TDA2009A
TDA2009A
TDA2009A
. . . . .
HIGH OUTPUT POWER (10 + 10W Min. @ D = 1%) HIGH CURRENT CAPABILITY (UP TO 3.5A) AC SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION SPACE AND COST SAVING : VERY LOW NUMBER OF EXTERNAL COMPONENTS AND SIMPLE MOUNTING THANKS TO THE MULTIWATT PACKAGE.
DESCRIPTION The TDA2009A is class AB dual Hi-Fi Audio power amplifier assembled in Multiwatt package, specially designed for high quality stereo application as Hi-Fi and music centers. PIN CONNECTION
September 2003
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SCHEMATIC DIAGRAM
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ABSOLUTE MAXIMUM RATINGS
Symbol Vs Io Io Ptot Tstg, Tj Supply Voltage Output Peak Current (repetitive f 20 Hz) Output Peak Current (non repetitive, t = 100 s) Power Dissipation at Tcase = 90 C Storage and Junction Temperature Parameter Value 28 3.5 4.5 20 40, + 150 Unit V A A W C
THERMAL DATA
Symbol Rth j-case Parameter Thermal Resistance Junction-case Max. Value 3 Unit C/W
ELECTRICAL CHARACTERISTICS (refer to the stereo application circuit, Tamb = 25oC, VS = 24V, GV = 36dB, unless otherwise specified)
Symbol Vs Vo Id Po Supply Voltage Quiescent Output Voltage Total Quiescent Drain Current Output Power (each channel) Vs = 24V Vs = 24V d = 1%, Vs = 24V, f = 1kHz RL = 4 RL = 8 f = 40Hz to 12.5kHz RL = 4 RL = 8 Vs = 18V, f = 1kHz RL = 4 RL = 8 f = 1kHz, Vs = 24V Po = 0.1 to 7W Po = 0.1 to 3.5W Vs = 18V Po = 0.1 to 5W Po = 0.1 to 2.5W RL = , Rg = 10k f = 1kHz f = 10kHz 300 f = 1kHz, Non Inverting Input RL = 4 RL = 4 f = 1kHz Rg = 10k (1) Rg = 10k (2) Rg = 10k fripple = 100Hz, Vripple = 0.5V 35.5 70 200 20 80 36 0.5 1.5 2.5 55 145 8 36.5 RL = 4 RL = 8 RL = 4 RL = 8 Parameter Test Conditions Min. 8 11.5 60 12.5 7 10 5 7 4 0.2 0.1 0.2 0.1 60 50 mV k Hz kHz dB dB V V dB C 120 Typ. Max. 28 Unit V V mA W W W W W W % % % % dB
CT
Vi Ri fL fH Gv Gv eN SVR TJ
Notes : 1. 2.
Input Saturation Voltage (rms) Input Resistance Low Frequency Roll off ( 3dB) High Frequency Roll off ( 3dB) Voltage Gain (closed loop) Closed Loop Gain Matching Total Input Noise Voltage Supply Voltage Rejection (each channel) Thermal Shut-down Junction Temperature
Curve A 22Hz to 22kHz
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Figure 1 : Test and Application Circuit (GV = 36dB)
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Figure 3 : Output Power versus Supply Voltage Figure 4 : Output Power versus Supply Voltage
Figure 5 :
Figure 6 :
Figure 7 :
Figure 8 :
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Figure 9 : Supply Voltage Rejection versus Frequency Figure 10 : Total Power Dissipation and Efficiency versus Output Power
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Figure 13 : 10W +10W Stereo Amplifier with Tone Balance and Loudness Control
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Figure 15 : High Quality 20 + 20W Two Way Amplifier for Stereo Music Center (one channel only)
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Figure 17 : P.C. BOARD and Components Layout of the Circuit of Figure 16 (1:1 scale)
APPLICATION SUGGESTION The recommended values of the components are those shown on application circuit of fig. 1. Different values can be used ; the following table can help the designer.
Component R1, R3 R2, R4 R5, R6 C1, C2 Recommended Value 1.2k 18k 1 2.2F Purpose Close Loop Gain Setting (1) Frequency Stability Input DC Decoupling Larger than Increase of Gain Decrease of Gain Danger of Oscillation at High Frequency with Inductive Load High Turn-on Delay Smaller than Decrease of Gain Increase of Gain
High Turn-on Pop. Higher Low Frequency Cut-off. Increase of Noise Degradation of SVR
BUILD-IN PROTECTION SYSTEMS THERMAL SHUT-DOWN The presence of a thermal limiting circuit offers the following advantages: 1) an averload on the output (even if it is perma nen t ), or an excessi ve ambient temperature can be easily withstood. 2) the heatsink can have a smaller factor of safety compared with that of a conventional circuit. There is no device damage in the case of excessive junction temperature : all that happens is that Po (and therefore Ptot) and Io are reduced.
The maximum allowable power dissipation depends upon the size of the external heatsink (i.e. its thermal resistance); Figure 18 shows this dissipable power as a function of ambient temperature for different thermal resistance.
Short circuit (AC Conditions). The TDA2009A can withstand an accidental short circuit from the output and ground made by a wrong connection during normal play operation.
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MOUNTING INSTRUCTIONS The power dissipated in the circuit must be removed by adding an external heatsink. Thanks to the MULTIWATT package attaching Figure 18 : Maximum Allowable Power Dissipation versus Ambient Temperature the heatsink is very simple, a screw or a compression spring (clip) being sufficient. Between the heatsink and the package it is better to insert a layer of silicon grease, to optimize the thermal contact ; no electrical isolation is needed between the two Figure 19 : Output Power versus Case Temperature
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mm MIN. A B C D E F G G1 H1 H2 L L1 L2 L3 L4 L7 M M1 S S1 Dia1 21.9 21.7 17.4 17.25 10.3 2.65 4.25 4.73 1.9 1.9 3.65 4.55 5.08 17.5 10.7 22.2 22.1 0.49 0.88 1.45 16.75 19.6 20.2 22.5 22.5 18.1 17.75 10.9 2.9 4.85 5.43 2.6 2.6 3.85 0.862 0.854 0.685 0.679 0.406 0.104 0.167 0.186 0.075 0.075 0.144 0.179 0.200 0.689 0.421 0.874 0.87 1.7 17 1 0.55 0.95 1.95 17.25 0.019 0.035 0.057 0.659 0.772 0.795 0.886 0.886 0.713 0.699 0.429 0.114 0.191 0.214 0.102 0.102 0.152 0.067 0.669 TYP. MAX. 5 2.65 1.6 0.039 0.022 0.037 0.077 0.679 MIN. inch TYP. MAX. 0.197 0.104 0.063
DIM.
Multiwatt11 V
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