A1308 and A1309

Linear Hall-Effect Sensor ICs with Analog Output

Available in a Miniature, Low-Profile Surface-Mount Package

FEATURES AND BENEFITS DESCRIPTION

• 5 V supply operation New applications for linear output Hall-effect sensors, such
• QVO temperature coefficient programmed at Allegro™ for as displacement and angular position, require higher accuracy
improved accuracy and smaller package sizes. The Allegro A1308 and A1309
• Miniature package options linear Hall-effect sensor ICs have been designed specifically
• High-bandwidth, low-noise analog output to meet both requirements. These temperature-stable devices
• High-speed chopping scheme minimizes QVO drift across are available in both surface-mount and through-hole packages.
operating temperature range
The accuracy of each device is enhanced via end-of-line
• Temperature-stable quiescent voltage output and sensitivity
optimization. Each device features nonvolatile memory to
• Precise recoverability after temperature cycling
optimize device sensitivity and the quiescent voltage output
• Output voltage clamps provide short-circuit diagnostic
(QVO: output in the absence of a magnetic field) for a given
capabilities
application or circuit. This A1308 and A1309 optimized
• Undervoltage lockout (UVLO)
performance is sustained across the full operating temperature
• Wide ambient temperature range: –40°C to 150°C (SOT-23W
range by programming the temperature coefficient for both
and SIP -L temp range), –40°C to 125°C (SIP -K temp range)
sensitivity and QVO at Allegro end-of-line test.
• Immune to mechanical stress
• Enhanced EMC performance for stringent automotive These ratiometric Hall-effect sensor ICs provide a voltage
applications output that is proportional to the applied magnetic field. The
quiescent voltage output is adjusted around 50% of the supply
PACKAGES: 3-pin ultramini SIP voltage.
1.5 mm × 4 mm × 3 mm
3-pin SOT-23W (suffix UA) The features of these linear devices make them ideal for use in
2 mm × 3 mm × 1 mm
(suffix LH) automotive and industrial applications requiring high accuracy,
and they operate across an extended temperature range,
–40°C to 150°C (SOT-23W and SIP -L temperature range) or
–40°C to 125°C (SIP -K temperature range).
Each BiCMOS monolithic circuit integrates a Hall element,
temperature-compensating circuitry to reduce the intrinsic
Continued on the next page…
Not to scale

Functional Block Diagram

V+
VCC
Dynamic Offset

Tuned Filter
Cancellation

VOUT

CBYPASS Sensitivity and Offset and

Sensitivity TC Offset TC

GND

A1308-9-DS, Rev. 13 July 24, 2023

MCO-0000134
A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

DESCRIPTION (continued)
sensitivity drift of the Hall element, a small-signal high-gain amplifier,
a clamped low-impedance output stage, and a proprietary dynamic
offset cancellation technique.
The A1308 and A1309 sensor ICs are offered in two package styles.
The LH is a SOT-23W style, miniature, low-profile package for
surface-mount applications. The UA is a 3-pin, ultramini, single
inline package (SIP) for through-hole mounting. Both packages are
lead (Pb) free, with 100% matte-tin leadframe plating.

SELECTION GUIDE
Operating Ambient
Output Sensitivity
Part Number Temperature Range Packing [1] Package
Polarity (typ) (mV/G)
(TA) (°C)
A1308KUA-2-T Forward 2.5 –40 to 125 500 pieces per bag 3-pin SIP through hole
A1308KUATN-1-T Forward 1.3 –40 to 125 4,000 pieces per reel 3-pin SIP through hole
A1308KUATN-2-T Forward 2.5 –40 to 125 4,000 pieces per reel 3-pin SIP through hole
A1308KUATN-3-T Forward 3.125 –40 to 125 4,000 pieces per reel 3-pin SIP through hole
A1308KUATN-5-T Forward 5 –40 to 125 4,000 pieces per reel 3-pin SIP through hole
A1308LUA-2-T Forward 2.5 –40 to 150 500 pieces per bag 3-pin SIP through hole
A1308LLHLX-05-T Forward 0.5 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1308LLHLX-1-T Forward 1.3 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1308LLHLX-2-T Forward 2.5 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1308LLHLX-3-T Forward 3.125 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1308LLHLX-5-T Forward 5 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1309KUATN-9-T Forward 9 –40 to 125 4,000 pieces per reel 3-pin SIP through hole
A1309LLHLX-9-T Forward 9 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount
A1309LLHLX-RP9-T Reverse –9 –40 to 150 10,000 pieces per reel 3-pin SOT-23W surface mount

[1] Contact Allegro for additional packing options.

ABSOLUTE MAXIMUM RATINGS

Characteristic Symbol Notes Rating Unit
Forward Supply Voltage VCC 8 V
Reverse Supply Voltage VRCC –0.1 V
Forward Output Voltage VOUT 7 V
Reverse Output Voltage VROUT –0.1 V
Output Source Current IOUT(SOURCE) VOUT to GND 2 mA
Output Sink Current IOUT(SINK) VCC to VOUT 10 mA
Range K –40 to 125 °C
Operating Ambient Temperature TA
Range L –40 to 150 °C
Maximum Junction Temperature TJ(max) 165 °C
Storage Temperature Tstg –65 to 170 °C

2
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

PINOUT DIAGRAMS AND TERMINAL LIST TABLE

LH Package UA Package Terminal List Table

Pinout Pinout
Number
Name Description
3 LH UA
Input power supply; tie to GND
VCC 1 1
with bypass capacitor
VOUT 2 3 Output signal
1 2 GND 3 2 Ground

1 2 3

THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic Symbol Test Conditions Value Units
Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each side
Package Thermal Resistance RθJA 110 °C/W
connected by thermal vias
Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W

3
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

OPERATING CHARACTERISTICS: Valid through TA , CBYPASS = 0.1 µF, VCC = 5 V, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit [1]
ELECTRICAL CHARACTERISTICS
Supply Voltage VCC 4.5 5.0 5.5 V
K temp. option tested at TA = 25°C to 125°C
VUVLOHI (device powers on); L temp. option tested at TA = – – 3 V
25°C to 150°C (device powers on)
Undervoltage Threshold [2]
K temp. option tested at TA = 25°C to 125°C
VUVLOLO (device powers off); L temp. option tested at TA = 2.5 – – V
25°C to 150°C (device powers off)
Supply Current ICC No load on VOUT – 9 11.5 mA
Power-On Time [3][4] tPO TA = 25°C, CL(PROBE) = 10 pF – 50 – µs
VCC Ramp Time [3][4] tVCC TA = 25°C 0.005 – 100 ms
VCC Off Level [3][4] VCCOFF TA = 25°C 0 – 0.55 V
Delay to Clamp [3][4] tCLP TA = 25°C, CL = 10 nF – 30 – µs
Supply Zener Clamp Voltage VZ TA = 25°C, ICC = 14.5 mA 6 7.3 – V
Internal Bandwidth [3] BWi Small signal –3 dB – 20 – kHz
Chopping Frequency [3][5] fC TA = 25°C – 400 – kHz
OUTPUT CHARACTERISTICS
VCC = 5 V, TA = 25°C, CBYPASS = open,
– 1.7 – G
Sens ≥ 1.3 mV/G, no load on VOUT
Output Referred Noise [3][6] VN
VCC = 5 V, TA = 25°C, CBYPASS = open,
– 2.8 – G
Sens = 0.5 mV/G, no load on VOUT
VCC = 5 V, TA = 25°C, CBYPASS = open,
– 1.5 – mG/√Hz
Sens ≥ 1.3 mV/G, no load on VOUT
Input Referred RMS Noise Density [3] VNRMS
VCC = 5 V, TA = 25°C, CBYPASS = open,
– 2.5 – mG/√Hz
Sens = 0.5 mV/G, no load on VOUT
DC Output Resistance [3] ROUT – 3 – Ω
Output Load Resistance [3] RL VOUT to GND 4.7 – – kΩ
Output Load Capacitance [3] CL VOUT to GND – – 10 nF
VCLPHIGH TA = 25°C, RL = 10 kΩ (VOUT to GND) 4.35 4.5 4.65 V
Output Voltage Clamp [7][8]
VCLPLOW TA = 25°C, RL = 10 kΩ (VOUT to VCC) 0.40 0.55 0.70 V
A1308KUA-1-T 1.17 1.3 1.43 mV/G
A1308KUA-2-T 2.4 2.5 2.6 mV/G
A1308KUA-3-T 3.025 3.125 3.225 mV/G
A1308KUA-5-T 4.85 5 5.15 mV/G
A1308LLHLX-1-T 1.17 1.3 1.43 mV/G
A1308LLHLX-2-T 2.4 2.5 2.6 mV/G
Sensitivity Sens TA = 25°C
A1308LLHLX-3-T 3.025 3.125 3.225 mV/G
A1308LLHLX-5-T 4.85 5 5.15 mV/G
A1308LUA-2-T 2.4 2.5 2.6 mV/G
A1309KUA-9-T 8.73 9 9.27 mV/G
A1309LLHLX-9-T 8.73 9 9.27 mV/G
A1309LLHLX-RP9-T –9.27 –9 –8.73 mV/G

Continued on the next page…

4
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

OPERATING CHARACTERISTICS (continued): Valid through TA , CBYPASS = 0.1 µF, VCC = 5 V, unless otherwise noted
Characteristics Symbol Test Conditions Min. Typ. Max. Unit [1]
OUTPUT CHARACTERISTICS (continued)
Quiescent Voltage Output (QVO) VOUT(Q) TA = 25°C 2.488 2.5 2.512 V
Programmed at TA = 125°C (K temp. option) or
Sensitivity Temperature Coefficient TCSens 150°C (L temp. option), calculated relative to 0.08 0.12 0.16 %/°C
Sens at 25°C
ERROR COMPONENTS
Linearity Sensitivity Error LinERR – ±1.5 – %
Symmetry Sensitivity Error SymERR – ±1.5 – %
Ratiometry Quiescent Voltage
RatVOUT(Q) Across supply voltage range (relative to VCC = 5 V) – ±1.5 – %
Output Error [9]
Ratiometry Sensitivity Error [9] RatSens Across supply voltage range (relative to VCC = 5 V) – ±1.5 – %
TA = 25°C, across supply voltage range (relative
Ratiometry Clamp Error [10] RatVOUTCLP – ±1.5 – %
to VCC = 5 V)
DRIFT CHARACTERISTICS
A1308KUA-1-T –15 0 15 mV
A1308KUA-2-T –10 0 10 mV
A1308KUA-3-T TA = 125°C –10 0 10 mV
A1308KUA-5-T –20 0 10 mV
A1309KUA-9-T –20 0 10 mV
A1308LLHLX-05-T –15 0 15 mV
Typical Quiescent Voltage Output Drift
∆VOUT(Q) A1308LLHLX-1-T –15 0 15 mV
Across Temperature Range
A1308LLHLX-2-T –20 – 0 mV
A1308LLHLX-3-T –20 – 0 mV
TA = 150°C
A1308LLHLX-5-T –30 – 0 mV
A1308LUA-2-T –10 – 10 mV
A1309LLHLX-9-T –30 – 0 mV
A1309LLHLX-RP9-T –30 – 0 mV
Sensitivity Drift Due to
∆SensPKG TA = 25°C, after temperature cycling – ±2 – %
Package Hysteresis [11]

[1] 1 G (gauss) = 0.1 mT (millitesla),

[2] On power-up, the output of the device is held low until VCC exceeds VUVLOHI. After the device is powered, the output remains valid until VCC drops
below VUVLOLO , when the output is pulled low.
[3] Determined by design and characterization, not evaluated at final test.
[4] See the Characteristic Definitions section.
[5] f varies as much as approximately ±20% across the full operating ambient temperature range and process.
C
[6] Output Referred Noise is calculated as 6 sigma (6 standard deviations) from characterization of a small sample of devices. Conversion of noise from
gauss to mV(P-P) can be done by: Noise (G) × Sensitivity (mV/G) = Noise (mV(P-P)).
[7] V
CLPLOW and VCLPHIGH scale with VCC due to ratiometry.
[8] Parameter is tested at wafer probe only.
[9] Percent change from actual value at V
CC = 5 V, for a given temperature.
[10] Percent change from actual value at V
CC = 5 V, TA = 25°C.
[11] Sensitivity drift through the life of the part, ΔSens
LIFE , can have a typical error value ±3% in addition to package hysteresis effects.

5
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

CHARACTERISTIC DEFINITIONS

Power-On Time. When the supply is ramped to its operating Quiescent Voltage Output. In the quiescent state (no signifi-
voltage, the device output requires a finite time to react to an cant magnetic field: B = 0 G), the output, VOUT(Q), is at a con-
input magnetic field. Power-On Time, tPO , is defined as the time stant ratio to the supply voltage, VCC, across the entire operating
it takes for the output voltage to begin responding to an applied ranges of VCC and Operating Ambient Temperature, TA.
magnetic field after the power supply has reached its minimum
Quiescent Voltage Output Drift Across Temperature
specified operating voltage, VCC(min), as shown in Figure 1.
Range. Due to internal component tolerances and thermal
Delay to Clamp. A large magnetic input step may cause the considerations, the Quiescent Voltage Output, VOUT(Q), may
clamp to overshoot its steady-state value. The Delay to Clamp, drift due to temperature changes within the Operating Ambient
tCLP , is defined as the time it takes for the output voltage to settle Temperature, TA. For purposes of specification, the Quiescent
within 1% of its steady-state value, after initially passing through Voltage Output Drift Across Temperature Range, ∆VOUT(Q) (mV),
its steady-state voltage, as shown in Figure 2. is defined as:

∆VOUT(Q) = VOUT(Q)(TA) –VOUT(Q)(25°C) (1)

V

VCC(typ)
VCC Sensitivity. The amount of the output voltage change is propor-
VOUT tional to the magnitude and polarity of the magnetic field applied.
90% VOUT This proportionality is specified as the magnetic sensitivity,
Sens (mV/G), of the device and is defined as:
VOUT(B+) – VOUT(B–)
Sens = (2)
VCC(min) (B+) – (B–)
tPO where B+ is the magnetic flux density in a positive field (south
t1 t2 polarity) and B– is the magnetic flux density in a negative field
t1= time at which power supply reaches
(north polarity).
minimum specified operating voltage
Sensitivity Temperature Coefficient. The device sensitiv-
t2= time at which output voltage settles ity changes as temperature changes, with respect to its Sensitiv-
within ±10% of its steady-state value
under an applied magnetic field ity Temperature Coefficient, TCSENS. TCSENS is programmed
at 150°C (L temperature device) or at 125°C (K temperature
0 device), and calculated relative to the baseline sensitivity pro-
+t
gramming temperature of 25°C. TCSENS is defined as:
Figure 1: Definition of Power-On Time, tPO
SensT2 – SensT1  1 
TCSens =  × 100    (%/°C) (3)
Magnetic Input Signal
 SensT1  T2–T1
where T1 is the baseline Sens programming temperature of 25°C,
VCLPHIGH and T2 is the TCSENS programming temperature of 150°C (L
VOUT
Magnetic Input Signal

temperature device) or 125°C (K temperature device).

Device Output, VOUT (V)

tCLP

t1 t2
The ideal value of Sens across the full ambient temperature
range, SensIDEAL(TA), is defined as:
t1= time at which output voltage initially
reaches steady-state clamp voltage SensIDEAL(TA) = SensT1 × [100 (%) + TCSENS (TA –T1)] (4)
t2= time at which output voltage settles to
within 1% of steady-state clamp voltage
Sensitivity Drift Across Temperature Range. Second-
order sensitivity temperature coefficient effects cause the
time (µs)
magnetic sensitivity, Sens, to drift from its ideal value across the
Figure 2: Definition of Delay to Clamp, tCLP operating ambient temperature range, TA. For purposes of specifi-

6
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

cation, the Sensitivity Drift Across Temperature Range, ∆SensTC, The output voltage clamps, VCLPHIGH and VCLPLOW , limit the
is defined as: operating magnetic range of the applied field in which the device
SensTA – SensIDEAL(TA) provides a linear output. The maximum positive and negative
∆SensTC =
Sens
× 100 (%) (5) applied magnetic fields in the operating range can be calculated:
IDEAL(TA)

Sensitivity Drift Due to Package Hysteresis. Package VCLPHIGH – VOUT(Q)

BMAX(+)  = (10)
stress and relaxation can cause the device sensitivity at TA = 25°C Sens
to change during and after temperature cycling. This change in VOUT(Q) – VCLPLOW
sensitivity follows a hysteresis curve. For purposes of specifica- BMAX(–)  =
tion, the Sensitivity Drift Due to Package Hysteresis, ∆SensPKG, Sens
is defined as:
Symmetry Sensitivity Error. The magnetic sensitivity of the
Sens(25°C)(2) – Sens(25°C)(1) device is constant for any two applied magnetic fields of equal
∆SensPKG = × 100 (%) (6)
Sens(25°C)(1) magnitude and opposite polarities. Symmetry error, SymERR (%),
where Sens(25°C)(1) is the programmed value of sensitivity is measured and defined as:
at TA = 25°C, and Sens(25°C)(2) is the value of sensitivity at  Sens(B+) 
TA = 25°C after temperature cycling TA up to 150°C (L tempera- SymERR = 1–  × 100 (%) (11)
ture device) or 125°C (K temperature device), down to –40°C,  Sens(B–) 
and back up to 25°C. where SensBx is as defined in equation 10, and B+ and B– are
positive and negative magnetic fields such that |B+| = |B–|.
Linearity Sensitivity Error. The A1308 and A1309 are
designed to provide linear output in response to a ramping Ratiometry Error. The A1308 and A1309 provide ratiometric
applied magnetic field. Consider two magnetic fields, B1 and B2. output. This means that the Quiescent Voltage Output, VOUT(Q) ,
Ideally, the sensitivity of a device is the same for both fields, for magnetic sensitivity, Sens, and clamp voltages, VCLPHIGH and
a given supply voltage and temperature. Linearity error is present VCLPLOW , are proportional to the supply voltage, VCC. In other
when there is a difference between the sensitivities measured at words, when the supply voltage increases or decreases by a
B1 and B2. certain percentage, each characteristic also increases or decreases
Linearity Sensitivity Error, LINERR , is calculated separately for by the same percentage. Error is the difference between the
positive (LinERR+) and negative (LinERR– ) applied magnetic measured change in the supply voltage relative to 5 V and the
fields. LINERR (%) is measured and defined as: measured change in each characteristic.

 Sens(B+)(2)  The ratiometric error in quiescent voltage output, RatVOUT(Q)

LinERR+ = 1–  × 100 (%) (7) (%), for a given supply voltage, VCC, is defined as:
 Sens(B+)(1) 
 VOUT(Q)(VCC) / VOUT(Q)(5V) 
 Sens(B–)(2) RatVOUT(Q) = 1–  × 100 (%) (12)
LinERR– = 1–  × 100 (%)  VCC / 5 (V) 
 Sens(B–)(1)
The ratiometric error in magnetic sensitivity, RatSens (%), for a
where:
given supply voltage, VCC, is defined as:
|VOUT(Bx) – VOUT(Q)|
SensBx = (8)  Sens(VCC) / Sens(5V) 
Bx RatSens = 1–  × 100 (%) (13)
 VCC / 5 (V) 
and Bx are positive and negative magnetic fields, with respect to
the quiescent voltage output, such that The ratiometric error in the clamp voltages, RatVOUTCLP (%), for
|B(+)(2)| > |B(+)(1)| and |B(–)(2)| > |B(–)(1)| a given supply voltage, VCC, is defined as:

The effective linearity error is:  VCLP(VCC) / VCLP(5V) 

RatVOUTCLP = 1–  × 100 (%) (14)
 VCC / 5 (V) 
LinERR = max(|LinERR+| , |LinERR– |) (9)
where VCLP is either VCLPHIGH or VCLPLOW .

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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

Undervoltage Lockout. The A1308 and A1309 provide an +V

VCC
undervoltage lockout feature which ensures that the device out-
puts a VOUT signal only when VCC is above certain thresholds . VUVLOHI
The undervoltage lockout feature provides a hysteresis of opera- VUVLOLOW
tion to eliminate indeterminate output states.
The output of the A1308 and A1309 is held low (GND) until
VCC exceeds VUVLOHI . After VCC exceeds VUVLOHI , the device VOUT
VOUT output is enabled, providing a ratiometric output volt-
age that is proportional to the input magnetic signal and VCC . If
VCC should drop back down below VUVLOLO after the device is
powered up, the output would be pulled low (see Figure 3) until time
VUVLOHI is reached again and VOUT would be reenabled.
VCC Ramp Time. The time taken for VCC to ramp from 0 V to Figure 3: Definition of Undervoltage Lockout
VCC(typ), 5 V (see Figure 4).
VCC Off Level. For applications in which the VCC pin of the tVCC
A1308 or A1309 is being power-cycled (for example using a VCC(typ)
multiplexer to toggle the part on and off), the specification of Supply Voltage, VCC (V)

VCC Off Level, VCCOFF , determines how high a VCC off voltage
can be tolerated while still ensuring proper operation and startup
of the device (see Figure 4).
VCCOFF

time

Figure 4: Definition of VCC Ramp Time, tVCC

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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
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APPLICATION INFORMATION

A1308
A1309
VCC VOUT

RL 4.7 nF
5V 0.1 µF GND

Figure 5: Typical Application Circuit

Chopper Stabilization Technique high-frequency signal. The magnetic-sourced signal then can pass
When using Hall-effect technology, a limiting factor for switch through a low-pass filter, while the modulated DC offset is sup-
point accuracy is the small signal voltage developed across the pressed. In addition to the removal of the thermal and mechanical
Hall element. This voltage is disproportionally small relative to stress-related offset, this novel technique also reduces the amount
the offset that can be produced at the output of the Hall sensor IC. of thermal noise in the Hall sensor IC while completely removing
This makes it difficult to process the signal while maintaining an the modulated residue resulting from the chopper operation. The
accurate, reliable output over the specified operating temperature chopper stabilization technique uses a high-frequency sampling
and voltage ranges. Chopper stabilization is a unique approach clock. For demodulation process, a sample-and-hold technique
used to minimize Hall offset on the chip. Allegro employs a is used. This high-frequency operation allows a greater sampling
technique to remove key sources of the output drift induced by rate, which results in higher accuracy and faster signal-processing
thermal and mechanical stresses. This offset reduction technique capability. This approach desensitizes the chip to the effects of
is based on a signal modulation-demodulation process. The thermal and mechanical stresses and produces devices that have
undesired offset signal is separated from the magnetic field- extremely stable quiescent Hall output voltages and precise
induced signal in the frequency domain, through modulation. recoverability after temperature cycling. This technique is made
The subsequent demodulation acts as a modulation process for possible through the use of a BiCMOS process, which allows the
the offset, causing the magnetic field-induced signal to recover use of low-offset, low-noise amplifiers in combination with high-
its original spectrum at baseband, while the DC offset becomes a density logic integration and sample-and-hold circuits.

Regulator

Clock/Logic

Hall Element

Amp

Anti-aliasing Tuned
LP Filter Filter

Figure 6: Chopper Stabilization Technique

9
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A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

Package LH, 3-Pin (SOT-23W)

For Reference Only – Not for Tooling Use

(Reference Allegro DWG-0000628, Rev. 1)
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown

+0.125
2.975 –0.075

1.49
4°±4°
3 Active Area Depth
0.28 ±0.04 mm
+0.020
0.180–0.053

2.40
0.96 0.70
+0.10 +0.19
2.90 –0.20 1.91 –0.06

Hall element 1.00

(not to scale) 0.25 MIN
0.38 NOM

0.95
1 2
PCB Layout Reference View
0.55 REF 0.25 BSC All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
Seating Plane to meet application process requirements and PCB layout tolerances
Gauge Plane

8× 10° ±5° Branded Face

Standard Branding Reference View
0.57 ±0.04
3× 1.00 ±0.13 C

0.10 C 0.41 ±0.04

SEATING
PLANE NNN
+0.10
0.05 –0.05
0.95 BSC
0.40 ±0.10 1
N = Last three digits of device part number

Part Number NNN

A1308LLHLX-05-T 308
A1308LLHLX-1-T 308
A1308LLHLX-2-T 308
A1308LLHLX-3-T 308
A1308LLHLX-5-T 308
A1309LLHLX-9-T 309
A1309LLHLX-RP9-T 09R

10
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

Package UA, 3-Pin SIP, Matrix Style

For Reference Only – Not For Tooling Use

(Reference DWG-0000404, Rev. 1)
NOT TO SCALE
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown

Ejector pin flash Mold gate and tie bar

protrusion protrusion zone

R0.25 MAX (2×) 5° (2×) 0.56 MAX

NNN

45° (2×) 1.52 ±0.05 1.68 MAX

0.10 MAX
5° (2×) 1

Standard Branding Reference View

+0.08 = Supplier emblem
4.09 –0.05
N = Last three digits of device part number
3.00 ±0.05
Branding scale and appearance
at supplier discretion.
Mold gate and tie bar
protrusion zone 0.15 MAX

Ejector pin +0.05 0.50 ±0.08 Active Area Depth

(far side) 2.04 0.08 –0.00
Including gate and
tie bar burrs
Ejector pin flash
protrusion
1.44
3.10 MAX +0.08
3.02 –0.05
Hall Element
(not to scale) 45°
10° (3×)

1.02 MAX 0.79 REF

0.51 REF

0.05 NOM
0.05 NOM

14.99 ±0.25 +0.03

0.41 –0.06

0.10 MAX

0.10 MAX
Dambar Trim Detail

1.27 NOM (2×) +0.05

0.43 –0.07 (3×)

11
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
A1308 and Linear Hall-Effect Sensor ICs with Analog Output
A1309 Available in a Miniature, Low-Profile Surface-Mount Package

Revision History
Number Date Description
– June 27, 2014 Initial release
1 June 27, 2014 Updated product offerings
2 November 13, 2015 Updated product offerings
3 March 30, 2016 Updated product offerings
4 April 19, 2016 Updated product offerings
5 September 2, 2016 Updated product offerings
6 December 9, 2016 Updated product offerings
7 January 4, 2017 Updated product offerings
8 June 6, 2017 Updated product offerings and Figure 3
9 November 14, 2018 Added A1309LUA-2-T and A1308LUA-9-T part options
10 September 30, 2019 Added A1308KUA-2-T part option; updated LH and UA package drawings and other minor editorial updates
11 February 20, 2020 Removed A1308LUA-9-T part option
12 February 17, 2022 Updated package drawings (pages 10-11)
13 July 24, 2023 Removed A1309LUA-2-T part option and added A1308-LUA-2-T part option (pages 2, 4-5)

Copyright 2023, Allegro MicroSystems.

Allegro MicroSystems reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit
improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems assumes no responsibility for its use; nor
for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.

For the latest version of this document, visit our website:

www.allegromicro.com

12
Allegro MicroSystems
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com