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imec achieves seamless #InP #Chiplet integration on 300mm RF Silicon #Interposer with excellent performance at 140GHz https://lnkd.in/ePXMS9SP At this week’s IEEE International Electron Devices Meeting (#IEDM), imec – a world-leading research and innovation hub in #nanoelectronics and digital technologies – presents breakthrough results in the hetero-integration of InP chiplets on a 300mm #RF silicon interposer. The chiplets’ integration comes with a negligible 0.1dB insertion loss at 140GHz. In addition, researchers observe zero performance degradation upon assembly of a two-stage InP power amplifier (PA). As the first to achieve this, imec’s findings mark a significant milestone in developing compact, energy-efficient modules for above 100GHz communication and radar sensing.

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