#TSMCOIP2024 ✨A huge thank you to everyone who attended the TSMC OIP Forum in Taiwan! We're excited to have been part of such an amazing event. We are thrilled about the next stop of the OIP Forum with TSMC in China. Join us to explore our latest NVM IP roadmap and find the best solution for your needs. 🚉Next Stop: TSMC 2024 China Open Innovation Platform Ecosystem Forum 📅 Date: November 13, 2024 (Wednesday) 8:30-16:20 📍 Venue: Hyatt Regency Beijing Wangjing 2F (Booth No. 26) Address: Lei Shing Hong Center, 8 Guangshun South Street, Chaoyang District, Beijing, China We are looking forward to exploring the future development of NVM technology and applications with you.💞
PUFsecurity
半導體
Hsinchu CountyJhubei City 744 位關注者
We focus on developing effective and economical PUF-based security IPs based on NeoPUF and NeoFuse OTP in this AIoT era.
關於我們
Official Activities from the PUFsecurity and related news and discussions will be updated on this company page. PUFsecurity is a subsidiary of eMemory - one of the world’s largest SIP holders in Logic non-volatile memory (NVM) technology -- which is focusing on PUF-based security IP solutions. We leverage the technical knowledge and industrial know-how of our parent, eMemory. With core IP as the root of trust for security applications and qualified manufacturer platforms, PUFsecurity aims to bring to the market PUF-based hardware security, which offers better performance and cost-efficiency. We believe embedded hardware security will find wide application in this connected world.
- 網站
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https://www.pufsecurity.com
外部PUFsecurity連結
- 產業
- 半導體
- 公司規模
- 11-50 名員工
- 總部
- Jhubei CityHsinchu County
- 類型
- 上市公司
- 創立時間
- 2019
地點
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主要
8F, No. 5, Tai-Yuan 1st Street
30288 TWHsinchu CountyJhubei City
PUFsecurity員工
動態消息
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Get ready—tomorrow is the day for TSMC 2024 Taiwan Open Innovation Platform Ecosystem Forum. Stop by our booth! We can’t wait to connect with you! 🌟Also, don’t miss the electrifying presentation by our R&D Director, Dr. Meng-Yi Wu! He’ll be unveiling “Groundbreaking SRAM Repair Toolset: Pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP” in the Automotive, IoT & RF Track. This is your chance to discover a game-changing toolset specifically designed for cutting-edge AI SoCs with high-density SRAM. 🗓 When: 11/6, 11:50 – 12:10 Mark your calendars—this is a session you won’t want to miss! 🚀
#TSMCOIP2024 Thank you all for joining us at the 2024 TSMC Japan OIP Forum at the Grand Hyatt Tokyo last week! Your presence and engagement truly made our event a success. TSMC OIP Forum東京会場にご来場いただきました皆様、誠にありがとうございました。続きましては、11/6の台湾会場にてお待ちしております。お会いできる日を楽しみにしております! Next stop: TSMC 2024 Taiwan Open Innovation Platform Ecosystem Forum Date: November 6, 2024 (Wednesday) Time: 8:30 a.m. - 4:35 p.m. Venue: Sheraton Hsinchu Hotel (Booth No. A-23) 265 Dong Sec. 1, Guangming 6th Rd., Zhubei City, Hsinchu County 302, Taiwan We look forward to connecting with you there! #TSMC #semiconductor #NVM #security #PUFsecurity
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Thank you for joining us at #ATS Taipei! It was a pleasure to discuss the importance of hardware security with you🔐 🎉We are excited to share that our #PUFcc Crypto Coprocessor IP has achieved #SESIP and PSA Certified™ Level 3 RoT Component certification. Together with Arm Corstone, this combination offers a robust and comprehensive security framework. As part of the ArmTotal Design ecosystem, PUFsecurity is honored to work alongside Arm in advancing innovative security technology. Next stop: Japan 📍Tokyo Conference Center 📅November 07 (Thursday) 📌Catch us at Booth #11 We look forward to meeting you there and exploring how to secure the connected world together. Thank you again for your support!🌟
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🚀 PUFsecurity announces a major milestone! Our #PUFcc Crypto Coprocessor IP has achieved #SESIP and PSA Certified™ Level 3 RoT Component certification in collaboration with Arm! 🎉 This solution is a game-changer for semiconductor companies seeking a reliable Root of Trust subsystem to meet PSA Certified Level 3 standards. Combined with the Arm® Corstone™-300, PUFcc delivers top-tier security to power the next generation of #IoT and #AI devices. 💪🔒 . Read more about this news>>https://lnkd.in/gwrWncHh . Learn more about this solution>>https://lnkd.in/gA6Kj9n8
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#TSMCOIP2024 Thank you all for joining us at the 2024 TSMC Japan OIP Forum at the Grand Hyatt Tokyo last week! Your presence and engagement truly made our event a success. TSMC OIP Forum東京会場にご来場いただきました皆様、誠にありがとうございました。続きましては、11/6の台湾会場にてお待ちしております。お会いできる日を楽しみにしております! Next stop: TSMC 2024 Taiwan Open Innovation Platform Ecosystem Forum Date: November 6, 2024 (Wednesday) Time: 8:30 a.m. - 4:35 p.m. Venue: Sheraton Hsinchu Hotel (Booth No. A-23) 265 Dong Sec. 1, Guangming 6th Rd., Zhubei City, Hsinchu County 302, Taiwan We look forward to connecting with you there! #TSMC #semiconductor #NVM #security #PUFsecurity
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🚀 The much-awaited Arm Tech Symposia #ATS is kicking off soon, and we can't wait to connect with you across multiple Asian locations! 🌍 This year, PUFsecurity is bringing cutting-edge innovation to: 📍10/29 - Taipei Marriott Hotel 📍11/07 - Tokyo Conference Center 📍11/19 - The Ritz-Carlton Shanghai, Pudong 🔗 Haven't registered yet? Don't miss out on this opportunity to explore the latest insights with us. Click below to secure your spot! https://lnkd.in/gtkw8sea
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🎉 A huge thank you to everyone who joined us at the TSMC Open Innovation Platform North America! We’re thrilled to have been part of such an incredible event. 🌏 Next stop: TSMC 2024 Japan Open Innovation Platform Ecosystem Forum! Join us to dive into our latest NVM IP roadmap and discover the best solutions for your needs. 📅 Date: Friday, October 25, 2024 📍 Venue: Grand Hyatt Tokyo 6-10-3, Roppongi, Minato-ku, Tokyo, Japan 106-0032 Stay tuned for more updates! ✈️ #TSMC #OIP #NVM #IP #EcosystemForum #GrandHyattTokyo #eMemory #PUFsecurity #security
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🚀 The TSMC 2024 OIP North America Ecosystem Forum is just around the corner! Are you excited? We certainly are! 🌟 Visit us at Booth#616 to explore our innovative NVM and security solutions. We can't wait to connect with you! In addition, don’t miss our R&D Director, Dr. Meng-Yi Wu, presenting “Groundbreaking SRAM Repair Toolset: Pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP” in the Automotive, IoT & RF Track. This session will showcase a cutting-edge toolset tailored for advanced AI SoCs with high-density SRAM. Mark your calendar for this insightful talk! Event Information: 📅 Date: September 25, 2024 🕣 Time: 8:30 AM - 6:00 PM 📍 Location: Santa Clara Convention Center, CA (Booth #616) Partner Talk Information: 📅 Date: September 25, 2024 🕦Time: 11:30 AM - 11:50 AM 📍Location: Santa Clara Convention Center, CA 1F Automotive, IoT & RF Track
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We are excited to partner with our parent company eMemory to participate in TSMC OIP Ecosystem Forum 2024. This event provides an excellent opportunity to showcase our innovative solutions and network with industry leaders. Our representatives are eager to share insights and explore potential collaborations with you. Don't miss the opportunity to join us at the North America OIP Ecosystem Forum! We look forward to seeing you next week at the Santa Clara Convention Center on September 25th.🤝🏼 🤗 Check out more details below 👇👇
📣 TSMC 2024 Open Innovation Platform Ecosystem Forum 📣 We are thrilled to be part of the TSMC 2024 OIP Exhibit once again this year! As a leading provider of eNVM and Security IP, we are committed to delivering innovative solutions and exceptional service to our customers. Leveraging TSMC's exceptional semiconductor manufacturing capabilities, our security-enhanced OTP development spans from 0.15 µm to 2 nm, covering both mature and advanced nodes. This enables us to deliver cutting-edge NVM solutions tailored for automotive, AI, cloud servers, and mobile applications. During the event, Siemens and eMemory will deliver a joint presentation showcasing a groundbreaking SRAM repair toolset, which pre-integrated Siemens Tessent MBIST with eMemory’s NeoFuse OTP, to meet the demand for advanced AI SoCs with high-density SRAM. Please stay tuned to our detailed information for each regional event. Meet with our representatives to discover our comprehensive and reliable NVM and security solutions. We look forward to connecting with you at the TSMC 2024 OIP Ecosystem Forum. Upcoming Events: 2024/09/25 North America - Santa Clara Convention Center, CA (Booth 616) 2024/10/25 Japan - Grand Hyatt Tokyo 2024/11/06 Taiwan - Sheraton Hsinchu Hotel 2024/11/13 China - Hyatt Regency Beijing Wangjing 2024/11/19 Europe - Hilton Amsterdam Airport Schiphol Event Registration link: https://lnkd.in/dnnQxsQY #TSMCOIP #semiconductor #NVM #NeoBit #NeoFuse #NeoPUF #NeoEE #NeoMTP #security
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We're so thankful for all the interest in our hardware security book series. ☺️ Now, the exciting news is that Book 3 is also live now! 🎉🎉🎉 Book 3 takes PUFsecurity’s product PUFrt as an example and states various attack methods on chips, then provides countermeasures and protective technologies based on various threats. We hope our readers gain a thorough knowledge of HRoT design and understand the design concepts of a secure system and what to be aware of. Don’t miss the industry’s best hardware security book series! Check out the Newsletter and download the Book 1-3 now!🏃♂️➡️ 🏃♀️➡️ 🏃➡️
We are thrilled to introduce our #PUF Book Series to the public! 🎉 PUFsecurity's engineers and editors have taken years to complete this monumental project since we knew that PUF technology would be the foundation for securing the future of interconnected computing. Don't miss this opportunity to take away Full Book Text!🤩