Mixx Technologies Inc

🌟 Congratulations to Dr. Rebecca Schaevitz! 🌟 We’re thrilled to share that our very own Chief Product Officer, Dr. Rebecca Schaevitz, has been recognized as one of the Top 100 people in Photonics by Photonics 100! 🎉 Her passion, dedication, and vision continue to drive groundbreaking advancements in the field and inspire everyone at Mixx and beyond. Here’s to many more milestones and much more brilliance ahead! 👏✨ #Photonics100 #ProudTeam #Innovation #WomenInTech

"Mindset: What we have done in the past will not work in the future!" says Dr Rebecca Schaevitz, at the PECC Summit, at Sunnyvale, CA by Optica and Advanced Photonics Coalition #OutOfTheBox #IntoTheEcosystem #innovation #technology #AI

🌟 Exciting Announcement! 🌟 We are thrilled to share that our Chief Product Officer, Dr. Rebecca Schaevitz will present at the Optica Photonic-Enabled Cloud Computing Industry Summit in Sunnyvale, California. Dr. Schaevitz has been at the forefront of innovation in photonics and advanced manufacturing for data centers, and we're proud to have her represent Mixx Technologies at this prestigious event. Her presentation is set to be a thought-provoking dive into the crucial topic: how to sustainably scale optics for the future of artificial intelligence. Save the date: 22nd-23rd Oct 2024 Rebecca’s presentation: Wednesday, 23rd Oct, 2024 Time:  8:40 - 9:55 am (PT) For registration: https://lnkd.in/gt3YVC2X #OpticaSummit #Photonics #CloudComputing #PECC #Innovation #Leadership #Networking #DrRebeccaSchaevitz

AI network architecture’s new spineless approach. #AInetwork #largeAIclusters #Networkarchitecture Rebecca Schaevitz Vivek Raghuraman

SemiCon India 2024 The recent Semicon India event in Greater Noida, sent ripples through the semiconductor world, extending far beyond India to everyone with an eye on India’s dynamic ecosystem. What made this event so noteworthy? Apart from the fact that India’s Prime Minister Modi inaugurated it, his inspiring speech resonated with a vision for India’s future as a global hub for manufacturing and innovations. For India to be positioned as a key contributor to the next wave of technological progress thereby inspiring confidence and excitement among stakeholders worldwide. “When the chips are down, you can bet on India,” Prime Minister Modi assured attendees that the country is well-positioned for success. He announced significant financial support for establishing semiconductor manufacturing, emphasizing the importance of developing a skilled workforce through training to pave the way for a bright future in this critical sector. Notably, the India Semiconductor Mission (ISM) has already facilitated investments of over USD $17 billion in semiconductor manufacturing projects across the country. Key Highlights from SEMICON India 2024 Strategic Partnerships: The event served as a platform for fostering partnerships between local and international stakeholders. Industry leaders from companies like Intel, TSMC, and Qualcomm participated, sharing insights on innovations and trends shaping the future of semiconductor technology. Focus on Sustainability: Discussions emphasized sustainability in semiconductor production, addressing energy efficiency and environmental impact. This focus aligns with global trends towards greener manufacturing processes. Talent Development: The government is investing to foster a skilled workforce for the semiconductor industry with plans to train around 85,000 technicians and engineers. This investment on human capital is crucial for sustaining growth in the high-tech sector. Emerging Technologies: The event highlighted advancements in next-generation technologies such as AI chipsets, sustainable architectures, and quantum computing. These innovations are essential for positioning India at the forefront of global technology trends. SEMICON India 2024 was not just an exhibition, it was a declaration of India's ambitions in the semiconductor space. With its rich pool of talent, a burgeoning startup culture, and supportive government policies, India is poised to not only meet its own semiconductor needs but also export to international markets. The possibilities are vast, and the visionary path laid out at the event will have lasting implications for the future of technology, both in India and across the globe. #semiconindia2024 #semiconductorindustry #india #technology #AI

Thank you Samarth Shyam for your insightful thoughts on Vivek Raghuraman's talk about siliconization of interconnects for sustainable AI!

Hot take (kinda) of the day: Mass AI adoption is gated by hardware challenges! I just wrapped up an insightful session at Penang with BC Ooi from Broadcom and Vivek Raghuraman from Mixx Technologies Inc. The biggest takeaway? Mass AI adoption is gated by hardware challenges—especially in optical integration. Sharing some of my thoughts/insights from the session: 1) Optical integration is a cornerstone for advancing high-performance computing, yet it's hindered by significant challenges in manufacturability, interconnects, and heat dissipation. These obstacles are particularly evident in the development of co-packaged optics (CPO) and ASICs, where the complexity of combining multiple chiplets onto a single substrate creates further difficulties. 2) Fragmentation in EDA tools is a significant problem. While we knew this was an issue in the broader semiconductor space, it was eye-opening to realize its impact on the design of systems like CPOs and ASICs. This insight validated, again, why we're developing AI-based EDA solutions at Niyam AI. We need more integrated tools that streamline the design process and make these sophisticated technologies more accessible and efficient. It won't come from giants like Cadence and Synopsys, but through the new age mom-and-pop EDA solution providers. 3) One possible answer to the issues Vivek highlighted with optical integration: Substrate CPOs. Broadcom deserves credit here because they were among the first to successfully implement substrate CPOs at scale. While it's a promising solution, they don’t fully resolve broader issues such as optical integration complexity, heat dissipation in high-density packages, and manufacturability at scale. Additionally, design flexibility and the lack of standardization across the industry remain significant hurdles. Promising, but lots of development and refinement yet to come. 4) Tencent has been piloting advanced packaging with optical integration, achieving significant milestones in reducing costs and improving energy efficiency. I think the industry buzz is that the early results show that they’ve managed to cut optics costs by nearly 50% and achieve power savings of around 70%. The potential of integrating optics into semiconductor packaging is massive. Looking ahead, it's clear that innovation in both hardware and software is vital to meet the demands of mass adoption in AI. The road is challenging, but companies like Mixx Technologies Inc are driving the necessary changes. Snapshot below of the session and a quick snippet of the MVP we've been building for optimizing SIC MOSFETS for EV Inverters.

🌟Thank You to Crest, Malaysia! 🌟 Our sincere gratitude to Collaborative Research in Engineering, Science & Technology (CREST) Center for hosting us and organizing such an insightful event. We are especially proud that our CEO Vivek Raghuraman was invited to give a talk about 'The Role of Interconnects in AI Chip Design - From AI Silicon to Systems' sharing valuable insights and engaging in meaningful discussions with industry leaders and enthusiasts. A heartfelt thank you to Dato’ B.C. Ooi for his unwavering support and to everyone who participated and contributed to the success of this event which reflected the true spirit of our industry, showcasing our collective commitment to innovation and progress. #AI #Interconnects #Innovation #Collaboration #ThankYou #mixxtechnologies #industrytalk

AI and the Latency Bottleneck: Network Connectivity plays a key role. AI technologies are transforming industries by enabling advanced data processing and real-time decision-making. These systems are a driving force behind everything from personalized recommendations on your favorite streaming service to groundbreaking advancements in healthcare. However, one significant challenge that hampers the effectiveness of AI applications is latency. The Latency Challenge In the simplest terms, latency is the time taken for data to travel from one point to another in a network. In the context of AI, latency can mean the difference between a seamless user experience and frustrating delays.  Despite advancements in AI algorithms and hardware, latency remains a bottleneck that can severely hamper performance. In training, new AI models are only as good as the data they can process, and if that data isn’t delivered quickly and efficiently, the AI cluster’s effectiveness is compromised and the model suffers. This is where network connectivity comes into play. Ever wondered why your AI-powered assistant sometimes lags?  Latency can arise from various sources, including network delays, processing times, data transfer speeds and component failures. In AI inference applications, high latency can disrupt the flow of information, leading to delays in processing and response times. This latency is especially critical for applications that require immediate feedback, such as autonomous vehicles, remote surgery, or interactive AI systems like chatbots. Addressing latency is crucial for maximizing the potential of AI applications. By improving network connectivity through strategic choices in infrastructure, technology, and configuration, organizations can significantly enhance the responsiveness and effectiveness of their AI systems - saving time, money, and power. The Future of AI and Latency AI applications today have become increasingly sophisticated, demanding real-time processing and rapid decision-making. The need for low-latency networks is accelerating. To support advanced AI systems, we require connectivity that delivers high bandwidth, efficient data transfer, extensive reach, and lightning-fast speeds. As AI continues to evolve, ensuring the network connectivity is up to speed could be the key to staying ahead in the race for innovation. #AIinterconnects #Latency #scalableAI #bottlenecks Rebecca Schaevitz Vivek Raghuraman