It is cleared by a software sequence (an Bit 7 = TDRE Transmit data register empty. access to the SCISR register followed by a read to This bit is set by hardware when the content of the TDR register has been transferred into the shift the SCIDR register). 0: No Overrun error register. An interrupt is generated if the TIE bit=1 1: Overrun error is detected in the SCICR2 register. It is cleared by a software sequence (an access to the SCISR register folNote: When this bit is set RDR register content will lowed by a write to the SCIDR register). not be lost but the shift register will be overwritten. 0: Data is not transferred to the shift register 1: Data is transferred to the shift register Bit 2 = NF Noise flag. Note: Data will not be transferred to the shift regThis bit is set by hardware when noise is detected ister unless the TDRE bit is cleared. on a received frame. It is cleared by a software sequence (an access to the SCISR register followed Bit 6 = TC Transmission complete. by a read to the SCIDR register). 0: No noise is detected This bit is set by hardware when transmission of a 1: Noise is detected frame containing Data, a Preamble or a Break is complete. An interrupt is generated if TCIE=1 in Note: This bit does not generate interrupt as it apthe SCICR2 register. It is cleared by a software sepears at the same time as the RDRF bit which itquence (an access to the SCISR register followed self generates an interrupt. by a write to the SCIDR register). 0: Transmission is not complete 1: Transmission is complete Bit 1 = FE Framing error. This bit is set by hardware when a de-synchronizaNote: TC is not set after the transmission of a Pretion, excessive noise or a break character is deamble or a Break. tected. It is cleared by a software sequence (an access to the SCISR register followed by a read to Bit 5 = RDRF Received data ready flag. the SCIDR register). This bit is set by hardware when the content of the 0: No Framing error is detected RDR register has been transferred to the SCIDR 1: Framing error or break character is detected register. An interrupt is generated if RIE=1 in the Note: This bit does not generate interrupt as it apSCICR2 register. It is cleared by a software sepears at the same time as the RDRF bit which itquence (an access to the SCISR register followed self generates an interrupt. If the word currently by a read to the SCIDR register). being transferred causes both frame error and 0: Data is not received overrun error, it will be transferred and only the OR 1: Received data is ready to be read bit will be set. Bit 4 = IDLE Idle line detect. This bit is set by hardware when a Idle Line is detected. An interrupt is generated if the ILIE=1 in the SCICR2 register. It is cleared by a software sequence (an access to the SCISR register followed by a read to the SCIDR register). 0: No Idle Line is detected 1: Idle Line is detected Bit 0 = PE Parity error. This bit is set by hardware when a parity error occurs in receiver mode. It is cleared by a software sequence (a read to the status register followed by an access to the SCIDR data register). An interrupt is generated if PIE=1 in the SCICR1 register. 0: No parity error 1: Parity error

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SERIAL COMMUNICATIONS INTERFACE (Contd) CONTROL REGISTER 1 (SCICR1) Bit 3 = WAKE Wake-Up method. Read/Write This bit determines the SCI Wake-Up method, it is Reset Value: x000 0000 (x0h) set or cleared by software. 0: Idle Line 7 0 1: Address Mark
R8 T8 SCID M WAKE PCE PS PIE

Bit 7 = R8 Receive data bit 8. This bit is used to store the 9th bit of the received word when M=1. Bit 6 = T8 Transmit data bit 8. This bit is used to store the 9th bit of the transmitted word when M=1. Bit 5 = SCID Disabled for low power consumption When this bit is set the SCI prescalers and outputs are stopped and the end of the current byte transfer in order to reduce power consumption.This bit is set and cleared by software. 0: SCI enabled 1: SCI prescaler and outputs disabled Bit 4 = M Word length. This bit determines the word length. It is set or cleared by software. 0: 1 Start bit, 8 Data bits, 1 Stop bit 1: 1 Start bit, 9 Data bits, 1 Stop bit Note: The M bit must not be modified during a data transfer (both transmission and reception).

Bit 2 = PCE Parity control enable. This bit selects the hardware parity control (generation and detection). When the parity control is enabled, the computed parity is inserted at the MSB position (9th bit if M=1; 8th bit if M=0) and parity is checked on the received data. This bit is set and cleared by software. Once it is set, PCE is active after the current byte (in reception and in transmission). 0: Parity control disabled 1: Parity control enabled Bit 1 = PS Parity selection. This bit selects the odd or even parity when the parity generation/detection is enabled (PCE bit set). It is set and cleared by software. The parity will be selected after the current byte. 0: Even parity 1: Odd parity Bit 0 = PIE Parity interrupt enable. This bit enables the interrupt capability of the hardware parity control when a parity error is detected (PE bit set). It is set and cleared by software. 0: Parity error interrupt disabled 1: Parity error interrupt enabled.

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SERIAL COMMUNICATIONS INTERFACE (Contd) CONTROL REGISTER 2 (SCICR2) Notes: Read/Write During transmission, a 0 pulse on the TE bit (0 followed by 1) sends a preamble (idle line) Reset Value: 0000 0000 (00 h) after the current word. 7 0 When TE is set there is a 1 bit-time delay before the transmission starts. TIE TCIE RIE ILIE TE RE RWU SBK Caution: The TDO pin is free for general purpose I/O only when the TE and RE bits are both cleared (or if TE is never set). Bit 7 = TIE Transmitter interrupt enable. This bit is set and cleared by software. 0: Interrupt is inhibited Bit 2 = RE Receiver enable. 1: An SCI interrupt is generated whenever This bit enables the receiver. It is set and cleared TDRE=1 in the SCISR register by software. 0: Receiver is disabled Bit 6 = TCIE Transmission complete interrupt ena1: Receiver is enabled and begins searching for a ble start bit This bit is set and cleared by software. 0: Interrupt is inhibited Bit 1 = RWU Receiver wake-up. 1: An SCI interrupt is generated whenever TC=1 in This bit determines if the SCI is in mute mode or the SCISR register not. It is set and cleared by software and can be cleared by hardware when a wake-up sequence is Bit 5 = RIE Receiver interrupt enable. recognized. This bit is set and cleared by software. 0: Receiver in Active mode 0: Interrupt is inhibited 1: Receiver in Mute mode 1: An SCI interrupt is generated whenever OR=1 Note: Before selecting Mute mode (setting the or RDRF=1 in the SCISR register RWU bit), the SCI must receive some data first, otherwise it cannot function in Mute mode with Bit 4 = ILIE Idle line interrupt enable. wakeup by idle line detection. This bit is set and cleared by software. 0: Interrupt is inhibited Bit 0 = SBK Send break. 1: An SCI interrupt is generated whenever IDLE=1 This bit set is used to send break characters. It is in the SCISR register. set and cleared by software. Bit 3 = TE Transmitter enable. This bit enables the transmitter. It is set and cleared by software. 0: Transmitter is disabled 1: Transmitter is enabled 0: No break character is transmitted 1: Break characters are transmitted Note: If the SBK bit is set to 1 and then to 0, the transmitter will send a BREAK word at the end of the current word.

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SERIAL COMMUNICATIONS INTERFACE (Contd) DATA REGISTER (SCIDR) Read/Write Reset Value: Undefined Contains the Received or Transmitted data character, depending on whether it is read from or written to.
7
DR7 DR6 DR5 DR4 DR3 DR2 DR1

Bits 5:3 = SCT[2:0] SCI Transmitter rate divisor These 3 bits, in conjunction with the SCP1 & SCP0 bits define the total division applied to the bus clock to yield the transmit rate clock in conventional Baud Rate Generator mode.
TR dividing factor 1 2 4 8 16 32 64 128 SCT2 0 0 0 0 1 1 1 1 SCT1 0 0 1 1 0 0 1 1 SCT0 0 1 0 1 0 1 0 1

0
DR0

The Data register performs a double function (read and write) since it is composed of two registers, one for transmission (TDR) and one for reception (RDR). The TDR register provides the parallel interface between the internal bus and the output shift register (see Figure 60). The RDR register provides the parallel interface between the input shift register and the internal bus (see Figure 60). BAUD RATE REGISTER (SCIBRR) Read/Write Reset Value: 0000 0000 (00h)
7
SCP1 SCP0 SCT2 SCT1 SCT0 SCR2

Bits 2:0 = SCR[2:0] SCI Receiver rate divisor. These 3 bits, in conjunction with the SCP[1:0] bits define the total division applied to the bus clock to yield the receive rate clock in conventional Baud Rate Generator mode.
RR Dividing factor 1 2 4 8 16 32 64 128 SCR2 0 0 0 0 1 1 1 1 SCR1 0 0 1 1 0 0 1 1 SCR0 0 1 0 1 0 1 0 1

0
SCR1 SCR0

Bits 7:6= SCP[1:0] First SCI Prescaler These 2 prescaling bits allow several standard clock division ranges:
PR Prescaling factor 1 3 4 13 SCP1 0 0 1 1 SCP0 0 1 0 1

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SERIAL COMMUNICATIONS INTERFACE (Contd) EXTENDED RECEIVE PRESCALER DIVISION REGISTER (SCIERPR) Read/Write Reset Value: 0000 0000 (00 h) Allows setting of the Extended Prescaler rate division factor for the receive circuit.
7 0

EXTENDED TRANSMIT PRESCALER DIVISION REGISTER (SCIETPR) Read/Write Reset Value:0000 0000 (00h) Allows setting of the External Prescaler rate division factor for the transmit circuit.
7
ETPR 7 ETPR 6 ETPR 5 ETPR 4 ETPR 3 ETPR 2

0
ETPR ETPR 1 0

ERPR ERPR ERPR ERPR ERPR ERPR ERPR ERPR 7 6 5 4 3 2 1 0

Bits 7:0 = ERPR[7:0] 8-bit Extended Receive Prescaler Register. The extended Baud Rate Generator is activated when a value different from 00h is stored in this register. Therefore the clock frequency issued from the 16 divider (see Figure 62) is divided by the binary factor set in the SCIERPR register (in the range 1 to 255). The extended baud rate generator is not used after a reset. Table 21. Baudrate Selection

Bits 7:0 = ETPR[7:0] 8-bit Extended Transmit Prescaler Register. The extended Baud Rate Generator is activated when a value different from 00h is stored in this register. Therefore the clock frequency issued from the 16 divider (see Figure 62) is divided by the binary factor set in the SCIETPR register (in the range 1 to 255). The extended baud rate generator is not used after a reset.

Conditions Symbol Parameter fCPU Accuracy vs. Standard Prescaler Conventional Mode TR (or RR)=128, PR=13 TR (or RR)= 32, PR=13 TR (or RR)= 16, PR=13 TR (or RR)= 8, PR=13 TR (or RR)= 4, PR=13 TR (or RR)= 16, PR= 3 TR (or RR)= 2, PR=13 TR (or RR)= 1, PR=13 Extended Mode ETPR (or ERPR) = 35, TR (or RR)= 1, PR=1 Standard Baud Rate Unit

~0.16% fTx fRx Communication frequency 8MHz

~300.48 300 1200 ~1201.92 2400 ~2403.84 4800 ~4807.69 9600 ~9615.38 10400 ~10416.67 19200 ~19230.77 38400 ~38461.54 14400 ~14285.71

Hz

~0.79%

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SERIAL COMMUNICATION INTERFACE (Contd) Table 22. SCI Register Map and Reset Values
Address (Hex.) 0050h 0051h 0052h 0053h 0054h 0055h 0057h Register Label SCISR Reset Value SCIDR Reset Value SCIBRR Reset Value SCICR1 Reset Value SCICR2 Reset Value SCIERPR Reset Value SCIPETPR Reset Value 7 TDRE 1 MSB x SCP1 0 R8 x TIE 0 MSB 0 MSB 0 6 TC 1 x SCP0 0 T8 0 TCIE 0 0 0 5 RDRF 0 x SCT2 0 SCID 0 RIE 0 0 0 4 IDLE 0 x SCT1 0 M 0 ILIE 0 0 0 3 OR 0 x SCT0 0 WAKE 0 TE 0 0 0 2 NF 0 x SCR2 0 PCE 0 RE 0 0 0 1 FE 0 x SCR1 0 PS 0 RWU 0 0 0 0 PE 0 LSB x SCR0 0 PIE 0 SBK 0 LSB 0 LSB 0

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10.7 I2C BUS INTERFACE (I2C) 10.7.1 Introduction The I2C Bus Interface serves as an interface between the microcontroller and the serial I2C bus. It provides both multimaster and slave functions, and controls all I2C bus-specific sequencing, protocol, arbitration and timing. It supports fast I2C mode (400kHz). 10.7.2 Main Features 2 I Parallel-bus/I C protocol converter I Multi-master capability I 7-bit/10-bit Addressing I Transmitter/Receiver flag I End-of-byte transmission flag I Transfer problem detection I2C Master Features: I Clock generation 2 I I C bus busy flag I Arbitration Lost Flag I End of byte transmission flag I Transmitter/Receiver Flag I Start bit detection flag I Start and Stop generation I2C Slave Features: I Stop bit detection 2 I I C bus busy flag I Detection of misplaced start or stop condition 2 I Programmable I C Address detection I Transfer problem detection I End-of-byte transmission flag I Transmitter/Receiver flag 10.7.3 General Description In addition to receiving and transmitting data, this interface converts it from serial to parallel format and vice versa, using either an interrupt or polled Figure 63. I2C BUS Protocol SDA MSB SCL 1 START CONDITION 2 8 9 STOP CONDITION
VR02119B

handshake. The interrupts are enabled or disabled by software. The interface is connected to the I2C bus by a data pin (SDAI) and by a clock pin (SCLI). It can be connected both with a standard I2C bus and a Fast I2C bus. This selection is made by software. Mode Selection The interface can operate in the four following modes: Slave transmitter/receiver Master transmitter/receiver By default, it operates in slave mode. The interface automatically switches from slave to master after it generates a START condition and from master to slave in case of arbitration loss or a STOP generation, allowing then Multi-Master capability. Communication Flow In Master mode, it initiates a data transfer and generates the clock signal. A serial data transfer always begins with a start condition and ends with a stop condition. Both start and stop conditions are generated in master mode by software. In Slave mode, the interface is capable of recognising its own address (7 or 10-bit), and the General Call address. The General Call address detection may be enabled or disabled by software. Data and addresses are transferred as 8-bit bytes, MSB first. The first byte(s) following the start condition contain the address (one in 7-bit mode, two in 10-bit mode). The address is always transmitted in Master mode. A 9th clock pulse follows the 8 clock cycles of a byte transfer, during which the receiver must send an acknowledge bit to the transmitter. Refer to Figure 63.

ACK

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I2C BUS INTERFACE (Contd) Acknowledge may be enabled and disabled by software. The I2C interface address and/or general call address can be selected by software. The speed of the I2C interface may be selected between Standard (0-100KHz) and Fast I2C (100400KHz). SDA/SCL Line Control Transmitter mode: the interface holds the clock line low before transmission to wait for the microcontroller to write the byte in the Data Register. Receiver mode: the interface holds the clock line low after reception to wait for the microcontroller to read the byte in the Data Register. Figure 64. I2C Interface Block Diagram

The SCL frequency (Fscl) is controlled by a programmable clock divider which depends on the I2C bus mode. When the I2C cell is enabled, the SDA and SCL ports must be configured as floating inputs. In this case, the value of the external pull-up resistor used depends on the application. When the I2C cell is disabled, the SDA and SCL ports revert to being standard I/O port pins.

DATA REGISTER (DR)

SDA or SDAI

DATA CONTROL DATA SHIFT REGISTER

COMPARATOR

OWN ADDRESS REGISTER 1 (OAR1) OWN ADDRESS REGISTER 2 (OAR2)

SCL or SCLI

CLOCK CONTROL

CLOCK CONTROL REGISTER (CCR)

CONTROL REGISTER (CR) STATUS REGISTER 1 (SR1) STATUS REGISTER 2 (SR2) CONTROL LOGIC

INTERRUPT

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I2C BUS INTERFACE (Contd) 10.7.4 Functional Description Refer to the CR, SR1 and SR2 registers in Section 10.7.7. for the bit definitions. By default the I2C interface operates in Slave mode (M/SL bit is cleared) except when it initiates a transmit or receive sequence. First the interface frequency must be configured using the FRi bits in the OAR2 register. 10.7.4.1 Slave Mode As soon as a start condition is detected, the address is received from the SDA line and sent to the shift register; then it is compared with the address of the interface or the General Call address (if selected by software). Note: In 10-bit addressing mode, the comparision includes the header sequence (11110xx0) and the two most significant bits of the address. Header matched (10-bit mode only): the interface generates an acknowledge pulse if the ACK bit is set. Address not matched: the interface ignores it and waits for another Start condition. Address matched: the interface generates in sequence: Acknowledge pulse if the ACK bit is set. EVF and ADSL bits are set with an interrupt if the ITE bit is set. Then the interface waits for a read of the SR1 register, holding the SCL line low (see Figure 65 Transfer sequencing EV1). Next, in 7-bit mode read the DR register to determine from the least significant bit (Data Direction Bit) if the slave must enter Receiver or Transmitter mode. In 10-bit mode, after receiving the address sequence the slave is always in receive mode. It will enter transmit mode on receiving a repeated Start condition followed by the header sequence with matching address bits and the least significant bit set (11110xx1) . Slave Receiver Following the address reception and after SR1 register has been read, the slave receives bytes from the SDA line into the DR register via the internal shift register. After each byte the interface generates in sequence: Acknowledge pulse if the ACK bit is set

EVF and BTF bits are set with an interrupt if the ITE bit is set. Then the interface waits for a read of the SR1 register followed by a read of the DR register, holding the SCL line low (see Figure 65 Transfer sequencing EV2). Slave Transmitter Following the address reception and after SR1 register has been read, the slave sends bytes from the DR register to the SDA line via the internal shift register. The slave waits for a read of the SR1 register followed by a write in the DR register, holding the SCL line low (see Figure 65 Transfer sequencing EV3). When the acknowledge pulse is received: The EVF and BTF bits are set by hardware with an interrupt if the ITE bit is set. Closing slave communication After the last data byte is transferred a Stop Condition is generated by the master. The interface detects this condition and sets: EVF and STOPF bits with an interrupt if the ITE bit is set. Then the interface waits for a read of the SR2 register (see Figure 65 Transfer sequencing EV4). Error Cases BERR: Detection of a Stop or a Start condition during a byte transfer. In this case, the EVF and the BERR bits are set with an interrupt if the ITE bit is set. If it is a Stop then the interface discards the data, released the lines and waits for another Start condition. If it is a Start then the interface discards the data and waits for the next slave address on the bus. AF: Detection of a non-acknowledge bit. In this case, the EVF and AF bits are set with an interrupt if the ITE bit is set. Note: In both cases, SCL line is not held low; however, SDA line can remain low due to possible 0 bits transmitted last. It is then necessary to release both lines by software.

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I2C BUS INTERFACE (Contd) How to release the SDA / SCL lines Set and subsequently clear the STOP bit while BTF is set. The SDA/SCL lines are released after the transfer of the current byte. 10.7.4.2 Master Mode To switch from default Slave mode to Master mode a Start condition generation is needed. Start condition Setting the START bit while the BUSY bit is cleared causes the interface to switch to Master mode (M/SL bit set) and generates a Start condition. Once the Start condition is sent: The EVF and SB bits are set by hardware with an interrupt if the ITE bit is set. Then the master waits for a read of the SR1 register followed by a write in the DR register with the Slave address, holding the SCL line low (see Figure 65 Transfer sequencing EV5). Slave address transmission Then the slave address is sent to the SDA line via the internal shift register. In 7-bit addressing mode, one address byte is sent. In 10-bit addressing mode, sending the first byte including the header sequence causes the following event: The EVF bit is set by hardware with interrupt generation if the ITE bit is set. Then the master waits for a read of the SR1 register followed by a write in the DR register, holding the SCL line low (see Figure 65 Transfer sequencing EV9). Then the second address byte is sent by the interface.

After completion of this transfer (and acknowledge from the slave if the ACK bit is set): The EVF bit is set by hardware with interrupt generation if the ITE bit is set. Then the master waits for a read of the SR1 register followed by a write in the CR register (for example set PE bit), holding the SCL line low (see Figure 65 Transfer sequencing EV6). Next the master must enter Receiver or Transmitter mode. Note: In 10-bit addressing mode, to switch the master to Receiver mode, software must generate a repeated Start condition and resend the header sequence with the least significant bit set (11110xx1). Master Receiver Following the address transmission and after SR1 and CR registers have been accessed, the master receives bytes from the SDA line into the DR register via the internal shift register. After each byte the interface generates in sequence: Acknowledge pulse if if the ACK bit is set EVF and BTF bits are set by hardware with an interrupt if the ITE bit is set. Then the interface waits for a read of the SR1 register followed by a read of the DR register, holding the SCL line low (see Figure 65 Transfer sequencing EV7). To close the communication: before reading the last byte from the DR register, set the STOP bit to generate the Stop condition. The interface goes automatically back to slave mode (M/SL bit cleared). Note: In order to generate the non-acknowledge pulse after the last received data byte, the ACK bit must be cleared just before reading the second last data byte.

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I2C BUS INTERFACE (Contd) Master Transmitter Following the address transmission and after SR1 register has been read, the master sends bytes from the DR register to the SDA line via the internal shift register. The master waits for a read of the SR1 register followed by a write in the DR register, holding the SCL line low (see Figure 65 Transfer sequencing EV8). When the acknowledge bit is received, the interface sets: EVF and BTF bits with an interrupt if the ITE bit is set. To close the communication: after writing the last byte to the DR register, set the STOP bit to generate the Stop condition. The interface goes automatically back to slave mode (M/SL bit cleared). Error Cases BERR: Detection of a Stop or a Start condition during a byte transfer. In this case, the EVF and

BERR bits are set by hardware with an interrupt if ITE is set. AF: Detection of a non-acknowledge bit. In this case, the EVF and AF bits are set by hardware with an interrupt if the ITE bit is set. To resume, set the START or STOP bit. ARLO: Detection of an arbitration lost condition. In this case the ARLO bit is set by hardware (with an interrupt if the ITE bit is set and the interface goes automatically back to slave mode (the M/SL bit is cleared). Note: In all these cases, the SCL line is not held low; however, the SDA line can remain low due to possible 0 bits transmitted last. It is then necessary to release both lines by software.

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I2C BUS INTERFACE (Contd) Figure 65. Transfer Sequencing 7-bit Slave receiver:
S Address A EV1 Data1 A EV2 Data2 A EV2 ..... DataN A EV2 P EV4

7-bit Slave transmitter:

S Address A EV1 EV3 Data1 A EV3 Data2 A EV3 ..... DataN NA EV3-1 P EV4

7-bit Master receiver:

S EV5 Address A EV6 Data1 A EV7 Data2 A EV7 ..... DataN NA EV7 P

7-bit Master transmitter:

S EV5 Address A EV6 EV8 Data1 A EV8 Data2 A EV8 ..... DataN A EV8 P

10-bit Slave receiver:

S Header A Address A EV1 Data1 A EV2 ..... DataN A EV2 P EV4

10-bit Slave transmitter:

Sr Header A EV1 EV3 Data1 A .... DataN EV3 . A EV3-1 P EV4

10-bit Master transmitter

S EV5 Header A EV9 Address A EV6 EV8 Data1 A EV8 ..... DataN A EV8 P

10-bit Master receiver:

Sr EV5 Header A EV6 Data1 A EV7 ..... DataN A EV7 P

Legend: S=Start, Sr = Repeated Start, P=Stop, A=Acknowledge, NA=Non-acknowledge, EVx=Event (with interrupt if ITE=1) EV1: EVF=1, ADSL=1, cleared by reading SR1 register. EV2: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register. EV3: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register. EV3-1: EVF=1, AF=1, BTF=1; AF is cleared by reading SR1 register. BTF is cleared by releasing the lines (STOP=1, STOP=0) or by writing DR register (DR=FFh). Note: If lines are released by STOP=1, STOP=0, the subsequent EV4 is not seen. EV4: EVF=1, STOPF=1, cleared by reading SR2 register. EV5: EVF=1, SB=1, cleared by reading SR1 register followed by writing DR register. EV6: EVF=1, cleared by reading SR1 register followed by writing CR register (for example PE=1). EV7: EVF=1, BTF=1, cleared by reading SR1 register followed by reading DR register. EV8: EVF=1, BTF=1, cleared by reading SR1 register followed by writing DR register. EV9: EVF=1, ADD10=1, cleared by reading SR1 register followed by writing DR register.

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I2C BUS INTERFACE (Contd) 10.7.5 Low Power Modes

Mode
2

Description No effect on I C interface. I2C interrupts cause the device to exit from WAIT mode. I2C registers are frozen. In HALT mode, the I2C interface is inactive and does not acknowledge data on the bus. The I2C interface resumes operation when the MCU is woken up by an interrupt with exit from HALT mode capability.

WAIT HALT

10.7.6 Interrupts Figure 66. Event Flags and Interrupt Generation

ADD10 BTF ADSL SB AF STOPF ARLO BERR ITE INTERRUPT

EVF

* * EVF can also be set by EV6 or an error from the SR2 register.
Event Flag ADD10 BTF ADSEL SB AF STOPF ARLO BERR Enable Control Bit Exit from Wait Yes Yes Yes Yes Yes Yes Yes Yes Exit from Halt No No No No No No No No

Interrupt Event 10-bit Address Sent Event (Master mode) End of Byte Transfer Event Address Matched Event (Slave mode) Start Bit Generation Event (Master mode) Acknowledge Failure Event Stop Detection Event (Slave mode) Arbitration Lost Event (Multimaster configuration) Bus Error Event

ITE

Note: The I2C interrupt events are connected to the same interrupt vector (see Interrupts chapter). They generate an interrupt if the corresponding Enable Control Bit is set and the I-bit in the CC register is reset (RIM instruction).

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I2C BUS INTERFACE (Contd) 10.7.7 Register Description I2C CONTROL REGISTER (CR) Read / Write Reset Value: 0000 0000 (00h)
7 0 0 PE ENGC START ACK STOP 0 ITE

In slave mode: 0: No start generation 1: Start generation when the bus is free Bit 2 = ACK Acknowledge enable. This bit is set and cleared by software. It is also cleared by hardware when the interface is disabled (PE=0). 0: No acknowledge returned 1: Acknowledge returned after an address byte or a data byte is received Bit 1 = STOP Generation of a Stop condition. This bit is set and cleared by software. It is also cleared by hardware in master mode. Note: This bit is not cleared when the interface is disabled (PE=0). In master mode: 0: No stop generation 1: Stop generation after the current byte transfer or after the current Start condition is sent. The STOP bit is cleared by hardware when the Stop condition is sent. In slave mode: 0: No stop generation 1: Release the SCL and SDA lines after the current byte transfer (BTF=1). In this mode the STOP bit has to be cleared by software. Bit 0 = ITE Interrupt enable. This bit is set and cleared by software and cleared by hardware when the interface is disabled (PE=0). 0: Interrupts disabled 1: Interrupts enabled Refer to Figure 66 for the relationship between the events and the interrupt. SCL is held low when the ADD10, SB, BTF or ADSL flags or an EV6 event (See Figure 65) is detected.

Bit 7:6 = Reserved. Forced to 0 by hardware. Bit 5 = PE Peripheral enable. This bit is set and cleared by software. 0: Peripheral disabled 1: Master/Slave capability Notes: When PE=0, all the bits of the CR register and the SR register except the Stop bit are reset. All outputs are released while PE=0 When PE=1, the corresponding I/O pins are selected by hardware as alternate functions. To enable the I2C interface, write the CR register TWICE with PE=1 as the first write only activates the interface (only PE is set). Bit 4 = ENGC Enable General Call. This bit is set and cleared by software. It is also cleared by hardware when the interface is disabled (PE=0). The 00h General Call address is acknowledged (01h ignored). 0: General Call disabled 1: General Call enabled Note: In accordance with the I2C standard, when GCAL addressing is enabled, an I2C slave can only receive data. It will not transmit data to the master. Bit 3 = START Generation of a Start condition. This bit is set and cleared by software. It is also cleared by hardware when the interface is disabled (PE=0) or when the Start condition is sent (with interrupt generation if ITE=1). In master mode: 0: No start generation 1: Repeated start generation

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I2C BUS INTERFACE (Contd) I2C STATUS REGISTER 1 (SR1) Read Only Reset Value: 0000 0000 (00h)
7 EVF ADD10 TRA BUSY BTF ADSL M/SL 0 SB

arbitration (ARLO=1) or when the interface is disabled (PE=0). 0: Data byte received (if BTF=1) 1: Data byte transmitted Bit 4 = BUSY Bus busy. This bit is set by hardware on detection of a Start condition and cleared by hardware on detection of a Stop condition. It indicates a communication in progress on the bus. This information is still updated when the interface is disabled (PE=0). 0: No communication on the bus 1: Communication ongoing on the bus Bit 3 = BTF Byte transfer finished. This bit is set by hardware as soon as a byte is correctly received or transmitted with interrupt generation if ITE=1. It is cleared by software reading SR1 register followed by a read or write of DR register. It is also cleared by hardware when the interface is disabled (PE=0). Following a byte transmission, this bit is set after reception of the acknowledge clock pulse. In case an address byte is sent, this bit is set only after the EV6 event (See Figure 65). BTF is cleared by reading SR1 register followed by writing the next byte in DR register. Following a byte reception, this bit is set after transmission of the acknowledge clock pulse if ACK=1. BTF is cleared by reading SR1 register followed by reading the byte from DR register. The SCL line is held low while BTF=1. 0: Byte transfer not done 1: Byte transfer succeeded Bit 2 = ADSL Address matched (Slave mode). This bit is set by hardware as soon as the received slave address matched with the OAR register content or a general call is recognized. An interrupt is generated if ITE=1. It is cleared by software reading SR1 register or by hardware when the interface is disabled (PE=0). The SCL line is held low while ADSL=1. 0: Address mismatched or not received 1: Received address matched

Bit 7 = EVF Event flag. This bit is set by hardware as soon as an event occurs. It is cleared by software reading SR2 register in case of error event or as described in Figure 65. It is also cleared by hardware when the interface is disabled (PE=0). 0: No event 1: One of the following events has occurred: BTF=1 (Byte received or transmitted) ADSL=1 (Address matched in Slave mode while ACK=1) SB=1 (Start condition generated in Master mode) AF=1 (No acknowledge received after byte transmission) STOPF=1 (Stop condition detected in Slave mode) ARLO=1 (Arbitration lost in Master mode) BERR=1 (Bus error, misplaced Start or Stop condition detected) ADD10=1 (Master has sent header byte) Address byte successfully transmitted in Master mode. Bit 6 = ADD10 10-bit addressing in Master mode . This bit is set by hardware when the master has sent the first byte in 10-bit address mode. It is cleared by software reading SR2 register followed by a write in the DR register of the second address byte. It is also cleared by hardware when the peripheral is disabled (PE=0). 0: No ADD10 event occurred. 1: Master has sent first address byte (header) Bit 5 = TRA Transmitter/Receiver. When BTF is set, TRA=1 if a data byte has been transmitted. It is cleared automatically when BTF is cleared. It is also cleared by hardware after detection of Stop condition (STOPF=1), loss of bus

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I2C BUS INTERFACE (Contd) Bit 1 = M/SL Master/Slave. This bit is set by hardware as soon as the interface is in Master mode (writing START=1). It is cleared by hardware after detecting a Stop condition on the bus or a loss of arbitration (ARLO=1). It is also cleared when the interface is disabled (PE=0). 0: Slave mode 1: Master mode Bit 0 = SB Start bit (Master mode). This bit is set by hardware as soon as the Start condition is generated (following a write START=1). An interrupt is generated if ITE=1. It is cleared by software reading SR1 register followed by writing the address byte in DR register. It is also cleared by hardware when the interface is disabled (PE=0). 0: No Start condition 1: Start condition generated I2C STATUS REGISTER 2 (SR2) Read Only Reset Value: 0000 0000 (00h)
7 0 0 0 AF 0 STOPF ARLO BERR GCAL

Bit 2 = ARLO Arbitration lost. This bit is set by hardware when the interface loses the arbitration of the bus to another master. An interrupt is generated if ITE=1. It is cleared by software reading SR2 register or by hardware when the interface is disabled (PE=0). After an ARLO event the interface switches back automatically to Slave mode (M/SL=0). The SCL line is not held low while ARLO=1. 0: No arbitration lost detected 1: Arbitration lost detected Bit 1 = BERR Bus error. This bit is set by hardware when the interface detects a misplaced Start or Stop condition. An interrupt is generated if ITE=1. It is cleared by software reading SR2 register or by hardware when the interface is disabled (PE=0). The SCL line is not held low while BERR=1. 0: No misplaced Start or Stop condition 1: Misplaced Start or Stop condition Bit 0 = GCAL General Call (Slave mode). This bit is set by hardware when a general call address is detected on the bus while ENGC=1. It is cleared by hardware detecting a Stop condition (STOPF=1) or when the interface is disabled (PE=0). 0: No general call address detected on bus 1: general call address detected on bus

Bit 7:5 = Reserved. Forced to 0 by hardware. Bit 4 = AF Acknowledge failure. This bit is set by hardware when no acknowledge is returned. An interrupt is generated if ITE=1. It is cleared by software reading SR2 register or by hardware when the interface is disabled (PE=0). The SCL line is not held low while AF=1. 0: No acknowledge failure 1: Acknowledge failure Bit 3 = STOPF Stop detection (Slave mode). This bit is set by hardware when a Stop condition is detected on the bus after an acknowledge (if ACK=1). An interrupt is generated if ITE=1. It is cleared by software reading SR2 register or by hardware when the interface is disabled (PE=0). The SCL line is not held low while STOPF=1. 0: No Stop condition detected 1: Stop condition detected

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I2C BUS INTERFACE (Contd) I2C CLOCK CONTROL REGISTER (CCR) Read / Write Reset Value: 0000 0000 (00h)
7 FM/SM CC6 CC5 CC4 CC3 CC2 CC1 0 CC0

I2C DATA REGISTER (DR) Read / Write Reset Value: 0000 0000 (00h)
7 D7 D6 D5 D4 D3 D2 D1 0 D0

Bit 7 = FM/SM Fast/Standard I2C mode. This bit is set and cleared by software. It is not cleared when the interface is disabled (PE=0). 0: Standard I2C mode 1: Fast I2C mode Bit 6:0 = CC[6:0] 7-bit clock divider. These bits select the speed of the bus (FSCL) depending on the I2C mode. They are not cleared when the interface is disabled (PE=0). Standard mode (FM/SM=0): FSCL <= 100kHz FSCL = FCPU/(2x([CC6..CC0]+2)) Fast mode (FM/SM=1): FSCL > 100kHz FSCL = FCPU/(3x([CC6..CC0]+2)) Note: The programmed FSCL assumes no load on SCL and SDA lines.

Bit 7:0 = D[7:0] 8-bit Data Register. These bits contain the byte to be received or transmitted on the bus. Transmitter mode: Byte transmission start automatically when the software writes in the DR register. Receiver mode: the first data byte is received automatically in the DR register using the least significant bit of the address. Then, the following data bytes are received one by one after reading the DR register.

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I2C BUS INTERFACE (Contd) I2C OWN ADDRESS REGISTER (OAR1) Read / Write Reset Value: 0000 0000 (00h)
7 ADD7 ADD6 ADD5 ADD4 ADD3 ADD2 ADD1 0 ADD0

I2C OWN ADDRESS REGISTER (OAR2) Read / Write Reset Value: 0100 0000 (40h)
7 FR1 FR0 0 0 0 ADD9 ADD8 0 0

7-bit Addressing Mode Bit 7:1 = ADD[7:1] Interface address. These bits define the I2C bus address of the interface. They are not cleared when the interface is disabled (PE=0). Bit 0 = ADD0 Address direction bit. This bit is dont care, the interface acknowledges either 0 or 1. It is not cleared when the interface is disabled (PE=0). Note: Address 01h is always ignored. 10-bit Addressing Mode Bit 7:0 = ADD[7:0] Interface address. These are the least significant bits of the I2C bus address of the interface. They are not cleared when the interface is disabled (PE=0).

Bit 7:6 = FR[1:0] Frequency bits. These bits are set by software only when the interface is disabled (PE=0). To configure the interface to I2C specifed delays select the value corresponding to the microcontroller frequency FCPU.
fCPU < 6 MHz 6 to 8 MHz FR1 0 0 FR0 0 1

Bit 5:3 = Reserved Bit 2:1 = ADD[9:8] Interface address. These are the most significant bits of the I2C bus address of the interface (10-bit mode only). They are not cleared when the interface is disabled (PE=0). Bit 0 = Reserved.

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IC BUS INTERFACE (Contd) Table 23. I2C Register Map and Reset Values
Address (Hex.) 0018h 0019h 001Ah 001Bh 001Ch 001Dh 001Eh Register Label I2CCR Reset Value I2CSR1 Reset Value I2CSR2 Reset Value I2CCCR Reset Value I2COAR1 Reset Value I2COAR2 Reset Value I2CDR Reset Value 7 6 5 PE 0 TRA 0 0 CC5 0 ADD5 0 0 0 4 ENGC 0 BUSY 0 AF 0 CC4 0 ADD4 0 0 0 3 START 0 BTF 0 STOPF 0 CC3 0 ADD3 0 0 0 2 ACK 0 ADSL 0 ARLO 0 CC2 0 ADD2 0 ADD9 0 0 1 STOP 0 M/SL 0 BERR 0 CC1 0 ADD1 0 ADD8 0 0 0 ITE 0 SB 0 GCAL 0 CC0 0 ADD0 0 0 LSB 0

0 EVF 0 0 FM/SM 0 ADD7 0 FR1 0 MSB 0

0 ADD10 0 0 CC6 0 ADD6 0 FR0 1 0

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10.8 10-BIT A/D CONVERTER (ADC) 10.8.1 Introduction The on-chip Analog to Digital Converter (ADC) peripheral is a 10-bit, successive approximation converter with internal sample and hold circuitry. This peripheral has up to 16 multiplexed analog input channels (refer to device pin out description) that allow the peripheral to convert the analog voltage levels from up to 16 different sources. The result of the conversion is stored in a 10-bit Data Register. The A/D converter is controlled through a Control/Status Register. Figure 67. ADC Block Diagram fCPU
DIV 4 DIV 2 0 1

10.8.2 Main Features I 10-bit conversion I Up to 16 channels with multiplexed input I Linear successive approximation I Data register (DR) which contains the results I Conversion complete status flag I On/off bit (to reduce consumption) The block diagram is shown in Figure 67.

fADC

EOC SPEEDADON

CH3

CH2

CH1

CH0

ADCCSR

AIN0

AIN1

ANALOG MUX
AINx

ANALOG TO DIGITAL CONVERTER

ADCDRH

D9

D8

D7

D6

D5

D4

D3

D2

ADCDRL

D1

D0

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10-BIT A/D CONVERTER (ADC) (Contd) 10.8.3 Functional Description The conversion is monotonic, meaning that the result never decreases if the analog input does not and never increases if the analog input does not. If the input voltage (VAIN) is greater than VAREF (high-level voltage reference) then the conversion result is FFh in the ADCDRH register and 03h in the ADCDRL register (without overflow indication). If the input voltage (VAIN) is lower than VSSA (lowlevel voltage reference) then the conversion result in the ADCDRH and ADCDRL registers is 00 00h. The A/D converter is linear and the digital result of the conversion is stored in the ADCDRH and ADCDRL registers. The accuracy of the conversion is described in the Electrical Characteristics Section. RAIN is the maximum recommended impedance for an analog input signal. If the impedance is too high, this will result in a loss of accuracy due to leakage and sampling not being completed in the alloted time. 10.8.3.1 A/D Converter Configuration The analog input ports must be configured as input, no pull-up, no interrupt. Refer to the I/O ports chapter. Using these pins as analog inputs does not affect the ability of the port to be read as a logic input. In the ADCCSR register: Select the CS[3:0] bits to assign the analog channel to convert. 10.8.3.2 Starting the Conversion In the ADCCSR register: Set the ADON bit to enable the A/D converter and to start the conversion. From this time on, the ADC performs a continuous conversion of the selected channel. When a conversion is complete: The EOC bit is set by hardware. The result is in the ADCDR registers. A read to the ADCDRH resets the EOC bit. To read the 10 bits, perform the following steps: 1. Poll the EOC bit 2. Read the ADCDRL register 3. Read the ADCDRH register. This clears EOC automatically. Note: The data is not latched, so both the low and the high data register must be read before the next conversion is complete, so it is recommended to disable interrupts while reading the conversion result. To read only 8 bits, perform the following steps: 1. Poll the EOC bit 2. Read the ADCDRH register. This clears EOC automatically. 10.8.3.3 Changing the conversion channel The application can change channels during conversion. When software modifies the CH[3:0] bits in the ADCCSR register, the current conversion is stopped, the EOC bit is cleared, and the A/D converter starts converting the newly selected channel. 10.8.4 Low Power Modes Note: The A/D converter may be disabled by resetting the ADON bit. This feature allows reduced power consumption when no conversion is needed and between single shot conversions. Mode WAIT Description No effect on A/D Converter A/D Converter disabled. After wakeup from Halt mode, the A/D Converter requires a stabilization time tSTAB (see Electrical Characteristics) before accurate conversions can be performed.

HALT

10.8.5 Interrupts None.

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10-BIT A/D CONVERTER (ADC) (Contd) 10.8.6 Register Description CONTROL/STATUS REGISTER (ADCCSR) Read /Write (Except bit 7 read only) Reset Value: 0000 0000 (00h)
7
EOC SPEED ADON 0 CH3 CH2 CH1

Bit 3:0 = CH[3:0] Channel Selection These bits are set and cleared by software. They select the analog input to convert.
Channel Pin* 0
CH0

CH3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1

CH2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1

CH1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1

CH0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1

Bit 7 = EOC End of Conversion This bit is set by hardware. It is cleared by hardware when software reads the ADCDRH register or writes to any bit of the ADCCSR register. 0: Conversion is not complete 1: Conversion complete Bit 6 = SPEED ADC clock selection This bit is set and cleared by software. 0: fADC = fCPU/4 1: fADC = fCPU/2 Bit 5 = ADON A/D Converter on This bit is set and cleared by software. 0: Disable ADC and stop conversion 1: Enable ADC and start conversion Bit 4 = Reserved. Must be kept cleared.

AIN0 AIN1 AIN2 AIN3 AIN4 AIN5 AIN6 AIN7 AIN8 AIN9 AIN10 AIN11 AIN12 AIN13 AIN14 AIN15

*The number of channels is device dependent. Refer to the device pinout description.

DATA REGISTER (ADCDRH) Read Only Reset Value: 0000 0000 (00h)
7
D9 D8 D7 D6 D5 D4 D3

0
D2

Bit 7:0 = D[9:2] MSB of Converted Analog Value DATA REGISTER (ADCDRL) Read Only Reset Value: 0000 0000 (00h)
7
0 0 0 0 0 0 D1

0
D0

Bit 7:2 = Reserved. Forced by hardware to 0. Bit 1:0 = D[1:0] LSB of Converted Analog Value

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10-BIT A/D CONVERTER (Contd) Table 24. ADC Register Map and Reset Values
Address (Hex.) 0070h 0071h 0072h Register Label ADCCSR Reset Value ADCDRH Reset Value ADCDRL Reset Value 7 EOC 0 D9 0 0 6 SPEED 0 D8 0 0 5 ADON 0 D7 0 0 4 3 CH3 0 D5 0 0 2 CH2 0 D4 0 0 1 CH1 0 D3 0 D1 0 0 CH0 0 D2 0 D0 0

0 D6 0 0

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11 INSTRUCTION SET
11.1 CPU ADDRESSING MODES The CPU features 17 different addressing modes which can be classified in 7 main groups:
Addressing Mode Inherent Immediate Direct Indexed Indirect Relative Bit operation Example nop ld A,#$55 ld A,$55 ld A,($55,X) ld A,([$55],X) jrne loop bset byte,#5

The CPU Instruction set is designed to minimize the number of bytes required per instruction: To do Table 25. CPU Addressing Mode Overview
Mode Inherent Immediate Short Long No Offset Short Long Short Long Short Long Relative Relative Bit Bit Bit Bit Direct Direct Direct Direct Direct Indirect Indirect Indirect Indirect Direct Indirect Direct Indirect Direct Indirect Relative Relative Indexed Indexed Indexed Indexed Indexed nop ld A,#$55 ld A,$10 ld A,$1000 ld A,(X) ld A,($10,X) ld A,($1000,X) ld A,[$10] ld A,[$10.w] ld A,([$10],X) ld A,([$10.w],X) jrne loop jrne [$10] bset $10,#7 bset [$10],#7 btjt $10,#7,skip btjt [$10],#7,skip Syntax

so, most of the addressing modes may be subdivided in two sub-modes called long and short: Long addressing mode is more powerful because it can use the full 64 Kbyte address space, however it uses more bytes and more CPU cycles. Short addressing mode is less powerful because it can generally only access page zero (0000h 00FFh range), but the instruction size is more compact, and faster. All memory to memory instructions use short addressing modes only (CLR, CPL, NEG, BSET, BRES, BTJT, BTJF, INC, DEC, RLC, RRC, SLL, SRL, SRA, SWAP) The ST7 Assembler optimizes the use of long and short addressing modes.

Destination

Pointer Address (Hex.)

Pointer Size (Hex.)

Length (Bytes) +0 +1

00..FF 0000..FFFF 00..FF 00..1FE 0000..FFFF 00..FF 0000..FFFF 00..1FE 0000..FFFF PC+/-127 PC+/-127 00..FF 00..FF 00..FF 00..FF 00..FF byte 00..FF byte 00..FF byte 00..FF 00..FF 00..FF 00..FF byte word byte word

+1 +2 +0 +1 +2 +2 +2 +2 +2 +1 +2 +1 +2 +2 +3

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INSTRUCTION SET OVERVIEW (Contd) 11.1.1 Inherent All Inherent instructions consist of a single byte. The opcode fully specifies all the required information for the CPU to process the operation.
Inherent Instruction NOP TRAP WFI HALT RET IRET SIM RIM SCF RCF RSP LD CLR PUSH/POP INC/DEC TNZ CPL, NEG MUL SLL, SRL, SRA, RLC, RRC SWAP Function No operation S/W Interrupt Wait For Interrupt (Low Power Mode) Halt Oscillator (Lowest Power Mode) Sub-routine Return Interrupt Sub-routine Return Set Interrupt Mask (level 3) Reset Interrupt Mask (level 0) Set Carry Flag Reset Carry Flag Reset Stack Pointer Load Clear Push/Pop to/from the stack Increment/Decrement Test Negative or Zero 1 or 2 Complement Byte Multiplication Shift and Rotate Operations Swap Nibbles

11.1.3 Direct In Direct instructions, the operands are referenced by their memory address. The direct addressing mode consists of two submodes: Direct (short) The address is a byte, thus requires only one byte after the opcode, but only allows 00 - FF addressing space. Direct (long) The address is a word, thus allowing 64 Kbyte addressing space, but requires 2 bytes after the opcode. 11.1.4 Indexed (No Offset, Short, Long) In this mode, the operand is referenced by its memory address, which is defined by the unsigned addition of an index register (X or Y) with an offset. The indirect addressing mode consists of three sub-modes: Indexed (No Offset) There is no offset, (no extra byte after the opcode), and allows 00 - FF addressing space. Indexed (Short) The offset is a byte, thus requires only one byte after the opcode and allows 00 - 1FE addressing space. Indexed (long) The offset is a word, thus allowing 64 Kbyte addressing space and requires 2 bytes after the opcode. 11.1.5 Indirect (Short, Long) The required data byte to do the operation is found by its memory address, located in memory (pointer). The pointer address follows the opcode. The indirect addressing mode consists of two sub-modes: Indirect (short) The pointer address is a byte, the pointer size is a byte, thus allowing 00 - FF addressing space, and requires 1 byte after the opcode. Indirect (long) The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing space, and requires 1 byte after the opcode.

11.1.2 Immediate Immediate instructions have two bytes, the first byte contains the opcode, the second byte contains the operand value.
Immediate Instruction LD CP BCP AND, OR, XOR ADC, ADD, SUB, SBC Load Compare Bit Compare Logical Operations Arithmetic Operations Function

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INSTRUCTION SET OVERVIEW (Contd) 11.1.6 Indirect Indexed (Short, Long) This is a combination of indirect and short indexed addressing modes. The operand is referenced by its memory address, which is defined by the unsigned addition of an index register value (X or Y) with a pointer value located in memory. The pointer address follows the opcode. The indirect indexed addressing mode consists of two sub-modes: Indirect Indexed (Short) The pointer address is a byte, the pointer size is a byte, thus allowing 00 - 1FE addressing space, and requires 1 byte after the opcode. Indirect Indexed (Long) The pointer address is a byte, the pointer size is a word, thus allowing 64 Kbyte addressing space, and requires 1 byte after the opcode. Table 26. Instructions Supporting Direct, Indexed, Indirect and Indirect Indexed Addressing Modes
Long and Short Instructions LD CP AND, OR, XOR ADC, ADD, SUB, SBC BCP Load Compare Logical Operations Arithmetic Additions/Substractions operations Bit Compare Function

11.1.7 Relative mode (Direct, Indirect) This addressing mode is used to modify the PC register value, by adding an 8-bit signed offset to it.
Available Relative Direct/Indirect Instructions JRxx CALLR Function Conditional Jump Call Relative

The relative addressing mode consists of two submodes: Relative (Direct) The offset is following the opcode. Relative (Indirect) The offset is defined in memory, which address follows the opcode.

Short Instructions Only CLR INC, DEC TNZ CPL, NEG BSET, BRES BTJT, BTJF SLL, SRL, SRA, RLC, RRC SWAP CALL, JP Clear

Function

Increment/Decrement Test Negative or Zero 1 or 2 Complement Bit Operations Bit Test and Jump Operations Shift and Rotate Operations Swap Nibbles Call or Jump subroutine

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INSTRUCTION SET OVERVIEW (Contd) 11.2 INSTRUCTION GROUPS The ST7 family devices use an Instruction Set consisting of 63 instructions. The instructions may
Load and Transfer Stack operation Increment/Decrement Compare and Tests Logical operations Bit Operation Conditional Bit Test and Branch Arithmetic operations Shift and Rotates Unconditional Jump or Call Conditional Branch Interruption management Condition Code Flag modification LD PUSH INC CP AND BSET BTJT ADC SLL JRA JRxx TRAP SIM WFI RIM HALT SCF IRET RCF CLR POP DEC TNZ OR BRES BTJF ADD SRL JRT SUB SRA JRF SBC RLC JP MUL RRC CALL SWAP CALLR SLA NOP RET BCP XOR CPL NEG RSP

be subdivided into 13 main groups as illustrated in the following table:

Using a pre-byte The instructions are described with one to four opcodes. In order to extend the number of available opcodes for an 8-bit CPU (256 opcodes), three different prebyte opcodes are defined. These prebytes modify the meaning of the instruction they precede. The whole instruction becomes: PC-2 End of previous instruction PC-1 Prebyte PC opcode PC+1 Additional word (0 to 2) according to the number of bytes required to compute the effective address

These prebytes enable instruction in Y as well as indirect addressing modes to be implemented. They precede the opcode of the instruction in X or the instruction using direct addressing mode. The prebytes are: PDY 90 Replace an X based instruction using immediate, direct, indexed, or inherent addressing mode by a Y one. PIX 92 Replace an instruction using direct, direct bit, or direct relative addressing mode to an instruction using the corresponding indirect addressing mode. It also changes an instruction using X indexed addressing mode to an instruction using indirect X indexed addressing mode. PIY 91 Replace an instruction using X indirect indexed addressing mode by a Y one.

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INSTRUCTION SET OVERVIEW (Contd)

Mnemo ADC ADD AND BCP BRES BSET BTJF BTJT CALL CALLR CLR CP CPL DEC HALT IRET INC JP JRA JRT JRF JRIH JRIL JRH JRNH JRM JRNM JRMI JRPL JREQ JRNE JRC JRNC JRULT JRUGE JRUGT Description Add with Carry Addition Logical And Bit compare A, Memory Bit Reset Bit Set Jump if bit is false (0) Jump if bit is true (1) Call subroutine Call subroutine relative Clear Arithmetic Compare One Complement Decrement Halt Interrupt routine return Increment Absolute Jump Jump relative always Jump relative Never jump Jump if ext. INT pin = 1 Jump if ext. INT pin = 0 Jump if H = 1 Jump if H = 0 Jump if I1:0 = 11 Jump if I1:0 <> 11 Jump if N = 1 (minus) Jump if N = 0 (plus) Jump if Z = 1 (equal) Jump if Z = 0 (not equal) Jump if C = 1 Jump if C = 0 Jump if C = 1 Jump if C = 0 Jump if (C + Z = 0) jrf * (ext. INT pin high) (ext. INT pin low) H=1? H=0? I1:0 = 11 ? I1:0 <> 11 ? N=1? N=0? Z=1? Z=0? C=1? C=0? Unsigned < Jmp if unsigned >= Unsigned > Pop CC, A, X, PC inc X jp [TBL.w] reg, M tst(Reg - M) A = FFH-A dec Y reg, M reg reg, M reg, M 1 I1 H 0 I0 N N Z Z C M 0 N N N 1 Z Z Z C 1 Function/Example A=A+M+C A=A+M A=A.M tst (A . M) bres Byte, #3 bset Byte, #3 btjf Byte, #3, Jmp1 btjt Byte, #3, Jmp1 A A A A M M M M C C Dst Src M M M M I1 H H H I0 N N N N N Z Z Z Z Z C C C

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INSTRUCTION SET OVERVIEW (Contd)

Mnemo JRULE LD MUL NEG NOP OR POP PUSH RCF RET RIM RLC RRC RSP SBC SCF SIM SLA SLL SRL SRA SUB SWAP TNZ TRAP WFI XOR Description Jump if (C + Z = 1) Load Multiply Negate (2's compl) No Operation OR operation Pop from the Stack Push onto the Stack Reset carry flag Subroutine Return Enable Interrupts Rotate left true C Rotate right true C Reset Stack Pointer Substract with Carry Set carry flag Disable Interrupts Shift left Arithmetic Shift left Logic Shift right Logic Shift right Arithmetic Substraction SWAP nibbles Test for Neg & Zero S/W trap Wait for Interrupt Exclusive OR A = A XOR M A M I1:0 = 10 (level 0) C <= A <= C C => A => C S = Max allowed A=A-M-C C=1 I1:0 = 11 (level 3) C <= A <= 0 C <= A <= 0 0 => A => C A7 => A => C A=A-M A7-A4 <=> A3-A0 tnz lbl1 S/W interrupt 1 1 1 0 N Z reg, M reg, M reg, M reg, M A reg, M M 1 1 N N 0 N N N N Z Z Z Z Z Z Z C C C C C A M N Z C 1 reg, M reg, M 1 0 N N Z Z C C A=A+M pop reg pop CC push Y C=0 A reg CC M M M M reg, CC 0 I1 H I0 N Z C N Z Function/Example Unsigned <= dst <= src X,A = X * A neg $10 reg, M A, X, Y reg, M M, reg X, Y, A 0 N Z N Z 0 C Dst Src I1 H I0 N Z C

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12 ELECTRICAL CHARACTERISTICS
12.1 PARAMETER CONDITIONS Unless otherwise specified, all voltages are referred to VSS. 12.1.1 Minimum and Maximum values Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA=25C and TA=TAmax (given by the selected temperature range). Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean3). 12.1.2 Typical values Unless otherwise specified, typical data are based on TA=25C, VDD=5V. They are given only as design guidelines and are not tested. Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean2). 12.1.3 Typical curves Unless otherwise specified, all typical curves are given only as design guidelines and are not tested. 12.1.4 Loading capacitor The loading conditions used for pin parameter measurement are shown in Figure 68. Figure 68. Pin loading conditions 12.1.5 Pin input voltage The input voltage measurement on a pin of the device is described in Figure 69. Figure 69. Pin input voltage

ST7 PIN

VIN

ST7 PIN

CL

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12.2 ABSOLUTE MAXIMUM RATINGS Stresses above those listed as absolute maximum ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these condi12.2.1 Voltage Characteristics
Symbol VDD - VSS VPP - VSS VIN 1) & 2) |VDDx| and |VSSx| |VSSA - VSSx| VESD(HBM) VESD(MM) Supply voltage Programming Voltage Input Voltage on true open drain pin Input voltage on any other pin Variations between different digital power pins Variations between digital and analog ground pins Electro-static discharge voltage (Human Body Model) Electro-static discharge voltage (Machine Model) Ratings

tions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Maximum value 6.5 13 VSS-0.3 to 6.5 VSS-0.3 to VDD+0.3 50 50

Unit

mV

see Section 12.7.3 on page 153

12.2.2 Current Characteristics

Symbol IVDD IVSS IIO Ratings Total current into VDD power lines (source) 3) Total current out of VSS ground lines (sink) 3) Output current sunk by any standard I/O and control pin Output current sunk by any high sink I/O pin Output current source by any I/Os and control pin Injected current on VPP pin IINJ(PIN)
2) & 4)

Maximum value 150 150 25 50 - 25 5 2 5 5 25

Unit mA

Injected current on RESET pin Injected current on OSC1 and OSC2 pins Injected current on any other pin 5) & 6) Total injected current (sum of all I/O and control pins) 5)

mA

IINJ(PIN) 2)

Notes: 1. Directly connecting the RESET and I/O pins to VDD or VSS could damage the device if an unintentional internal reset is generated or an unexpected change of the I/O configuration occurs (for example, due to a corrupted program counter). To guarantee safe operation, this connection has to be done through a pull-up or pull-down resistor (typical: 4.7k for RESET, 10k for I/Os). For the same reason, unused I/O pins must not be directly tied to VDD or VSS. 2. When the current limitation is not possible, the VIN absolute maximum rating must be respected, otherwise refer to IINJ(PIN) specification. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. 3. All power (VDD) and ground (VSS) lines must always be connected to the external supply. 4. Negative injection disturbs the analog performance of the device. See note in ADC Accuracy on page 167. For best reliability, it is recommended to avoid negative injection of more than 1.6mA. 5. When several inputs are submitted to a current injection, the maximum IINJ(PIN) is the absolute sum of the positive and negative injected currents (instantaneous values). These results are based on characterisation with IINJ(PIN) maximum current injection on four I/O port pins of the device. 6. True open drain I/O port pins do not accept positive injection.

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12.2.3 Thermal Characteristics

Symbol TSTG TJ Ratings Storage temperature range Value -65 to +150 Unit C

Maximum junction temperature (see Section 13.2 THERMAL CHARACTERISTICS)

12.3 OPERATING CONDITIONS 12.3.1 General Operating Conditions

Symbol fCPU VDD Parameter Internal clock frequency Standard voltage devices (except Flash Write/Erase) Operating Voltage for Flash Write/Erase VPP = 11.4 to 12.6V 1 Suffix Version 5 Suffix Version TA Ambient temperature range 6 or A Suffix Versions 7 or B Suffix Versions C Suffix Version Conditions Min 0 3.8 4.5 0 -10 -40 -40 -40 Max 8 5.5 5.5 70 85 85 105 125 C Unit MHz V

Figure 70. fCPU Max Versus VDD

fCPU [MHz]

8 FUNCTIONALITY NOT GUARANTEED IN THIS AREA

6

4 2 1 0 3.5 3.8 4.0 4.5 5.5 SUPPLY VOLTAGE [V]

FUNCTIONALITY GUARANTEED IN THIS AREA IN STANDARD VOLTAGE DEVICES (UNLESS OTHERWISE SPECIFIED IN THE TABLES OF PARAMETRIC DATA)

Note: Some temperature ranges are only available with a specific package and memory size. Refer to Ordering Information .

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OPERATING CONDITIONS (Contd) 12.3.2 Operating Conditions with Low Voltage Detector (LVD) Subject to general operating conditions for VDD, fCPU, and TA.
Symbol VIT+(LVD) Parameter Reset release threshold (VDD rise) Reset generation threshold (VDD fall) LVD voltage threshold hysteresis 1) VDD rise time 1)2) VDD glitches filtered (not detected) by LVD 1) Conditions VD level = High in option byte Min 4.0
1)

Typ 4.2 3.75 3.15 4.0 3.55 3.0 200

Max 4.5 4.01) 3.351) 4.25 1) 3.751) 3.15 1) 250

Unit

VD level = Med. in option byte3) 3.55 1) VD level = Low in option byte3) 2.95 1) VD level = High in option byte 3.8 VD level = Med. in option byte3) 3.351) VD level = Low in option byte3) 2.81) VIT+(LVD)-VIT-(LVD) 150 6

VIT-(LVD) Vhys(LVD) VtPOR tg(VDD)

mV s/V ns

40

Notes: 1. Data based on characterization results, not tested in production. 2. When VtPOR is faster than 100 s/V, the Reset signal is released after a delay of max. 42s after VDD crosses the VIT+(LVD) threshold. 3. If the medium or low thresholds are selected, the detection may occur outside the specified operating voltage range. Below 3.8V, device operation is not guaranteed.

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12.3.3 Auxiliary Voltage Detector (AVD) Thresholds Subject to general operating conditions for VDD, fCPU, and TA.
Symbol VIT+(AVD) Parameter 10 AVDF flag toggle threshold (VDD rise) 01 AVDF flag toggle threshold (VDD fall) AVD voltage threshold hysteresis Conditions VD level = High in option byte VD level = Med. in option byte VD level = Low in option byte VD level = High in option byte VD level = Med. in option byte VD level = Low in option byte VIT+(AVD)-VIT-(AVD) Min 4.4 1) 3.95 1) 3.4 1) 4.2 3.751) 3.21) Typ 4.6 4.15 3.6 4.4 4.0 3.4 200 450 Max 4.9 4.41) 3.81) 4.65 1) 4.2 1) 3.6 1) Unit

VIT-(AVD) Vhys(AVD) VIT-

mV mV

Voltage drop between AVD flag set VIT-(AVD)-VIT-(LVD) and LVD reset activated

1. Data based on characterization results, not tested in production.

12.3.4 External Voltage Detector (EVD) Thresholds Subject to general operating conditions for VDD, fCPU, and TA.
Symbol VIT+(EVD) VIT-(EVD) Vhys(EVD) Parameter 10 AVDF flag toggle threshold (VDD rise)1) 01 AVDF flag toggle threshold (VDD fall)1) EVD voltage threshold hysteresis VIT+(EVD)-VIT-(EVD) Conditions Min 1.15 1.1 Typ 1.26 1.2 200 Max 1.35 V 1.3 mV Unit

1. Data based on characterization results, not tested in production.

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12.4 SUPPLY CURRENT CHARACTERISTICS The following current consumption specified for the ST7 functional operating modes over temperature range does not take into account the clock source current consumption. To get the total device consumption, the two current values must be added (except for HALT mode for which the clock is stopped). 12.4.1 RUN and SLOW Modes (Flash devices)
Symbol Parameter 3.8VVDD5.5V Supply current in RUN mode 2) (see Figure 71) IDD Supply current in SLOW mode 2) (see Figure 72) Conditions fOSC=2MHz, fCPU=1MHz fOSC=4MHz, fCPU=2MHz fOSC=8MHz, fCPU=4MHz fOSC=16MHz, fCPU=8MHz fOSC=2MHz, fCPU=62.5kHz fOSC=4MHz, fCPU=125kHz fOSC=8MHz, fCPU=250kHz fOSC=16MHz, fCPU=500kHz Typ 1.3 2.0 3.6 7.1 0.6 0.7 0.8 1.1 Max 1) 3.0 5.0 8.0 15.0 2.7 3.0 3.6 4.0 Unit mA

mA

Figure 71. Typical IDD in RUN vs. fCPU

9 8 7 6

Figure 72. Typical IDD in SLOW vs. fCPU

1.20 1.00 0.80

8MHz 4MHz 2MHz 1MHz Idd (mA)

500kHz 250kHz 125kHz 62.5kHz

Idd (mA)

5 4 3 2

0.60 0.40 0.20

1 0 3.2 3.6 4 4.4 4.8 5.2 5.5 0.00 3.2 3.6 4 4.4 4.8 5.2 5.5

Vdd (V)

Vdd (V)

Notes: 1. Data based on characterization results, tested in production at VDD max. and fCPU max. 2. Measurements are done in the following conditions: - Progam executed from RAM, CPU running with RAM access. The increase in consumption when executing from Flash is 50%. - All I/O pins in input mode with a static value at VDD or VSS (no load) - All peripherals in reset state. - CSS and LVD disabled. - Clock input (OSC1) driven by external square wave. - In SLOW and SLOW WAIT mode, fCPU is based on fOSC divided by 32. To obtain the total current consumption of the device, add the clock source (Section 12.5.3 and Section 12.5.4) and the peripheral power consumption (Section 12.4.7).

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SUPPLY CURRENT CHARACTERISTICS (Contd) 12.4.2 WAIT and SLOW WAIT Modes (Flash devices)
Symbol Parameter 3.8VVDD5.5V Supply current in WAIT mode 2) (see Figure 73) IDD Supply current in SLOW WAIT mode 2) (see Figure 74) Conditions fOSC=2MHz, fCPU=1MHz fOSC=4MHz, fCPU=2MHz fOSC=8MHz, fCPU=4MHz fOSC=16MHz, fCPU=8MHz fOSC=2MHz, fCPU=62.5kHz fOSC=4MHz, fCPU=125kHz fOSC=8MHz, fCPU=250kHz fOSC=16MHz, fCPU=500kHz Typ 1.0 1.5 2.5 4.5 0.58 0.65 0.77 1.05 Max 1) 3.0 4.0 5.0 7.0 1.2 1.3 1.8 2.0 Unit mA

mA

Figure 73. Typical IDD in WAIT vs. fCPU

6 5 4

Figure 74. Typical IDD in SLOW-WAIT vs. fCPU

1.20 1.00 0.80

8MHz 4MHz 2MHz 1MHz

500kHz 250kHz 125kHz 62.5kHz

Idd (mA)

3 2 1 0 3.2 3.6 4 4.4 4.8 5.2 5.5

)
0.60 0.40 0.20 0.00 3.2 3.6 4 4.4 4.8 5.2 5.5

Vdd (V)

Vdd (V)

Notes: 1. Data based on characterization results, tested in production at VDD max. and fCPU max. 2. Measurements are done in the following conditions: - Progam executed from RAM, CPU running with RAM access. The increase in consumption when executing from Flash is 50%. - All I/O pins in input mode with a static value at VDD or VSS (no load) - All peripherals in reset state. - CSS and LVD disabled. - Clock input (OSC1) driven by external square wave. - In SLOW and SLOW WAIT mode, fCPU is based on fOSC divided by 32. To obtain the total current consumption of the device, add the clock source (Section 12.5.3 and Section 12.5.4) and the peripheral power consumption (Section 12.4.7).

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SUPPLY CURRENT CHARACTERISTICS (Contd) 12.4.3 RUN and SLOW Modes (ROM devices)
Symbol Parameter Supply current in RUN mode 2) IDD Supply current in SLOW mode 2) 3.8VVDD5.5V Conditions fOSC=2MHz, fCPU=1MHz fOSC=4MHz, fCPU=2MHz fOSC=8MHz, fCPU=4MHz fOSC=16MHz, fCPU=8MHz fOSC=2MHz, fCPU=62.5kHz fOSC=4MHz, fCPU=125kHz fOSC=8MHz, fCPU=250kHz fOSC=16MHz, fCPU=500kHz Typ 1.3 2.0 3.6 7.1 0.6 0.7 0.8 1.1 Max 1) 3.0 5.0 8.0 15.0 2.7 3.0 3.6 4.0 Unit

mA

12.4.4 WAIT and SLOW WAIT Modes (ROM devices)

Symbol Parameter Supply current in WAIT mode 2) IDD Supply current in SLOW WAIT mode 2) 3.8VVDD5.5V Conditions fOSC=2MHz, fCPU=1MHz fOSC=4MHz, fCPU=2MHz fOSC=8MHz, fCPU=4MHz fOSC=16MHz, fCPU=8MHz fOSC=2MHz, fCPU=62.5kHz fOSC=4MHz, fCPU=125kHz fOSC=8MHz, fCPU=250kHz fOSC=16MHz, fCPU=500kHz Typ 1.0 1.5 2.5 4.5 0.07 0.1 0.2 0.35 Max 1) 3.0 4.0 5.0 7.0 1.2 1.3 1.8 2.0 Unit

mA

Notes: 1. Data based on characterization results, tested in production at VDD max. and fCPU max. 2. Measurements are done in the following conditions: - Progam executed from RAM, CPU running with RAM access. There is no increase in consumption if programs are executed in ROM - All I/O pins in input mode with a static value at VDD or VSS (no load) - All peripherals in reset state. - CSS and LVD disabled. - Clock input (OSC1) driven by external square wave. - In SLOW and SLOW WAIT mode, fCPU is based on fOSC divided by 32. To obtain the total current consumption of the device, add the clock source (Section 12.5.3 and Section 12.5.4) and the peripheral power consumption (Section 12.4.7).

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SUPPLY CURRENT CHARACTERISTICS (Contd) 12.4.5 HALT and ACTIVE-HALT Modes

Symbol IDD IDD Parameter Supply current in HALT mode 1) Supply current in ACTIVE-HALT mode 2) VDD=5.5V Conditions -40CTA+85C -40CTA+125C 650 Typ Max 10 50 No max. guaranteed Unit A A

fOSC = 16 MHz, VDD= 5V

Notes: 1. All I/O pins in push-pull 0 mode (when applicable) with a static value at VDD or VSS (no load), CSS and LVD disabled. Data based on characterization results, tested in production at VDD max. and fCPU max. 2. Data based on characterisation results, not tested in production. All I/O pins in push-pull 0 mode (when applicable) with a static value at VDD or VSS (no load); clock input (OSC1) driven by external square wave, CSS and LVD disabled. To obtain the total current consumption of the device, add the clock source consumption (Section 12.5.3 and Section 12.5.4).

12.4.6 Supply and Clock Managers The previous current consumption specified for the ST7 functional operating modes over temperature range does not take into account the clock source current consumption. To get the total device consumption, the two current values must be added (except for HALT mode).
Symbol Parameter Conditions Typ 625 see Section 12.5.3 on page 147 VDD= 5V VDD= 5V HALT mode, VDD= 5V 360 250 150 300 Max 1) Unit

IDD(RCINT) Supply current of internal RC oscillator IDD(RES) IDD(PLL) IDD(CSS) IDD(LVD) Supply current of resonator oscillator 2) & 3) PLL supply current Clock security system supply current LVD supply current

Notes: 1. Data based on characterisation results, not tested in production. 2. Data based on characterization results done with the external components specified in Section 12.5.3, not tested in production. 3. As the oscillator is based on a current source, the consumption does not depend on the voltage.

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SUPPLY CURRENT CHARACTERISTICS (Contd) 12.4.7 On-Chip Peripherals Measured on S72F521R9T3 on TQFP64 generic board T A = 25C fCPU=4MHz.
Symbol IDD(TIM) IDD(ART) IDD(SPI) IDD(I2C) IDD(ADC) Parameter 16-bit Timer supply current ART PWM supply current2) SPI supply current 3) I2C supply current ADC supply current when converting 6)
4) 1)

Conditions VDD=5.0V VDD=5.0V VDD=5.0V VDD=5.0V VDD=5.0V

Typ 50 75 400 175 400

Unit A A A A A

Notes: 1. Data based on a differential IDD measurement between reset configuration (timer counter running at fCPU/4) and timer counter stopped (only TIMD bit set). Data valid for one timer. 2. Data based on a differential IDD measurement between reset configuration (timer stopped) and timer counter enabled (only TCE bit set). 3. Data based on a differential IDD measurement between reset configuration (SPI disabled) and a permanent SPI master communicationat maximum speed (data sent equal to 55h).This measurement includes the pad toggling consumption. 4. Data based on a differential IDD measurement between reset configuration (I2C disabled) and a permanent I2C master communication at 100kHz (data sent equal to 55h). This measurement include the pad toggling consumption (27kOhm external pull-up on clock and data lines). 6. Data based on a differential IDD measurement between reset configuration and continuous A/D conversions.

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12.5 CLOCK AND TIMING CHARACTERISTICS Subject to general operating conditions for VDD, fCPU, and TA. 12.5.1 General Timings
Symbol tc(INST) tv(IT) Parameter Instruction cycle time Interrupt reaction time tv(IT) = tc(INST) + 10
2)

Conditions fCPU=8MHz fCPU=8MHz

Min 2 250 10 1.25

Typ 1) 3 375

Max 12 1500 22 2.75

Unit tCPU ns tCPU s

12.5.2 External Clock Source

Symbol VOSC1H VOSC1L tw(OSC1H) tw(OSC1L) tr(OSC1) tf(OSC1) IL Parameter OSC1 input pin high level voltage OSC1 input pin low level voltage OSC1 high or low time 3) OSC1 rise or fall time 3) OSCx Input leakage current VSSVINVDD see Figure 75 Conditions Min VDD-1 VSS 5 ns 15 1 A Typ Max VDD VSS+1 Unit V

Figure 75. Typical Application with an External Clock Source

90% VOSC1H 10% VOSC1L tr(OSC1) tf(OSC1) tw(OSC1H) tw(OSC1L)

OSC2

Not connected internally fOSC

EXTERNAL CLOCK SOURCE

OSC1

IL ST72XXX

Notes: 1. Data based on typical application software. 2. Time measured between interrupt event and interrupt vector fetch. tc(INST) is the number of tCPU cycles needed to finish the current instruction execution. 3. Data based on design simulation and/or technology characteristics, not tested in production.

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CLOCK AND TIMING CHARACTERISTICS (Contd) 12.5.3 Crystal and Ceramic Resonator Oscillators The ST7 internal clock can be supplied with four different Crystal/Ceramic resonator oscillators. All the information given in this paragraph are based on characterization results with specified typical external components. In the application, the resonator and the load capacitors have to be placed as
Symbol Parameter Oscillator Frequency 1) Feedback resistor Recommended load capacitance versus equivalent serial resistance of the crystal or ceramic resonator (RS)

close as possible to the oscillator pins in order to minimize output distortion and start-up stabilization time. Refer to the crystal/ceramic resonator manufacturer for more details (frequency, package, accuracy...).
Conditions Min 1 >2 >4 >8 20 22 22 18 15 Typ 80 160 310 610 Max 2 4 8 16 40 56 46 33 33 Max 150 250 460 910 Unit

fOSC RF CL1 CL2

LP: Low power oscillator MP: Medium power oscillator MS: Medium speed oscillator HS: High speed oscillator RS=200 RS=200 RS=200 RS=100 LP oscillator MP oscillator MS oscillator HS oscillator Conditions VDD=5V VIN=VSS LP oscillator MP oscillator MS oscillator HS oscillator

MHz k pF

Symbol i2

Parameter OSC2 driving current

Unit A

Figure 76. Typical Application with a Crystal or Ceramic Resonator

WHEN RESONATOR WITH INTEGRATED CAPACITORS

i2
fOSC OSC1

CL1

RESONATOR CL2 OSC2

RF ST72XXX

Notes: 1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small RS value. Refer to crystal/ceramic resonator manufacturer for more details.

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CLOCK AND TIMING CHARACTERISTICS (Contd)

Oscil. MURATA Ceramic LP MP MS HS Typical Ceramic Resonators (information for guidance only) Reference3) CSA2.00MG CSA4.00MG CSA8.00MTZ CSA16.00MXZ0404) Freq. Characteristic
1)

CL1 CL2 tSU(osc) [pF] [pF] [ms] 2) 22 22 33 33 4 2 1 0.7

2MHz fOSC=[0.5%tolerance,0.3%Ta,0.3%aging,x.x%correl] 22 4MHz fOSC=[0.5%tolerance,0.3%Ta,0.3%aging,x.x%correl] 22 8MHz fOSC=[0.5%tolerance,0.5%Ta,0.3%aging,x.x%correl] 33 16MHz fOSC=[0.5%tolerance,0.3%Ta,0.3%aging,x.x%correl] 33

Notes: 1. Resonator characteristics given by the ceramic resonator manufacturer. 2. tSU(OSC) is the typical oscillator start-up time measured between VDD=2.8V and the fetch of the first instruction (with a quick VDD ramp-up from 0 to 5V (<50s). 3. Resonators all have different characteristics. Contact the manufacturer to obtain the appropriate values of external components and to verify oscillator performance. 4. 3rd overtone resonators require specific validation by the resonator manufacturer.

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CLOCK CHARACTERISTICS (Contd) 12.5.4 RC Oscillators

Symbol fOSC (RCINT) Parameter Internal RC oscillator frequency See Figure 77 Conditions TA=25C, VDD=5V Min 2 Typ 3.5 Max 5.6 Unit MHz

Figure 77. Typical fOSC(RCINT) vs TA

4 fOSC(RCINT) (MHz) 3.8 3.6 3.4 3.2 3 -45 0 25 TA(C) 70 130 Vdd = 5V Vdd = 5.5V

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CLOCK CHARACTERISTICS (Contd) 12.5.5 Clock Security System (CSS)

Symbol fSFOSC Parameter Safe Oscillator Frequency 1) Conditions Min Typ 3 Max Unit MHz

Note: 1. Data based on characterization results.

12.5.6 PLL Characteristics Operating conditions: VDD 3.8 to 5.5V @ TA 0 to 70C1) or VDD 4.5 to 5.5V @ TA -40 to 125C
Symbol VDD(PLL) fOSC fCPU/ fCPU Parameter PLL Operating Range PLL input frequency range Instantaneous PLL jitter 1) fOSC = 4 MHz. fOSC = 2 MHz. Conditions TA 0 to 70C TA -40 to +125C Min 3.8 4.5 2 1.0 2.5 Typ Max 5.5 5.5 4 2.5 4.0 Unit V MHz % %

Note: 1. Data characterized but not tested.

Figure 78. PLL Jitter vs. Signal frequency1

0.8 0.7 0.6 +/-Jitter (%) 0.5 0.4 0.3 0.2 0.1 0 2000 1000 500 250 125 Application Signal Frequency (KHz) PLL ON PLL OFF

The user must take the PLL jitter into account in the application (for example in serial communication or sampling of high frequency signals). The PLL jitter is a periodic effect, which is integrated over several CPU cycles. Therefore the longer the period of the application signal, the less it will be impacted by the PLL jitter. Figure 78 shows the PLL jitter integrated on application signals in the range 125kHz to 2MHz. At frequencies of less than 125KHz, the jitter is negligible.

Note 1: Measurement conditions: fCPU = 4MHz, TA= 25C

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12.6 MEMORY CHARACTERISTICS 12.6.1 RAM and Hardware Registers

Symbol VRM Parameter Data retention mode
1)

Conditions HALT mode (or RESET)

Min 1.6

Typ

Max

Unit V

12.6.2 FLASH Memory

DUAL VOLTAGE HDFLASH MEMORY Symbol Parameter fCPU VPP IDD IPP tVPP tRET NRW TPROG TERASE Operating frequency Programming voltage 3) Supply current4) VPP current4) Internal VPP stabilization time Data retention Write erase cycles Programming or erasing temperature range Conditions Read mode Write / Erase mode 4.5V VDD 5.5V RUN mode (fCPU = 4MHz) Write / Erase Power down mode / HALT Read (VPP=12V) Write / Erase TA=55C TA=25C Min 2) 0 1 11.4 Typ Max 2) 8 8 12.6 3 10 200 30 Unit MHz V mA A mA s years cycles C

0 1

10 20 100 -40 25 85

Notes: 1. Minimum VDD supply voltage without losing data stored in RAM (in HALT mode or under RESET) or in hardware registers (only in HALT mode). Not tested in production. 2. Data based on characterization results, not tested in production. 3. VPP must be applied only during the programming or erasing operation and not permanently for reliability reasons. 4. Data based on simulation results, not tested in production. Warning: Do not connect 12V to VPP before VDD is powered on, as this may damage the device.

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12.7 EMC CHARACTERISTICS Susceptibility tests are performed on a sample basis during product characterization. 12.7.1 Functional EMS (Electro Magnetic Susceptibility) Based on a simple running application on the product (toggling 2 LEDs through I/O ports), the product is stressed by two electro magnetic events until a failure occurs (indicated by the LEDs). ESD : Electro-Static Discharge (positive and negative) is applied on all pins of the device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2 standard. I FTB: A Burst of Fast Transient voltage (positive and negative) is applied to VDD and VSS through a 100pF capacitor, until a functional disturbance occurs. This test conforms with the IEC 1000-44 standard. A device reset allows normal operations to be resumed.
I

Symbol VFESD VFFTB

Parameter Voltage limits to be applied on any I/O pin to induce a functional disturbance

Conditions VDD=5V, TA=+25C, fOSC=8MHz conforms to IEC 1000-4-2

Neg 1) -1 -1.5

Pos 1) 1.5

Unit

Fast transient voltage burst limits to be apVDD=5V, TA=+25C, fOSC=8MHz plied through 100pF on VDD and VDD pins conforms to IEC 1000-4-4 to induce a functional disturbance

kV 1.5

12.7.2 Electro Magnetic Interference (EMI) Based on a simple application running on the product (toggling 2 LEDs through the I/O ports), the product is monitored in terms of emission. This emission test is in line with the norm SAE J 1752/3 which specifies the board and the loading of each pin.
Symbol Parameter Conditions Monitored Frequency Band 0.1MHz to 30MHz Max vs. [fOSC/fCPU] 8/4MHz 15 20 0 2.5 18 16 11 2.5 16/8MHz 15 27 5 3.0 23 24 17 3.0 dBV dBV Unit

SEMI

Peak level

VDD=5V, TA=+25C, 30MHz to 130MHz TQFP64 14x14 package conforming to SAE J 1752/3 130MHz to 1GHz SAE EMI Level VDD=5V, TA=+25C, 30MHz to 130MHz TQFP44 package conforming to SAE J 1752/3 130MHz to 1GHz SAE EMI Level 0.1MHz to 30MHz

SEMI

Peak level

Notes: 1. Data based on characterization results, not tested in production.

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EMC CHARACTERISTICS (Contd) 12.7.3 Absolute Electrical Sensitivity Based on three different tests (ESD, LU and DLU) using specific measurement methods, the product is stressed in order to determine its performance in terms of electrical sensitivity. For more details, refer to the AN1181 ST7 application note. 12.7.3.1 Electro-Static Discharge (ESD) Electro-Static Discharges (a positive then a negative pulse separated by 1 second) are applied to the pins of each sample according to each pin combination. The sample size depends of the number of supply pins of the device (3 parts*(n+1) supply pin). Two models are usually simulated: Human Body Model and Machine Model. This test conforms to the JESD22-A114A/A115A standard. See Figure 79 and the following test sequences. Human Body Model Test Sequence C L is loaded through S1 by the HV pulse generator. S1 switches position from generator to R. A discharge from CL through R (body resistance) to the ST7 occurs. S2 must be closed 10 to 100ms after the pulse delivery period to ensure the ST7 is not left in charge state. S2 must be opened at least 10ms prior to the delivery of the next pulse. Absolute Maximum Ratings
Symbol VESD(HBM) VESD(MM) Ratings Electro-static discharge voltage (Human Body Model) Electro-static discharge voltage (Machine Model)

Machine Model Test Sequence CL is loaded through S1 by the HV pulse generator. S1 switches position from generator to ST7. A discharge from CL to the ST7 occurs. S2 must be closed 10 to 100ms after the pulse delivery period to ensure the ST7 is not left in charge state. S2 must be opened at least 10ms prior to the delivery of the next pulse. R (machine resistance), in series with S2, ensures a slow discharge of the ST7.

Conditions TA=+25C TA=+25C

Maximum value 1) Unit 2000 V 200

Figure 79. Typical Equivalent ESD Circuits

S1 R=1500 S1 R=10k~10M

HIGH VOLTAGE PULSE GENERATOR

CL=100pF

ST7

S2

HIGH VOLTAGE PULSE GENERATOR CL=200pF

ST7

S2

HUMAN BODY MODEL

MACHINE MODEL

Notes: 1. Data based on characterization results, not tested in production.

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EMC CHARACTERISTICS (Contd) 12.7.3.2 Static and Dynamic Latch-Up I LU: 3 complementary static tests are required on 10 parts to assess the latch-up performance. A supply overvoltage (applied to each power supply pin) and a current injection (applied to each input, output and configurable I/O pin) are performed on each sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details, refer to the AN1181 ST7 application note. I DLU: Electro-Static Discharges (one positive then one negative test) are applied to each pin of 3 samples when the micro is running to assess the latch-up performance in dynamic mode. Power supplies are set to the typical values, the oscillator is connected as near as possible to the pins of the micro and the component is put in reset mode. This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards and is described in Figure 80. For more details, refer to the AN1181 ST7 application note. 12.7.3.3 Designing hardened software to avoid noise problems EMC characterization and optimization are performed at component level with a typical application environment and simplified MCU software. It Electrical Sensitivities
Symbol LU DLU Parameter Static latch-up class Dynamic latch-up class

should be noted that good EMC performance is highly dependent on the user application and the software in particular. Therefore it is recommended that the user applies EMC software optimization and prequalification tests in relation with the EMC level requested for his application. Software recommendations: The software flowchart must include the management of runaway conditions such as: Corrupted program counter Unexpected reset Critical Data corruption (control registers...) Prequalification trials: Most of the common failures (unexpected reset and program counter corruption) can be reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1 second. To complete these trials, ESD stress can be applied directly on the device, over the range of specification values. When unexpected behaviour is detected, the software can be hardened to prevent unrecoverable errors occurring (see application note AN1015).

Conditions TA=+25C TA=+85C TA=+125C VDD=5.5V, fOSC=4MHz, TA=+25C

Class 1) A A A A

Figure 80. Simplified Diagram of the ESD Generator for DLU

RCH=50M RD=330

DISCHARGE TIP

VDD VSS

CS=150pF ESD GENERATOR 2)

HV RELAY

ST7

DISCHARGE RETURN CONNECTION

Notes: 1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B Class strictly covers all the JEDEC criteria (international standard). 2. Schaffner NSG435 with a pointed test finger.

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EMC CHARACTERISTICS (Contd) 12.7.4 ESD Pin Protection Strategy To protect an integrated circuit against ElectroStatic Discharge the stress must be controlled to prevent degradation or destruction of the circuit elements. The stress generally affects the circuit elements which are connected to the pads but can also affect the internal devices when the supply pads receive the stress. The elements to be protected must not receive excessive current, voltage or heating within their structure. An ESD network combines the different input and output ESD protections. This network works, by allowing safe discharge paths for the pins subjected to ESD stress. Two critical ESD stress cases are presented in Figure 81 and Figure 82 for standard pins and in Figure 83 and Figure 84 for true open drain pins.

Standard Pin Protection To protect the output structure the following elements are added: A diode to VDD (3a) and a diode from VSS (3b) A protection device between VDD and VSS (4) To protect the input structure the following elements are added: A resistor in series with the pad (1) A diode to VDD (2a) and a diode from VSS (2b) A protection device between VDD and VSS (4)

Figure 81. Positive Stress on a Standard Pad vs. VSS

VDD VDD

(3a)

(2a)

(1) OUT (4) IN

Main path Path to avoid

(3b) (2b)

VSS

VSS

Figure 82. Negative Stress on a Standard Pad vs. VDD

VDD VDD

(3a)

(2a)

(1) OUT (4) IN

Main path
(3b) (2b)

VSS

VSS

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EMC CHARACTERISTICS (Contd) True Open Drain Pin Protection The centralized protection (4) is not involved in the discharge of the ESD stresses applied to true open drain pads due to the fact that a P-Buffer and diode to VDD are not implemented. An additional local protection between the pad and VSS (5a & 5b) is implemented to completely absorb the positive ESD discharge. Multisupply Configuration When several types of ground (VSS, VSSA, ...) and power supply (VDD, VAREF, ...) are available for any reason (better noise immunity...), the structure shown in Figure 85 is implemented to protect the device against ESD.

Figure 83. Positive Stress on a True Open Drain Pad vs. VSS
VDD VDD

Main path Path to avoid

(1) OUT (4) IN

(5a)

(3b)

(2b)

(5b)

VSS

VSS

Figure 84. Negative Stress on a True Open Drain Pad vs. VDD
VDD VDD

Main path
(1) OUT (4) IN

(3b)

(3b)

(2b)

(3b)

VSS

VSS

Figure 85. Multisupply Configuration

VDD

VAREF

VAREF

VSS
BACK TO BACK DIODE BETWEEN GROUNDS

VSSA

VSSA

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12.8 I/O PORT PIN CHARACTERISTICS 12.8.1 General Characteristics Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified.
Symbol VIL VIH Vhys IINJ(PIN)3) IINJ(PIN)3) IL IS RPU CIO tf(IO)out tr(IO)out tw(IT)in Parameter Input low level voltage
1)

Conditions CMOS ports

Min 0.7xVDD

Typ

Max 0.3xVDD

Unit

Input high level voltage 1) Schmitt trigger voltage hysteresis 2) Injected Current on an I/O pin

0.7 4 25 1
4)

V mA

Total injected current (sum of all I/O VDD=5V and control pins) Input leakage current Static current consumption Weak pull-up equivalent resistor 5) I/O pin capacitance Output high to low level fall time 1) External interrupt pulse time 6) CL=50pF Output low to high level rise time 1) Between 10% and 90% 1 VSSVINVDD Floating input mode VIN=VSS VDD=5V 50 120 5 25 25

200 250

A k pF ns tCPU

Figure 86. Connecting Unused I/O Pins

VDD 10k

Figure 87. Typical IPU vs. VDD with VIN=VSS

90 80 70 60 Ip u(uA) 50 40 30
Ta=1 40C Ta=9 5C

ST72XXX
UNUSED I/O PORT

Ta=2 5C Ta=-45 C

10k

UNUSED I/O PORT

20 10

ST72XXX

0 2 2 .5 3 3 .5 4 4.5 V dd(V ) 5 5 .5 6

Notes: 1. Data based on characterization results, not tested in production. 2. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested. 3. When the current limitation is not possible, the VIN maximum must be respected, otherwise refer to IINJ(PIN) specification. A positive injection is induced by VIN>VDD while a negative injection is induced by VIN<VSS. Refer to Section 12.2.2 on page 137 for more details. 4. Configuration not recommended, all unused pins must be kept at a fixed voltage: using the output mode of the I/O for example or an external pull-up or pull-down resistor (see Figure 86). Data based on design simulation and/or technology characteristics, not tested in production. 5. The RPU pull-up equivalent resistor is based on a resistive transistor (corresponding IPU current characteristics described in Figure 87). 6. To generate an external interrupt, a minimum pulse width has to be applied on an I/O port pin configured as an external interrupt source.

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I/O PORT PIN CHARACTERISTICS (Contd) 12.8.2 Output Driving Current Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Symbol Parameter Output low level voltage for a standard I/O pin when 8 pins are sunk at same time (see Figure 88) VDD=5V Output low level voltage for a high sink I/O pin when 4 pins are sunk at same time (see Figure 89 and Figure 91) Output high level voltage for an I/O pin when 4 pins are sourced at same time (see Figure 90 and Figure 93) Conditions IIO=+5mA IIO=+2mA IIO=+20mA, TA85C TA85C IIO=+8mA IIO=-5mA, TA85C VDD-1.4 TA85C VDD-1.6 IIO=-2mA VDD-0.7 Min Max 1.2 0.5 1.3 1.5 0.6 Unit

VOL 1)

VOH 2)

Figure 88. Typical VOL at VDD=5V (standard)

1.4 1.2

Figure 90. Typical VOH at VDD=5V

5.5 5 Vdd-Vo h (V) at Vd d=5V 4.5 4 3.5
V dd= 5V 1 40C m in

1 V ol (V ) at Vdd=5V 0.8 0.6 0.4 0.2 0 0 0.005 Iio(A) 0.0 1 0.01 5

Ta =14 0C " Ta =95 C Ta =25 C Ta =-45 C

3 2.5 2 -0.01

V dd= 5v 95C m in V dd= 5v 25C m in V dd= 5v -4 5C m in

-0.008 -0.006 -0.004 Iio (A)

-0.002

Figure 89. Typical VOL at VDD=5V (high-sink)

1 0.9 0.8 Vol(V ) at V dd=5V 0.7 0.6 0.5 0.4
Ta= 140 C

0.3 0.2 0.1 0

0 0.01 0.02 Iio(A)

Ta= 95 C Ta= 25 C Ta= -45C

0.03

Notes: 1. The IIO current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of IIO (I/O ports and control pins) must not exceed IVSS. 2. The IIO current sourced must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of IIO (I/O ports and control pins) must not exceed IVDD. True open drain I/O pins do not have VOH.

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I/O PORT PIN CHARACTERISTICS (Contd) Figure 91. Typical VOL vs. VDD (standard)
1
Ta= -4 5C

0.45
Ta=-4 5C
Ta= 25C Ta= 95C Ta= 140 C

0.9 0.8 Vol(V ) at Iio =5m A 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 2 2.5 3 3.5 4 Vd d(V ) 4.5

0.4 0.35 Vo l(V ) a t Iio=2 mA 0.3 0.25 0.2 0.15 0.1 0.05

Ta=2 5C Ta=9 5C Ta=1 40C

5.5

0 2 2 .5 3 3.5 4 Vd d(V ) 4.5 5 5.5 6

Figure 92. Typical VOL vs. VDD (high-sink)

0 .6

1 .6

1 .4
0 .5

Ta= 140 C Ta=95 C

1 .2
0 .4

Ta=25 C Ta=-45C

Vol(V ) at Iio=20m A

Vol(V ) at Iio=8m A

0 .3

0 .8

0 .6

0 .2

Ta= 14 0C Ta=9 5C
0 .4

0 .1

Ta=2 5C
0 .2

Ta=-45 C
0 2 2.5 3 3.5 4 Vdd (V ) 4.5 5 5.5 6

0 2 2.5 3 3.5 4 V dd(V ) 4.5 5 5.5 6

Figure 93. Typical VDD-VOH vs. VDD

5.5 5 Vdd-Voh(V ) at Iio =-2m A 4.5 4 3.5
Ta= -4 5C

6
Ta= -4 5C

5 Vdd-Voh(V) at Iio=-5m A

Ta= 25C Ta= 95C

Ta= 140C

3 2.5

Ta= 25C Ta= 95C

1
Ta= 140C

2 2 2.5 3 3.5 4 Vdd(V) 4.5 5 5.5 6

0 2 2.5 3 3.5 4 Vdd(V) 4.5 5 5.5 6

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12.9 CONTROL PIN CHARACTERISTICS 12.9.1 Asynchronous RESET Pin Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Symbol VIL VIH Vhys VOL IIO RON Parameter Input low level voltage
1)

Conditions

Min 0.85xVDD

Typ

Max 0.16xVDD

Unit V

Input high level voltage 1) Schmitt trigger voltage hysteresis 2) Output low level voltage 3) VDD=5V IIO=+2mA Input current on RESET pin Weak pull-up equivalent resistor External pin Internal reset sources

2.5 0.2 2 20 0 20 2.5 200 30 30 0.5 TBD 120 429) 429) mA k s s s ns

tw(RSTL)out Generated reset pulse duration th(RSTL)in tg(RSTL)in External reset pulse hold time 4) Filtered glitch duration 5)

Figure 94. Typical Application with RESET pin 6)7)8)

Recommended if LVD is disabled
VDD VDD

VDD

ST72XXX

USER EXTERNAL RESET CIRCUIT 5)

0.01F

4.7k

RON
Filter

INTERNAL RESET

0.01F

PULSE GENERATOR

WATCHDOG LVD RESET

Required if LVD is disabled

Notes: 1. Data based on characterization results, not tested in production. 2. Hysteresis voltage between Schmitt trigger switching levels. 3. The IIO current sunk must always respect the absolute maximum rating specified in Section 12.2.2 and the sum of IIO (I/O ports and control pins) must not exceed IVSS. 4. To guarantee the reset of the device, a minimum pulse has to be applied to the RESET pin. All short pulses applied on the RESET pin with a duration below th(RSTL)in can be ignored. 5. The reset network (the resistor and two capacitors) protects the device against parasitic resets, especially in noisy environments. 6. The output of the external reset circuit must have an open-drain output to drive the ST7 reset pad. Otherwise the device can be damaged when the ST7 generates an internal reset (LVD or watchdog). 7. Whatever the reset source is (internal or external), the user must ensure that the level on the RESET pin can go below the VIL max. level specified in Section 12.9.1 . Otherwise the reset will not be taken into account internally. 8. Because the reset circuit is designed to allow the internal RESET to be output in the RESET pin, the user must ensure that the current sunk on the RESET pin (by an external pull-up for example) is less than the absolute maximum value specified for IINJ(RESET) in Section 12.2.2 on page 137. 9. Data guaranteed by design, not tested in production.

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CONTROL PIN CHARACTERISTICS (Contd) 12.9.2 ICCSEL/VPP Pin Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Symbol VIL VIH IL Parameter Input low level voltage 1) Input high level voltage 1) Input leakage current Conditions FLASH versions ROM versions FLASH versions ROM versions VIN=VSS Min VSS Max 0.2
V

Unit

VSS 0.3xVDD VDD-0.1 12.6 0.7xVDD VDD 1

Figure 95. Two typical Applications with ICCSEL/VPP Pin 2)

ICCSEL/V PP

PROGRAMMING TOOL 10k

VPP

ST72XXX

ST72XXX

Notes: 1. Data based on design simulation and/or technology characteristics, not tested in production. 2. When ICC mode is not required by the application ICCSEL/VPP pin must be tied to VSS.

12.10 TIMER PERIPHERAL CHARACTERISTICS Subject to general operating conditions for VDD, fOSC, and TA unless otherwise specified. Refer to I/O port characteristics for more details on the input/output alternate function characteristics (output compare, input capture, external clock, PWM output...). 12.10.1 8-Bit PWM-ART Auto-Reload Timer
Symbol Parameter Conditions Min 1 fCPU=8MHz 125 0 0 fCPU/2 fCPU/2 8 VDD=5V, Res=8-bits 20 Typ Max Unit tCPU ns MHz bit mV

tres(PWM) PWM resolution time fEXT fPWM ResPWM VOS ART external clock frequency PWM repetition rate PWM resolution PWM/DAC output step voltage

12.10.2 16-Bit Timer

Symbol Parameter Conditions Min 1 2 fCPU=8MHz 250 0 0 fCPU/4 fCPU/4 16 Typ Max Unit tCPU tCPU ns MHz MHz bit

tw(ICAP)in Input capture pulse time tres(PWM) PWM resolution time fEXT fPWM ResPWM Timer external clock frequency PWM repetition rate PWM resolution

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12.11 COMMUNICATION INTERFACE CHARACTERISTICS 12.11.1 SPI - Serial Peripheral Interface Subject to general operating conditions for V DD, fCPU, and TA unless otherwise specified.
Symbol fSCK 1/tc(SCK) tr(SCK) tf(SCK) tsu(SS) th(SS) tw(SCKH) tw(SCKL) tsu(MI) tsu(SI) th(MI) th(SI) ta(SO) tdis(SO) tv(SO) th(SO) tv(MO) th(MO) Parameter Master SPI clock frequency fCPU=8MHz Slave fCPU=8MHz SPI clock rise and fall time SS setup time SS hold time SCK high and low time Data input setup time Data input hold time Data output access time Data output disable time Data output valid time Data output hold time Data output valid time Data output hold time Slave Slave Master Slave Master Slave Master Slave Slave Slave Slave (after enable edge) Master (before capture edge) 0 0.25 0.25 tCPU

Refer to I/O port characteristics for more details on the input/output alternate function characteristics (SS, SCK, MOSI, MISO).
Conditions Min fCPU/128 0.0625 0 Max fCPU/4 2 fCPU/2 4 Unit

MHz

see I/O port pin description 120 120 100 90 100 100 100 100 0 120 240 90

ns

Figure 96. SPI Slave Timing Diagram with CPHA=0 3)

SS INPUT tsu(SS)
SCK INPUT

tc(SCK)

th(SS)

CPHA=0 CPOL=0 CPHA=0 CPOL=1 ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK)
LSB OUT

tdis(SO)
see note 2

MISO OUTPUT

see note 2

MSB OUT

BIT6 OUT

tsu(SI)

th(SI)

MOSI INPUT

MSB IN

BIT1 IN

LSB IN

Notes: 1. Data based on design simulation and/or characterisation results, not tested in production. 2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its alternate function capability released. In this case, the pin status depends on the I/O port configuration. 3. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.

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COMMUNICATION INTERFACE CHARACTERISTICS (Contd) Figure 97. SPI Slave Timing Diagram with CPHA=11)
SS INPUT tsu(SS)
SCK INPUT

tc(SCK)

th(SS)

CPHA=1 CPOL=0 CPHA=1 CPOL=1 ta(SO) tw(SCKH) tw(SCKL) tv(SO) th(SO) tr(SCK) tf(SCK)
LSB OUT

tdis(SO)

MISO OUTPUT

see note 2

HZ

MSB OUT

BIT6 OUT

see note 2

tsu(SI)

th(SI)

MOSI INPUT

MSB IN

BIT1 IN

LSB IN

Figure 98. SPI Master Timing Diagram

SS INPUT

1)

tc(SCK) CPHA=0 CPOL=0

SCK INPUT

CPHA=0 CPOL=1 CPHA=1 CPOL=0 CPHA=1 CPOL=1 tw(SCKH) tw(SCKL) tsu(MI) th(MI) tr(SCK) tf(SCK)

MISO INPUT tv(MO)

MSB IN

BIT6 IN

LSB IN

th(MO)

MOSI OUTPUT see note 2

MSB OUT

BIT6 OUT

LSB OUT

see note 2

Notes: 1. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD. 2. When no communication is on-going the data output line of the SPI (MOSI in master mode, MISO in slave mode) has its alternate function capability released. In this case, the pin status depends of the I/O port configuration.

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COMMUNICATION INTERFACE CHARACTERISTICS (Contd)

2 12.11.2 I C - Inter IC Control Interface Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.

Refer to I/O port characteristics for more details on the input/output alternate function characteristics (SDAI and SCLI). The ST7 I2C interface meets the requirements of the Standard I2C communication protocol described in the following table.
Standard mode I2C Min 1) 4.7 4.0 250 0
3)

Symbol tw(SCLL) tw(SCLH) tsu(SDA) th(SDA) tr(SDA) tr(SCL) tf(SDA) tf(SCL) th(STA) tsu(STA) tsu(STO) Cb SCL clock low time

Parameter

Fast mode I2C Min 1) 1.3 0.6 100 0 2) 900 3) 300 300 Max 1)

Max 1)

Unit s

SCL clock high time SDA setup time SDA data hold time SDA and SCL rise time SDA and SCL fall time START condition hold time Repeated START condition setup time STOP condition setup time Capacitive load for each bus line

1000 300 4.0 4.7 4.0 4.7 400

20+0.1Cb 20+0.1Cb 0.6 0.6 0.6 1.3

ns

s ns ms 400 pF

tw(STO:STA) STOP to START condition time (bus free)

Figure 99. Typical Application with I2C Bus and Timing Diagram 4)
VDD 4.7k I C BUS
2

VDD 4.7k 100 100 SDAI SCLI

ST72XXX
REPEATED START START

tsu(STA)
SDA

tw(STO:STA)

START

tf(SDA)
SCL

tr(SDA)

tsu(SDA)

th(SDA)

STOP

th(STA)

tw(SCKH)

tw(SCKL)

tr(SCK)

tf(SCK)

tsu(STO)

Notes: 1. Data based on standard I2C protocol requirement, not tested in production. 2. The device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of the falling edge of SCL. 3. The maximum hold time of the START condition has only to be met if the interface does not stretch the low period of SCL signal. 4. Measurement points are done at CMOS levels: 0.3xVDD and 0.7xVDD.

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12.12 10-BIT ADC CHARACTERISTICS Subject to general operating conditions for VDD, fCPU, and TA unless otherwise specified.
Symbol fADC VAREF VAIN IL RAIN CAIN fAIN CADC tSTAB tADC Parameter ADC clock frequency Analog reference voltage 2) 0.7*VDDVAREFVDD -40CTA85C range Other TA ranges Conversion voltage range 3) Input leakage current for analog input External input impedance External capacitor on analog input Variation freq. of analog input signal Internal sample and hold capacitor Stabilization time after ADC enable Conversion time (Sample+Hold) fCPU=8MHz, SPEED=0 - No of sample capacitor loading cycles fADC=2MHz - No. of Hold conversion cycles 12 0
5)

Conditions

Min 0.4 3.8 VSSA

Typ 1)

Max 2 5.5 VAREF 250 1 see Figure 100 and Figure 1013)4)5)

Unit MHz V nA A k pF Hz pF s 1/fADC

7.5 4 11

Figure 100. RAIN max. vs f ADC with CAIN=0pF4)

45 40 35

Figure 101. Recommended CAIN & RAIN values.5)

1000

Cain 10 nF
2 MHz
100

Max. R AIN (Kohm)

Cain 22 nF Cain 47 nF

30 25 20 15 10 5 0 0 10 30 70

1 MHz

Max. R AIN (Kohm)

10

0.1 0.01 0.1 1 10

CPARASITIC (pF)

f AIN(KHz)

Figure 102. Typical A/D Converter Application

VDD VT 0.6V

ST72XXX 2k(max)

RAIN VAIN CAIN

AINx

10-Bit A/D Conversion CADC 12pF

VT 0.6V

IL 1A

Notes: 1. Unless otherwise specified, typical data are based on TA=25C and VDD-VSS=5V. They are given only as design guidelines and are not tested. 2. When VDDA and VSSA pins are not available on the pinout, the ADC refers to VDD and VSS. 3. Any added external serial resistor will downgrade the ADC accuracy (especially for resistance greater than 10k). Data based on characterization results, not tested in production. 4. CPARASITIC represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the pad capacitance (3pF). A high CPARASITIC value will downgrade conversion accuracy. To remedy this, fADC should be reduced. 5. This graph shows that depending on the input signal variation (fAIN), CAIN can be increased for stabilization time and decreased to allow the use of a larger serial resistor (RAIN).

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ADC CHARACTERISTICS (Contd) 12.12.1 Analog Power Supply and Reference Pins Depending on the MCU pin count, the package may feature separate VAREF and VSSA analog power supply pins. These pins supply power to the A/D converter cell and function as the high and low reference voltages for the conversion. In some packages, VAREF and VSSA pins are not available (refer to Table 1). In this case the analog supply and reference pads are internally bonded to the VDD and VSS pins. Separation of the digital and analog power pins allow board designers to improve A/D performance. Conversion accuracy can be impacted by voltage drops and noise in the event of heavily loaded or badly decoupled power supply lines (see Section 12.12.2 General PCB Design Guidelines). 12.12.2 General PCB Design Guidelines To obtain best results, some general design and layout rules should be followed when designing the application PCB to shield the noise-sensitive, analog physical interface from noise-generating CMOS logic signals. Use separate digital and analog planes. The analog ground plane should be connected to the Figure 103. Power Supply Filtering
1 to 10F
ST7 DIGITAL NOISE FILTERING

digital ground plane via a single point on the PCB. Filter power to the analog power planes. It is recommended to connect capacitors, with good high frequency characteristics, between the power and ground lines, placing 0.1F and optionally, if needed 10pF capacitors as close as possible to the ST7 power supply pins and a 1 to 10F capacitor close to the power source (see Figure 103). The analog and digital power supplies should be connected in a star nework. Do not use a resistor, as VAREF is used as a reference voltage by the A/D converter and any resistance would cause a voltage drop and a loss of accuracy. Properly place components and route the signal traces on the PCB to shield the analog inputs. Analog signals paths should run over the analog ground plane and be as short as possible. Isolate analog signals from digital signals that may switch while the analog inputs are being sampled by the A/D converter. Do not toggle digital outputs on the same I/O port as the A/D input being converted.

10pF (if needed) 0.1F

ST72XXX VSS

VDD

VDD

POWER SUPPLY SOURCE

10pF (if needed) 0.1F

EXTERNAL NOISE FILTERING

VAREF

VSSA

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10-BIT ADC CHARACTERISTICS (Contd) 12.12.3 ADC Accuracy Conditions: VDD=5V

Symbol |ET| EO EG |ED| |EL| Parameter Total unadjusted error Offset error 1) Gain Error 1) Differential linearity error 1) Integral linearity error 1) CPU in run mode @ fADC 2 MHz. CPU in run mode @ fADC 2 MHz.
1)

Conditions

Typ 4 3 -0.5 1.5 1.5

Max 3.52) -22) 4.52) 4.52)

Unit

LSB

Notes: 1. Injecting negative current on any of the analog input pins significantly reduces the accuracy of any conversion being performed on any analog input. Analog pins can be protected against negative injection by adding a Schottky diode (pin to ground). Injecting negative current on digital input pins degrades ADC accuracy especially if performed on a pin close to the analog input pins. Any positive injection current within the limits specified for IINJ(PIN) and IINJ(PIN) in Section 12.8 does not affect the ADC accuracy. 2. Data based on characterization results, monitored in production.

Figure 104. ADC Accuracy Characteristics

Digital Result ADCDR 1023 1022 1021 1LSB IDEAL V V A REF SS A = ------------------------------------------EG

(1) Example of an actual transfer curve (2) The ideal transfer curve (3) End point correlation line

1024

(2) ET 7 6 5 4 3 2 1 0 1 VSSA 2 3 4 1 LSBIDEAL EO EL ED (3) (1)

ET=Total Unadjusted Error: maximum deviation between the actual and the ideal transfer curves. EO=Offset Error: deviation between the first actual transition and the first ideal one. EG=Gain Error: deviation between the last ideal transition and the last actual one. ED=Differential Linearity Error: maximum deviation between actual steps and the ideal one. EL=Integral Linearity Error: maximum deviation between any actual transition and the end point correlation line.

Vin (LSBIDEAL) 5 6 7 1021 1022 1023 1024

VAREF

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13 PACKAGE CHARACTERISTICS
13.1 PACKAGE MECHANICAL DATA Figure 105. 64-Pin Thin Quad Flat Package
D D1 A1 A A2

Dim. A A1 A2

mm Min 0.05 1.35 0.30 0.09 16.00 14.00 16.00 14.00 0.80 0 0.45 3.5 0.60 1.00 64 7 0 1.40 0.37 Typ Max 1.60 0.15 0.002 Min

inches Typ Max 0.063 0.006

1.45 0.053 0.055 0.057 0.45 0.012 0.015 0.018 0.20 0.004 0.630 0.551 0.630 0.551 0.031 3.5 0.039 7 0.75 0.018 0.024 0.030 0.008

b c D

e E1 E

D1 E E1 e L

L L1 c h

L1 N

Number of Pins

Figure 106. 64-Pin Thin Quad Flat Package

Dim.
D D1 A1 A A2

mm Min 0.05 1.35 0.17 0.09 12.00 10.00 12.00 10.00 0.50 0 0.45 3.5 0.60 1.00 64 7 0 1.40 0.22 Typ Max 1.60 0.15 0.002 Min

inches Typ Max 0.063 0.006

A A1 A2 b

1.45 0.053 0.055 0.057 0.27 0.007 0.009 0.011 0.20 0.004 0.472 0.394 0.472 0.394 0.020 3.5 0.039 7 0.75 0.018 0.024 0.030 0.008

c D D1

E1

E e

E E1 e
c

L L1 N

L1 h L

Number of Pins

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Figure 107. 44-Pin Thin Quad Flat Package

D D1 A1 b

A A2

Dim. A A1 A2 b C D

mm Min 0.05 1.35 0.30 0.09 12.00 10.00 12.00 10.00 0.80 0 0.45 3.5 0.60 1.00 44 7 0 1.40 0.37 Typ Max 1.60 0.15 0.002 Min

inches Typ Max 0.063 0.006

1.45 0.053 0.055 0.057 0.45 0.012 0.015 0.018 0.20 0.004 0.000 0.008 0.472 0.394 0.472 0.394 0.031 3.5 0.039 7 0.75 0.018 0.024 0.030

E1 E

D1 E E1 e L L1

L1 L h

Number of Pins N

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13.2 THERMAL CHARACTERISTICS

Symbol Ratings Package thermal resistance (junction to ambient) TQFP64 14x14 TQFP64 10x10 TQFP44 10x10 Power dissipation 1) Maximum junction temperature 2) Value Unit

RthJA

47 50 52 500 150

C/W

PD TJmax

mW C

Notes: 1. The power dissipation is obtained from the formula PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA.

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13.3 SOLDERING AND GLUEABILITY INFORMATION Recommended soldering information given only as design guidelines. Figure 108. Recommended Wave Soldering Profile (with 37% Sn and 63% Pb)
250 200 150 Temp. [C] 100 50 0 20 40 60 80 100 120 140 160 PREHEATING PHASE Time [sec] 80C 5 sec SOLDERING PHASE COOLING PHASE (ROOM TEMPERATURE)

Figure 109. Recommended Reflow Soldering Oven Profile (MID JEDEC)

250 200 150 Temp. [C] 100 50 0 100 200 300 400
ramp up 2C/sec for 50sec ramp down natural 2C/sec max 90 sec at 125C 150 sec above 183C Tmax=235+/-5C for 25 sec

Time [sec]

Recommended glue for SMD plastic packages dedicated to molding compound with silicone: I Heraeus: PD945, PD955 I Loctite: 3615, 3298

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14 ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION

Each device is available for production in user programmable versions (FLASH) as well as in factory coded versions (ROM/FASTROM). ST72321 devices are ROM versions. ST72P321 devices are Factory Advanced Service Technique ROM (FASTROM) versions: they are factory-programmed HDFlash devices. Each device is available for production in user programmable versions 14.1 FLASH OPTION BYTES
STATIC OPTION BYTE 0 7 PKG0 WDG HALT SW CSS 1 0 VD 0 0 Reserved 0 FMP_R 7 PKG1 RSTC OSCTYPE 1 1 0 0 2 1 OSCRANGE 1 1 0 1 STATIC OPTION BYTE 1 0 PLLOFF 1 VD0 1 0 1 0

(FLASH) as well as in factory coded versions (ROM). FLASH devices are shipped to customers with a default content, while ROM/FASTROM factory coded parts contain the code supplied by the customer. This implies that FLASH devices have to be configured by the customer using the Option Bytes while the ROM/FASTROM devices are factory-configured.

Default

The option bytes allow the hardware configuration of the microcontroller to be selected. They have no address in the memory map and can be accessed only in programming mode (for example using a standard ST7 programming tool). The default content of the FLASH is fixed to FFh. To program the FLASH devices directly using ICP, FLASH devices are shipped to customers with the internal RC clock source enabled. In masked ROM devices, the option bytes are fixed in hardware by the ROM code (see option list). OPTION BYTE 0 OPT7= WDG HALT Watchdog and HALT mode This option bit determines if a RESET is generated when entering HALT mode while the Watchdog is active. 0: No Reset generation when entering Halt mode 1: Reset generation when entering Halt mode OPT6= WDG SW Hardware or software watchdog This option bit selects the watchdog type. 0: Hardware (watchdog always enabled) 1: Software (watchdog to be enabled by software) OPT5 = CSS Clock security system on/off This option bit enables or disables the clock security system function (CSS) which includes the clock filter and the backup safe oscillator. 0: CSS enabled 1: CSS disabled Caution: The CSS function is not guaranteed. Refer to Section 15

OPT4:3= VD[1:0] Voltage detection These option bits enable the voltage detection block (LVD, and AVD) with a selected threshold for the LVD and AVD (EVD+AVD).
Selected Low Voltage Detector LVD and AVD Off Lowest Threshold: (VDD~3V) Med. Threshold (VDD~3.5V) Highest Threshold (VDD~4V) VD1 1 1 0 0

Caution: If the medium or low thresholds are selected, the detection may occur outside the specified operating voltage range. Below 3.8V, device operation is not guaranteed. For details on the AVD and LVD threshold levels refer to Section 12.3.2 on page 139 OPT2 = Reserved, must be kept at default value. OPT1= PKG0 Package selection bit 0 This option bit is used to select the package (see table in PKG1 option bit description).

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ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION (Contd) OPT0= FMP_R Flash memory read-out protection This option indicates if the user flash memory is protected against read-out piracy. This protection is based on read and a write protection of the memory in test modes and ICP mode. Erasing the option bytes when the FMP_R option is selected causes the whole user memory to be erased first, and the device can be reprogrammed. Refer to Section 4.3.1 and the ST7 Flash Programming Reference Manual for more details. Note: Readout protection is not supported if LVD is enabled. 0: Read-out protection enabled 1: Read-out protection disabled OPTION BYTE 1 OPT7= PKG1 Package selection bit 1 This option bit, with the PKG0 bit, selects the package.
Version (A)R J Selected Package TQFP64 TQFP44 PKG 1 PKG 0 1 0 0 0

OPT3:1 = OSCRANGE[2:0] Oscillator range When the resonator oscillator type is selected, these option bits select the resonator oscillator current source corresponding to the frequency range of the used resonator. Otherwise, these bits are used to select the normal operating frequency range.
OSCRANGE Typ. Freq. Range 2 LP MP MS HS 1~2MHz 2~4MHz 4~8MHz 8~16MHz 0 0 0 0 1 0 0 1 1 0 0 1 0 1

Note: On the chip, each I/O port has 8 pads. Pads that are not bonded to external pins are in input pull-up configuration after reset. The configuration of these pads must be kept at reset state to avoid added current consumption. OPT6 = RSTC RESET clock cycle selection This option bit selects the number of CPU cycles applied during the RESET phase and when exiting HALT mode. For resonator oscillators, it is advised to select 4096 due to the long crystal stabilization time. 0: Reset phase with 4096 CPU cycles 1: Reset phase with 256 CPU cycles OPT5:4 = OSCTYPE[1:0] Oscillator Type These option bits select the ST7 main clock source type.
OSCTYPE Clock Source 1 Resonator Oscillator Reserved Internal RC Oscillator External Source 0 0 1 1 0 0 1 0 1

OPT0 = PLLOFF PLL activation This option bit activates the PLL which allows multiplication by two of the main input clock frequency. The PLL must not be used with the internal RC oscillator. The PLL is guaranteed only with an input frequency between 2 and 4MHz. 0: PLL x2 enabled 1: PLL x2 disabled CAUTION: the PLL can be enabled only if the OSC RANGE (OPT3:1) bits are configured to MP - 2~4MHz. Otherwise, the device functionality is not guaranteed.

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ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION (Contd) 14.2 DEVICE ORDERING INFORMATION AND TRANSFER OF CUSTOMER CODE Customer code is made up of the ROM/FASTROM contents and the list of the selected options (if any). The ROM/FASTROM contents are to be sent on diskette, or by electronic means, with the S19 hexadecimal file generated by the development tool. All unused bytes must be set to FFh. The selected options are communicated to STMicroelectronics using the correctly completed OPTION LIST appended. Refer to application note AN1635 for information on the counter listing returned by ST after code has been transferred. The STMicroelectronics Sales Organization will be pleased to provide detailed information on contractual points.

Figure 110. ROM Factory Coded Device Types

DEVICE PACKAGE VERSION / XXX Code name (defined by STMicroelectronics) 1= 0 to +70 C 5= -10 to +85 C 6= -40 to +85 C C = -40 to +125 C T= Plastic Thin Quad Flat Pack ST72321AR9, ST72321AR7, ST72321AR6, ST72321J9, ST72321J7, ST72321R9, ST72321R7, ST72321R6

Table 27. Orderable Flash Device Types

Part Number ST72F321AR6TA ST72F321AR7TA ST72F321AR9TA ST72F321AR9TC ST72F321J7TA ST72F321J9TA ST72F321J9TC ST72F321R6TA ST72F321R7TA ST72F321R9TA ST72F321R9TC ST72F321AR6T6 ST72F321AR7T6 ST72F321AR9T6 ST72F321J7T6 ST72F321J9T6 ST72F321R6T6 ST72F321R7T6 ST72F321R9T6 TQFP64 14 x 14 Standard TQFP44 10 x 10 TQFP64 10 x 10 TQFP64 14 x 14 Automotive TQFP44 10 x 10 TQFP64 10 x 10 Version Package Flash Memory (Kbytes) 32 48 60 60 48 60 60 32 48 60 60 32 48 60 48 60 32 48 60 -40C +85C -40C +125C -40C +85C -40C +125C -40C +85C -40C +125C -40C +85C Temp. Range

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14.2.1 Version-Specific Sales Conditions To satisfy the different customer requirements and to ensure that ST Standard Microcontrollers will consistently meet or exceed the expectations of each Market Segment, the Codification System for Standard Microcontrollers clearly distinguishes

products intended for use in automotive environments, from products intended for use in non-automotive environments. It is the responsibility of the Customer to select the appropriate product for his application.

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ST72321 DEVICE CONFIGURATION AND ORDERING INFORMATION (Contd)

ST72321 MICROCONTROLLER OPTION LIST ................................ ................................ ................................ Contact: ................................ Phone No: ................................ Reference/ROM Code* : . . . . . . . . . . . . . . . . . . . . . . . *The ROM code name is assigned by STMicroelectronics. ROM code must be sent in .S19 format. .Hex extension cannot be processed. Customer: Address: Device Type/Memory Size/Package (check only one option):
--------------------------------ROM DEVICE: --------------------------------TQFP44 10x10: TQFP64 14x14: TQFP64 10x10: --------------------------------DIE FORM: --------------------------------64-pin: | | | | | | | | ------------------------------------60K ------------------------------------[ ] ST72321J9 [ ] ST72321R9 [ ] ST72321AR9 --------------------------------------60K --------------------------------------[] || | | | || | ------------------------------------48K ------------------------------------[ ] ST72321J7 [ ] ST72321R7 [ ] ST72321AR7 -------------------------------------48K -------------------------------------[] || | | | ----------------------------------32K -----------------------------------

[ ] ST72321R6 [ ] ST72321AR6 -----------------------------------32K || -----------------------------------| []

Conditioning (check only one option): ------------------------------------------------------------------------ | ----------------------------------------------------Die Product (dice tested at 25C only) Packaged Product | ---------------------------------------------------------------------------------------------------------------------------[ ] Tape & Reel [ ] Tray | [ ] Tape & Reel | [ ] Inked wafer | [ ] Sawn wafer on sticky foil Version/Temp. Range (do not check for die product). Please refer to datasheet for specific sales conditions:
-------------------Standard -------------------[] [] [] || | | | | | --------------------------------------------------------Automotive || Temp. Range --------------------------------------------------------| 0C to +70C | -10C to +85C [] | -40C to +85C [] | [ ] -40C to +105C [] | [ ] -40C to +125C

Special Marking: [ ] No [ ] Yes "_ _ _ _ _ _ _ _ _ _ " (10 char. max) Authorized characters are letters, digits, '.', '-', '/' and spaces only.

Clock Source Selection: [ ] Resonator:

PLL2 CSS4 LVD Reset

[ ] Internal RC1 [ ] External Clock

[ ] LP: Low power resonator (1 to 2 MHz) [ ] MP: Medium power resonator (2 to 4 MHz) [ ] MS: Medium speed resonator (4 to 8 MHz) [ ] HS: High speed resonator (8 to 16 MHz)
[ ] Disabled [ ] Disabled [ ] Enabled [ ] Enabled [ ] Med. threshold5 [ ] Low threshold5

[ ] Disabled

[ ] High threshold

Reset Delay Watchdog Selection: Halt when Watchdog on: Readout Protection3: Date Signature

[ ] 256 Cycles [ ] 4096 Cycles [ ] Software Activation [ ] Hardware Activation [ ] Reset [ ] No reset [ ] Disabled [ ] Enabled

1LVD must be enabled when internal RC is selected. 2PLL must not be enabled if internal RC or External Clock 3

................................ ................................
is selected.

4Not guaranteed 5Device operation

below 3.8V not guaranteed

Readout protection is not supported if LVD is enabled.

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DEVICE CONFIGURATION AND ORDERING INFORMATION (Contd) 14.3 DEVELOPMENT TOOLS STMicroelectronics offers a range of hardware and software development tools for the ST7 microcontroller family. Full details of tools available for the ST7 from third party manufacturers can be obtain from the STMicroelectronics Internet site: http//mcu.st.com. Tools from these manufacturers include C compliers, emulators and gang programmers. ST Emulators The emulator is delivered with everything (probes, TEB, adapters etc.) needed to start emulating the devices. To configure the emulator to emulate different ST7 subfamily devices, the active probe for the ST7 EMU3 can be changed and the ST7EMU3 probe is designed for easy interchange of TEBs (Target Emulation Board). See Table 28 for more details. 14.3.1 Socket and Emulator Adapter Information For information on the type of socket that is supplied with the emulator, refer to the suggested list of sockets in Table 29. Note: Before designing the board layout, it is recommended to check the overall dimensions of the socket as they may be greater than the dimensions of the device. For footprint and other mechanical information about these sockets and adapters, refer to the manufacturers datasheet (www.yamaichi.de for TQFP64 10 x 10 and www.cabgmbh.com for TQFP64 14 x 14,)

Table 28. STMicroelectronics Development Tools

Supported Products ST7 Evaluation Board ST7 Emulator Active Probe & T.E.B. ST7MDT20MTEB ST7 Programming Board ST7MDT20M-EPB/EU ST7MDT20M-EPB/US ST7MDT20M-EPB/UK ST7MDT20J-EPB/EU ST7MDT20J-TEB ST7MDT20J-EPB/US ST7MDT20J-EPB/UK

ST7MDT2-TRAIN/ EU ST7MDT2TRAIN/US ST72321(A)R, ST72F321(A)R ST7MDT2-TRAIN/ UK ST7MDT2-TRAIN/ EU ST7MDT2TRAIN/US ST7MDT2-TRAIN/ UK

ST7MDT20MEMU3

ST72321J, ST72F321J

ST7MDT20JEMU3

Note: 1. Flash Programming interface for FLASH devices. Table 29. Suggested List of Socket Types
Device TQFP64 14 x14 TQFP64 10 x10 TQFP44 10 X10 Socket (supplied with ST7MDT20MEMU3) CAB 3303262 YAMAICHI IC149-064-*75-*5 YAMAICHI IC149-044-*52-*5 Emulator Adapter (supplied with ST7MDT20M-EMU3) CAB 3303351 YAMAICHI ICP-064-6 YAMAICHI ICP-044-5

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14.4 ST7 APPLICATION NOTES

IDENTIFICATION DESCRIPTION EXAMPLE DRIVERS AN 969 SCI COMMUNICATION BETWEEN ST7 AND PC AN 970 SPI COMMUNICATION BETWEEN ST7 AND EEPROM AN 971 IC COMMUNICATING BETWEEN ST7 AND M24CXX EEPROM AN 972 ST7 SOFTWARE SPI MASTER COMMUNICATION AN 973 SCI SOFTWARE COMMUNICATION WITH A PC USING ST72251 16-BIT TIMER AN 974 REAL TIME CLOCK WITH ST7 TIMER OUTPUT COMPARE AN 976 DRIVING A BUZZER THROUGH ST7 TIMER PWM FUNCTION AN 979 DRIVING AN ANALOG KEYBOARD WITH THE ST7 ADC AN 980 ST7 KEYPAD DECODING TECHNIQUES, IMPLEMENTING WAKE-UP ON KEYSTROKE AN1017 USING THE ST7 UNIVERSAL SERIAL BUS MICROCONTROLLER AN1041 USING ST7 PWM SIGNAL TO GENERATE ANALOG OUTPUT (SINUSOID) AN1042 ST7 ROUTINE FOR IC SLAVE MODE MANAGEMENT AN1044 MULTIPLE INTERRUPT SOURCES MANAGEMENT FOR ST7 MCUS AN1045 ST7 S/W IMPLEMENTATION OF IC BUS MASTER AN1046 UART EMULATION SOFTWARE AN1047 MANAGING RECEPTION ERRORS WITH THE ST7 SCI PERIPHERALS AN1048 ST7 SOFTWARE LCD DRIVER AN1078 PWM DUTY CYCLE SWITCH IMPLEMENTING TRUE 0% & 100% DUTY CYCLE AN1082 DESCRIPTION OF THE ST72141 MOTOR CONTROL PERIPHERAL REGISTERS AN1083 ST72141 BLDC MOTOR CONTROL SOFTWARE AND FLOWCHART EXAMPLE AN1105 ST7 PCAN PERIPHERAL DRIVER AN1129 PERMANENT MAGNET DC MOTOR DRIVE. AN INTRODUCTION TO SENSORLESS BRUSHLESS DC MOTOR DRIVE APPLICATIONS AN1130 WITH THE ST72141 AN1148 USING THE ST7263 FOR DESIGNING A USB MOUSE AN1149 HANDLING SUSPEND MODE ON A USB MOUSE AN1180 USING THE ST7263 KIT TO IMPLEMENT A USB GAME PAD AN1276 BLDC MOTOR START ROUTINE FOR THE ST72141 MICROCONTROLLER AN1321 USING THE ST72141 MOTOR CONTROL MCU IN SENSOR MODE AN1325 USING THE ST7 USB LOW-SPEED FIRMWARE V4.X AN1445 USING THE ST7 SPI TO EMULATE A 16-BIT SLAVE AN1475 DEVELOPING AN ST7265X MASS STORAGE APPLICATION AN1504 STARTING A PWM SIGNAL DIRECTLY AT HIGH LEVEL USING THE ST7 16-BIT TIMER PRODUCT EVALUATION AN 910 PERFORMANCE BENCHMARKING AN 990 ST7 BENEFITS VERSUS INDUSTRY STANDARD AN1077 OVERVIEW OF ENHANCED CAN CONTROLLERS FOR ST7 AND ST9 MCUS AN1086 U435 CAN-DO SOLUTIONS FOR CAR MULTIPLEXING AN1150 BENCHMARK ST72 VS PC16 AN1151 PERFORMANCE COMPARISON BETWEEN ST72254 & PC16F876 AN1278 LIN (LOCAL INTERCONNECT NETWORK) SOLUTIONS PRODUCT MIGRATION AN1131 MIGRATING APPLICATIONS FROM ST72511/311/214/124 TO ST72521/321/324 AN1322 MIGRATING AN APPLICATION FROM ST7263 REV.B TO ST7263B AN1365 GUIDELINES FOR MIGRATING ST72C254 APPLICATION TO ST72F264 PRODUCT OPTIMIZATION

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IDENTIFICATION AN 982 AN1014 AN1015 AN1040 AN1070 AN1324 AN1477 AN1502 AN1529

DESCRIPTION USING ST7 WITH CERAMIC RESONATOR HOW TO MINIMIZE THE ST7 POWER CONSUMPTION SOFTWARE TECHNIQUES FOR IMPROVING MICROCONTROLLER EMC PERFORMANCE MONITORING THE VBUS SIGNAL FOR USB SELF-POWERED DEVICES ST7 CHECKSUM SELF-CHECKING CAPABILITY CALIBRATING THE RC OSCILLATOR OF THE ST7FLITE0 MCU USING THE MAINS EMULATED DATA EEPROM WITH XFLASH MEMORY EMULATED DATA EEPROM WITH ST7 HDFLASH MEMORY EXTENDING THE CURRENT & VOLTAGE CAPABILITY ON THE ST7265 VDDF SUPPLY ACCURATE TIMEBASE FOR LOW-COST ST7 APPLICATIONS WITH INTERNAL RC OSCILAN1530 LATOR PROGRAMMING AND TOOLS AN 978 KEY FEATURES OF THE STVD7 ST7 VISUAL DEBUG PACKAGE AN 983 KEY FEATURES OF THE COSMIC ST7 C-COMPILER PACKAGE AN 985 EXECUTING CODE IN ST7 RAM AN 986 USING THE INDIRECT ADDRESSING MODE WITH ST7 AN 987 ST7 SERIAL TEST CONTROLLER PROGRAMMING AN 988 STARTING WITH ST7 ASSEMBLY TOOL CHAIN AN 989 GETTING STARTED WITH THE ST7 HIWARE C TOOLCHAIN AN1039 ST7 MATH UTILITY ROUTINES AN1064 WRITING OPTIMIZED HIWARE C LANGUAGE FOR ST7 AN1071 HALF DUPLEX USB-TO-SERIAL BRIDGE USING THE ST72611 USB MICROCONTROLLER AN1106 TRANSLATING ASSEMBLY CODE FROM HC05 TO ST7 PROGRAMMING ST7 FLASH MICROCONTROLLERS IN REMOTE ISP MODE (IN-SITU PROAN1179 GRAMMING) AN1446 USING THE ST72521 EMULATOR TO DEBUG A ST72324 TARGET APPLICATION AN1478 PORTING AN ST7 PANTA PROJECT TO CODEWARRIOR IDE AN1527 DEVELOPING A USB SMARTCARD READER WITH ST7SCR AN1575 ON-BOARD PROGRAMMING METHODS FOR XFLASH AND HDFLASH ST7 MCUS

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15 IMPORTANT NOTES
15.1 Silicon Identification This section refers to ST72F321/ST72321 devices shown in Table 30 and Table 31. They are identifiable both by the last letter of the Trace code marked on the device package and by the last 3 digits of the Internal Sales Type printed on the box label. Table 30. Flash Device Identification
Part Number ST72F321 xxxx ST72F321 xxxx Trace Code marked on device xxxxxxxxxQ (current revision) xxxxxxxxxS Internal Sales Type on box label 72F321xxxx$A2 72F321xxxx$U2 72F321xxxx$U8

15.2 ALL FLASH AND ROM DEVICES 15.2.1 External RC option The External RC clock source option described in previous datasheet revisions is no longer supported and has been removed from this specification. 15.2.2 CSS Function The Clock Security System function is not guaranteed. The features described in Section 6.4.3 are subject to revision. 15.2.3 Safe Connection of OSC1/OSC2 Pins The OSC1 and/or OSC2 pins must not be left unconnected otherwise the ST7 main oscillator may start and, in this configuration, could generate an fOSC clock frequency in excess of the allowed maximum (>16MHz.), putting the ST7 in an unsafe/undefined state. Refer to Section 6.2 on page 24. 15.2.4 Unexpected Reset Fetch If an interrupt request occurs while a "POP CC" instruction is executed, the interrupt controller does not recognise the source of the interrupt and, by default, passes the RESET vector address to the CPU. Workaround To solve this issue, a "POP CC" instruction must always be preceded by a "SIM" instruction. 15.2.5 Internal RC Oscillator with LVD The internal RC can only be used if LVD is enabled. 15.2.6 Read-out protection with LVD The LVD is not supported if the read-out protection is enabled. 15.2.7 16-bit Timer PWM Mode In PWM mode, the first PWM pulse is missed after writing the value FFFCh in the OC1R register (OC1HR, OC1LR). It leads to either full or no PWM during a period, depending on the OLVL1 and OLVL2 settings.

Table 31. ROM Device Identification

Part Number ST72321x xxx ST72321x xxx Trace Code marked on device xxxxxxxxxX (current revision) xxxxxxxxxY Internal Sales Type on box label 72321xxxx/xxx$U4 72321xxxx/xxx$U3

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15.3 FLASH REV S and ALL ROM DEVICES 15.3.1 External clock source with PLL External clock source is not supported with the PLL enabled. 15.3.2 LVD Startup behaviour When the LVD is enabled, the MCU reaches its authorized operating voltage from a reset state. However, in some devices, the reset state is released when VDD is approximately between 0.8V and 1.5V. As a consequence, the I/Os may toggle when VDD is within this window. This may be an issue especially for applications where the MCU drives power components. Because Flash write access is impossible within this window, the Flash memory contents will not be corrupted.

Figure 111. LVD Startup Behaviour

5V LVD RESET VIT+

VD

1.5V 0.8V

Window

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15.4 FLASH REV S and ROM Rev Y DEVICES ONLY 15.4.1 I/O Port D Configuration When using an external quartz crystal or ceramic resonator, the fOSC2 clock may be disturbed because the device goes into reserved mode controlled by Port D. This happens with either one of the following configurations: PD[3:1]=010 while CSS and PLL options are both disabled and PD4 is toggling PD[4:1]=1010 while CSS or PLL options are enabled This is detailed in the following table: CSS PLL PD[3:1] PD4 Toggling Clock Disturbance Max. 2 clock cycles lost at each rising or falling edge of PD4 Max. 1 clock cycle lost out of every 16

15.5 ALL ROM DEVICES 15.5.1 LVD Operation Depending on the operating conditions, especially the VDD ramp up speed and ambient temperature, in some cases the LVD may not start. When this occurs, the MCU may operate outside the guaranteed functional area (see datasheet Figure 76) without being forced into reset state. In this case, proper use of the watchdog may make it possible to recover through a watchdog reset and allow normal operations to resume. Consequently, the LVD function is not guaranteed in the current silicon revision. For complete security, an external reset circuit must be added. 15.5.2 AVD not supported On some devices with a specific VDD ramp up speed the AVD may not start. As a result it cannot generate interrupts when VDD rises and falls. 15.5.3 Internal RC oscillator operation Internal RC oscillator operation is not supported in ROM devices.

OFF OFF x ON ON x

010

010

As a consequence, for cycle-accurate operations, these configurations are prohibited in either input or output mode. Workaround: To avoid this occurring, it is recommended to connect one of these pins to GND (PD2 or PD4) or VDD (PD1 or PD3).

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Table 32. Product Evolution Summary Silicon Rev. FLASH Devices ROM Devices Previous Current Previous Current Rev S RevQ Rev Y Rev X
G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G

Section

Limitation

15.2.1 15.2.2 15.2.3 15.2.4 15.2.5 15.2.6 15.2.7 15.3.1 15.3.2 15.4.1 15.5.1 15.5.2 15.5.3

EXTERNAL RC OPTION CSS FUNCTION SAFE CONNECTION OF OSC1/OSC2 PINS UNEXPECTED RESET FETCH INTERNAL RC OSCILLATOR WITH LVD READ-OUT PROTECTION WITH LVD 16-BIT TIMER PWM MODE EXTERNAL CLOCK WITH PLL LVD STARTUP BEHAVIOUR I/O PORT D CONFIGURATION LVD OPERATION AVD NOT SUPPORTED INTERNAL RC OSCILLATOR OPERATION G;

H H H

H H H H H H

H
G G G

Legend: Limitation present =

Limitation not present = H.

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16 SUMMARY OF CHANGES
Revision Main Changes Added note to Read-out Protection on page 17 LVD not supported if ROP is enabled Added note to MULTI-OSCILLATOR (MO) on page 24 External clock source not supported if PLL is enabled 1.7 Modified ACTIVE-HALT AND HALT MODES on page 43: wakeup from active halt by reset or MCC/RTC interrupt only Reset pin IINJMAX for changed to 2 mA in Section 12.9.1 and Section 12.2 Updated ordering information Section 18.2 on page 230 Added IMPORTANT NOTES on page 180 1.8 Added Errata sheet Added 44-pin package throughout document (merged ST72321AR/R with ST72321J datasheet ) Removed External RC option from Section 6.2 on page 24 and throughout document Added Caution CSS function is not guaranteed to Section 6.4 on page 27 and Section 14.1 on page 172 Modified description of internal RC oscillator in Section 6.2. Added Caution about disconnecting OSC pins in Section 6.2 on page 24 Moved LVD startup behaviour diagram from Section 12.3.2 on page 139 to Section 15 Modified notes in table of Murata resonators in Section 12.5.3 1.9 Modified description of VAREF/VSSA pins in Section 12.12.1 on page 166 Added phrase can be reprogrammed in Section 4.3.1 on page 17 and Section 14.1 on August 03 July 03 Mar 03 Date

page 172
Added heading Related Documentation on page 19 Modified description of TLI (maskable instead of non maskable) in Section 7 Updated EMC CHARACTERISTICS on page 152 Added FASTROM information to Section 14 on page 172 Added note under VD option bit table in Section 14.1 on page 172 Updated option list in Section 14.2 Removed Errata sheet and put information in IMPORTANT NOTES on page 180 Please read carefully the IMPORTANT NOTES on page 180

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Notes:

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without the express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics

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