James Hermanowski

#HBM5 20hi Stack to Adopt Hybrid Bonding Technology, Potentially Transforming Business Models, Says TrendForce Corporation TrendForce Corporation reports that the focus on #HBM products in the #DRAM industry is increasingly turning attention toward advanced packaging technologies like #hybridbonding. Major HBM manufacturers are considering whether to adopt hybrid bonding for HBM4 16hi stack products but have confirmed plans to implement this #technology in the HBM5 20hi stack generation. Hybrid bonding offers several advantages when compared to the more widely used micro-bumping. Since it does not require bumps, it allows for more stacked layers and can accommodate thicker #chips that help address #warpage. Hybrid-bonded chips also benefit from faster #data transmission and improved heat dissipation. TrendForce indicates that the three major #manufacturers will continue to use Advanced MR-MUF and TC-NCF stacking architectures for the #HBM3e 12hi stack and #HBM4 12hi stack. Meanwhile, a clear preference for the HBM4 16hi stack and HBM4e 16hi stack has yet to emerge between hybrid bonding and micro-bumping as hybrid bonding currently lacks significant advantages over micro-bumping. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/dJHZfsd9 #semiconductorindustry #semiconductors #semiconductor #tech #it #chip #chips #ai #datacenter #computing #computer #foundry #dram #memory #hpc #couldcomputing #usa #korea #taiwan #japan #it NVIDIA Samsung Semiconductor SK hynix Micron Technology TSMC

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The Micron 6550 ION has just taken the lead in density, performance, AND efficiency for 60TB SSDs, addressing key challenges for AI-driven data centers. This groundbreaking innovation offers unparalleled high-density performance with up to 12.0 GB/s sequential reads and 5.0 GB/s sequential writes, all while consuming up to 20% less power compared to competition. It's been a pleasure collaborating with leaders across Micron and the industry to bring this revolutionary product to the world. The 6550 ION is set to transform AI workloads, high-performance computing, big data, and analytics environments. Learn more about this game-changing SSD at the link below! hashtag#Innovation hashtag#DataCenter hashtag#SSD hashtag#Micron hashtag#TechNews

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Low-Temperature Microprobe station Welcome to the forefront of precision testing and characterization with the SATs Micro-Probe Station. Engineered to excel in semiconductor research, materials science, and beyond, this innovative system integrates cutting-edge technology with robust design features to meet the diverse needs of modern laboratories. Key Specifications Temperature Versatility Operates flanklessly across a wide temperature range, Stage Temperature: From -40°C to 120°C without the need for liquid nitrogen (LN), or ambient (Room Temperature, RT) to 350°C for high-temperature applications. Vacuum Compatibility Maintains stability and precision under vacuum conditions up to 5×10 −2 Torr, ensuring reliable measurements in controlled environments. Optical Characterization Capability Equipped with an upper quartz optical window, enabling advanced opto-electric and photo-catalytic characterization. This feature supports detailed analysis of optical and electrochemical properties crucial for cutting-edge research. Electrode Configuration Features four pure tungsten electrodes, each with a 50-micrometer tip size, providing superior electrical contact and versatility for probing various materials and devices. XYZ Positioning Control Offers precise control in X, Y, and Z directions, facilitating accurate alignment and measurement of microelectronic components. Compatibility with Electrical Measurement Devices: Seamlessly connects with LCR meters, Potentiostats, and other electrical measurement devices. This capability allows comprehensive electrical characterization, including impedance spectroscopy, electrochemical measurements, and more.. Applications Widely used in the semiconductor R&D Seamlessly connects with LCR meters, Potentiostats, and other electrical measurement devices. This capability allows comprehensive electrical characterization, including impedance spectroscopy, electrochemical measurements, and more #solarcell #perovskite #semicunductordevice

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Tunable Pulsed Lasers OPO/DPSS configurations with options between 210-4500nm, Supercontinuum lasers with options between 410-1700nm & tunable bandwidth options

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This week we dive into the Semiconductor industry numbers that drive growth down to the plastics commodity level. While the industry remains strong, the anticipated surge seems to continue to be just out of reach. Contact your local #PortPlastics office for everything #SemiconductorPlastics. #SemiconScott

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✔️ Tackle the challenges of developing consumer and power electronics with SimScale’s all-in-one simulation platform. Join our upcoming webinar where Matthew Bemis demonstrates how to optimize your design process with simulations for various electronic components. 👉 Register today: https://hubs.la/Q02NyY420 #electronics #SimScale #simulation #innovation

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Success Story – MEMS Microfluidics Wafer Probe System Applicationhttps://hubs.ly/Q02BkK0J0

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Join this upcoming AMD w ebinar on June 26th: Designing for Versal Adaptive SoCs with AI Engines using Simulink and Vitis Model Composer. This webinar will show an example design – targeting the programmable logic and AI Engines in a Versal AI Edge device, and features speakers from AMD, Avnet, and MathWorks. #TogetherWeAdvance #AdaptiveComputing #Webinar #Versal #Vitis

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STMicroelectronics Maintains Top Spot with 32.6% Market, onsemi Rises to Second Place in 2023 Revenue Ranking for #SiC Power Devices, Says TrendForce Corporation 💡 TrendForce 集邦科技 reports that the SiC power devices industry maintained strong growth in 2023, driven by the application of #BEVs. The top five suppliers accounted for approximately 91.9% of total revenue; ST lead the pack with a 32.6% market share while onsemi rose from fourth place in 2022 to second place. TrendForce’s analysis indicates that demand from #AI #servers and other fields will significantly increase in 2024. However, the noticeable slowdown in the sales growth of BEVs and weakening #industrial demand are affecting the SiC #supplychain. It is expected that the annual growth rate of industry revenue for SiC power devices will significantly decelerate in 2024 compared to previous years. Thanks again to TrendForce Corporation for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/ePiyY-nw #semiconductorindustry #semiconductors #semiconductor #technology #semiconductormanufacturing #innovation #automotiveindustry #chip #chips #geopolitics #batterytechnology #battery #electricvehicles #evs

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Our latest blog on Power Spectral Density (PSD).

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PI Expert, our robust online design tool, features schematic and netlist export function made possible by SnapMagic. You can automatically export any power supply design you create in PI Expert to your preferred CAD tool within seconds, saving hours, even days, of development time. Watch this video to learn more -

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Register now for our upcoming webinar, on October 23rd, for an overview of the AMD Cost-Optimized Portfolio as well as a deep dive into Spartan UltraScale+ FPGAs and more. https://lnkd.in/eJXb_22d #TogetherWeAdvance #AdaptiveComputing #Ultrascale+ #FPGA

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🌡️ Introducing the TMP1075DGGR from Texas Instruments! 🌡️ This high-accuracy temperature sensor is ideal for a wide range of applications, including industrial automation and consumer electronics. It ensures precise temperature measurements and reliable performance. 🏭📱 Optimize your systems with advanced temperature sensing technology. #TexasInstruments #TemperatureSensor #Precision #IndustrialAutomation #ConsumerElectronics #EngineeringInnovation #ReliableSolutions #TechInnovation

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The U.S. Department of Commerce has issued a Notice of Intent (NOI) opening a competition for new R&D deliveries to secure and drive domestic capacity for semiconductor advanced packaging Click here to read the full story: https://lnkd.in/ee6WgCsC To get access to exclusive premium content, become a Packaging Europe member: https://lnkd.in/em_Jz4_Q Follow our hashtag to stay up to date with the latest packaging news: hashtag #PackagingEurope

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Join our December 4th webinar to explore how the automotive landscape is transforming and how AMD solutions can help you to stay ahead. You will also learn how the AMD Versal™ AI Edge Series Gen 2 can accelerate AI inference and high-performance post-processing in automotive applications. Register here: https://lnkd.in/d_G_im_B #TogetherWeAdvance #AdaptiveComputing #Automotive #Versal #AI

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Are you interested in SiC? Take a look at my discussion with Simon Keeton from onsemi to learn what onsemi and Arrow Electronics are doing to help companies utilize this technology.

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In my 2022 invited talk at the Display Week in San Jose, I argued that the road to high volume production of micro-LED displays must pass through the semiconductors industry. Careful examination of the various process flows used today to manufacture micro-LEDs unequivocally tells us that it is time to leverage the semiconductor industry experience in metal deposition and patterning, especially when it comes to selective deposition and/or the deposition and patterning of two different contact metals at different heights. For example, the size of the defects generated from the commonly used metal lift-off deposition technique are comparable to the size of the micro-LEDs themselves, which fundamentally makes this process inadequate. With #LuxNour’s extensive expertise in advanced process technology, this is naturally a focus area that may further support the entire ecosystem for micro-LED high volume production. #LuxNour, #LEDdisplay, #microLED, #displays

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We're expanding our edge computing portfolio with the new MCX W wireless MCU series. Dive into this article to learn how these advanced chips are powering smart industrial and IoT devices. #NXP #Semiconductors #IoT

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