Scribd Logo
Upload

Welcome to Scribd!

  • 279 views

    Formation of Silicon Wafers

    Uploaded by

    Ftoom Matt
    The document summarizes the 4-step process for forming silicon wafers: 1) Silicon crystal growth - polysilicon is melted and a seed crystal is used to form an ingot using the Czochralski process. 2) Crystal shaping process - the ingot is cropped, ground, and flats are ground to obtain the specified diameter. 3) Wafer slicing - the crystal is sliced into wafers using a wire saw. 4) Wafer preparation - the wafers undergo edge contouring, lapping, etching, polishing and cleaning to produce a smooth surface for integrated circuits.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPTX, PDF, TXT or read online from Scribd

    Formation of Silicon Wafers

    Uploaded by

    Ftoom Matt
    279 views20 pages
    The document summarizes the 4-step process for forming silicon wafers: 1) Silicon crystal growth - polysilicon is melted and a seed crystal is used to form an ingot using the Czochralski process. 2) Crystal shaping process - the ingot is cropped, ground, and flats are ground to obtain the specified diameter. 3) Wafer slicing - the crystal is sliced into wafers using a wire saw. 4) Wafer preparation - the wafers undergo edge contouring, lapping, etching, polishing and cleaning to produce a smooth surface for integrated circuits.

    Copyright

    © Attribution Non-Commercial (BY-NC)

    Available Formats

    PPTX, PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    The document summarizes the 4-step process for forming silicon wafers: 1) Silicon crystal growth - polysilicon is melted and a seed crystal is used to form an ingot using the Czochralski process. 2) Crystal shaping process - the ingot is cropped, ground, and flats are ground to obtain the specified diameter. 3) Wafer slicing - the crystal is sliced into wafers using a wire saw. 4) Wafer preparation - the wafers undergo edge contouring, lapping, etching, polishing and cleaning to produce a smooth surface for integrated circuits.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    279 views20 pages

    Formation of Silicon Wafers

    Uploaded by

    Ftoom Matt
    The document summarizes the 4-step process for forming silicon wafers: 1) Silicon crystal growth - polysilicon is melted and a seed crystal is used to form an ingot using the Czochralski process. 2) Crystal shaping process - the ingot is cropped, ground, and flats are ground to obtain the specified diameter. 3) Wafer slicing - the crystal is sliced into wafers using a wire saw. 4) Wafer preparation - the wafers undergo edge contouring, lapping, etching, polishing and cleaning to produce a smooth surface for integrated circuits.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    of 20

    } Definition

    of

    Wafers } Pure Silicon } wafer formation process


    1.

    2.

    3. 4.

    Silicon Ingot growth Crystal Shaping process Wafer slicing Wafer inspection and Packing

    Formation of silicon wafers

    A 300mm silicon wafer

    A thin disk of pure silicon ( 99.99% purity) semiconductor used as a substrate material for Integrated Circuits ( ICs).

    Silica SiO2

    99.99% pure Poly crystalline Silicon (EG-Si)

    Reduction of silica with carbon and reacting the obtained MG-Si with gaseous HCL to get MGEG-Si the pure EG-Si.

    Step 1
    Silicon Crystal Growth

    Step 2
    Crystal Shaping Process

    Step 3
    Wafer Slicing

    Step 4
    Wafers preparatio n steps

    Polysilicon 2500oC

    Seed crystal

    Czochralski Process

    Cropping

    Testing

    Grinding

    Flats grinding

    Crystal Shaping process

    Cropping
    Tang

    Testing

    Grinding

    Flats grinding
    Crown

    Cropping

    Cropping

    Testing

    Grinding
    Testing Slice

    Flats grinding

    Testing

    Cropping

    Testing

    Grinding

    Flats grinding

    Centerless grinding

    Center grinding

    Grinding
    This process aims to obtain the specified diameter of the wafer

    Cropping

    Testing

    Grinding

    Flats grinding

    Flat

    Flats grinding
    Flats are a straightened parts of the wafers that have below 200mm diameters.

    Edge Contouring

    Wafer lapping

    Wafer etching

    Wafer polishing

    Wafer cleaning

    Edge Contouring

    Wafer lapping

    Wafer etching

    Wafer polishing

    Wafer cleaning

    Counter Rotating Lapping machine

    Edge Contouring

    Wafer lapping

    Wafer etching

    Wafer polishing

    Wafer cleaning

    Etching purpose is to remove any damaged layers which may be 10 m deep

    Edge Contouring

    Wafer lapping

    Wafer etching

    Wafer polishing

    Wafer cleaning

    Slurry consists of SiO2 and NaOH The purpose of polishing is to produce a smooth, specular surface on which device features can be defined by photolithography.

    Edge Contouring

    Wafer lapping

    Wafer etching

    Wafer polishing

    Wafer cleaning

    Wafer cleaning is meant to clean wafers from any contamination source: 1. Airborne bacteria 2. Grease and wax from physical handling. 3. Metals and abrasive elements such as : silica , diamond dust and alumina from lapping ,sewing and polishing processes.

    o Some wafers properties such as: flatness, thickness, resistivity and type are inspected to meet customers specifications. o Wafers are then packed in cassettes and shipped to the customer such as AMD or Intel

    en.wikipedia.org/wiki/Wafer_(electronics) http://en.wikipedia.org/wiki/Seed_crystal http://en.wikipedia.org/wiki/Crystal_structure http://www.xtal.iqfr.csic.es/Cristalografia/index-

    en.html http://www.semi.org/en/ http://en.wikipedia.org/wiki/Czochralski_process www.youtube.com/watch?v=aWVywhzuHnQ http://cleanroom.byu.edu/EW_formation.phtml http://cnx.org/content/m16627/latest/

    Any Questions?

    You might also like