Kevin Smith B.Sc, M.Sc

Dive into the characteristics of capacitors and their distinctive benefits. Explore their basic functionality, diverse types, and selection criteria, and discover their pivotal role in the electronics industry 👇 https://lnkd.in/ea8nrkJ8

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MathWorks welcomes Cadence #Tensilica #DSP into the Connections program for an integration that enables rapid porting of #MATLAB and #Simulink models, including #PIL (processor-in-the-loop) capability as well as verification and testing of generated code.

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Review of OnFILTER' Power Line EMI Adapters by Mach One Design

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Missed our last post? Here’s a quick reminder about our latest insight article, where we explore why DRC alone isn't enough for your PCB layout design. Discover how integrating DFx, DFM, and DFT practices early in your design process can significantly reduce risks, streamline production, and speed up your time-to-market. You can read the full article here: https://lnkd.in/dey6wMK8

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Insightful slide from Orbion Space Technology in recent GDevCon Limited conference. So why you go to the trouble when you solve your version control in with CI CD pipeline? Are you in trouble deploying your LabVIEW or TestStand CI CD pipeline NI (National Instruments) #ContinuousIntegration #LabVIEW #TestStand

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Earlier this year, our Business Development Manager, Tony Hawkins, sat down with Electronic Sourcing magazine to explore the complexities of the UK PCB supply chain. From market challenges to innovative strategies, Tony delves into the factors shaping the industry and how Daleba is navigating these dynamic times. Check out the conversation in the Electronic Sourcing magazine on pages 22-24! https://bit.ly/3T0wKKf #PCB #SupplyChain #Electronics #Innovation #ElectronicSourcingMagazine

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Confocal displacement sensors- Micro-Epsilon UK https://lnkd.in/esmGVKFK #ConfocalDisplacementSensor #MeasurementTechnology #MultiLayerThicknessMeasurement

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A survey from embedded.com in 2023 revealed that nearly half of the engineers faced a processor change in subsequent projects. Additionally, the incorporation of external Integrated Circuits (ICs) as peripherals further amplifies the complexity, requiring more code, extensive debugging, and prolonged development times. At PowerBeam, we like to save time, contact us! . . . #PowerBeam #TechDevelopment #Innovation #PowerDesign

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PCB Buyers: Expect Metal Pricing Increases Recent rumblings from both manufacturers and their suppliers indicate copper and gold prices are headed up, driven by the rising needs of green energy. And that, unfortunately, means printed circuit boards will soon be affected as well. Several key laminate suppliers have signaled double-digit price increases in the coming months, challenging many PCB manufacturers who are trying to limit how much of the extra cost they pass on to customers. What can a PCB buyer do to stave off these increases? Here are some suggestions: FORECAST: Ask your sales department. Take a hard look at what you plan to buy of which part number and let your PCB vendor know immediately. This will allow them to place an “anticipated order” of material at today’s prices, helping to keep overall pricing in check. Also ask your vendor what you can do differently to cut costs. For example, maybe change your buying habits from once a month to once a quarter with monthly deliveries. FREIGHT: Have a heart-to-heart with your production people. Do you really need that PCB in 4 weeks’ time when your manufacturing operation is consistent in delivering production assemblies in 8-12 weeks, or even greater lead times? Maybe your company can’t wait for sea freight, but what about air-cargo, which is 12-15 days for transit? How about consolidating multiple shipments? With a little extra planning, that freight cost difference may just offset any materials price increases. FUNCTION: Check with your board designers. There is nothing wrong with you as a buyer asking questions about cost adders. Here are some examples: 1. Are we just being “safe” with the product by having all that extra surface copper or extra mil of copper in the hole to dissipate heat? Would a few carefully placed extra via holes do the trick? 2. Do we need 6 layers of copper, or could we redesign this as a 4-layer, thereby saving copper and avoiding tariffs? (25% tariff if coming from China.) FIELDING QUOTES:  This is the best time to reach out to other potential vendors. I am not suggesting jumping immediately to another vendor on pricing but rather keeping your present vendors on their pricing toes. Don’t be hesitant, though, to bring on a new vendor when necessary, and to let your present suppliers know of this. Your actions (or inaction) will determine how much harder your present vendor base will work for you. Rising costs are nothing new to our industry. But as a board buyer armed with knowledge and forethought, you can influence the impact those costs have on the delivered price. Let me know your thoughts! #pcbassembly #pcbdesign #electronicsmanufacturing

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Simplify testing setups and overcome technical challenges with our guide on using a multi-bus switch matrix platform. Enhance your testing efficiency and troubleshooting capabilities. Download our Semiconductor Application Guide to learn how: https://hubs.ly/Q02FC3Tj0 #AutomatedTest #Efficiency #SemiconductorTest

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Sondrel announces Advanced Modelling Process for AI chip designs Reading UK – 10 September 2024. Sondrel has announced an Advanced Modelling Process for #AI chip designs. This runs through every stage of a chip’s design to ‘prove’ that the design is what was specified – Functional #Verification -- and that it does what it is supposed do – Performance Verification. Paul Martin, Sondrel’s Global Field Engineering Director, explained, “AI chips are extremely complex to design because of the huge amounts of data that have to flow round them between the #heterogeneous processors, IO and the memory. There cannot be periods when the processors are stalled waiting for data, which is made more complicated when the chip has several different types of processors each with different data traffic requirements. This new Process enables us to analyse and balance the dataflow through the chip whilst executing the software workloads on the AI chip. “This uses accurate, cycle-based, system performance modelling early in the design cycle in advance of #RTL development, enabling us to check that the design will meet its specification. The Process then continually evolves as RTL and eventually silicon becomes available to validate the design performs as specified. To accelerate the #design process, we base the design on our Architecting the Future platform to ensure that we have a reliable, predictable path to market. This means we are reusing pre-verified design elements in the Process that constrain the solution space whilst ensuring high confidence in the integration of those elements, which also reduces risk and time to market.” Power consumption by AI is a hot topic with some predictions saying that the power consumption of data centres could as much as triple the world’s energy needs. With AI proliferating everywhere to make devices smarter, there is an obvious drive to process data as much as possible before sending it to the cloud – so called AI at the Edge. To do this efficiently means that the power consumption of these compute intensive chips must be minimised which means using advanced nodes to hit the targets. Sondrel has always specialised in designing at the leading edge of chip #technology and is currently working on #3nm designs. Advanced process technologies enable the power usage to be constrained whilst delivering the performance from using billions of transistors required from these #ultracomplex custom chips. A key to the Process is that it is able to extract the behavioural interaction between the processors and the memory and then map it onto the rest of the chip’s functions. This insight enables Sondrel’s designers to see how the chip is performing and to optimise the design to achieve the required balance of Power, Performance and Area (#PPA). Further details at https://lnkd.in/ePkpbWiG. #electronics #CustomChips

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In a recent EE Times | Electronic Engineering Times article, Gary Hilson details the latest UCIe 2.0 specification features including support for 3D packaging. Read the full article to learn more: https://bit.ly/4ddQiTu

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The use of automation has streamlined our production processes and significantly reduced our time to market. One notable instance when automation added value was when we needed to increase our volumes from approximately 15 to 20 semiconductor frames per week to anywhere from 30 to 100 per week. This particular client used both Athena and an overseas contract manufacturer to produce this component. By integrating cobots into this medium-volume work, we utilized automation to quadruple our weekly rate. Additionally, our go-to-market time was only three weeks, whereas the overseas manufacturer took six months to reach these high volumes at the necessary speed. View our services: https://bit.ly/3GLRek7 #contractmanufacturingservices #AthenaManufacturing

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Ultra HDI – Cost Comparison UHDI has the potential to lower costs. A significant benefit of Ultra HDI is the capability to reduce layer count and number of lamination cycles, with reduced complexity of the PCB design. See more at https://loom.ly/sBuhMRc

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Redundancy matters in critical applications. That's why DIS SENSORS offers a vertically mounted 90° inclinometer with built-in redundancy. The redundancy feature is particularly valuable for industries needing to meet a suitable safety PLD classification. Its dual MEMS chips and independent analog outputs ensure that safety is never compromised, making it a valuable addition to any safety-critical application. Interested in getting one of these inclinometers for your project? Email us at [email protected].

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Do I think AI will take over jobs at EC Electronics Ltd? No. ​ ​ I’m confident no amount of artificial intelligence would ever be able to replace the years of expertise and skills behind our team. Instead, I think it will help to drive efficiency and enhance the excellent work they already do. ​ ​ But according to findings from a ByteSnap Design survey on the impact and perceptions of AI within the electronics industry, 51.7% fear potential job displacement, highlighting widespread anxieties about automation's impact on employment. ​ ​ So, as managers and business leaders, what can we do to ensure employees stay motivated and embrace new technology rather than work against it?​ ​ You can read more findings from the survey below. ​ ​ https://lnkd.in/evwrbkBt ​ ​ #AI #Automation #ElectronicsIndustry

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Introducing 32 V Diac from STMicroelectronics for Oscillator Applications Learn more: https://ow.ly/vfjI50Rn8UK #products #datasheet #manufacturing #quotation #switching #diac #thyristors #powerconversion #powermanagement #powerelectronics

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