Alexey Cherkasov’s Post

Stellantis and Infineon Technologies will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all. To support this, the companies have signed major supply and capacity agreements that will serve as the foundation for the planned collaboration to develop the next generation of power architecture, including: - Infineon’s PROFET™ smart power switches, which will replace traditional fuses, reduce wiring and enable Stellantis to become one of the first automakers to implement intelligent power network management. - #SiC #semiconductors, which will support Stellantis in its efforts to standardize its power modules, improve the performance and efficiency of EVs while also reducing costs. - AURIX™ microcontrollers, which target the first generation of the STLA Brain zonal architecture.

The collaboration aims to significantly enhance cost, energy efficiency, driver experience and vehicle range.  www.infineon.com Stellantis and Infineon announced they will work jointly on the power architecture for Stellantis’ electric vehicles to support Stellantis’ ambition of offering clean, safe and affordable mobility to all. To support this, the companies have signed major supply and capacity agreements that will serve as the foundation for the planned collaboration to develop the next generation of power architecture, including: Infineon’s PROFET™ smart power switches, which will replace traditional fuses, reduce wiring and enable Stellantis to become one of the first automakers to implement intelligent power network management. Silicon carbide (SiC) semiconductors, which will support Stellantis in its efforts to standardize its power modules, improve the performance and efficiency of EVs while also reducing costs. AURIXTM microcontrollers, which target the first ge

🗞 Electronic News! 🗞 ROHM and TSMC have entered a strategic partnership on development and volume production of gallium nitride power devices for electric vehicle applications. The partnership will integrate ROHM’s device development technology with TSMC’s industry-leading GaN-on-silicon process technology to meet the growing demand for superior high-voltage and high-frequency properties over silicon for power devices. GaN power devices are currently used in consumer and industrial applications such as AC adapters and server power supplies. TSMC, a leader in sustainability and green manufacturing, supports GaN technology for its potential environmental benefits in automotive applications, such as on-board chargers and inverters for electric vehicles . #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

Infineon Technologies and Marelli are #collaborating to drive #innovation in Zone Control Units using Infineon's #AURIX #TC4x_MCU family. This partnership aims to enhance #automotive safety, performance, and #efficiency, enabling advanced control systems for #next_generation_vehicles. #powerelectronics #powermanagement #powersemiconductor

Stellantis and Infineon are also in the process of extending their cooperation with the implementation of a Joint Power Lab to define the next-generation scalable and intelligent power architecture enabling Stellantis’ software-defined vehicle.

𝐓𝐡𝐞 #𝐆𝐚𝐭𝐞 #𝐃𝐫𝐢𝐯𝐞𝐫 #𝐈𝐂 #𝐌𝐚𝐫𝐤𝐞𝐭 𝐬𝐢𝐳𝐞 𝐰𝐚𝐬 𝐯𝐚𝐥𝐮𝐞𝐝 𝐚𝐭 𝐔𝐒𝐃 𝟏.𝟒𝟖 𝐁𝐢𝐥𝐥𝐢𝐨𝐧 𝐢𝐧 𝟐𝟎𝟐𝟑 𝐚𝐧𝐝 𝐭𝐡𝐞 𝐭𝐨𝐭𝐚𝐥 𝐆𝐚𝐭𝐞 𝐃𝐫𝐢𝐯𝐞𝐫 𝐈𝐂 𝐌𝐚𝐫𝐤𝐞𝐭 𝐫𝐞𝐯𝐞𝐧𝐮𝐞 𝐢𝐬 𝐞𝐱𝐩𝐞𝐜𝐭𝐞𝐝 𝐭𝐨 𝐠𝐫𝐨𝐰 𝐚𝐭 𝐚 𝐂𝐀𝐆𝐑 𝐨𝐟 𝟓.𝟐𝟓% 𝐟𝐫𝐨𝐦 𝟐𝟎𝟐𝟒 𝐭𝐨 𝟐𝟎𝟑𝟎, 𝐫𝐞𝐚𝐜𝐡𝐢𝐧𝐠 𝐧𝐞𝐚𝐫𝐥𝐲 𝐔𝐒𝐃 𝟐.𝟏𝟐 𝐁𝐢𝐥𝐥𝐢𝐨𝐧. 𝐂𝐥𝐢𝐜𝐤 𝐡𝐞𝐫𝐞 𝐟𝐨𝐫 𝐚 𝐦𝐨𝐫𝐞 𝐝𝐞𝐭𝐚𝐢𝐥𝐞𝐝 𝐞𝐱𝐩𝐥𝐚𝐧𝐚𝐭𝐢𝐨𝐧:  https://lnkd.in/e3QV7hBf The Gate Driver IC Market is experiencing robust #growth, driven by the #increasing demand for efficient power management in various applications, including automotive, #industrial, and consumer electronics. These integrated circuits play a crucial role in enhancing the performance of power semiconductor devices, enabling faster switching speeds and #improving overall system efficiency. Moreover, the shift towards #renewable energy sources and electric vehicles is further propelling the market, as gate driver ICs are essential for controlling power in inverters and converters. As #technology advances, the focus on miniaturization and integration continues to drive innovations in gate driver designs, ensuring #higher performance in compact packages. 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬: 1. Infineon Technologies AG Erlangen 2. Mitsubishi Electric 3. NXP Semiconductors 4. ON SEMICONDUCTORS 5. Roehm #GateDriverIC #PowerManagement #Semiconductor #ElectricVehicles #RenewableEnergy #Efficiency #PowerElectronics #IndustrialAutomation #ConsumerElectronics #Innovation

MSS's article was just published in EE Times! We unveil our materials analysis of Samsung's 3nm GAAFET technology! In this article, we explore how gate-all-around (GAA) technology addresses critical industry challenges, reducing leakage while optimizing performance for next-generation semiconductors. This breakthrough represents a major leap forward, paving the way for high-performance semiconductor innovations. Check out the full article on EE Times to learn more about it! https://lnkd.in/eW4yqHXH

Following the news on the first 300mm #GaN wafer, and the launch of the fab for 200mm #SiC in Malaysia, Infineon revealed a few days ago another #semiconductor manufacturing technological breakthrough with an eye toward #silicon. The press release claims that Infineon is the first to master handling and processing ultrathin 20-micrometer, 300-millimeter size wafers for power semiconductors. Richard Kunčič, Senior Vice President & General Manager Power & Sensor Systems Division of Infineon Technologies, said in an interview with Power Electronics News how ultra-thin wafers open new possibilities for #efficiency and compactness in power delivery systems, especially in #artificialintelligence #datacenters, consumer electronics, motor control, and #computing applications.

Infineon Technologies has announced two new generations of #highvoltage (HV) and #mediumvoltage (MV) CoolGaN #devices. These advancements now enable customers to utilize #GalliumNitride (GaN) in voltage classes ranging from 40 V to 700 V across a broader spectrum of applications, contributing to digitalization and decarbonization. Let’s delve into the details: #electronicsnews #technologynews

Dive into the crucial role of #IC_packaging and testing in driving the #semiconductor revolution! This article explores how advancements in these areas are enabling higher performance, efficiency, and #reliability in #electronic_devices. Discover the foundations that support this ever-evolving industry and their impact on future #innovations. #powerelectronics #powermanagement #powersemiconductor