APTGT400A60D3G Rev2
APTGT400A60D3G Rev2
APTGT400A60D3G Rev2
Application
3 Welding converters
Q1 Switched Mode Power Supplies
4 Uninterruptible Power Supplies
Motor control
5
1 Features
Q2 Trench + Field Stop IGBT3 Technology
6 - Low voltage drop
- Low tail current
- Switching frequency up to 20 kHz
7
2 - Soft recovery parallel diodes
- Low diode VF
- Low leakage current
- RBSOA and SCSOA rated
Kelvin emitter for easy drive
High level of integration
M6 power connectors
Benefits
Stable temperature behavior
Very rugged
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Easy paralleling due to positive TC of VCEsat
RoHS Compliant
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
See application note APT0502 on www.microsemi.com
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APTGT400A60D3G
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
ICES Zero Gate Voltage Collector Current VGE = 0V, VCE = 600V 500 µA
VGE = 15V Tj = 25°C 1.5 1.9
VCE(sat) Collector Emitter saturation Voltage V
IC = 400A Tj = 150°C 1.7
VGE(th) Gate Threshold Voltage VGE = VCE , IC = 6.4 mA 5.0 5.8 6.5 V
IGES Gate – Emitter Leakage Current VGE = 20V, VCE = 0V 400 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
Cies Input Capacitance VGE = 0V 24
Coes Output Capacitance VCE = 25V 1.5 nF
Cres Reverse Transfer Capacitance f = 1MHz 0.75
VGE=±15V, IC=400A
QG Gate charge 4.2 µC
VCE=300V
Td(on) Turn-on Delay Time Inductive Switching (25°C) 110
Tr Rise Time VGE = ±15V 50
VBus = 300V ns
Td(off) Turn-off Delay Time 490
IC = 400A
Tf Fall Time RG = 1.5 50
Td(on) Turn-on Delay Time Inductive Switching (150°C) 130
Tr Rise Time VGE = ±15V 60
VBus = 300V ns
Td(off) Turn-off Delay Time IC = 400A 530
Tf Fall Time RG = 1.5 70
VGE = ±15V Tj = 25°C 3.2
Eon Turn on Energy
VBus = 300V Tj = 150°C 3.4
mJ
IC = 400A Tj = 25°C 15
Eoff Turn off Energy RG = 1.5 Tj = 150°C 15.5
VGE ≤15V ; VBus = 360V
Isc Short Circuit data 2000 A
tp ≤ 6µs ; Tj = 150°C
Tj = 150°C 180
IF = 400A Tj = 25°C 18.8
Qrr Reverse Recovery Charge VR = 300V µC
di/dt =4800A/µs Tj = 150°C 39.5
Tj = 25°C 4.4
Err Reverse Recovery Energy mJ
Tj = 150°C 9.6
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APTGT400A60D3G
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
IGBT 0.12
RthJC Junction to Case Thermal Resistance °C/W
Diode 0.20
VISOL RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 4000 V
TJ Operating junction temperature range -40 175
TSTG Storage Temperature Range -40 125 °C
TC Operating Case Temperature -40 125
For terminals M6 3 5
Torque Mounting torque N.m
To Heatsink M6 3 5
Wt Package Weight 350 g
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APTGT400A60D3G
Typical Performance Curve
Output Characteristics (VGE=15V) Output Characteristics
600 600
TJ = 150°C
500 500
VGE=13V
400 400
IC (A)
TJ=150°C
IC (A)
VGE=15V
300 300
200 VGE=9V
200
100 100
TJ=25°C
0 0
0 0.5 1 1.5 2 2.5 0 0.5 1 1.5 2 2.5 3 3.5
VCE (V) VCE (V)
20
IC (A)
400
15 Err
10
200 TJ=150°C
5 Eon
0 0
5 6 7 8 9 10 11 0 200 400 600 800
VGE (V) IC (A)
Switching Energy Losses vs Gate Resistance Reverse Bias Safe Operating Area
35 1000
VCE = 300V Eon
30 VGE =15V
IC = 400A 800
25 TJ = 150°C Eoff
600
E (mJ)
20
IC (A)
15
400
10 VGE=15V
Err 200 TJ=150°C
5
RG=1.5Ω
0 0
0 2.5 5 7.5 10 0 100 200 300 400 500 600 700
Gate Resistance (ohms) VCE (V)
0.12 0.9
0.1
0.7
APTGT400A60D3G – Rev 2 October 2012
0.08
0.5
0.06
0.3
0.04
0.02 0.1
Single Pulse
0.05
0
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration in Seconds
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APTGT400A60D3G
Operating Frequency vs Collector Current Forward Characteristic of diode
80 600
Fmax, Operating Frequency (kHz)
VCE=300V
D=50% 500
ZCS
60 RG=1.5Ω
TJ=150°C 400
ZVS Tc=85°C
IF (A)
40 300
Hard 200
switching TJ=150°C
20
100
TJ=25°C
0 0
0 100 200 300 400 500 0 0.4 0.8 1.2 1.6 2 2.4
IC (A) VF (V)
0.2 0.9
0.15 0.7
0.5
0.1
0.3
0.05
0.1
0.05 Single Pulse
0
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration in Seconds
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APTGT400A60D3G
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Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
support or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
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application. User or customer shall not rely on any data and performance specifications or parameters provided by
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Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
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new proposed specific part.
APTGT400A60D3G – Rev 2 October 2012
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