"On-chip bus thermal analysis and optimization."

Feng Wang et al. (2006)

> Home

Details and statistics

DOI: 10.1109/DATE.2006.243743

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

- view
  authority control:
- export record
  dblp key:
  - conf/date/WangXVI06
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/date/WangXVI06
Feng Wang, Yuan Xie, Narayanan Vijaykrishnan, Mary Jane Irwin:
On-chip bus thermal analysis and optimization. DATE 2006: 850-855

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.