Jim Elliott

https://lnkd.in/gGR5Q6dW DRAM industry Q2 sales surged 24.8% to $22.9 billion! According to TrendForce, DRAM industry revenue increased significantly to US$22.9 billion in the second quarter of 2024, a month-on-month increase of 24.8%. This surge was mainly due to the expansion of mainstream product shipments, which drove revenue growth for most manufacturers. Contract prices in the second quarter continued to rise, and due to geopolitical factors, the increase in traditional DRAM contract prices in the third quarter is expected to exceed previous forecasts. Major manufacturers Samsung, SK Hynix and Micron all saw an increase in shipments in the second quarter compared to the previous quarter. Average selling prices also continued the upward trend in the first quarter. Driving factors included the earthquake in Taiwan in early April and high demand for high-bandwidth memory (HBM) products, which prompted DRAM buyers to adopt a more aggressive purchasing strategy. As a result, contract prices in the second quarter ultimately increased by 13% to 18%. #realized #China #Oem , #ODM , #OBM #TechbicalSales #IPSales #OwnalltheChipsknowledge #Builddeeplytruthasmyrespondsibility #Microchip #SSD #HDD #DRAM #DDR #Serverparts #HPC #Servercpu #Truth #OneStopShopping #OEM. #OWNTear1Chipsresource #Outstanding #monthlyorder #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation ]#personaldevelopment #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #ssd #dram #ddr

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Here offer Micron N48R：QLC HBM MT29F1T08GBLCEN48R3WC1-R Q’ty：300K samsung V5 256Gb. 6k EP3C16F484C6N EP3C5F256C8N  M393A4K40EB3-CWE server 1. H5WRAGESM8W-N8L Qty:8,000/pcs USD650/pcs D/C:Within 2 years L/T:10Weeks HK EXW 2. KHAA84901B-JC17 Qty:10,000pcs USD480/pcs D/C:21+ L/T:12-16Weeks HK EXW The HBM4 war begins! Memory chip stacking is difficult to solve, Hybrid Bonding is the key to breakthrough SK Hynix, a major Korean memory manufacturer, participated in COMPUTEX 2024 for the first time, displaying the latest HBM3E memory and MR-MUF technology (Mass Re-flow Molded Underfill), and revealed that Hybrid bonding will become a very important part of the chip stack. MR-MUF is a process in which semiconductor wafers are attached to circuits and "EMC" (liquid epoxy molding compound) is used to fill the gaps between wafers or between wafers and bumps when stacking the wafers. At present, MR-MUF technology can make chips closer together, improve heat dissipation performance by 10%, improve energy efficiency by 10%, product capacity reaches 36GB, and can be stacked 12 layers.As for competitors such as Samsung and Micron, which use TC-NCF technology (thermal compression with non-conductive film, non-conductive film thermal compression), it is necessary to convert the material into a solid through high temperature and high pressure, then melt it, and then clean it. The total process More than 2-3 steps, MR-MUF can be completed in one go and no further cleaning is required. Compared with NCF, MR-MUF has about twice the thermal conductivity, which has a great impact on process speed and yield. As the number of stacked layers increases, the HBM package thickness is limited to 775 microns (μm). Therefore, memory manufacturers must think about how to stack more layers within a certain height. This is also a big challenge for current packaging technology, and hybrid bonding (Hybrid bonding) is likely to be one of the solutions.stack more than 20 layers (ie no more than 775 microns) through Hybrid bonding technology. According to Korean media reports, HBM4E will be a 16-20-layer product and is expected to debut in 2028. SK Hynix will use 10-nanometer sixth-generation (1c) DRAM in HBM4E for the first time, and the memory capacity is expected to be significantly increased. (Source of the first picture: Science and Technology News).#china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle]\\

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Transphorm GaN technology offers the most flexibility in power electronics. This is the result its ease of design, which is one of the cornerstones of our technology. Our SuperGaN FETs compete directly against silicon, silicon carbide, and e-mode GaN whether it’s how the device is driven or the package(s) it’s offered in. Up and above SuperGaN’s flexibility we also enable our SIP (System-In-Package) partners such as Weltrend with GaN FET solutions that compliment our discrete offerings. This results in a solution for all customers no matter their architecture or system needs. #supergan #gan #transphorm #reliability #Weltrend

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#Memory Production Utilization Near Full Capacity, Surpassing Mature Nodes Foundries 💡 As memory prices and demand rise, memory manufacturers Nanya Technology and Winbond have resumed normal production, no longer reducing output as they did last year. TrendForce Corporation and industry sources cited in a report from Liberty Times Net also indicate that memory shipments will continue to recover in the third quarter. Reportedly, memory manufacturers’ utilization rates have reached 90% to 100%, surpassing the 60% to 70% utilization rates of mature process foundries. Last year, in response to market conditions, #Winbond adjusted its inventory and reduced production at its Taichung plant by up to 30-40%. This year, as market demand has rebounded, production has resumed, with capacity now at full utilization, producing 58,000 #wafers per month. Moreover, Winbond’s #Kaohsiung plant has introduced new capacity equipment, increasing monthly production from 10,000 to 14,000 wafers and upgrading processes from 25nm to 20nm. #Nanya Technology adjusted production levels dynamically last year, reducing output by up to 20%. However, production has gradually increased this year. Thanks again to TrendForce 集邦科技 for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eKPUUCis #semiconductorindustry #semiconductors #dram #datacenter #pc #it #ai #smartphone #notebook #mobile #taiwan #industrial #technology #tech

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AI Demand Surges: SK Hynix Accelerates HBM Technology Roadmap Deployment With the surge in artificial intelligence, HBM (High Bandwidth Memory) has shown strong momentum. Reportedly, SK Hynix is accelerating the deployment of its HBM development roadmap.  In the rapidly evolving global semiconductor industry, SK Hynix, with its keen market insight and excellent technological innovation capabilities, is accelerating the promotion of its HBM development roadmap. This strategic move not only demonstrates SK Hynix's precise grasp of future technological trends but also reflects the profound impact of the surge in AI demand on the semiconductor industry, especially in the field of high-performance computing. With the rapid development and widespread application of AI technology, from autonomous driving and intelligent healthcare to smart cities, various fields are calling for higher-performance computing capabilities. The complexity of AI models and the explosive growth of data volumes present unprecedented challenges for storage and processing speeds. In this context, HBM, as a high-performance, high-bandwidth memory solution, is gradually becoming a core component in key application areas such as AI servers and data centers. Facing the strong demand of the AI era, SK Hynix has decisively adjusted its strategic direction, making HBM one of its key development priorities. The company has not only increased its R&D investment in the HBM field but also plans to invest heavily in expanding its production capacity in the coming years. According to the latest news, SK Group plans to invest over $70 billion in its semiconductor business by 2028, with most of the funds allocated to the production of high-end memory chips such as HBM. #SK HYNIX #HBM

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In the latest Exec Talk, Finbarr Moynihan, GM & VP, Corporate Marketing, shares MediaTek's POV on the tech trends to watch. MediaTek sees major growth opportunities for Edge AI, the expansion to new form factors for consumer devices, and leveraging ASIC for cloud and datacenter applications. Learn why these are the trends to look out for to live, work, and play smarter. Watch here: https://bit.ly/3KlylWO Explore more Exec Talks here: https://bit.ly/3SZe6Ux #MediaTek #ExecTalk #EdgeAI #ASIC

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Intel's team partnered with both our partners Presidio & Denvr Dataworks with a goal to determine how well Intel's Gaudi 2 technology optimizes an Inference-as-a-Service use case—an essential application for businesses looking to enhance their LLMs, especially for AI-driven tasks like RAG pipeline creation. they focused on the demanding Large Mistral 2 model. Presidio's benchmarks were shared in the instructions blog post linked below, the results were detailed providing throughput (tokens/second), tokens per second per card, throughput per card, and time to first token at different concurrency levels. GARRETT DUGGER Juan Ignacio Demaestri #Intel #IAmIntel

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SK hynix reports record Q1 with soaring demand for #HBM #chips #SKhynix saw first 2024 quarter revenues soar 144 percent as demand for high-bandwidth memory (HBM) chips rocketed. The #DRAM and #NAND manufacturer reported ₩12.43 trillion ($9.03 billion) in revenues with a ₩1.92 trillion ($1.4 billion) profit compared to last year’s ₩2.6 trillion ($1.9 billion) loss. This was a record first quarter revenue amount. DRAM accounted for 61 percent of its revenue and NAND 35 percent, with the remainder coming from other activities. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ejUBVCMT #semiconductorindustry #semiconductors #semiconductor #technology #ai #tech #ai #artificialintelligence #semiconductormanufacturing #chips

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#Samsung, #SKHynix and #Micron Ramp Up #HBM Production, Reportedly Doubling Output Next Year 🤩 According to a report from Commercial Times, SK hynix, Samsung Electronics, and Micron Technology, the world’s top three #memory #manufacturers, are actively investing in high-bandwidth memory (#HBM) capacity expansion plans. Industry sources cited by the same report estimate that by 2025, the additional production will reach approximately 276,000 units, bringing the total capacity to 540,000 units, an annual increase of 105%. Regarding the latest developments in #HBM, TrendForce Corporation indicates that HBM3e will become the market mainstream this year, with shipments concentrated in the second half of the year. Currently, SK Hynix remains the primary supplier for HBM, along with Micron, both utilizing 1beta nm processes and already shipping to NVIDIA. Samsung, using a 1alpha nm process, is expected to complete qualification in the second quarter and begin deliveries mid-year. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eFJXY9xR #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #chip #chips #ic #southkorea #usa #geopolitics #ai

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IDC: #Memory Makers Drive #Semiconductor Market Growth in Q1 2024 as #AI Demand Soars Latest research from #IDC, titled Worldwide #Semiconductor Integrated Device #Manufacturing Market: Top 10 Vendor Ranking and Insight, 1Q24, reveals significant trends in the #semiconductorindustry during the first quarter of 2024. The report highlights the normalization of memory applications and inventory levels, driven by a stabilizing device market and the demand for AI training and inference in #datacenters. This recovery follows the fading of the #COVID19 #pandemic. This normalization propelled the development of the integrated device manufacturing (IDM) market in the first quarter of 2024 (1Q24), where high-bandwidth #memory (#HBM) played a pivotal role. The growing demand of #HBM, priced four to five times higher than traditional memory, squeezed the capacity of #DRAM in the device market and pushed up its price, significantly boosting the overall memory market revenue. Meanwhile, newly released AI #PCs and AI #smartphones required more memory content than traditional devices, which also drove the development of the memory market. Three of the top five IDM vendors for this quarter were memory-related, capturing nearly half of the top 10 vendors' revenue. The top 10 vendors were Samsung Electronics, Intel Corporation, SK hynix, Micron Technology, Infineon Technologies, Texas Instruments, STMicroelectronics, NXP Semiconductors, Sony, and Murata. With the rising demand for #AI in #datacenters and the device market, memory is projected to remain an important driver for the development of the #IDM in the second half of 2024 (2H24). Thanks again to IDC for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/e_KSuEst #semiconductorindustry #semiconductors #semiconductor #technology #tech #informationtechnology #aiot #foundry #usa #geopolitics #china #Japan #southkorea #europe #germany #singapore #malaysia #asml ot

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Intel flagship processor for next gen is here …

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We are pleased to introduce TSMC 3DFabric™, our comprehensive family of 3D Silicon Stacking and Advanced Packaging Technologies. 3DFabric complements our advanced semiconductor technologies to unleash our customer's innovations. Packaging technologies were once considered just backend processes, almost an inconvenience. Times have changed. Computing workloads have evolved more over the past decade than perhaps the previous four decades. Cloud computing, big data analytics, artificial intelligence (AI), neural network training, AI inferencing, mobile computing on advanced smartphones and even self-driving cars are all pushing the computing envelope. #business #india #china #europe #buy #globalbusiness #headhunter #usa #automotive #automotiveindustry #leadership #motivation #kindness #bestadvice #personaldevelopment #linkedin #hiring #careers #help #employment #happiness #jobs #health #global #world #jobchange #process #plasma #Knlowledgestudy #buyer #globalbusiness #Technology #recycle

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#HBM4 set to land sooner than expected 💡 Suppliers and JEDEC are bringing their HBM4 plans forward as they suspect the forecasted Gen #AI boom means incoming NVIDIA GPUs will need it sooner. High bandwidth memory (#HBM) bypasses #X86 socket-connected #DRAM capacity and bandwidth limits by having #memory dies stacked on top of a logic layer, with interconnecting TSV channels, all linked to a #GPU via an interposer component providing higher bandwidth than X86 sockets. The Joint Electron Device Engineering Council (JEDEC) confirms and issues HBM standards, with the current one being its fifth, HBM3E (extended). JEDEC has said it will issue a completed HBM4 spec by the end of this year – just few months ago the schedule was for a 2025 delivery. Preliminary HBM4 characteristics are emerging already. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eZp_wyHB #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #semiconductormanufacturing #it #chip #chips #ic #it

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The Death of #LCDs, Means New Life for #Chips Major moves in recent weeks show that LCD's days are numbered. But it's great timing for semiconductor makers - Opinion by Tim Culpan (高燦鳴) 🤩 Around 20 years ago Tim Culpan (高燦鳴) was in a media briefing with a senior executive of Au Optronics Inc, then #Taiwan's largest flat-panel maker. #LCD #displays were hot and the days of bulky cathode-ray tube #TVs were numbered. In that meeting an astute journalist (not me!) asked the AUO boss a snarky albeit fair question: What happens when everyone’s already bought themselves a flat-screen #TV, won’t the market tank? Don’t worry, the executive replied, LCD resolution will continue to advance and these TVs will only last about eight to ten years anyway. Consumers will keep buying. He was wrong. It’s only a matter of time before LCD disappears, and three developments this past month have convinced me the end is nigh: INNOLUX群創光電 sold a 5.5G LCD fab in Southern Taiwan to TSMC.  AUO is set to sell two facilities, in #Taichung and #Tainan, to #Micron. Apple dumped #LCD for all future #iPhones, according to a Nikkei report this week. A very big thank you to Tim Culpan (高燦鳴) for his new platform "Tim Culpan’s Position" where you can find the full article and opinion with more background and insights via the link below 💡🙏👇 https://lnkd.in/eEWP6iCa #semiconuctorindustry #semiconductors #chips #ic #technology #tech #innovation #consumerelectronics #geopolitics #foundry #memory #it

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Design-optimized, cost-competitive, "flat" single board designs make sense to consider as you scale above a few thousand boards. Watch this informative video of the approach we take at Ezurio!

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#AI accelerators have been a hot area for some years, but the field is accelerating the move of server segment away from x86 architecture MediaTek Plans To Introduce Its Own AI Server Chips, Featuring ARM Architecture & TSMC 3nm Process https://lnkd.in/gJJw_z8n MediaTek getting on the Bandwagon now

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PCIe Gen6 + 5nm + MRVL SerDes = Lowest Power for AI!!

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