Jan Beenaerts

“At imec they’re tech-savy and have a collaborative mindset. That’s why it’s such a good place to come together to define the chiplet architectures our industry needs.” Dr. Christoph Grote, SVP electronics and software at BMW Group talks about the path to next-generation automotive E/E architectures. #ITFWorld2024 #imec40years

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#Chiplets are already a reality for #high-#performance #compute engines in #datacenters. In contrast, when will #carmakers start needing chiplets? Bart Plackle at imec isn't worried. “The evidence is extremely clear that it’s just a matter of time when the #automotive #industry has to transition to chiplets.” But a bigger quetion is whether the chiplets designed for automotive today will survive 10, 15 years from now. Then what about its cost? Plackle did not mince his words: "If you put the chiplet on the #siliconinterposer, I can already tell you that your interposer is going to be more expensive than the silicon itself.” We also talked to Jack Weast at Intel Corporation and David Bennett at Tenstorrent, asked them why they are so hot to trott on chiplets. MediaTek Renesas Electronics NVIDIA

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How do you see Heterogeneous Integration as a key enabler for future applications? 🤔Dimitrios Velenis, Head of the 3D and Silicon Photonics Device and Components Group of imec, explains heterogeneous integration offers two main characteristics: functionality and cost flexibility. During the 3D & Systems Summit Dimitrios represented HiCONNECTS and presented imec's work with the consortium. 📽️ Watch the video to learn how Heterogeneous Integration enables future applications. Stay tuned for more insights from the SEMI 3D & Systems Summit (#3DSummit)! 👉 https://lnkd.in/dpJmjkH

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imec #ITF2024 - USING PHOTOACOUSTICS TO LOOK DEEPER INSIDE THE BODY: Let's continue our coverage of interesting optical technologies we saw at the recent imec ITF2024 two-day conference in the heart of #Antwerp. On day two, I wandered around the exhibition looking for demos – you know that I love demos. I renewed contact with Hilde Jans, who is R&D Project Manager at imec. Watch the video! She brings us up to date on what Optica Corporate member imec is doing in the field of photoacoustics for (mainly) biomedical applications. This is a non-invasive sensing technique for biomedical applications, such as tumour imaging or glucose sensing. It is based on the photoacoustic principle discovered by Alexander Graham Bell (yes, him), where incoming light is absorbed by a sample and generates sound waves. Looking deeper inside the body Because it focuses with sound, photoacoustics is able to image deeper in tissue than light-based alternatives. When imaging biological tissue, the choice of modality depends on the contrast used for imaging and the trade-off between resolution and depth. Light waves, e.g. used in endoscopy or microscopy, can generate high-resolution images but don’t travel far unperturbed. Deeper in tissue, the light gets scattered, resulting in blurry images. High-energy X-rays form a special case as they penetrate deep into the tissue and yield high-resolution images, but this ionizing radiation limits their use. To circumvent these drawbacks, other options that don’t rely on unperturbed light propagation have also been explored. Acoustic or sound waves are well known to safely monitor foetuses in the womb using ultrasound imaging. These mechanical waves are less scattered than electromagnetic waves of comparable frequencies or wavelengths, so they can reach objects deeper in the tissue. However, ultrasound images typically suffer from a low resolution. MRI images have greater detail than ultrasound images, but they are typically not real-time and static. In the soft spot between these established imaging methods emerges a novel technique with the resolution of light-based imaging and the good depth penetration of sound-based imaging, called photoacoustics (PA). It is capable of imaging finer blood vessels than other techniques without the need for contrast agents or X-ray. More info here: https://lnkd.in/dH2mNMb2

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imec demonstrates die-to-wafer hybrid bonding with a Cu #interconnect pad pitch of 2µm https://lnkd.in/eGxiC8FD #chiplet #semiconductor

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imec achieves seamless #InP #Chiplet integration on 300mm RF Silicon #Interposer with excellent performance at 140GHz https://lnkd.in/ePXMS9SP At this week’s IEEE International Electron Devices Meeting (#IEDM), imec – a world-leading research and innovation hub in #nanoelectronics and digital technologies – presents breakthrough results in the hetero-integration of InP chiplets on a 300mm #RF silicon interposer. The chiplets’ integration comes with a negligible 0.1dB insertion loss at 140GHz. In addition, researchers observe zero performance degradation upon assembly of a two-stage InP power amplifier (PA). As the first to achieve this, imec’s findings mark a significant milestone in developing compact, energy-efficient modules for above 100GHz communication and radar sensing.

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IMEC and ASML are both 40 years old this year and the trust and partnership between our two organizations has created so much innovation and results that has contributed to advancing the semiconductor industry's golden goals of reducing the power consumption of chips, Improving their preformance and shrinking their size while reducing the carbon footprint of our industry and hence creating the chips that drive AI and contribute to a better world for all of us. Our partnership with ASML is a true testament to the power of collaboration and partnership. https://lnkd.in/gDfCaxGm

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Last chance to reduce the chaos in your product development cycles! In our free live webinar, discover the power of Altium 365 Cloud PLM Integration with Duro. Perfect for managers looking to boost efficiency. Save Your Spot 👉 https://bit.ly/3WV2nrZ #Altium #Engineering #Electronics #TechWebinar #ProductDevelopment #PLM

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Looking to gain a full understanding of the #MIPI DSI, CSI-2 and D-PHY specifications and operations? NXP Semiconductors' Ali Osman Ors and John Phillippe did a deep dive into that very subject at the recent embedded world Conference. Download the presentation: https://hubs.ly/Q02DsVft0 #ew24

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Start a Movement Challenge | In this element14 Electronics #challenge the participants are tasked with creating a #project that incorporates #automated #movement or #kineticism of some kind using the Analog Devices TMC5272-EVAL-KIT. 🔥🔥🔥https://lnkd.in/epfXz_rG #motioncontrol #motor #electronics #designchallenge 

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Last week, I had the privilege of having lunch with some colleagues of the Gen Z team at Melexis- the future of our industry. Their perspectives are as refreshing as they are enlightening. Here's what resonates with them: 🤝 Trust & Flexibility: They value the trust they receive from team leads and the company. The freedom to work remotely or in the office is not just a plus; it's essential. 📚 Continuous Learning: They are eager to grow, tapping into internal resources and having experiences at external events like keynotes and conferences. 💻Tech Savvy: Technical skills are a must-have, but it's the collaborative spirit and positive atmosphere among team members that truly drives innovation. 🌱 Purpose-Driven Work: Engagement comes from meaningful work that is in line with their values. Our colleagues are confirming the global trends I often read about. They’re shaping a future where work adapts to people, not the other way around. #Melexis #GenZ #WorkplaceCulture #FutureOfWork Anastasiia Besova Brecht Van Roy Cedric Debien Thomas Gielis Jeroen Goelen Lana Lazareva Liese Hubrechtsen

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Discover TTM Technologies’s Substrate-Like (SLP) PCB solutions, designed to deliver unparalleled reliability and performance! These advanced technologies offer exceptional capabilities for the semiconductor industry and beyond. Read more here: https://ow.ly/A35450T4Qa3 #TTMTechnologies #PCB #Directory #Industry #Competencies #Capabilities #Innovation #Technology #Semiconductor #SLP

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A special thank you to Kees-Jan Leliveld, Managing Director at ASMPT ALSI, for his enlightening session at I.S.E.S. EU Power 2024! Session Title: SiC Wafer Dicing with Multi-Beam Laser: Optimal Process Quality and Minimized Cost Abstract: Kees Jan Leliveld highlighted the limitations of traditional blade sawing for power wafers, including issues like side wall cracks, passivation chipping, wafer cracks, metal peeling, and high consumable costs. As the industry moves towards thinner wafers, thicker backside metallization, and materials like SiC and GaN, these issues become more pronounced. Traditional solutions, such as reducing blade saw speed, are not sustainable due to increased equipment and fab space costs. Kees Jan presented ASMPT ALSI's innovative multi-beam laser dicing technology, which outperforms traditional blade sawing in both process quality and cost of ownership. He showcased several examples demonstrating the superior performance and efficiency of this advanced technology. Thank you, Kees Jan, for sharing your expertise and innovative solutions that are shaping the future of power wafer dicing! #ISESEUPower2024

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UNDERSTANDING STRATEGIES OF TWO EUROPEAN RTO’s. If your photonics company (large or small) does business with either TNO or imec, then this 45 minute panel discussion on the first day of the Optica Global Economics Forum in Malaga will definitely interest you. Both are large Research and Technology organisations in the Netherlands and Belgium respectively. Moderator Jim Kafka, president-elect of Optica, moderated a discussion with Tjark Tjin-A-Tsoi, CEO of TNO, and Luc Van den hove, CEO of imec, focusing on the transition from research to commercialization. Tjark highlighted TNO's diversified portfolio and the need for them to focus on improving market impact. Luc emphasized imec's customer-centric approach, adjusting technology readiness levels (TRL) based on individual partnerships. Both stressed the importance of long-term partnerships, global collaboration, and strategic interdependence. Duplication of effort wastes valuable, expensive resources. They discussed the challenges of attracting and retaining talent, emphasizing brand reputation and meaningful work. The conversation also gathered differing approaches to the value of roadmaps, the impact of globalization and current instabilities, and the balance between public and private sector interests in technology transfer. I especially liked the audience question: When do you say NO? https://lnkd.in/d6nwmJn4

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